CN108044254A - A kind of electronic component welding solder alloy and preparation method thereof - Google Patents
A kind of electronic component welding solder alloy and preparation method thereof Download PDFInfo
- Publication number
- CN108044254A CN108044254A CN201711333602.9A CN201711333602A CN108044254A CN 108044254 A CN108044254 A CN 108044254A CN 201711333602 A CN201711333602 A CN 201711333602A CN 108044254 A CN108044254 A CN 108044254A
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- China
- Prior art keywords
- electronic component
- solder alloy
- component welding
- welding solder
- preparation
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of electronic component welding solder alloys and preparation method thereof, comprise the following steps：According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C, keeps the temperature 30 minutes, stirring is continuously heating to 420 DEG C, keeps the temperature 60 minutes, stirring, is cooled to room temperature, obtains electronic component welding solder alloy.Compared with prior art, using Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn as raw material, each ingredient interaction influences each other the present invention, improves the wettability and mechanical property of the electronic component welding solder alloy of preparation.
Description
Technical field
The present invention relates to solder alloy technical field more particularly to a kind of electronic component welding solder alloy and its preparations
Method.
Background technology
Solder is for dosing the general name of the metal alloy compositions in weld seam, overlay cladding and brazed seam.Including welding wire, weldering
Item, solder etc..Solder compound is tin-lead alloy in the past, i.e., tin-lead alloy has suitable fusing point, strength characteristics and electricity spy
Property, it is main product to be used in electronics industry for decades.
In the prior art, solder alloy and preparation method thereof has obtained extensive report, for example, Application No.
200610036478.5 Chinese patent literature reports a kind of solder, including at least two metal of tin and copper, is also wrapped in the solder
Include germanium.The Chinese patent literature of Application No. 200610012366.6 reports a kind of lead-free solder, contains following component, each group
The ratio of weight and number of part is 10-20 parts of Ag, 4-6 parts of P, 72-86 parts of Cu, in addition, can also further contain 0.1-1 weight
The Ni of the Au or 0.1-0.5 parts by weight of number.The Chinese patent literature of Application No. 201280024585.X reports one kind
Solder ball, to inhibit the interface peel of the joint interface of solder ball and inhibiting the incomplete fusion generated between solder ball and soldering paste
, the solder ball that the fault mode that electronic unit is when falling is low, for plating Au etc. Ni electrode portions and water solubility is coated on Cu
The workable solder ball of Cu electrode portions of pre- solder flux.It is Ag0.5-1.1 mass %, Cu0.7-0.8 mass %, Ni0.05-
0.08 mass %, surplus Sn BGA, CSP electrode Lead-free solder ball, the printed circuit board (PCB) no matter engaged be Cu electrodes,
Or surface treatment uses plating Au, the Ni electrodes for plating Au/Pd, and drop impact is all good.It and then can also be with total in the composition
Meter 0.003-0.1 mass % adds more than one elements in Fe, Co, Pt or is added with amounting to 0.003-0.1 mass %
Add more than one elements in Bi, In, Sb, P, Ge.
But the wettability and mechanical property of the solder material of above-mentioned report are up for further improving.
The content of the invention
Present invention solves the technical problem that being to provide a kind of electronic component welding solder alloy and preparation method thereof, have
There are good wettability and mechanical property.
In view of this, the present invention provides a kind of electronic component welding solder alloy, prepared using the following raw material：Ag
1.2-3.5%, Si 0.03-0.06%, Cr 0.2-0.6%, Bi 0.5-1.3%, Cu 1.1-1.8%, Ni 0.4-0.9%,
Fe 0.1-0.4%, P 0.5-1.2%, surplus Sn.
Preferably, Ag 1.2-2.5%.
Preferably, Si 0.03-0.05%.
Preferably, Cr 0.3-0.6%.
Preferably, Bi 0.8-1.3%.
Preferably, Cu 1.1-1.5%.
Preferably, Ni 0.6-0.9%.
Preferably, Fe 0.1-0.3%.
Preferably, P 0.8-1.2%.
Correspondingly, the preparation the present invention also provides the electronic component welding solder alloy described in a kind of above-mentioned technical proposal
Method comprises the following steps：According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, risen
Temperature keeps the temperature 30 minutes to 350 DEG C, and stirring is continuously heating to 420 DEG C, keeps the temperature 60 minutes, and stirring is cooled to room temperature, obtains electronics
Element welding solder alloy.
The present invention provides a kind of electronic component welding solder alloy and preparation method thereof, is prepared using the following raw material：Ag
1.2-3.5%, Si 0.03-0.06%, Cr 0.2-0.6%, Bi 0.5-1.3%, Cu 1.1-1.8%, Ni 0.4-0.9%,
Fe 0.1-0.4%, P 0.5-1.2%, surplus Sn；Its preparation method comprises the following steps：According to weight percent, by Ag,
Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C, keep the temperature 30 minutes, and stirring is continuously heating to
420 DEG C, 60 minutes are kept the temperature, stirring is cooled to room temperature, obtains electronic component welding solder alloy.Compared with prior art, originally
Using Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn as raw material, each ingredient interaction influences each other, and improves preparation for invention
The wettability and mechanical property of electronic component welding solder alloy.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are simply for the feature and advantage that further illustrate the present invention rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of electronic component welding solder alloys, are prepared using the following raw material：Ag 1.2-
3.5%th, Si 0.03-0.06%, Cr 0.2-0.6%, Bi 0.5-1.3%, Cu 1.1-1.8%, Ni 0.4-0.9%, Fe
0.1-0.4%, P 0.5-1.2%, surplus Sn.
Preferably, Ag 1.2-2.5%, Si 0.03-0.05%, Cr 0.3-0.6%, Bi 0.8-1.3%, Cu
1.1-1.5%, Ni 0.6-0.9%, Fe 0.1-0.3%, P 0.8-1.2%.
Correspondingly, the preparation the present invention also provides the electronic component welding solder alloy described in a kind of above-mentioned technical proposal
Method comprises the following steps：According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, risen
Temperature keeps the temperature 30 minutes to 350 DEG C, and stirring is continuously heating to 420 DEG C, keeps the temperature 60 minutes, and stirring is cooled to room temperature, obtains electronics
Element welding solder alloy.
The present invention provides a kind of electronic component welding solder alloy and preparation method thereof, is prepared using the following raw material：Ag
1.2-3.5%, Si 0.03-0.06%, Cr 0.2-0.6%, Bi 0.5-1.3%, Cu 1.1-1.8%, Ni 0.4-0.9%,
Fe 0.1-0.4%, P 0.5-1.2%, surplus Sn；Its preparation method comprises the following steps：According to weight percent, by Ag,
Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C, keep the temperature 30 minutes, and stirring is continuously heating to
420 DEG C, 60 minutes are kept the temperature, stirring is cooled to room temperature, obtains electronic component welding solder alloy.Compared with prior art, originally
Using Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn as raw material, each ingredient interaction influences each other, and improves preparation for invention
The wettability and mechanical property of electronic component welding solder alloy.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment
Bright, protection scope of the present invention is not limited by the following examples.
The raw material that the embodiment of the present invention uses is purchased in market.
Embodiment 1
A kind of electronic component welding solder alloy, is calculated, is prepared using the following raw material in percentage by weight：
Ag 1.2%, Si 0.06%, Cr 0.2%, Bi 1.3%, Cu 1.1%, Ni 0.9%, Fe 0.1%, P
1.2%, surplus Sn.
Preparation process：
According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C,
Heat preservation 30 minutes, stirring are continuously heating to 420 DEG C, keep the temperature 60 minutes, and stirring is cooled to room temperature, and obtain electronic component welding and use
Solder alloy.
The performance of solder alloy manufactured in the present embodiment is detected, tensile strength 79Rm/MPa, shear strength is
30N/mm2, elongation percentage 58%.
Embodiment 2
A kind of electronic component welding solder alloy, is calculated, is prepared using the following raw material in percentage by weight：
Ag 3.5%, Si 0.03%, Cr 0.6%, Bi 0.5%, Cu 1.8%, Ni 0.4%, Fe0.4%, P
0.5%, surplus Sn.
Preparation process：
According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C,
Heat preservation 30 minutes, stirring are continuously heating to 420 DEG C, keep the temperature 60 minutes, and stirring is cooled to room temperature, and obtain electronic component welding and use
Solder alloy.
The performance of solder alloy manufactured in the present embodiment is detected, tensile strength 77Rm/MPa, shear strength is
32N/mm2, elongation percentage 57%.
Embodiment 3
A kind of electronic component welding solder alloy, is calculated, is prepared using the following raw material in percentage by weight：
Ag 3%, Si 0.04%, Cr 0.4%, Bi 0.8%, Cu 1.5%, Ni 0.6%, Fe 0.2%, P
0.8%, surplus Sn.
Preparation process：
According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C,
Heat preservation 30 minutes, stirring are continuously heating to 420 DEG C, keep the temperature 60 minutes, and stirring is cooled to room temperature, and obtain electronic component welding and use
Solder alloy.
The performance of solder alloy manufactured in the present embodiment is detected, tensile strength 82Rm/MPa, shear strength is
29N/mm2, elongation percentage 60%.
Embodiment 4
A kind of electronic component welding solder alloy, is calculated, is prepared using the following raw material in percentage by weight：
Ag 2.6%, Si 0.04%, Cr 0.3%, Bi 0.6%, Cu 1.2%, Ni 0.9%, Fe 0.3%, P
1.1%, surplus Sn.
Preparation process：
According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C,
Heat preservation 30 minutes, stirring are continuously heating to 420 DEG C, keep the temperature 60 minutes, and stirring is cooled to room temperature, and obtain electronic component welding and use
Solder alloy.
The performance of solder alloy manufactured in the present embodiment is detected, tensile strength 81Rm/MPa, shear strength is
32N/mm2, elongation percentage 57%.
Embodiment 5
A kind of electronic component welding solder alloy, is calculated, is prepared using the following raw material in percentage by weight：
Ag 3.2%, Si 0.05%, Cr 0.5%, Bi 0.8%, Cu 1.7%, Ni 0.8%, Fe 0.4%, P
0.5%, surplus Sn.
Preparation process：
According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C,
Heat preservation 30 minutes, stirring are continuously heating to 420 DEG C, keep the temperature 60 minutes, and stirring is cooled to room temperature, and obtain electronic component welding and use
Solder alloy.
The performance of solder alloy manufactured in the present embodiment is detected, tensile strength 78Rm/MPa, shear strength is
29N/mm2, elongation percentage 60%.
The explanation of above example is only intended to help to understand method and its core concept of the invention.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Several improvement and modification, these improvement and modification are also fallen into the protection domain of the claims in the present invention.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (10)
1. a kind of electronic component welding solder alloy, which is characterized in that prepared using the following raw material：
Ag 1.2-3.5%, Si 0.03-0.06%, Cr 0.2-0.6%, Bi 0.5-1.3%, Cu 1.1-1.8%, Ni
0.4-0.9%, Fe 0.1-0.4%, P 0.5-1.2%, surplus Sn.
2. electronic component welding solder alloy according to claim 1, which is characterized in that Ag 1.2-2.5%.
3. electronic component welding solder alloy according to claim 1, which is characterized in that Si 0.03-0.05%.
4. electronic component welding solder alloy according to claim 1, which is characterized in that Cr 0.3-0.6%.
5. electronic component welding solder alloy according to claim 1, which is characterized in that Bi 0.8-1.3%.
6. electronic component welding solder alloy according to claim 1, which is characterized in that Cu 1.1-1.5%.
7. electronic component welding solder alloy according to claim 1, which is characterized in that Ni 0.6-0.9%.
8. electronic component welding solder alloy according to claim 1, which is characterized in that Fe 0.1-0.3%.
9. electronic component welding solder alloy according to claim 1, which is characterized in that P 0.8-1.2%.
10. a kind of preparation method of electronic component welding solder alloy described in any one of claim 1-9, feature exist
In comprising the following steps：
According to weight percent, Ag, Si, Cr, Bi, Cu, Ni, Fe, P, Sn are added in into smelting furnace, are warming up to 350 DEG C, heat preservation
30 minutes, stirring was continuously heating to 420 DEG C, keeps the temperature 60 minutes, and stirring is cooled to room temperature, obtains electronic component welding solder
Alloy.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711333602.9A CN108044254A (en) | 2017-12-13 | 2017-12-13 | A kind of electronic component welding solder alloy and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711333602.9A CN108044254A (en) | 2017-12-13 | 2017-12-13 | A kind of electronic component welding solder alloy and preparation method thereof |
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| CN108044254A true CN108044254A (en) | 2018-05-18 |
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ID=62132773
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| CN201711333602.9A Pending CN108044254A (en) | 2017-12-13 | 2017-12-13 | A kind of electronic component welding solder alloy and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483081A (en) * | 2018-12-03 | 2019-03-19 | 先导薄膜材料（广东）有限公司 | Metal targets bind solder and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999004048A1 (en) * | 1997-07-17 | 1999-01-28 | Litton Systems, Inc. | Tin-bismuth based lead-free solders |
| CN1712176A (en) * | 2005-07-22 | 2005-12-28 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| CN1919522A (en) * | 2005-09-23 | 2007-02-28 | 东莞市千岛金属锡品有限公司 | Environmental protection type hyperthermia oxidation resistance weld material |
| CN102085604A (en) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder |
| CN104439751A (en) * | 2014-12-24 | 2015-03-25 | 深圳市亿铖达工业有限公司 | Novel low-melting-point lead-free solder |
| CN106964917A (en) * | 2012-06-30 | 2017-07-21 | 千住金属工业株式会社 | Module substrate and welding method |
-
2017
- 2017-12-13 CN CN201711333602.9A patent/CN108044254A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999004048A1 (en) * | 1997-07-17 | 1999-01-28 | Litton Systems, Inc. | Tin-bismuth based lead-free solders |
| CN1712176A (en) * | 2005-07-22 | 2005-12-28 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| CN1919522A (en) * | 2005-09-23 | 2007-02-28 | 东莞市千岛金属锡品有限公司 | Environmental protection type hyperthermia oxidation resistance weld material |
| CN102085604A (en) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder |
| CN106964917A (en) * | 2012-06-30 | 2017-07-21 | 千住金属工业株式会社 | Module substrate and welding method |
| CN104439751A (en) * | 2014-12-24 | 2015-03-25 | 深圳市亿铖达工业有限公司 | Novel low-melting-point lead-free solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483081A (en) * | 2018-12-03 | 2019-03-19 | 先导薄膜材料（广东）有限公司 | Metal targets bind solder and preparation method thereof |
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Application publication date: 20180518 |
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