CN105834611B - A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging - Google Patents
A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging Download PDFInfo
- Publication number
- CN105834611B CN105834611B CN201610288123.9A CN201610288123A CN105834611B CN 105834611 B CN105834611 B CN 105834611B CN 201610288123 A CN201610288123 A CN 201610288123A CN 105834611 B CN105834611 B CN 105834611B
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- China
- Prior art keywords
- solder
- solders
- electronic packaging
- high reliability
- solder joint
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging, the main metal element of solder alloy is Ce, Sn, Ag, Cu and Be.The solder of the present invention, by adding micro Be in Ce Sn Ag Cu solder alloy solders, unexpectedly improve the high oxidation and corrosion resistance and electrical and thermal conductivity performance of solder alloy, the dimensional stability of postwelding solder joint is high, solder joint anti-dropping capability is strong, can meet the rigors of existing Electronic Packaging.
Description
Technical field
The present invention relates to a kind of high performance solder, more particularly to a kind of high conductance high reliability suitable for Electronic Packaging
Ce-Sn-Ag-Cu solders.
Background technology
Develop along with electronic product to thin, light, small and digitlization, multifunction direction, the miniaturization of electronic component,
The development trend of precise treatment and high performance will further speed up so that the number of welds for Electronic Packaging increases, size
Diminish, spacing it is more and more narrow, and calorifics that it is born, electricity, mechanical loading more and more higher.Research shows, electronic device
Failure have 70% be as caused by the failure for encapsulating and assembling, wherein, solder joint failure is chief reason.
Solder joint can be used as electrical path in Electronic Packaging, and and can provides the same of mechanical connection between chip and substrate
Shi Tigao thermal conductivitys, it is used widely in electronics load, so welding spot reliability problem has very important research meaning
Justice.
The development of the ultra-fine pitch electronic encapsulation of High Density Integration is necessarily faced with the challenge of welding spot reliability decline, wherein,
Interconnection short circuit caused by being concentrated between chip bump and pad due to thermal stress between fillet lifting and salient point is electronic product
In relatively common failure mode.In order to avoid occurring, it is necessary to the dimensionally stable of accurate effective control solder joint for such case
Property and be on active service during electrical and thermal conductivity performance.
To study bright, Ce-Sn-Ag-Cu solders have electric conductivity more more preferable than traditional Sn-Pb solders and density,
Although fusion temperature is more slightly higher than Sn-Pb solder, all within the scope of existing soldering processes are acceptable.The wetting of solder,
Sprawl result of the test to show, Ce-Sn-Ag-Cu solders are on Au/Ni/Cu substrates than having preferably wetting on Cu substrates
Performance.Micro Ce elements are added, the wetting of Sn-Ag-Cu solders, spreading property can be made to increase significantly, solder is in substrate
On spreading area increase, wetting time shorten, wetting power improve, angle of wetting reduce.Ce addition is left 0.03% ~ 0.05%
When right, the wetting and spreading performance of Ce-Sn-Ag-Cu solders is optimal, and its wetting time shortens than being not added with Ce Sn-Ag-Cu solders
20%~40%.Ce is surface active element, there is enrichment phenomenon on Sn-Ag-Cu solders surface, and Ce surface enrichment reduces molten
Melt the surface tension of solder, be effectively improved wetting, the spreading property of lead-free brazing.Solder joint mechanical property test result table
Tensile force and the shearing force of plate resistor solder joint bright, that Ce addition will all improve its QFP pin solder joint.When Ce contents exist
When 0.03% or so, the mechanical property of Ce-Sn-Ag-Cu solder joints is optimal.For QFP32, QFP100 and three kinds of electronics of plate resistor
Component, tensile force (shearing force) values of Sn-Ag-Cu-0.03Ce solder joints improves 4.56% than Sn-Ag-Cu solder joint respectively,
4.06% and 3.81%.Theory analysis shows, due to rare earth element ce has " close Sn " effects, i.e. Ce elements preferentially with Sn element knots
Close, therefore, Ce addition can make the structure refinement of brazing filler metal alloy and solder joint, homogenization, can be effectively prevented from Sn elements and
Ag elements, which combine, generates thick Ag3Sn intermetallic compounds, so as to improve the mechanical property of solder joint.It is unleaded to QFP pins
Solder joint and plate resistor Lead-Free Solder Joint carry out thermal cycling test (the actual military service situation of simulating solder joint) result and found, experienced
After Long Time Thermal cyclic test, solder joint mechanical property gradually reduces with the increase in thermal cycle cycle, and trace rare-earth element
Ce addition can delay the deterioration of solder joint mechanical property, so as to effectively improve the reliability of solder joint.
However, the electrical conductance of Ce-Sn-Ag-Cu solders, reliability can not still meet that the harshness of existing Electronic Packaging will
Ask.Develop a kind of more excellent solder of performance.
The content of the invention
It is an object of the invention to provide a kind of high conductance high reliability Ce-Sn-Ag-Cu welderings suitable for Electronic Packaging
Material.
The technical solution used in the present invention is：
A kind of high conductance high reliability Ce-Sn-Ag-Cu solders suitable for Electronic Packaging, the major metal of solder alloy
Element is Ce, Sn, Ag, Cu and Be.
As the further improvement of above-mentioned solder, the mass percent of main metal element is in solder alloy：Ag ：2.0
~3.8%, Cu：0.4~0.7%, Ce：0.01~0.7%, Be：0.01~1.0%, surplus Sn.
As the further improvement of above-mentioned solder, the mass percent of main metal element is in solder alloy：Ag ：3.0
~3.8%, Cu：0.5~0.7%, Ce：0.02~0.7%, Be：0.2~0.5%, surplus Sn.
As the further improvement of above-mentioned solder, Ag and Cu quality addition ratio is in solder alloy（5~6）：1, preferably
, Ag and Cu quality addition ratio are（5~5.4）：1.
As the further improvement of above-mentioned solder, Ce and Be quality addition is than being 1 in solder alloy：（1~2）, preferably
, Ce and Be quality addition are than being 1：（1~1.5）.
A kind of circuit board, has solder joint on circuit board, and solder joint is highly reliable by the above-mentioned high conductance suitable for Electronic Packaging
Property Ce-Sn-Ag-Cu solders weld to obtain.
The beneficial effects of the invention are as follows：
The solder of the present invention, by adding micro Be in Ce-Sn-Ag-Cu solder alloy solders, is unexpectedly improved
The high oxidation and corrosion resistance and electrical and thermal conductivity performance of solder alloy, the dimensional stability of postwelding solder joint is high, solder joint anti-drop
Can be strong, the rigors of existing Electronic Packaging can be met.
Brief description of the drawings
Fig. 1 is comparative example 1, the metallograph of the solder alloy of comparative example 2；
Fig. 2 is the metallograph of the solder alloy of embodiment 1；
Fig. 3 is the solder alloy SEM figures of comparative example 1；
Fig. 4 is comparative example 2 and the solder alloy SEM figures of embodiment 1；
Fig. 5 comparative examples 1, comparative example 2 and the tensile strength of solder joint comparison diagram of embodiment 1,2,3；
The solder joint pictorial diagram of Fig. 6 embodiments 1,2,3,4；
Fig. 7 is the welding point interface figure of comparative example 1, comparative example 2；
Fig. 8 is the welding point interface figure of embodiment 1.
Embodiment
A kind of high conductance high reliability Ce-Sn-Ag-Cu solders suitable for Electronic Packaging, the major metal of solder alloy
Element is Ce, Sn, Ag, Cu and Be.Inevitable impurity element can also be contained in solder.
As the further improvement of above-mentioned solder, the mass percent of main metal element is in solder alloy：Ag ：2.0
~3.8%, Cu：0.4~0.7%, Ce：0.01~0.7%, Be：0.01~1.0%, surplus Sn.
As the further improvement of above-mentioned solder, the mass percent of main metal element is in solder alloy：Ag ：3.0
~3.8%, Cu：0.5~0.7%, Ce：0.02~0.7%, Be：0.2~0.5%, surplus Sn.
As the further improvement of above-mentioned solder, Ag and Cu quality addition ratio is in solder alloy（5~6）：1, preferably
, Ag and Cu quality addition ratio are（5~5.4）：1.
As the further improvement of above-mentioned solder, Ce and Be quality addition is than being 1 in solder alloy：（1~2）, preferably
, Ce and Be quality addition are than being 1：（1~1.5）.
A kind of circuit board, has solder joint on circuit board, and solder joint is highly reliable by the above-mentioned high conductance suitable for Electronic Packaging
Property Ce-Sn-Ag-Cu solders weld to obtain.
The solder of the present invention can be prepared according to a conventional method, i.e., formed according to the alloy of solder, weigh corresponding metal
Melting is uniform under element or alloy, vacuum state or protection gas shielded, and secondary melt back is uniform afterwards, uses routine side as needed
Method manufactured Board, band, paper tinsel, thread or ultra-fine welding powder.
With reference to embodiment, technical scheme is further illustrated.
For the sake of convenient comparison, the solder of following examples and comparative example is prepared as follows：
1) corresponding raw metal is weighed by solder composition, in vacuum intermediate-frequency induction melting furnace, in argon atmosphere
In be warming up to 850~1000 DEG C of meltings, be incubated 0.5h；
2) 400~500 DEG C of remeltings 3 times are cooled to, to ensure that the structural constituent that alloy is made is uniform, subsequent air cooling, are made
Solder ingot blank；
3) as needed, solder ingot blank is used directly as solder, or the method using machinings such as pressure rolling, extruding
Manufactured Board, band, paper tinsel, gage solder, or using Close-Coupled Gas Atomization equipment be atomized into 15~25 μm, 20~38 μm of ultra-fine welding powders with
It is standby to use.
The solder of embodiment and comparative example composition is as follows：
With reference to experiment, the performance difference of different solders is further illustrated.
Fig. 1 is comparative example 1, the metallograph of the solder alloy of comparative example 2, and Fig. 2 is that the metallographic of the solder alloy of embodiment 1 shines
Piece.It can be seen that by adding Be elements in Ce-Sn-Ag-Cu solders, β-Sn tissues can be refined significantly, form
From original bar-shaped to granular transformation, and the distribution of crystal grain more disperse is tiny.
Fig. 3 is the solder alloy SEM figures of comparative example 1, and Fig. 4 is comparative example 2 and the solder alloy SEM figures of embodiment 1.From figure
In as can be seen that the present invention solder, moreover it is possible to refined eutectic structure, on the basis of Sn-Ag-Cu-Ce solders add Be elements
Can significantly Ag in refined eutectic structure3The size of Sn phases, it can effectively improve the mechanical property of solder alloy.
Fig. 5 comparative examples 1, comparative example 2 and the tensile strength of solder joint comparison diagram of embodiment 1,2,3.It can be seen that utilize
Solder joint prepared by the solder of the present invention has more preferable mechanical property.
The solder joint pictorial diagram of Fig. 6 embodiments 1,2,3,4.It can be seen that the sold joint that the solder of the present invention is formed
Excellent, the surface zero defect of property.
Fig. 7 is the welding point interface figure of comparative example 1, comparative example 2, and Fig. 8 is the welding point interface figure of embodiment 1.Can be with from figure
To find out, welding point interface of the invention is straight, by adding Be elements so that welding point interface is changed from scallop shape to straightened, and
The growth of welding point interface brittle compound layer is inhibited, improves the mechanical property of welding point interface to a certain extent.
Claims (7)
1. a kind of high conductance high reliability Ce-Sn-Ag-Cu solders suitable for Electronic Packaging, the major metal member of solder alloy
Element is Ce, Sn, Ag, Cu and Be, and the mass percent of main metal element is：Ag：2.0~3.8%, Cu：0.4~0.7%,
Ce：0.01~0.7%, Be：0.01~1.0%, surplus Sn.
2. the high conductance high reliability Ce-Sn-Ag-Cu solders according to claim 1 suitable for Electronic Packaging, its feature
It is：The mass percent of main metal element is：Ag：3.0~3.8%, Cu：0.5~0.7%, Ce：0.02~0.7%,
Be：0.2~0.5%, surplus Sn.
3. the high conductance high reliability Ce-Sn-Ag-Cu solders according to claim 1 suitable for Electronic Packaging, its feature
It is：Ag and Cu quality addition ratio is (5~6)：1.
4. the high conductance high reliability Ce-Sn-Ag-Cu solders suitable for Electronic Packaging according to claim 1 or 3, its
It is characterised by：Ce and Be quality addition is than being 1：(1~2).
5. the high conductance high reliability Ce-Sn-Ag-Cu solders according to claim 3 suitable for Electronic Packaging, its feature
It is：Ag and Cu quality addition ratio is (5~5.4)：1.
6. the high conductance high reliability Ce-Sn-Ag-Cu solders according to claim 4 suitable for Electronic Packaging, its feature
It is：Ce and Be quality addition is than being 1：(1~1.5).
7. a kind of circuit board, there is solder joint on circuit board, it is characterised in that：Solder joint is as described in claim 1~6 any one
Weld to obtain suitable for the high conductance high reliability Ce-Sn-Ag-Cu solders of Electronic Packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610288123.9A CN105834611B (en) | 2016-05-04 | 2016-05-04 | A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610288123.9A CN105834611B (en) | 2016-05-04 | 2016-05-04 | A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105834611A CN105834611A (en) | 2016-08-10 |
| CN105834611B true CN105834611B (en) | 2018-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610288123.9A Expired - Fee Related CN105834611B (en) | 2016-05-04 | 2016-05-04 | A kind of high conductance high reliability Ce Sn Ag Cu solders suitable for Electronic Packaging |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825983B (en) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | SnAgSbNi series lead-free soldering tin alloy and preparation method and application thereof |
| CN113857713B (en) * | 2021-09-15 | 2023-02-28 | 昆明理工大学 | Low-silver Sn-Ag-Cu lead-free solder and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203960C (en) * | 2003-01-15 | 2005-06-01 | 深圳市亿铖达工业有限公司 | Oxidation-inhibited lead-free welding materials |
| CN1570166A (en) * | 2004-05-09 | 2005-01-26 | 邓和升 | Lead free solder alloy and its preparation method |
| CN1990161A (en) * | 2005-12-30 | 2007-07-04 | 上海飞轮有色冶炼厂 | Lead free solder alloy and its preparation method |
| JP5210323B2 (en) * | 2006-12-29 | 2013-06-12 | イルジン カッパー ホイル カンパニー リミテッド | Lead-free solder alloy |
| JP5245568B2 (en) * | 2008-06-23 | 2013-07-24 | 新日鉄住金マテリアルズ株式会社 | Electronic member having lead-free solder alloy, solder ball and solder bump |
| CN105149809B (en) * | 2015-10-10 | 2017-09-26 | 南京青锐风新材料科技有限公司 | It is a kind of suitable for antioxidant of SnAgCu or SnCu solders and preparation method thereof |
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| CN105834611A (en) | 2016-08-10 |
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Granted publication date: 20180213 Termination date: 20190504 |