CN1990161A - Lead free solder alloy and its preparation method - Google Patents
Lead free solder alloy and its preparation method Download PDFInfo
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- CN1990161A CN1990161A CN 200510112378 CN200510112378A CN1990161A CN 1990161 A CN1990161 A CN 1990161A CN 200510112378 CN200510112378 CN 200510112378 CN 200510112378 A CN200510112378 A CN 200510112378A CN 1990161 A CN1990161 A CN 1990161A
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Abstract
The invention discloses a lead-free welding materials alloy which consists of silver, copper, tin and mixed rare earth Re, and the weight percentage of the composition is: Ag 3 ~ 8%, Cu 0.1 ~ 1.0%, mixed rare earth Re 0.01 ~ 0. 5% and cushion is Sn. The invention also discloses the preparation method of said lead-free welding materials alloy. The lead-free welding materials alloy in the invention can be widely used in welding materials of various circuit boards, components and assembly production line. The lead-free welding materials alloy in the invention has excellent rollout performance, low melting point but high environmental protection, and does not generate low melting point eutectic composition; it is conducive to forming reliable welding joints in welding process.
Description
Technical field
The present invention relates to field of metallurgy, be specifically related to a kind of leadless welding alloy and preparation method thereof, this solder can be widely used in the welding raw material of various wiring boards, components and parts and assembly line.
Background technology
In the past, the scolder that is used for the electrical connection of electronic product components uses the more brazing alloy of lead tolerance mostly.But lead is the toxic metals element of non-degradable.Along with the develop rapidly of science and technology and the reinforcement of environmental protection consciousness, people are to plumbous and compound polluted environment, and the problem that is detrimental to health is more and more paid attention to.Therefore, lead-free solder is growing to even greater heights with people's cry that closely related field substitutes kupper solder of living, and developed countries such as the U.S., Europe, Japan make laws one after another and implement to promote lead-free solder.Agenda has been mentioned in the unleaded arrangement of electronic product, and each major company launches the research of lead-free solder one after another, and sequential trial is released lead-free product.
Researched and developed out multiple lead-free solder at present both at home and abroad, comprising silver (Ag), copper (Cu), tin (Sn) alloy, although approach tin, metal on silver, copper, the ashbury metal performance in many aspects, but still there are many deficiencies, spreading property, the gap filling performance of metals such as copper are relatively poor, fusing point is higher, thereby makes its application be subjected to very big restriction.And silver, copper, ashbury metal are easy to produce the low melting point eutectic composition.Therefore, at present prior art also untapped go out a kind of unleaded but keep the essence substitutability product of scolder premium properties.
Summary of the invention
The object of the present invention is to provide that a kind of spreading property is good, fusing point is lower and the lead-free solder of height environmental protection, scolder of the present invention can not produce the low melting point eutectic composition, help in welding process, forming reliable solder joint, and more help reducing the deformation of creep.
A kind of leadless welding alloy of the present invention is made up of silver, copper, tin and mishmetal Re, and the percentage by weight of each component is:
Ag 3～8％，
Cu 0.1～1.0％，
Mishmetal Re 0.01～0.5%,
Surplus is Sn.
In the leadless welding alloy, the percentage by weight of described each component is:
Ag 4～6％，
Cu 0.2～0.8％，
Mishmetal Re 0.05～0.3%,
Surplus is Sn.
In described leadless welding alloy, the composition of described mishmetal Re is a kind of element in La, Ce, the Pr rare earth, or is the mixing of the arbitrary proportion of two or three element in La, Ce, the Pr rare earth.
Technical problem to be solved by this invention also is to provide a kind of method of making described leadless welding alloy, and this method may further comprise the steps:
(1) take by weighing Ag, Cu, mishmetal Re and Sn element according to proportion speed,
(2) quality according to 99 times of mishmetal Re takes by weighing the Sn of first, Sn of first and mishmetal Re are melted formation rare earth foundry alloy under 500～600 ℃ of temperature, the rare earth foundry alloy is made up of Sn and Re, wherein, the percentage by weight that mishmetal Re accounts for the rare earth foundry alloy is 1%, the percentage by weight that Sn accounts for the rare earth foundry alloy is 99%
(3) will deduct the 60%-70% quality of the later Sn of the Sn of first and whole Ag, Cu and add in the container, and be warming up to 540-560 ℃, all the fusing back adds the rare earth foundry alloy of preparation in the step (1), fully fusing,
(4) add last remaining Sn in described container, fully after the fusing, stirring is cast into the leadless welding alloy piece.
In welding process, liquid solder can generate intermetallic compound with the reaction of substrate copper, and cause the dissolving of substrate, adopt copper in the lead-free solder, the copper that can reduce on the matrix circuit board dissolves in scolder, can reduce the fusing point of scolder, improve the wettability of scolder, have than excellent mechanical property simultaneously.
Mishmetal Re is joined in the SnAgCu alloy, can not produce the low melting point eutectic composition, help in welding process, forming reliable solder joint.
Under the surface-assembled condition, because thermal coefficient of expansion does not match and can make the inner thermal stress that produces of plumb joint between components and parts, substrate and the scolder, especially in low cycle facigue process, because strengthening, the sustained period proportion make creep more and more become the main cause of joint fails, the elastic strain that it can make joint inside produce owing to thermal expansion does not match in creep process changes plastic strain into by stress release and accumulates, and finally causes the inefficacy of joint.Added the coefficient of expansion of the SnAgCu solder of mishmetal and compared, more approached the linear expansion coefficient of copper substrate, thereby more help reducing the deformation of creep with the SnPb scolder.
The specific embodiment
The preparation of embodiment 1 leadless welding alloy 1
Prepare a kind of leadless welding alloy, be made up of silver, copper, tin and mishmetal Re, each component according to percentage by weight is: Ag 4%, and Cu 1.2%, mishmetal Re 0.05%, and Ce 0.05%, and surplus is Sn.
When the preparation leadless welding alloy, at first take by weighing each element according to aforementioned proportion speed, then specifically be prepared: at 500～600 ℃ of rare earth foundry alloys of producing Sn-Re1% down by following steps, the percentage by weight that mishmetal Re accounts for is 1%, 60%-70% and whole Ag, Cu with remaining Sn weight adds in the container with the rare earth foundry alloy, be warming up to 550 ℃, treat all rare earth foundry alloys of the aforementioned preparation of fusing back adding, fully fusing, add remaining tin, fully after the fusing, stirring is cast into leadless welding alloy.
The preparation of embodiment 2 leadless welding alloys 2
Prepare a kind of leadless welding alloy, it comprises silver, copper, tin, and mishmetal Re, and each component according to percentage by weight is: Ag 7%, Cu1.2%, and mishmetal Re 0.2%, surplus is Sn.
When the preparation leadless welding alloy, at first take by weighing each element according to aforementioned proportion speed, then specifically be prepared: at 500～600 ℃ of rare earth foundry alloys of producing Sn-Re1% down by following steps, the percentage by weight that mishmetal Re accounts for is 1%, the rare earth foundry alloy is added in the container with remaining Sn and whole Ag, Cu, be warming up to about 550 ℃.Treat all rare earth foundry alloys of the aforementioned preparation of fusing back adding, fully fusing adds remaining tin, and after the abundant fusing, stirring is cast into leadless welding alloy.
3 one example and steps thereof of producing the 1000g leadless welding alloy of embodiment:
(1) take by weighing 396gSn earlier, 4g mishmetal Re prepares 400g Sn-Re rare earth foundry alloy, takes by weighing 50g Ag, 8g Cu, 362g Sn, 180g Sn then respectively;
(2) 362g Sn, 50g Ag and 8g Cu are put into pot, be heated to 540 ℃-560 ℃ be stirred to whole fusings after;
(3) in pot, add 400g Sn-Re foundry alloy, after the continuation heating is stirred to whole fusings;
(4) in pot, continue to add 180g Sn,, be cast into leadless welding alloy after stirring to off-bottom.
Embodiment 4 leadless welding alloys 1 and 2 performance test
The solder of two kinds of different proportionings of preparation among embodiment 1 and the embodiment 2 is carried out performance test, and with traditional Ag-Sn-Cu solder alloy in contrast, each performance parameter such as table 1.
Table 1
| Fusing point | The firm welding degree | Spreadability | |
| Leadless welding alloy 1 | 217～220 | 12 | 128 |
| Leadless welding alloy 2 | 219～225 | 15 | 124 |
| Tradition Ag-Sn-Cu scolder | 210～230 | 4 | 120 |
As seen from the above table, the present invention can not produce the low melting point eutectic composition, helps forming reliable solder joint in welding process, has than excellent mechanical property simultaneously.
Claims (4)
1. a leadless welding alloy is characterized in that, this leadless welding alloy is made up of silver, copper, tin and mishmetal Re, and the percentage by weight of each component is:
Ag 3～8％，
Cu 0.1～1.0％，
Mishmetal Re 0.01～0.5%,
Surplus is Sn.
2. a kind of leadless welding alloy as claimed in claim 1 or 2 is characterized in that, the percentage by weight of each component of this leadless welding alloy is:
Ag 4～6％，
Cu 0.2～0.8％，
Mishmetal Re 0.05～0.3%,
Surplus is Sn.
3. a kind of leadless welding alloy as claimed in claim 1 or 2 is characterized in that, the composition of described mishmetal Re is a kind of element in La, Ce, the Pr rare earth, or is the mixing of the arbitrary proportion of two or three element in La, Ce, the Pr rare earth.
4. a method of making the described leadless welding alloy of claim 1 is characterized in that, this method may further comprise the steps:
(1) take by weighing Ag, Cu, mishmetal Re and Sn element according to proportion speed,
(2) quality according to 99 times of mishmetal Re takes by weighing the Sn of first, Sn of first and mishmetal Re are melted formation rare earth foundry alloy under 500～600 ℃ of temperature, the rare earth foundry alloy is made up of Sn and Re, wherein, the percentage by weight that mishmetal Re accounts for the rare earth foundry alloy is 1%, the percentage by weight that Sn accounts for the rare earth foundry alloy is 99%
(3) will deduct the 60%-70% quality of the later Sn of the Sn of first and whole Ag, Cu and add in the container, and be warming up to 540-560 ℃, all the fusing back adds the rare earth foundry alloy of preparation in the step (1), fully fusing,
(4) add last remaining Sn in described container, fully after the fusing, stirring is cast into the leadless welding alloy piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510112378 CN1990161A (en) | 2005-12-30 | 2005-12-30 | Lead free solder alloy and its preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510112378 CN1990161A (en) | 2005-12-30 | 2005-12-30 | Lead free solder alloy and its preparation method |
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| CN1990161A true CN1990161A (en) | 2007-07-04 |
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| CN 200510112378 Pending CN1990161A (en) | 2005-12-30 | 2005-12-30 | Lead free solder alloy and its preparation method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384746A (en) * | 2014-09-20 | 2015-03-04 | 明光旭升科技有限公司 | Low-melting-point lead-free soldering tin particles and preparation method thereof |
| CN104942473A (en) * | 2013-01-16 | 2015-09-30 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN105834612A (en) * | 2016-05-04 | 2016-08-10 | 中南大学 | High-dimensional stability Sn-Ag-Cu solder suitable for electronic packaging |
| CN105834611A (en) * | 2016-05-04 | 2016-08-10 | 中南大学 | High-electrical-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging |
| CN108213764A (en) * | 2017-12-13 | 2018-06-29 | 华南理工大学 | A kind of tin base leadless soldering-flux alloy for effectively reducing base material meltage |
| CN108526748A (en) * | 2018-03-28 | 2018-09-14 | 云南锡业锡材有限公司 | A kind of SnBiAgSbIn low temperature lead-free solder alloys |
| CN113458650A (en) * | 2021-07-05 | 2021-10-01 | 云南锡业锡材有限公司 | Sn-Ag-Cu-Ce high-reliability lead-free solder |
-
2005
- 2005-12-30 CN CN 200510112378 patent/CN1990161A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942473A (en) * | 2013-01-16 | 2015-09-30 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN104942473B (en) * | 2013-01-16 | 2017-05-03 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN104384746A (en) * | 2014-09-20 | 2015-03-04 | 明光旭升科技有限公司 | Low-melting-point lead-free soldering tin particles and preparation method thereof |
| CN105834612A (en) * | 2016-05-04 | 2016-08-10 | 中南大学 | High-dimensional stability Sn-Ag-Cu solder suitable for electronic packaging |
| CN105834611A (en) * | 2016-05-04 | 2016-08-10 | 中南大学 | High-electrical-conductivity and high-reliability Ce-Sn-Ag-Cu solder suitable for electronic packaging |
| CN105834612B (en) * | 2016-05-04 | 2018-02-23 | 中南大学 | A kind of high-dimensional stability Sn Ag Cu solders suitable for Electronic Packaging |
| CN108213764A (en) * | 2017-12-13 | 2018-06-29 | 华南理工大学 | A kind of tin base leadless soldering-flux alloy for effectively reducing base material meltage |
| CN108526748A (en) * | 2018-03-28 | 2018-09-14 | 云南锡业锡材有限公司 | A kind of SnBiAgSbIn low temperature lead-free solder alloys |
| CN113458650A (en) * | 2021-07-05 | 2021-10-01 | 云南锡业锡材有限公司 | Sn-Ag-Cu-Ce high-reliability lead-free solder |
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