CN1265934C - Anti-oxidation lead-free solder and its preparing method - Google Patents
Anti-oxidation lead-free solder and its preparing method Download PDFInfo
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- CN1265934C CN1265934C CN 200310122489 CN200310122489A CN1265934C CN 1265934 C CN1265934 C CN 1265934C CN 200310122489 CN200310122489 CN 200310122489 CN 200310122489 A CN200310122489 A CN 200310122489A CN 1265934 C CN1265934 C CN 1265934C
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- copper
- tin
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Abstract
The present invention relates to antioxidation leadless solder which belongs to the technical field of solder. The present invention has the preparation method that tin is melted firstly; copper is added proportionally in 500 to 700 DEG C., and the copper and the tin are stirred to melt the copper; copper-nickel alloy, tin-lanthanum-cerium rare earth alloy and tin-gallium alloy are added respectively to make the total amount of all the added copper, the nickel, the gallium, and the lanthanum-cerium rare earth accords with a certain ratio; the copper, the nickel, the gallium, and the lanthanum-cerium rare earth are stirred and melted; the mixture is cooled in the temperature of 400 to 450 DEG C., and the heat is preserved for 1 hour; the mixture is cast into ingots. The antioxidation leadless solder provided by the present invention has favorable antioxidation property and good flowability, and welding spot crystallisation is refined and bright after the weld is carried out.
Description
Technical field the present invention relates to a kind of oxidation resistant lead-free solder and preparation method thereof, belongs to welding technology field.
The scolder that background technology is traditional is the Sn-pb solder, this scolder physics and mechanical property are superior, be widely used in the welding of electronic building brick, yet contain a large amount of lead in the conventional solder, lead is a kind of poisonous metallic element, can and can not discharge in the human body gathering after human body is taken in, human body is produced serious deleterious effects.Research points out, lead can combine strongly with the human body internal protein and suppress the normal function of human body, causes nervous function and metabolic function disorder, and can cause that hemochrome reduces, and causes anaemia, diseases such as hypertension.In the production and use of lead-tin solder, the people knows from experience the lead of inevitable excess intake; Leaded discarded object is possibility contaminated soil and underground water also, finally also can be absorbed by the body.Therefore, replacing traditional lead-tin solder with lead-free solder in electronics industry is the important topic that countries nowadays is paid close attention to.In this case, various lead-free solders arise at the historic moment.Present lead-free solder mainly contains Sn-Cu series, Sn-Ag-Cu series, and Sn-Zn series etc. are multiple, although the kind of lead-free solder is a lot, have such or such problem mostly, and wherein modal have following two problems:
1, antioxygenic property is poor.Tin easily is oxidized to scruff in welding process.So both influence use, caused the waste of tin again.
2, alloy structure is not careful, and welding back solder joint is lackluster, influences the solder joint outward appearance.
3, mobile poor, cause easily after the welding and draw point and bridging, influence welding quality.
Summary of the invention the objective of the invention is to propose a kind of oxidation resistant lead-free solder and preparation method thereof, adds an amount of Ni in scolder, to improve the institutional framework of scolder, makes solder fluidity good, the careful light of welding back solder joint crystallization.
The oxidation resistant lead-free solder that the present invention proposes, the percentage by weight of each component is:
Copper 0.7%
Nickel 0.03～0.05%
Gallium 0.0008～0.01%
Lanthanum cerium mischmetal 0.005%
The tin surplus.
The preparation process of above-mentioned scolder may further comprise the steps:
(1) with the tin fusing, under 550～600 ℃, adds copper in proportion, stir and make the copper fusing;
(2) add copper-nickel alloy, tin-lanthanum cerium mischmetal alloy and tin-gallium alloy respectively, make the total amount of copper, nickel, gallium and the lanthanum-cerium mischmetal of all addings meet aforementioned proportion, stir and make its fusing;
(3) be cooled to 400～450 ℃, be incubated 1 hour;
(4) be cast into ingot.
The oxidation resistant lead-free solder that the present invention proposes has good antioxygenic property, and solder fluidity is good, the careful light of welding back solder joint crystallization.Add suitable Ga (gallium) and RE (lanthanum cerium rare earth element) in the Sn-Cu lead-free solder, the adding of Ga and RE can improve the non-oxidizability of scolder greatly.The adding of Ga can form the close collection skin layer of the fine and smooth ， Cause of one deck structure at solder surface, because the effect of collection skin layer, it is oxidized that lead-free solder is difficult for.The adding of RE has the effect of getter action and modulation alloy refinement, and it is oxidized that lead-free solder is difficult for.In scolder, be dissolved with gases such as nitrogen, oxygen usually, because the existence of oxygen makes lead-free solder be easy to oxidation.Because RE has certain attraction function to oxygen, make the oxidability of oxygen descend.And, because the adding of RE makes the oxide layer surface close by loose Bian De Cause, make scolder be difficult for further oxidation, thereby improve the oxidation resistance of scolder.In the Sn-Cu lead-free solder, add suitable Ni.The adding of Ni can significantly improve the crystalline condition of alloy.The Sn-Cu scolder is with Cu when crystallization
6Sn
5Form the metallic compound crystallization of skill shape, the crystallization generation is excessive will to make crystallization seem coarse, behind the adding Ni, can form Ni in the Sn-Cu scolder
3Sn
2Phase, its molten point is 795 ℃, is higher than Cu
6-Sn
5Phase is because Ni
3Sn
2The existence of phase has suppressed Cu
6Sn
5Growing up of phase, thus make the crystallization of Sn-Cu scolder careful glossy.Also therefore make flowability improve.The addition of Ga, RE and Ni is vital, and the Ga addition is 0.0008～0.1%, and the addition of RE is 0.001～0.1%, and the adding of Ni is to be 0.01～0.3%, and addition is crossed inoperative at least, and addition is too much, can cause fusing point to raise.
The specific embodiment
Following examples of the present invention are example with preparation 100Kg lead-free solder all, and wherein the nickel content in the Cu-Ni intermediate alloy of Jia Ruing is 6%, and the RE content in closing in the middle of the Sn-RE is 2%, and the Ga content in the Sn-Ga intermediate alloy is 1%.
Embodiment one:
With the 99.27KgSn fusing, add 0.19KgCu at 550 ℃, stir and make it fusing.Add Cu-Ni intermediate alloy 0.33Kg, Sn-RE intermediate alloy 0.15Kg and Sn-Ga intermediate alloy 0.08Kg.Stirring makes it fusing.Be incubated 1 hour down at 400 ℃, casting ingot-forming.
Embodiment two
With the 99.06KgSn fusing, add 0.13KgCu at 600 ℃, stir and make it fusing.Add Cu-Ni intermediate alloy 0.50Kg, Sn-RE intermediate alloy 0.25Kg and Sn-Ga intermediate alloy 0.10Kg.Stirring makes it fusing.Be incubated 1 hour casting ingot-forming down at 400 ℃.
Embodiment three
With the 98.51KgSn fusing, add 0.07KgCu at 580 ℃, stir and make it fusing.Add Cu-Ni intermediate alloy 0.67Kg, Sn-RE intermediate alloy 0.30Kg and Sn-Ga intermediate alloy 0.50Kg.Stirring makes it fusing.Be incubated 1 hour casting ingot-forming down at 400 ℃.
Embodiment four
With the 98.41KgSn fusing, add 0.07KgCu at 550 ℃, stir and make it fusing.Add Cu-Ni intermediate alloy 0.67Kg, Sn-RE intermediate alloy 0.40Kg and Sn-Ga intermediate alloy 0.50Kg.Stirring makes it fusing.Be incubated 1 hour casting ingot-forming down at 400 ℃.
Embodiment five
With the 97.72KgSn fusing, add 0.02KgCu at 580 ℃, stir and make it fusing.Add Cu-Ni intermediate alloy 0.83Kg, Sn-RE intermediate alloy 0.50Kg and Sn-Ga intermediate alloy 1.0Kg.Stirring makes it fusing.Be incubated 1 hour casting ingot-forming down at 400 ℃.
The oxidation resistant lead-free solder of this method preparation is carried out non-oxidizability and flowability is tested, compare experiment with the Sn-Cu lead-free solder simultaneously, 6 in experiment sample, 2 in contrast sample.Antioxygenic property is to go out the quantity of slag as index.Experimental technique is as follows: takes by weighing a certain amount of scolder, is placed in the soldering pot, and 250 ℃ of following continuous stirring 2 hours, stir speed (S.S.) is 60 rev/mins, writes down out the quantity of slag.Crystalline condition adopts visual comparison method to carry out.Dissolve, behind the condensation-crystallization, the oxidation resistant lead-free solder of contrast this method preparation and the crystalline condition of Sn-Cu lead-free solder, comparative result sees the following form.
Oxidation resistant lead-free solder and general lead-free solder performance comparison table
| Sample | Form (%) | Performance | |||||
| Cu | Ni | RE | Ga | Non-oxidizability | Mobile | Crystalline condition | |
| Embodiment one | 0.7 | 0.03 | 0.005 | 0.0008 | Good | Good | Careful |
| Embodiment two | 0.7 | 0.03 | 0.005 | 0.001 | Good | Good | Careful |
| Embodiment three | 0.7 | 0.04 | 0.005 | 0.005 | Good | Good | Careful |
| Embodiment four | 0.7 | 0.04 | 0.005 | 0.005 | Good | Good | Careful |
| Embodiment five | 0.7 | 0.05 | 0.005 | 0.01 | Good | Good | Careful |
| Comparative sample 1 | 0.7 | 0 | 0 | 0 | Difference | Difference | Coarse |
| Comparative sample 2 | 0.7 | 0 | 0 | 0 | Difference | Difference | Coarse |
Claims (2)
1, a kind of oxidation resistant lead-free solder is characterized in that the percentage by weight of each component in this scolder is:
Copper 0.7%
Nickel 0.03～0.05%
Gallium 0.0008～0.01%
Lanthanum cerium mischmetal 0.005%
The tin surplus.
2, a kind of preparation method of oxidation resistant lead-free solder is characterized in that the percentage by weight of each component in this scolder is:
Copper 0.7%
Nickel 0.03～0.05%
Gallium 0.0008～0.01%
Lanthanum cerium mischmetal 0.005%
The tin surplus
Its preparation process may further comprise the steps:
(1) with the tin fusing, under 550～600 ℃, adds copper in proportion, stir and make the copper fusing;
(2) add copper-nickel alloy, tin-lanthanum cerium mischmetal alloy and tin-gallium alloy respectively, make the total amount of copper, nickel, gallium and the lanthanum-cerium mischmetal of all addings meet aforementioned proportion, stir and make its fusing;
(3) be cooled to 400～450 ℃, be incubated 1 hour;
(4) be cast into ingot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310122489 CN1265934C (en) | 2003-12-26 | 2003-12-26 | Anti-oxidation lead-free solder and its preparing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310122489 CN1265934C (en) | 2003-12-26 | 2003-12-26 | Anti-oxidation lead-free solder and its preparing method |
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| Publication Number | Publication Date |
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| CN1554511A CN1554511A (en) | 2004-12-15 |
| CN1265934C true CN1265934C (en) | 2006-07-26 |
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| CN 200310122489 Expired - Fee Related CN1265934C (en) | 2003-12-26 | 2003-12-26 | Anti-oxidation lead-free solder and its preparing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1927525B (en) * | 2006-08-11 | 2010-11-24 | 北京有色金属研究总院 | Silver-free tin-bismuth-copper leadless solder and preparation method |
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301179C (en) * | 2005-05-11 | 2007-02-21 | 郴州金箭焊料有限公司 | Leadless solder |
| CN100351035C (en) * | 2005-10-28 | 2007-11-28 | 亚通电子有限公司 | Lead free solder |
| CN100366376C (en) * | 2005-12-23 | 2008-02-06 | 南京航空航天大学 | Leadless brazing filler metal containing cerium |
| CN113441868B (en) * | 2019-03-20 | 2022-06-14 | 中山翰华锡业有限公司 | Lead-free antioxidant tin paste with good wetting effect and preparation method thereof |
| CN110823867A (en) * | 2019-10-14 | 2020-02-21 | 重庆长安工业(集团)有限责任公司 | Analysis method for multi-element content in tin-lanthanum-cerium intermediate alloy |
| CN112322929A (en) * | 2020-10-28 | 2021-02-05 | 云南锡业集团（控股）有限责任公司研发中心 | Intermediate alloy for improving oxidation resistance of solder |
-
2003
- 2003-12-26 CN CN 200310122489 patent/CN1265934C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1927525B (en) * | 2006-08-11 | 2010-11-24 | 北京有色金属研究总院 | Silver-free tin-bismuth-copper leadless solder and preparation method |
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1554511A (en) | 2004-12-15 |
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