CN1806998A - Lead-free solder - Google Patents
Lead-free solder Download PDFInfo
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- CN1806998A CN1806998A CN 200610033080 CN200610033080A CN1806998A CN 1806998 A CN1806998 A CN 1806998A CN 200610033080 CN200610033080 CN 200610033080 CN 200610033080 A CN200610033080 A CN 200610033080A CN 1806998 A CN1806998 A CN 1806998A
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Abstract
The invention relates to a leadless tin soldering material which comprises the constituents (by mass ratio) of Ag 0.5-6%, Cu 0.1-2%, In 0.0001-1%, P 0.0001-1%, and balancing Sn. The preparing process of the soldering material comprises weighing 1.67-20 parts of Sn-Ag intermediate alloy ingot containing Ag 30%, 1-20 parts of Sn-Cu intermediate alloy ingot containing Cu 30%, 0.002-20 parts of Sn-In intermediate alloy ingot containing In 5%, P 0.0001-1 part, and balancing Sn in the whole 100 parts, charging the raw materials into manganese alloy crucible, smelting in intermediate frequency furnaces, evacuating and filling in nitrogen, elevating the temperature to 450 deg. C, agitating 1 hour, cooling down slowly and homogeneously to 340 deg C, charging weighed P and stirring homogeneously, finally pouring the melted liquid into dies.
Description
Technical field
The present invention relates to welding material, particularly a kind of lead-free tin solder belongs to the ashbury metal field.
Background technology
Along with developing rapidly of electronics industry, requirement to electronic product is more and more higher. and the used scolder kind of present electronic product is a lot, but great majority still use tin one metal scolder, because tin-lead solder is leaded to have pollution to environment, be pernicious to people, thereby a lot of country begins to ban use of solder containing pb.And existing lead-free solder majority is Xi-Yin, tin-copper, tin-silver-copper, tin-zinc-indium-bismuth, tin-silver alloy, and its weak point is the fusing point height that has, and the wetability that has is little, the cost height that has.
Summary of the invention
The objective of the invention is to overcome the shortcoming and the weak point of above-mentioned prior art, provide that a kind of to have a fusing point low, wetability is good, the lead-free solder that cost is low, thus the welding material of high-quality is provided for the processing and manufacturing of electronic product.
Purpose of the present invention is achieved through the following technical solutions:
A kind of lead-free solder, the mass percent of its component is: silver-colored 0.5-6%, copper 0.1-2%, indium 0.0001-1%, phosphorus 0.0001-1%, surplus is a tin; The preparation method of this scolder is as follows:
(1) silver ingot of the refined tin of stanniferous 99.95% and argentiferous 99.99% mass ratio by 70: 30 is added crucible and inserts the intermediate frequency furnace melting, vacuum nitrogen filling gas is warming up to 1200 ℃, is incubated 3 hours, stirred 30 minutes, the tin silver intermediate alloy ingot of argentiferous 30% is cast in the cooling of coming out of the stove;
(2) the smart copper of the refined tin of stanniferous 99.95% and cupric 99.95% mass ratio by 70: 30 is added crucible and inserts the intermediate frequency furnace melting, vacuum nitrogen filling gas is warming up to 900 ℃, is incubated 3 hours, stirred the tin copper intermediate alloy ingot that cupric 30% is cast in the cooling of coming out of the stove 30 minutes;
(3) the tin grain with stanniferous 99.95% is put in the Muffle furnace with the indium grain that contains indium 99.95%, and wherein the mass ratio of tin and indium is 95: 5, and smelting temperature is 350 ℃, be incubated 2 hours, stirred 30 minutes, left standstill 30 minutes, the tin indium intermediate alloy ingot that contains indium 5% is cast in the cooling of coming out of the stove;
(4) take by weighing the tin silver intermediate alloy ingot 1.67-20 part of (1) by quality, the tin copper intermediate alloy ingot 1-20 part of (2), the tin indium intermediate alloy ingot 0.002-20 part of (3), phosphorus 0.0001-1 part, can and aforementioned four kinds of materials can gather together enough 100 parts of surplus tin; The other materials that dephosphorization is outer adds in the manganese alloy pot and places the intermediate frequency furnace melting, and vacuum nitrogen filling gas is warming up to 450 ℃, carries out stirring in 1 hour, and uniform decrease in temperature slowly adds the phosphorus that weighs up, and continues to stir when temperature drops to 340 ℃ then;
(5) the alloy liquation that stirs is poured in the mould, be cast into the lead-free solder rod, obtain product of the present invention.
The present invention does wooden excellent whipping process Wheat Protein, and alloy appearance liquid leaves standstill and can make the alloy grain refinement in 30 minutes, improves the wetability of scolder; Add phosphorus effect be: can prevent that the oxidation piece from appearring in scolder, the flowability of scolder makes scruff obviously reduce simultaneously when improving weld job, and the brightness of solder joint increases.The indium that adds in this product is a tetragonal structure, and fusing point is very low, and reflective is good, good corrosion resistance.
Warp is to sample detection, and the scolder product that make according to this method obtain following data:
Diffusion and wetability all improve to some extent; Through at 200 times of metallography microscope sem observations, find the crystalline phase even tissue, grain refinement.
Compare with prior art, the present invention has following advantage and effect:
Metallographic is more even, and more refinement has improved wetability, elongation, welding performance;
This product has good welding performance to wire rod, transformer, and easier and base material (Gu material) produces
Give birth to good affinity, the solder joint light, full.
The specific embodiment
Below in conjunction with embodiment the utility model is done further to specify, but content of the present invention is not limited to embodiment.
Because machine is same mutually for the fusing point of silver, copper, tin, phosphorus and tin, wherein the fusing point of silver, copper is higher, and is also this than the precious metal addition in order to prepare the more accurate grasp indium in scene for the fusing point in the smelting of balance tinbase, can adopt the method for producing intermediate alloy.Intermediate alloy and preparation method thereof is as follows: tin silver intermediate alloy: with the silver ingot of the refined tin of stanniferous 99.95% and argentiferous 99.99% by 70: 30 mass ratio adding crucible and insert the intermediate frequency furnace melting, vacuum nitrogen filling gas, be warming up to 1200 ℃, be incubated 3 hours, stirred 30 minutes, the tin silver intermediate alloy ingot of argentiferous 30% is cast in the cooling of coming out of the stove.
Tin copper intermediate alloy: the smart copper of the refined tin of stanniferous 99.95% and cupric 99.95% mass ratio by 70: 30 is added crucible and inserts the intermediate frequency furnace melting, vacuum nitrogen filling gas is warming up to 900 ℃, is incubated 3 hours, stirred the tin copper intermediate alloy ingot that cupric 30% is cast in the cooling of coming out of the stove 30 minutes.
Tin indium intermediate alloy: the tin grain and the indium grain that contains indium 99.95% of stanniferous 99.95% are put in the Muffle furnace, and wherein the mass ratio of tin and indium is 95: 5, and smelting temperature is 350 ℃, be incubated 2 hours, stirred 30 minutes, left standstill 30 minutes, the tin indium intermediate alloy ingot that contains indium 5% is cast in the cooling of coming out of the stove.
After having prepared above-mentioned intermediate alloy, when making product of the present invention, can:
(1) takes by weighing the tin silver intermediate alloy ingot of 1# in the following table, tin copper intermediate alloy ingot, tin indium intermediate alloy ingot, the refined tin of phosphorus and stanniferous 99.95% by quality to the given umber of 12# scheme.
(2) tin silver intermediate alloy ingot, tin copper intermediate alloy ingot, tin indium intermediate alloy ingot and the surplus tin that takes by weighing is added in the stainless-steel pan, be warming up to 480-520 ℃ and carry out melting, stirred again by one hour, alloy is produced, uniform decrease in temperature slowly adds the phosphorus that weighs up and also continues to stir when temperature drops to 340 ℃ then;
(3) scolder that stirs is poured in the mould, be cast into the lead-free solder rod, obtain product of the present invention.
The component percentage composition table of the raw material mass mixture ratio of several prods and corresponding product thereof
| The embodiment numbering | 1# | 2# | 3# | 4# | 5# | 6# | ||
| The raw material mass fraction | Sn-ag alloy | 1.67 | 2.67 | 6.67 | 13.33 | 20 | 3.6 | |
| Gun-metal | 0.33 | 1.67 | 3.33 | 5 | 6.67 | 5 | ||
| Tin-indium alloy | 0.002 | 0.2 | 2 | 10 | 20 | 20 | ||
| Phosphorus | 0.0001 | 0.01 | 0.1 | 0.5 | 1 | 0.5 | ||
| Tin | 99.9979 | 95.45 | 97.9 | 71.17 | 52.33 | 70.9 | ||
| Product component (surplus tin) | Silver | 0.5 | 0.8 | 2 | 4 | 6 | 0.09 | |
| Copper | 0.1 | 0.5 | 1 | 1.5 | 2 | 1.5 | ||
| Indium | 0.0001 | 0.01 | 0.1 | 0.5 | 1 | 1 | ||
| Phosphorus | 0.0001 | 0.01 | 0.1 | 0.5 | 1 | 0.5 | ||
| The embodiment numbering | 7# | 8# | 9# | 10# | 11# | 12# | ||
| The raw material mass fraction | Sn-ag alloy | 20 | 13.33 | 2.67 | 1.67 | 4.8 | 6 | |
| Gun-metal | 0.33 | 1.67 | 5 | 6.67 | 6.67 | 5 | ||
| Tin-indium alloy | 0.002 | 0.2 | 10 | 20 | 10 | 20 | ||
| Phosphorus | 1 | 0.5 | 0.01 | 0.0001 | 1 | 1 | ||
| Tin | 78.668 | 84.3 | 82.32 | 81.6599 | 77.53 | 68 | ||
| Product component (surplus tin) | Silver | 6 | 4 | 0.8 | 0.5 | 0.12 | 0.15 | |
| Copper | 0.1 | 0.5 | 1.5 | 2 | 2 | 1.5 | ||
| Indium | 0.0001 | 0.01 | 0.5 | 1 | 0.5 | 1 | ||
| Phosphorus | 1 | 0.5 | 0.01 | 0.0001 | 1 | 1 | ||
Claims (2)
1. a lead-free solder is characterized in that, the constituent mass percentage of this scolder is: silver-colored 0.5-6%, and copper 0.1-2%, indium 0.0001-1%, phosphorus 0.0001-1%, surplus is a tin;
The preparation method of this scolder is as follows:
(1) silver ingot of the refined tin of stanniferous 99.95% and argentiferous 99.99% mass ratio by 70: 30 is added crucible and inserts the intermediate frequency furnace melting, vacuum nitrogen filling gas is warming up to 1200 ℃, is incubated 3 hours, stirred 30 minutes, the tin silver intermediate alloy ingot of argentiferous 30% is cast in the cooling of coming out of the stove;
(2) the smart copper of the refined tin of stanniferous 99.95% and cupric 99.95% mass ratio by 70: 30 is added crucible and inserts the intermediate frequency furnace melting, vacuum nitrogen filling gas is warming up to 900 ℃, is incubated 3 hours, stirred the tin copper intermediate alloy ingot that cupric 30% is cast in the cooling of coming out of the stove 30 minutes;
(3) the tin grain with stanniferous 99.95% is put in the Muffle furnace with the indium grain that contains indium 99.95%, and wherein the mass ratio of tin and indium is 95: 5, and smelting temperature is 350 ℃, be incubated 2 hours, stirred 30 minutes, left standstill 30 minutes, the tin indium intermediate alloy ingot that contains indium 5% is cast in the cooling of coming out of the stove;
(4) take by weighing the tin silver intermediate alloy ingot 1.67-20 part of (1) by quality, the tin copper intermediate alloy ingot 1-20 part of (2), the tin indium intermediate alloy ingot 0.002-20 part of (3), phosphorus 0.0001-1 part, can and aforementioned four kinds of materials can gather together enough 100 parts of surplus tin; The other materials that dephosphorization is outer adds in the manganese alloy pot and places the intermediate frequency furnace melting, and vacuum nitrogen filling gas is warming up to 450 ℃, carries out stirring in 1 hour, and uniform decrease in temperature slowly adds the phosphorus that weighs up, and continues to stir when temperature drops to 340 ℃ then;
(5) the alloy liquation that stirs is poured in the mould, be cast into the lead-free solder rod, obtain product of the present invention.
2. lead-free solder according to claim 1 is characterised in that the mass percent of its component is: silver-colored 0.8-4%, copper 0.5-1.5%, indium 0.1-1%, phosphorus 0.1-1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100330806A CN100478115C (en) | 2006-01-20 | 2006-01-20 | Lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100330806A CN100478115C (en) | 2006-01-20 | 2006-01-20 | Lead-free solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1806998A true CN1806998A (en) | 2006-07-26 |
| CN100478115C CN100478115C (en) | 2009-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100330806A Expired - Fee Related CN100478115C (en) | 2006-01-20 | 2006-01-20 | Lead-free solder |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100430178C (en) * | 2006-11-23 | 2008-11-05 | 太仓市南仓金属材料有限公司 | Lead-free anti-oxidation alloy of lead-free soldering flux, prepn. method and use thereof |
| CN112342417A (en) * | 2020-11-17 | 2021-02-09 | 昆明理工大学 | Tin-based solder and preparation method thereof |
| TWI728842B (en) * | 2020-06-12 | 2021-05-21 | 大陸商重慶群崴電子材料有限公司 | Lead-free solder and manufacturing method thereof |
-
2006
- 2006-01-20 CN CNB2006100330806A patent/CN100478115C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100430178C (en) * | 2006-11-23 | 2008-11-05 | 太仓市南仓金属材料有限公司 | Lead-free anti-oxidation alloy of lead-free soldering flux, prepn. method and use thereof |
| TWI728842B (en) * | 2020-06-12 | 2021-05-21 | 大陸商重慶群崴電子材料有限公司 | Lead-free solder and manufacturing method thereof |
| CN112342417A (en) * | 2020-11-17 | 2021-02-09 | 昆明理工大学 | Tin-based solder and preparation method thereof |
| CN112342417B (en) * | 2020-11-17 | 2022-03-15 | 昆明理工大学 | Tin-based solder and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN100478115C (en) | 2009-04-15 |
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Granted publication date: 20090415 Termination date: 20170120 |