CN1927525B - Silver-free tin-bismuth-copper leadless solder and preparation method - Google Patents
Silver-free tin-bismuth-copper leadless solder and preparation method Download PDFInfo
- Publication number
- CN1927525B CN1927525B CN2006100892574A CN200610089257A CN1927525B CN 1927525 B CN1927525 B CN 1927525B CN 2006100892574 A CN2006100892574 A CN 2006100892574A CN 200610089257 A CN200610089257 A CN 200610089257A CN 1927525 B CN1927525 B CN 1927525B
- Authority
- CN
- China
- Prior art keywords
- solder
- silver
- bismuth
- pure
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a tin-base leadless solder without silver, and relative production. Wherein, it comprises Bi at 7.5-60% (without 7.5%), Cu at 0.1-3.0%, and the left is tin; and it also can contain Zn, Ni, P, Ge, Ga, In, Al, La, Ce, Sb, Cr, Fe, Mn, or Co while the total amount of micro alloy element is not higher than 1.0%. And the production comprises that in protective gas or vacuum, smelting middle alloy Sn-Cu10; then smelting into leadless solder alloy ingot which can be used as solder directly or be made into bar band, wire plate or powder. The inventive solder has low cost while its fusion point can be controlled between 140 and 230Deg. C. And it has strong anti-oxidization and anti-corrosion properties.
Description
Technical field
The present invention relates to the manufacturing technology field of tin-base lead-free solder, particularly a kind of tin bismuth cuprum series leadless solder that does not have silver and preparation method thereof.
Background technology
Scolder is widely used in connection materials such as electronic apparatus, yet, should have processing performance good (fusing point is low, wetability good, anticorrosive antioxygenic property is good, mechanical property is good, good conductivity), technology yield height (spreading rate is fast, solder yield is high, slagging rate height), welding spot reliability good (solder joint bond strength height, creep-resistant property good), operation easily, characteristics such as with low cost as a kind of novel Lead-free Electronics Packaging scolder.
Several big alloy system of current lead-free solder development: Sn-Ag system (comprising Sn-Ag-Cu system), Sn-Cu system, Sn-Zn system, Sn-Bi system, weigh as value equation according to the user, all having intrinsic defective: Sn-Ag is that scolder can provide good reliability and technology yield, but contain more Ag, cost is higher, and the antioxidant anticorrosive performance is unsatisfactory; The acquisition with low cost, easy of Sn-Cu eutectic system scolder and modified alloy thereof, but soldering reliability, technology yield and anti-oxidant aspect have certain problem; And the most serious problem be these two kinds of system scolders than original general Sn-Pb scolder fusing points high a lot (about 34～44 ℃), this is a huge test for the equipment that is generally used for the Sn-Pb welding, also is the obstacle of leadless process maximum.Although the Sn-Zn scolder has remarkable advantages on fusing point and cost, the non-oxidizability that its activity causes is difficult to system with the coupling solder flux of sprawling the aspect and cause thus and joins selection etc., and it obviously is in a disadvantageous position; The Sn-Bi scolder has that fusing point is low, convenient welding, efficient advantages of higher, but its reliability aspect with and intrinsic drawback under the higher temperature applications occasion also be to impel the fundamental driving force of its modification or innovation.Japanese patent application 2-70033 for this reason, 5-228685 and 8-132277 disclose a series of scolders, yet owing to all contain Ag in these patent composition, have increased the consumption of war preparedness resource Ag, have also increased the cost of scolder.U.S. Pat Patent 6,180, the 264 disclosed Sn-Bi-Cu component (Cu that contain 0.1-2.0%, the Bi of 1.0-7.5%), although got rid of the use of Ag, but lower Bi and Cu content have determined it to be the scolder of high tin content, and just inevitably there is high tin defects in this: as to corrosion of container, equipment or the like, and lower Bi content is limited to the effect that drags down the scolder fusing point.
For overcoming above-mentioned defective, Sn-Bi-Cu system scolder of the present invention contains the Bi of high level, in order to reduce the scolder fusing point; In addition, Cu is identical with the scolder baseplate material, its wetability and bond strength have been increased, and the adding of Cu has improved the fusing point and the reliability of Sn-Bi scolder accordingly, its under rigorous environment more (as higher serviceability temperature condition, the device of vibration etc. is arranged) used become possibility, and can make its fusing point and Sn-Pb approaching by the composition adjustment, reducing has lead welding to connect the unleaded conversion cost and the service life of equipment.In addition, Sn and Bi lay in a large number in China in the world, and that Ag compares other countries at the deposit of China is less, and it is of many uses, Chang Zuowei war preparedness resource, therefore wideling popularize the Sn-Bi-Cu that does not have silver in this " the big processing factory in the world "-China is scolder, to the lead-free solder industry of development China, catches up with and surpasses developed country fast and has important effect.
Summary of the invention
One of purpose of the present invention is the problem that exists in the existing lead-free solder, proposes the low-cost lead-free solder of Sn-Bi-Cu system that a kind of fusing point approaches the no silver that Sn-Pb scolder, wetting and spreading are all good, the technology yield better, it is comparatively stable to use, anti-oxidant corrosion resistance is good.
The objective of the invention is to reach by the following technical programs:
A kind of tin bismuth cuprum series leadless solder that does not have silver, it is characterized in that, percentage meter by weight, bismuth: 7.5～60% (not comprising 7.5%), copper: 0.1～3%, surplus is a tin, and this scolder is not got rid of one or more of microalloy elements such as containing zinc, nickel, phosphorus, germanium, gallium, indium, aluminium, lanthanum, cerium, antimony, chromium, iron, manganese, cobalt, and microalloy element content total amount should be no more than 1.0%.
The above-described tin bismuth cuprum series leadless solder that does not have silver is characterized in that percentage meter by weight, bismuth: 10～40%, and copper: 0.5～1.5%, surplus is a tin.
The above-described tin bismuth cuprum series leadless solder that does not have silver is characterized in that percentage meter by weight, bismuth: 15～35%, and copper: 0.5～1.5%, surplus is a tin.
The above-described tin bismuth cuprum series leadless solder that does not have silver, it is characterized in that percentage meter by weight, bismuth: 15～35%, copper: 0.5～1.5%, surplus is a tin, for improving non-oxidizability, improving wetting and spreading and also added as one or more of indium (In), phosphorus (P), germanium (Ge), gallium (Ga), rare earth microalloy elements such as (lanthanum, ceriums); For the reliability that improves solder joint has also added as one or more of zinc (Zn), nickel (Ni), indium (In), germanium microalloy elements such as (Ge), added one or more of nickel (Ni), antimony (Sb), aluminium (Al), chromium (Cr), iron (Fe), manganese (Mn), cobalt microalloy elements such as (Co) for improving the solder joint mechanical property, microalloy element content total amount should be no more than 1.0%.
The above-described tin bismuth cuprum series leadless solder that does not have silver is characterized in that percentage meter by weight, bismuth: 15～35%, and copper: 0.5～1.5%, indium: 0.001～1.0%, surplus is a tin.
The above-described tin bismuth cuprum series leadless solder that does not have silver is characterized in that percentage meter by weight, bismuth: 15～35%, and copper: 0.5～1.5%, nickel: 0.01～0.1%, germanium: 0.01～0.05%, surplus is a tin.
The above-described tin bismuth cuprum series leadless solder that does not have silver is characterized in that percentage meter by weight, bismuth: 15～35%, and copper: 0.5～1.5%, zinc: 0.5～1.0%, surplus is a tin.
The above-described tin bismuth cuprum series leadless solder that does not have silver is characterized in that percentage meter by weight, bismuth: 15～35%, and copper: 0.5～1.5%, gallium and phosphorus: 0.1～0.5%, surplus is a tin.
Another object of the present invention provides the above preparation method who does not have the tin bismuth cuprum series leadless solder of silver.This purpose reaches by the following technical programs:
A kind of preparation method who does not have the tin bismuth cuprum series leadless solder of silver, its step is as follows:
1. the pure Sn that will weigh up in proportion earlier is melted to 650 ℃ in inert gas atmosphere or vacuum induction melting stove, adds the pure Cu sheet that weighs up, and stirs and is melted to 500～600 ℃ of furnace temperature, stirs insulation 10 minutes, pours into square little ingot and is prepared into the Sn-Cu intermediate alloy;
2. take by weighing the 1. Sn-Cu intermediate alloy of middle gained of step in proportion, pure bismuth and pure tin; Again pure tin is melted in resistance furnace and be heated to 300 ℃, add load weighted pure bismuth and Sn-Cu intermediate alloy successively, be heated to 300 ℃, insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃ insulation 10min, pull out the surface oxidation slag, be cast in and make ingot blank in the mould.
The above-described preparation method who does not have the tin bismuth cuprum series leadless solder of silver is characterized in that, with step 2. the gained ingot blank pour into ingot blank 200～350 ℃ of fusings, directly use, or make band, filament plate or roll sheet and use as scolder (wave-soldering).
The above-described preparation method who does not have the tin bismuth cuprum series leadless solder of silver is characterized in that, with step 2. the gained ingot blank utilize aerosolization or centrifugal atomizing or sound atomization technique to be prepared into alloy welding powder 200～350 ℃ of fusings as the soldering paste base-material.
Beneficial effect: the tin bismuth cuprum series leadless solder that the present invention does not have silver has the pre-arcing characterisitics close with Sn-Pb, thereby the unleaded conversion of equipment is become simply, and obviously reduces the high temperature secondary effect of welding process to components and parts; Lead-free solder of the present invention is compared the more lead-free solder of present application and is had lower Sn content, thereby has reduced high tin risk; Patent of the present invention does not contain noble metal silver, has saved the consumption of war preparedness resource Ag, has reduced material cost; In addition, experiment shows that the tin bismuth cuprum series leadless solder that does not have silver of the present invention has good solder wettability and non-oxidizability.
The present invention is described in detail below by drawings and Examples.It should be understood that described embodiment only relates to the preferred embodiments of the invention, do not breaking away under the spirit and scope of the present invention situation that the changes and improvements of various compositions and content all are possible.
For ease of comparing, tin bismuth cuprum series leadless solder and the traditional Sn-Pb37 eutectic solder that does not have silver of the present invention all obtains under aforementioned the same terms.
Description of drawings
Fig. 1 does not have preparation technology's flow chart of the tin bismuth cuprum series leadless solder of silver for the present invention;
Fig. 2 sprawls comparison diagram for the solder joint of the tin bismuth cuprum series leadless solder that does not have silver of the present invention and SnPb37 and SnAg3.0Cu0.5, SnBi58 scolder;
Fig. 3 is the DSC differential thermal analysis curve figure of tin bismuth cuprum series leadless solder of the no silver of the embodiment of the invention.
The specific embodiment
As shown in Figure 1, the preparation technology's flow chart that does not have the tin bismuth cuprum series leadless solder of silver for preparation the present invention.Among the figure: 1 is raw material preparation and weighing, and 2 is the melting preparation of intermediate alloy ingot blank, the preparation of 3 prealloy scolder ingot blanks, and 4 is the preparation of scolder ingot blank, and 5 is the preparation of solder bar, band, silk, plate and sheet, and 6 is the preparation of scolder powder.
Embodiment 1
The preparation of Sn-Bi8-Cu0.5: prepare Sn-Cu10 intermediate alloy 5.0kg in the induction furnace frequently in a vacuum, in the preparation process: 1. earlier load weighted pure Sn is melted to 650 ℃ in the vacuum induction melting stove, add the pure Cu sheet that weighs up, stirring is melted to 500～600 ℃ of furnace temperature, stir insulation 10 minutes, pour into square little ingot and be prepared into the Sn-Cu10 intermediate alloy; 2. analyze the uniformity of intermediate alloy composition.Take by weighing Sn-Cu10 intermediate alloy 5g, pure Bi8g, pure Sn87g.Again pure Sn is melted in resistance furnace and be heated to 300 ℃, add load weighted pure Bi and Sn-Cu10 intermediate alloy successively, be heated to 300 ℃ of insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃ insulation 10min, pull out the surface oxidation slag, be cast in that to make ingot blank in the ingot mold standby, this ingot blank promptly can be used as the scolder ingot that wave-soldering uses and directly uses.
The preparation of Sn-Bi15-Cu0.1: the preparation of intermediate alloy is with example 1.Take by weighing Sn-Cu10 intermediate alloy 1.0g, pure Bi15g, pure Sn84g.Again pure Sn is melted in resistance furnace and be heated to 300 ℃, add load weighted pure Bi and Sn-Cu10 intermediate alloy successively, be heated to 300 ℃ of insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃ insulation 10min, pull out the surface oxidation slag, be cast in and make the lead-free solder bar in the bar shaped mould.
The preparation of Sn-Bi58-Cu3.0: the preparation of intermediate alloy is with example 1.Take by weighing Sn-Cu10 intermediate alloy 30g, pure Bi58g, pure Sn12g.Again pure Sn is melted in resistance furnace and be heated to 300 ℃, add load weighted pure Bi and Sn-Cu10 intermediate alloy successively, be heated to 300 ℃ of insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃ insulation 10min, be cast in then and make lead-free solder sheet material in the flat plate mold.
The preparation of Sn-Bi9.5-Cu0.5: the preparation of intermediate alloy is with example 1.Take by weighing Sn-Cu10 intermediate alloy 5.0g, pure Bi9.5g, pure Sn85.5g.Again pure Sn is melted in resistance furnace and be heated to 300 ℃, add load weighted pure Bi and Sn-Cu10 intermediate alloy successively, be heated to 300 ℃ of insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃ insulation 10min, alloy liquid is cast directly on the chill roll that rotation rotates along the stem bar of a special pore size distribution forms the scolder band.
The preparation of Sn-Bi17.5-Cu0.5-In1.0: the preparation of intermediate alloy is with example 1.Take by weighing Sn-Cu10 intermediate alloy 5g, pure Bi17.5g, pure In1.0g, pure Sn76.5g.Again pure Sn is melted in resistance furnace and be heated to 300 ℃, add load weighted pure Bi and Sn-Cu10 intermediate alloy successively, add metal In at last, be heated to 300 ℃ of insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with behind ingot casting remelting to the 250 ℃ insulation 10min, suction pouring and then directly is drawn into a material with bar and uses as the centreless welding wire in mould.
The preparation of Sn-Bi17.5-Cu0.5-Ni0.05-Ge0.02: the preparation of intermediate alloy is with example 1, difference is with it, in preparation Sn-Ni10 (or Sn-Ge5) the intermediate alloy process: pure Sn that will weigh up earlier and pure Ni (or pure Sn and pure Ge) are melted to 950 ℃ (or 550 ℃) in the induction furnace in a vacuum frequently, stir insulation 10 minutes, pour into square little ingot and be prepared into Sn-Ni10 (or Sn-Ge5) intermediate alloy, analyze homogeneity of ingredients.Take by weighing Sn-Cu10 intermediate alloy 5.0g, pure Bi17.5g, Sn-Ni10 intermediate alloy 0.5g, Sn-Ge5 intermediate alloy 0.4g, pure Sn76.6g.Earlier pure Sn is melted in resistance furnace and be heated to 300 ℃, add Sn-Cu10 intermediate alloy, pure Bi successively, Sn-Ni10 intermediate alloy and Sn-Ge5 intermediate alloy, be heated to 300 ℃ of insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃ insulation 10min, pull out the surface oxidation slag, be cast in that to make ingot blank in the mould stand-by.
The preparation of Sn-Bi17.5-Cu0.5-Ga0.2-P0.05: the preparation of intermediate alloy is with example 1, difference is with it, in the preparation Sn-P5 intermediate alloy process: the pure Sn that will weigh up earlier is melted to 500～600 ℃ in pressure furnace, be poured in the mould that red P powder is housed, insulation 10 minutes is stirred in remelting after treating alloy graining, pour into square little ingot and be prepared into the Sn-P5 alloy, analyze homogeneity of ingredients.Take by weighing Sn-Cu10 intermediate alloy 5.0g, pure Bi17.5g, Sn-P5 intermediate alloy 1.0g, pure Ga0.2g, pure Sn76.3g.Earlier pure Sn is melted in resistance furnace and be heated to 300 ℃; add pure Bi and Sn-Cu10 intermediate alloy, Sn-P5 intermediate alloy and simple substance Ga successively; be heated to 300 ℃ of insulation 10min; be cast in the cylindrical mold; treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃; under nitrogen protection atmosphere, adopt the ultrasonic atomizatio technology to be prepared into spherical alloy welding powder, give over to the preparation lead-free tin cream.
The preparation of Sn-Bi17.5-Cu0.5-Zn1.0: the preparation of intermediate alloy is with example 1, difference is with it, in the preparation Sn-Zn9 alloy process: pure Sn that will weigh up in proportion earlier and pure Zn stir in the stove in a vacuum and are melted to 500～600 ℃ of furnace temperature, stir insulation 10 minutes, pour into square little ingot and be prepared into the Sn-Zn9 alloy, analyze homogeneity of ingredients.Take by weighing Sn-Cu10 intermediate alloy 5.0g, pure Bi17.5g, Sn-9Zn alloy 11.1g, pure Sn66.4g.Earlier pure Sn is melted in resistance furnace and be heated to 300 ℃, add pure Bi and Sn-Cu10 intermediate alloy, Sn-Zn9 alloy successively, be heated to 300 ℃ of insulation 10min, be cast in the cylindrical mold, treat ingot casting solidify fully after again with ingot casting remelting to 250 ℃ insulation 10min, pull out the surface oxidation slag, be cast in that to make ingot blank in the mould stand-by.
As shown in Figure 2, for the solder joint of the tin bismuth cuprum series leadless solder that does not have silver of the present invention and SnPb37 and SnAg3.0Cu0.5, SnBi58 scolder is sprawled comparison diagram, wherein above row's (a) usefulness be that the synthetic colophony type scaling powder of CR22LU type prepares; Below a row (b) formulated for the general solder flux that contains the Pb scolder.
All be followed successively by SnPb37, Sn-Bi17-Cu0.5, SAC305, SnBi58 among Fig. 2 from left to right.According to Japanese JIS standard the 0.2+0.001g scolder being placed on purity is on 99.9% the copper plate, is incubated 90s on 250 ℃ of thermostatic electrothermal plates, takes with digital camera behind the air cooling.Before the experiment, copper coin sand paper fine grinding is cleaned with acetone and is removed greasy dirt and dip 5s removal surface film oxide in 10%HCl, fully washes with deionized water again, and what use among this test a figure is the synthetic colophony type scaling powder preparation of CR22LU type; Formulated among the b figure for the general solder flux that contains the Pb scolder.As can be seen from Figure 2: the tin bismuth cuprum series leadless solder that does not have silver of the present invention SnPb37 at present has suitable spreading area, and than the surperficial rounding of SnBi58 scolder, full.The tin bismuth cuprum series leadless solder that this explanation the present invention does not have silver has spreading property preferably, the stronger anti-ability of subsiding, thereby makes scolder of the present invention have good solderability, and can reduce the generation of solder shorts.
As shown in Figure 3, be the DSC differential thermal analysis curve figure that does not have the tin bismuth cuprum series leadless solder of silver of the present invention.This experiment uses DSC2910 difference formula scanning calorimeter (TA Instru-ment) to measure the fusing point of alloy, carries out the fusion temperature analysis, and technological parameter is according to Japanese JIS-Z3198 standard test.Alloy numbering and composition contrast are as table 5 among the figure.Fig. 3 is as can be seen: the tin bismuth cuprum series leadless solder that does not have silver of the present invention has lower fusing point (140～230 ℃), and difference along with constituent element content, alloy DSC curve is obviously different, and is the rule variation along with the difference of constituent element content: the increase of Cu helps alloy melting point to 180 ℃ close (Fig. 3 a to 3d) under the identical Bi content condition; The increase fusing point of Bi obviously reduces under the identical Cu content condition, but bimodal (Fig. 3 e to 3g) appears in DSC curve (10＜Bi＜50) in certain Bi content range, the proof alloy has segregation to take place, and this mainly is that alloy near is similar to the balance fusion process owing to heat up slowly when carrying out the DSC test.This explanation adopts this kind scolder should adopt the solid technology of nearly fast condensation to avoid segregation serious in welding process.
Table 1 is the component content analysis tabulation of lead-free solder intermediate alloy;
Table 2 does not have the one-tenth assignment system table of silver lead-free solder for the present invention;
Table 3 does not have relatively abridged table of the performance of silver lead-free solder and traditional Sn-Pb37 scolder and SnAg3.0Cu0.5, SnBi58 scolder for the present invention.
Table 4 is the mechanical property table that has added the lead-free solder of modifying element.
Table 5 is the no silver-colored Sn-Bi-Cu scolder numbering-composition correspondence table of typical case.
Table 1
| Lead-free solder and intermediate alloy constituent content chemical analysis | Cu(wt％) | Ni(wt％) | Ge(wt％) | Zn(wt％) | P(wt％) |
| Sn-Cu10 | 9.84 | - | - | - | - |
| Sn-Ni10 | - | 9.56 | - | - | - |
| Sn-Ge5 | - | - | 4.38 | - | - |
| Sn-Zn9 | - | - | - | 8.90 | - |
| Sn-P5 | - | - | - | - | 4.69 |
Table 2
| Alloying component | SnCu10 (g) | Bi (g) | Sn (g) | SnP5 (g) | SnGe5 (g) | SnNi10 (g) | SnZn9 (g) | In (g) | Ga (g) | Add up to (g) |
| Sn-Bi8-Cu0.5 | 5 | 8 | 87 | - | - | - | - | - | - | 100 |
| Sn-Bi15-Cu0.1 | 1 | 15 | 84 | - | - | - | - | - | - | 100 |
| Sn-Bi58-Cu3.0 | 30 | 58 | 12 | - | - | - | - | - | - | 100 |
| Sn-Bi9.5-Cu0.5 | 5 | 9.5 | 85.5 | - | - | - | - | - | - | 100 |
| Sn-Bi17.5-Cu0.5-In1.0 | 5 | 17.5 | 76.5 | - | - | - | - | 1 | - | 100 |
| Sn-Bi17.5-Cu0.5-Ni0.05 -Ge0.02 | 5 | 17.5 | 76.6 | - | 0.4 | 0.5 | - | - | - | 100 |
| Sn-Bi17.5-Cu0.5-Ga0.2- P0.05 | 5 | 17.5 | 76.3 | 1 | - | - | - | - | 0.2 | 100 |
| Sn-Bi17.5-Cu0.5-Zn1.0 | 5 | 17.5 | 66.4 | - | - | - | 11.1 | - | - | 100 |
Table 3
| Alloy nomenclature | Density (g/cm 3) | Fusing point (℃) | Spreading area (mm 2/0.2g) | Tensile strength (σ b:MPa) | Resistivity (μ Ω cm) |
| Sn-Bi8-Cu0.5 | 7.51 | 190-200 | 50.47 | 31.5 | 27.54 |
| Sn-Bi15-Cu0.1 | 7.68 | 150-180 | 50.47 | 31.5 | 27.54 |
| Sn-Bi58-Cu3.0 | 8.796 | 140-170 | 49.06 | 29.5 | 34.2 |
| Sn-Bi9.5-Cu0.5 | 7.55 | 195-200 | 49.06 | 29.5 | 27.63 |
| Sn-Bi17.5-Cu0.5-In1.0 | 7.75 | 190-210 | 49.77 | 32.0 | 27.53 |
| Sn-Bi17.5-Cu0.5-Ni0.05- Ge0.02 | 7.75 | 190-210 | 51.90 | 33.0 | 27.59 |
| Sn-Bi17.5-Cu0.5-Ga0.2-P 0.05 | 7.74 | 190-210 | 50.68 | 35.0 | 27.60 |
| Sn-Bi17.5-Cu0.5-Zn1.0 | 7.74 | 190-210 | 51.90 | 33.0 | 27.59 |
| Sn-Pb37 | 8.4 | 183 | 49.52 | 30.5 | 13.3 |
| Sn-Bi58 | 8.75 | 139 | 49.21 | 34 | 34.4 |
| Alloy nomenclature | Density (g/cm 3) | Fusing point (℃) | Spreading area (mm 2/0.2g) | Tensile strength (σ b:MPa) | Resistivity (μ Ω cm) |
| Sn-Ag3.0-Cu0.5 | 7.37 | 217-221 | 65.59 | 45 | 12 |
| Sn-Cu0.7 | 7.31 | 227 | 62.38 | 22 | 12.9 |
Table 4
| The alloy numbering | Host element (wt%) | Alloying element (wt%) | Intensity (MPa) | Percentage elongation (%) | |||||||||
| Sn | Bi | Cu | Al | La | Ce | Sb | Cr | Fe | Mn | Co | |||
| H1 | Surplus | 17 | 0.5 | 0.01 | - | - | - | - | - | - | - | 43.0 | 2.5 |
| H2 | Surplus | 17 | 0.5 | - | 0.05 | - | - | - | - | - | - | 42.0 | 2.0 |
| H3 | Surplus | 17 | 0.5 | - | - | 0.05 | - | - | - | - | - | 41.8 | 1.7 |
| H4 | Surplus | 17 | 0.5 | - | - | - | 0.5 | - | - | - | - | 36 | 5.8 |
| H5 | Surplus | 17 | 0.5 | - | - | - | - | 0.05 | - | - | - | 50 | 3.4 |
| H6 | Surplus | 17 | 0.5 | - | - | - | - | - | 0.05 | - | - | 48 | 2.8 |
| H7 | Surplus | 17 | 0.5 | - | - | - | - | - | - | 0.1 | - | 40 | 3.9 |
| H8 | Surplus | 17 | 0.5 | - | - | - | - | - | - | - | 0.1 | 46 | 2.7 |
Table 5
| The alloy numbering | 4# | 5# | 6# | 7# | 8# |
| Alloying component | Sn-8Bi-0.5Cu | Sn-10Bi-0.5Cu | Sn-20Bi-0.5Cu | Sn-30Bi-0.5Cu | Sn-10Bi-1Cu |
| The alloy numbering | 9# | 10# | 11# | 12# | 13# |
| Alloying component | Sn-20Bi-1Cu | Sn-30Bi-1Cu | Sn-50Bi-1Cu | Sn-10Bi-2Cu | Sn-20Bi-2Cu |
| The alloy numbering | 14# | 15# | 16# | 19# | 20# |
| Alloying component | Sn-30Bi-2Cu | Sn-50Bi-2Cu | Sn-10Bi-3Cu | Sn-50Bi-3Cu | Sn-50Bi-5Cu |
Claims (3)
1. a tin bismuth cuprum series leadless solder that does not have silver is characterized in that, percentage meter by weight, and bismuth: greater than 7.5% and smaller or equal to 60%, copper: 0.1～3%; Also contain in aluminium, lanthanum, cerium, chromium, manganese, the cobalt one or more, and its content total amount is no more than 1.0%, surplus is a tin.
2. the tin bismuth cuprum series leadless solder that does not have silver according to claim 1 is characterized in that, percentage meter by weight, and bismuth: 10～40%, copper: 0.5～1.5%.
3. the tin bismuth cuprum series leadless solder that does not have silver according to claim 1 is characterized in that, percentage meter by weight, and bismuth: 15～35%, copper: 0.5～1.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100892574A CN1927525B (en) | 2006-08-11 | 2006-08-11 | Silver-free tin-bismuth-copper leadless solder and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100892574A CN1927525B (en) | 2006-08-11 | 2006-08-11 | Silver-free tin-bismuth-copper leadless solder and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1927525A CN1927525A (en) | 2007-03-14 |
| CN1927525B true CN1927525B (en) | 2010-11-24 |
Family
ID=37857746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100892574A Active CN1927525B (en) | 2006-08-11 | 2006-08-11 | Silver-free tin-bismuth-copper leadless solder and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1927525B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160144462A1 (en) * | 2011-08-02 | 2016-05-26 | Alpha Metals, Inc. | High impact solder toughness alloy |
| US10046417B2 (en) | 2011-08-17 | 2018-08-14 | Honeywell International Inc. | Lead-free solder compositions |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101380700B (en) * | 2007-09-05 | 2011-04-20 | 北京康普锡威科技有限公司 | Tin bismuth cuprum series leadless solder and preparation method thereof |
| CN101549441B (en) * | 2008-04-01 | 2011-06-29 | 东莞市中实焊锡有限公司 | Lead-free solder |
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
| CN101569966B (en) * | 2009-06-10 | 2015-11-25 | 上海华庆焊材技术有限公司 | A kind of lead-free tin cream |
| CN102059471B (en) * | 2010-12-29 | 2013-03-20 | 厦门大学 | Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof |
| CN102896435B (en) * | 2011-07-28 | 2015-01-21 | 北京有色金属研究总院 | In-suit reaction type high-temperature lead-free solder paste |
| CN102371439A (en) * | 2011-10-17 | 2012-03-14 | 上海交通大学 | Sn-Cu-Bi-Cr lead-free solder |
| CN102371438A (en) * | 2011-10-17 | 2012-03-14 | 上海交通大学 | Sn-Cu-Bi-Al lead-free solder |
| CN102615447B (en) * | 2012-03-26 | 2014-11-05 | 广东工业大学 | Tin-based lead-free solder and preparation method thereof |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| TWI460046B (en) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
| CN103071942A (en) * | 2013-01-05 | 2013-05-01 | 张家港市东大工业技术研究院 | Low-temperature solder matrix composite solder for synthesizing magnetic-phase particles in situ and preparation method thereof |
| US20150037087A1 (en) * | 2013-08-05 | 2015-02-05 | Senju Metal Industry Co., Ltd. | Lead-Free Solder Alloy |
| TWI482864B (en) * | 2013-08-23 | 2015-05-01 | Univ Nat Formosa | A composition having a damping characteristic, and a damper to which the composition is applied |
| CN106031963A (en) * | 2015-03-11 | 2016-10-19 | 中山翰华锡业有限公司 | A lead-free and silver-free tin bar and a preparation method thereof |
| JP5880766B1 (en) | 2015-05-26 | 2016-03-09 | 千住金属工業株式会社 | Solder alloy, solder ball, chip solder, solder paste and solder joint |
| CN108292610B (en) * | 2015-09-25 | 2023-02-28 | 英特尔公司 | Electronic assembly using bismuth-rich solder |
| JP6504401B2 (en) * | 2015-11-05 | 2019-04-24 | パナソニックＩｐマネジメント株式会社 | Solder alloy and mounting structure using the same |
| CN105499830A (en) * | 2016-03-04 | 2016-04-20 | 保定爱廸新能源股份有限公司 | Sn-Zn system lead-free multi-element alloy for photovoltaic welding strips and method for preparing Sn-Zn system lead-free multi-element alloy |
| CN106216872B (en) * | 2016-08-11 | 2019-03-12 | 北京康普锡威科技有限公司 | A kind of SnBiSb series low-temperature leadless solder and preparation method thereof |
| EP3292943A1 (en) * | 2016-09-12 | 2018-03-14 | Interflux Electronics N.V. | Lead-free solder alloy comprising sn, bi and at least one of p, mn, cu, zn, sb and its use for soldering an electronic component to a substrate |
| CN106695162A (en) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | Lead-free solder for micro-electronics industry and preparation method thereof |
| US11344976B2 (en) * | 2017-11-24 | 2022-05-31 | Senju Metal Industry Co., Ltd. | Solder material, solder paste, and solder joint |
| CN107877031A (en) * | 2017-11-27 | 2018-04-06 | 东莞市千岛金属锡品有限公司 | A kind of lead-free low-temperature solder and preparation method thereof |
| CN108384988A (en) * | 2018-02-02 | 2018-08-10 | 陕西斯瑞新材料股份有限公司 | A kind of preparation method of sn-bi alloy material for High-Voltage Electrical Appliances switch board clump weight |
| CN112518167A (en) * | 2018-04-04 | 2021-03-19 | 史国民 | Corrosion-resistant low-temperature welding material |
| CN108971441A (en) * | 2018-07-13 | 2018-12-11 | 广东省材料与加工研究所 | A kind of supersonic casting method preparing hypereutectic high-temp leadless Sn-Cu solder ingot |
| CN109513747B (en) * | 2018-09-25 | 2020-06-30 | 深圳市兴鸿泰锡业有限公司 | Method for preparing tin-bismuth alloy preformed soldering lug difficult to deform |
| CN109732237A (en) * | 2019-01-02 | 2019-05-10 | 昆明理工大学 | A kind of SnBiCuAgNiCe low temperature lead-free solder alloy |
| KR102187085B1 (en) * | 2019-01-24 | 2020-12-04 | 주식회사 경동엠텍 | lead-free solder composition for high-temperature and vibrational circumstance and manufacturing method thereof |
| CN109955001B (en) * | 2019-03-20 | 2021-08-13 | 中山翰华锡业有限公司 | Lead-free antioxidant solder paste and preparation method thereof |
| US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| FR3101561B1 (en) * | 2019-10-06 | 2023-09-22 | Pruvost Jean Claude Lucien | Lead-free solder alloy called SIA based on Sn and Bi and Cu and Ag additives limited to 1%. |
| CN111390424A (en) * | 2020-04-21 | 2020-07-10 | 深圳市唯特偶新材料股份有限公司 | Tin-plated copper strip coating anti-oxidation solder alloy and preparation method thereof |
| CN112958941B (en) * | 2021-03-19 | 2022-03-29 | 湖南大学 | Sn-Bi-In-Zn-Ga low-melting-point high-entropy alloy lead-free solder and preparation method and application thereof |
| CN114289927A (en) * | 2021-12-28 | 2022-04-08 | 上海大学 | Lead-free solder |
| CN115194363B (en) * | 2022-08-23 | 2024-03-12 | 无锡市斯威克科技有限公司 | Low-melting-point lead-free solder, low-melting-point lead-free solder strip, preparation method and application |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220199A (en) * | 1998-04-27 | 1999-06-23 | 王首盛 | Special-purpose tin-lead solder |
| CN1400081A (en) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN1803376A (en) * | 2006-01-24 | 2006-07-19 | 昆山成利焊锡制造有限公司 | Leadless soft soldering material |
| CN1265934C (en) * | 2003-12-26 | 2006-07-26 | 杨嘉骥 | Anti-oxidation lead-free solder and its preparing method |
-
2006
- 2006-08-11 CN CN2006100892574A patent/CN1927525B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1220199A (en) * | 1998-04-27 | 1999-06-23 | 王首盛 | Special-purpose tin-lead solder |
| CN1400081A (en) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN1265934C (en) * | 2003-12-26 | 2006-07-26 | 杨嘉骥 | Anti-oxidation lead-free solder and its preparing method |
| CN1803376A (en) * | 2006-01-24 | 2006-07-19 | 昆山成利焊锡制造有限公司 | Leadless soft soldering material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160144462A1 (en) * | 2011-08-02 | 2016-05-26 | Alpha Metals, Inc. | High impact solder toughness alloy |
| US10046417B2 (en) | 2011-08-17 | 2018-08-14 | Honeywell International Inc. | Lead-free solder compositions |
| US10661393B2 (en) | 2011-08-17 | 2020-05-26 | Honeywell International Inc. | Lead-free solder compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1927525A (en) | 2007-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1927525B (en) | Silver-free tin-bismuth-copper leadless solder and preparation method | |
| CN101380700B (en) | Tin bismuth cuprum series leadless solder and preparation method thereof | |
| CN1895837B (en) | Sn-Cu-Cr lead-free soldering material and its preparation | |
| CN1895838B (en) | Sn-Ag-Cu-Cr-X lead-free soldering material and its preparation | |
| CN105195915B (en) | Low-temperature lead-free solder alloy | |
| CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
| CN101780607B (en) | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof | |
| CN101417375B (en) | Leadless welding alloy for welding electronic elements | |
| CN101381826B (en) | Sn-Cu base leadless solder alloy and preparation method | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN100494436C (en) | Low melting point leadless welding flux alloy | |
| CN103028863B (en) | A kind of High-anti-oxidation lead-free solder | |
| CN102699563A (en) | Low-silver lead-free soft solder | |
| CN101618484A (en) | Lead-free solder and preparation method thereof | |
| CN112122823A (en) | Preparation method of SnBi-based lead-free solder containing graphene and iron particles | |
| CN103243234B (en) | A kind of Electronic Packaging soldering serial low silver leadless solder and preparation method thereof | |
| CN100467192C (en) | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus | |
| CN110238557B (en) | ZnSn-based high-temperature lead-free solder and preparation method thereof | |
| CN102500946A (en) | Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same | |
| CN100352596C (en) | Lead-free soft brazing alloy containing mixed rare earth and production thereof | |
| CN101081463A (en) | Sn-Ag-Cu-Dy Lead-free solder alloy | |
| JPWO2019198690A1 (en) | Solder paste | |
| CN109926750B (en) | Low-temperature lead-free solder alloy and vacuum casting method thereof | |
| CN101690995A (en) | Low-temperature lead-free solder | |
| CN101392337B (en) | Low melting point lead-free solder alloy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: BEIJING COMPO SOLDER CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20101214 Address after: 100088, 2, Xinjie street, Beijing Co-patentee after: Beijing COMPO Advanced Technology Co.,Ltd. Patentee after: General Research Institute for Nonferrous Metals Address before: 100088, 2, Xinjie street, Beijing Co-patentee before: Beijing Compo Solder Co., Ltd. Patentee before: General Research Institute for Nonferrous Metals |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20190726 Address after: 101407 Beijing city Huairou District Yanqi Park Economic Development Zone No. 6 street Patentee after: Beijing COMPO Advanced Technology Co.,Ltd. Address before: 100088, 2, Xinjie street, Beijing Co-patentee before: Beijing COMPO Advanced Technology Co.,Ltd. Patentee before: General Research Institute for Nonferrous Metals |
|
| TR01 | Transfer of patent right |