CN101417375A - Leadless welding alloy for welding electronic elements - Google Patents
Leadless welding alloy for welding electronic elements Download PDFInfo
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- CN101417375A CN101417375A CNA2007101762375A CN200710176237A CN101417375A CN 101417375 A CN101417375 A CN 101417375A CN A2007101762375 A CNA2007101762375 A CN A2007101762375A CN 200710176237 A CN200710176237 A CN 200710176237A CN 101417375 A CN101417375 A CN 101417375A
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 50
- 239000000956 alloy Substances 0.000 title claims abstract description 50
- 238000003466 welding Methods 0.000 title claims abstract description 28
- 239000011701 zinc Substances 0.000 claims abstract description 25
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 20
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 19
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 18
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000005275 alloying Methods 0.000 claims abstract description 10
- 229910052718 tin Inorganic materials 0.000 claims abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910020994 Sn-Zn Inorganic materials 0.000 claims description 13
- 229910009069 Sn—Zn Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 229910052684 Cerium Inorganic materials 0.000 claims description 9
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 29
- 238000007254 oxidation reaction Methods 0.000 abstract description 15
- 230000003647 oxidation Effects 0.000 abstract description 14
- 230000008018 melting Effects 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 231100000956 nontoxicity Toxicity 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 150000002910 rare earth metals Chemical class 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 6
- 229910020816 Sn Pb Inorganic materials 0.000 description 5
- 229910020922 Sn-Pb Inorganic materials 0.000 description 5
- 229910008783 Sn—Pb Inorganic materials 0.000 description 5
- 238000007792 addition Methods 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 238000003723 Smelting Methods 0.000 description 4
- 229910005728 SnZn Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 239000006023 eutectic alloy Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- -1 rare earth compound Chemical class 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910008457 SnGe Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000007499 fusion processing Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910006414 SnNi Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
- 229910006640 β-Sn Inorganic materials 0.000 description 1
- 229910006632 β—Sn Inorganic materials 0.000 description 1
Abstract
The invention relates to a leadless soldering alloy used for welding of electronic elements and is characterized in that the weight percentage of all the alloying elements is as follows: 5 to 10 percent of zinc, 0.1 to 5 percent of gallium, 0.1 to 1 percent of rare earth elements and tin as the rest. The leadless soldering alloy has the advantages of low alloy cost, proximity of melting point to the traditional solder, better wettability, excellent mechanical performance, no toxicity, no pollution, excellent comprehensive performance and leading the oxidation resistance to be improved greatly, and can meet the requirements of the application fields of leadless solder of the electronic industry, in particular to household appliances and the like.
Description
Technical field
The invention belongs to the metal material technical field, relate to Electronic Packaging brazing material technology, particularly a kind ofly be applicable to the soldering electronic devices and components and do not cause the low-cost lead-free solder alloy of fire damage.
Background technology
Unleadedly become a kind of trend, welding material unleaded, do not have that to poison direction fixed, China is again electronic assemblies big country, carry out the research of unleaded connection material of advanced electronics and technology, realize the Application and Development of lead-free product, promote the technological progress of information industry and electronic industry, improve China's electronic product competitiveness in the international market, its economic and social benefit is self-evident.In addition, European Union completely forbade the use of harmful element in electronics industry such as containing lead, cadmium since on July 1st, 2006.Thereby, in order to eliminate plumbous pollution, press for unleaded solder and replace the Sn-Pb solder and be applied in the Electronic Packaging solder technology.
In order to make lead-free solder alloy satisfy the relevant laws and regulations requirement, and has a fusing point that is more or less the same with traditional Sn-Pb solder, excellent mechanical property and reliability, good characteristics such as alloy structure stability, the research of lead-free solder is just progressively goed deep into, and the research emphasis of scolder concentrates on SnAgCu and SnZn system at present.Cost is higher but Sn-Ag is solder alloy, is about 3 times of traditional tin-lead solder.And Sn-Zn is a scolder because molten temperature region is the most close with Sn-Pb, and both can share by equipment on welding procedure; And Sn, Zn belong to the plasticity and toughness constituent element, Sn-Zn is the mechanical performance of alloy, comprise that tensile strength, antifatigue and creep-resistant property all are better than the Sn-Pb eutectic alloy, ductility is identical with the Sn-Pb eutectic alloy substantially, cost is low because the SnZn alloy has again, reserves abundant, advantages such as nontoxic pollution-free are described as rising brazing filler metal alloy.
But Sn-Zn is a product also exists deficiencies such as non-oxidizability difference: because the active high easy oxidized generation oxide-film of Zn; cause the not good and more welding slag of Sn-Zn scolder wetability in welding process; and be easy to generate galvano-cautery; so preparation process usually need be carried out, and must use active stronger scaling powder under protective atmosphere.
At these problems, existing a lot of people launch research, and to be 200510028447.0 the disclosed SnZnCr alloy lead-free solder of Chinese patent improve the non-oxidizability of solder by adding Cr to application number.Application number is the disclosed oxidation resistant lead-free solder of the Chinese patent of 03129619.X by adding Cu, Ag, and alloying elements such as Ga improve the solder non-oxidizability, but that shortcoming is a fusing point is too high.The researcher of the U.S. and Japan etc. thinks that being added with of Al is beneficial to the raising wetability, but the content of Al is very low in the solder that comes into operation, because the Al too high levels of adding can make oxide-film blocked up, have a strong impact on the solder solderability, but the control ratio of trace of Al content is difficult.The tin-base lead-free solder that contains rare earth in addition is by adding rare earth element, can thinning microstructure, increase solderability, but corrosion resistance is not good.
Therefore it is good to develop a kind of wetability, and the Welding Sn-Zn material that corrosion resistance and mechanical property are further improved just becomes this technical field urgent problem.
Summary of the invention
It is good to the purpose of this invention is to provide a kind of wetability, the leadless welding alloy of the electronic component welding usefulness of corrosion resistance and good mechanical performance.
Above-mentioned purpose of the present invention is achieved through the following technical solutions:
A kind of leadless welding alloy of electronic devices and components welding usefulness, it is characterized in that: the percentage by weight of various alloying elements is as follows: zinc is 5～10%, and gallium is 0.1～5%, and rare earth element is 0.01～1%, and surplus is a tin.
A kind of optimal technical scheme is characterized in that: described rare earth element is La, Ce, one or more among the Gd.
A kind of optimal technical scheme is characterized in that: also comprise 0～5% Bi in the described Welding Sn-Zn material.
A kind of optimal technical scheme is characterized in that: comprise also in the described Welding Sn-Zn material that percentage by weight is 0.1～2% Ni.
A kind of optimal technical scheme is characterized in that: comprise also in the described Welding Sn-Zn material that percentage by weight is the Ge of 0-5%.
Principle of the present invention is: the oxidation behavior result of study of Sn-Zn binary eutectic alloy under hot conditions shown, the oxidation of alloy at first is the oxidation of Zn, next is the oxidation of Sn, the main body composition of oxide-film is the oxide of zinc, this oxide-film passivation ability a little less than, along with the prolongation of high-temperature residence time, oxidation weight gain curve keeps approximate linear rule.Based on this, know-why of the present invention is to add certain specific surface active element or anti-oxidant element in the SnZn alloy, make it gather surface partially by means of the reciprocation of these alloying elements and alloy substrate at liquid alloy, form the layer of surface enriched layer, under hot conditions, the surface enrichment layer of this gathering trace element is difficult for oxidation or preferential oxidation, changed the skin covering of the surface characteristic, slowed down the further oxidation of liquid level, thereby reach the purpose that reduces the alloy surface oxidation rate, the wetting and spreading performance of liquid solder and substrate in the time of also will taking into account soldering when promoting surface passivation, avoid the interpolation of alloying element and the formation of passive oxidation film to bring capillary increase, oxide-film is easy to remove under the brazing flux effect during soldering.
Inventive point of the present invention is: at present Sn-Zn is the ubiquitous problem of scolder, by adding the solderability of enhancing solder alloys such as alloying element gallium, germanium, nickel, improves the non-oxidizability of alloy; Add the thickness that alloying element Ni also can reduce interface compound between scolder and substrate in addition, improve mechanical performance and corrosion stability.The interpolation bismuth additions can improve the solderability of scolder, reduces fusing point.Add rare earth element (as Ce) and can optimize the performance of solder from following three aspects: 1, Ce is a kind of active element, the liquid surface that accumulates in easily down reduces the surface energy of alloy, thereby reduces the interfacial tension between alloying element and the copper matrix, reduce angle of wetting, improve welding condition; 2, the interpolation of Ce can suppress the generation of thick β-Sn crystal grain, and crystal grain thinning significantly improves the mechanical property of alloy; 3, in the fusion process in the scolder gas at first with rare earth element chemical combination, form rare earth compound and float on the motlten metal liquid level, thereby play the effect of degasification with the form of slag, make the alloy structure densification.
Tin zinc gallium cerium series leadless solder alloy provided by the invention has a variety of preparation methods, both can be with the direct smelting process of the direct mixed smelting of several elemental metals, and the also available intermediate alloys such as Sn-Re of preparation earlier are prepared into the substep smelting process of brazing filler metal alloy again.Because alloy Zn in the preparation, the easy oxidization burning loss of Re, so be preferably in melting under vacuum or the protective conditions such as inert gas, fused salt during melting.Because Zn, Bi evaporation easily under low-vapor pressure adopts the inert gas shielding effect better than direct smelting or vacuum metling, inert gas is nitrogen, argon gas etc. again.The component deviation that can effectively avoid the oxidation of the evaporation of elements such as Zn, Bi and active metal and cause.Required raw material can be powdered pure metal, granular simple metal during melting, also can be block simple metal.
Advantage of the present invention is: (1) Ga, Ge, Re, Bi, alloy elements such as Ni can optimize non-oxidizability, wetability and the mechanical property of SnZn brazing filler metal alloy, and fusing point is suitable, can be widely used in electronics industry, household electrical appliances especially, the unleaded demand in fields such as automobile; (2) in the fusion process, the interpolation of alloying element Ga can preferentially form one deck dense oxidation film on the surface, prevent that alloy from continuing oxidation; Add simultaneously a small amount of active rare earth element in the alloy, in the scolder gas at first with rare earth element chemical combination, form the form emersion motlten metal liquid level of rare earth compound with slag, thereby play the effect of degasification, make the alloy structure densification, thus the refinement alloy structure, the mechanical property of raising solder alloy; (3) lead-free brazing Main Ingredients and Appearance Sn provided by the present invention and Zn aboundresources, cost is low, helps industrialized applying.
The present invention will be further described below by the specific embodiment, but and do not mean that limiting the scope of the invention.
The specific embodiment
Following technical scheme has been described in detail the preferred embodiments of the present invention, and table 1 is chemical composition analysis the results list of the embodiment of the invention, and table 2 is mechanical property and physical property tabulations of the embodiment of the invention.
Wherein the stretching experiment of scolder carries out with reference to GB GB/T228-2002, is that AG-50KNE-Japan's manufacturing universal material experimental machine is carried out Mechanics Performance Testing to scolder, calculated tensile strength, percentage elongation and the contraction percentage of area of solder with model.
Sample is processed into the cylindrical rod of Φ 6 * 100mm, and its surface is the 600#SiC sand papering with granularity, carefully polish smooth, and with the foreign material such as grease of alcohol flush away specimen surface, use TH2513A type instrument for measuring DC resistance records resistance value.Resistivity by formula ρ=RA/L is calculated.
The spreading area of scolder is that 0.3 ± 0.01g solder bead is placed on the Cu sheet, and insulation 15s in fusing back records after the cooling on 250 ℃ of thermostatic electrothermal plates.
Embodiment 1: contain the tin zinc gallium lead-free brazing 100g of rare earth, its component and percentage by weight are respectively: 5%Zn, 0.1%Ga, 0.1%Ce, surplus is Sn.Take by weighing LiCl and KCl 230g that mass percent is 1.3:1, mix, put in the alumina crucible, be heated to 500 ℃, after the fusing Sn dropped in the crucible, put back to Sn is melted fully, add Ga again, Zn, and Ce, constantly stir, insulation 2h, the precooling of coming out of the stove, treat that coverture begins crystallization and the salt grain occurs after, skim rapidly, then casting.
Embodiment 2: contain the tin zinc gallium lead-free brazing 100g of rare earth, its component and percentage by weight are respectively: 8%Zn, 3%Ga, 0.8%La, 0.2Ni, surplus is Sn.Take by weighing LiCl and KCl 230g that mass percent is 1.3:1, mix, put in the alumina crucible, be heated to 500 ℃, after the fusing Sn dropped in the crucible, put back to Sn is melted fully, add Ga again, Zn, and La, constantly stir, insulation 2h, the precooling of coming out of the stove, treat that coverture begins crystallization and the salt grain occurs after, skim rapidly, then casting.
Embodiment 3: contain the tin zinc gallium lead-free brazing 100g of rare earth, its component and percentage by weight are respectively: 10%Zn, 5%Ga, 1%Ce, 2%Ni, surplus is Sn.Take by weighing LiCl and KCl 230g that mass percent is 1.3:1, mix, put in the alumina crucible, be heated to 500 ℃, after the fusing Sn dropped in the crucible, put back to Sn is melted fully, add Ga again, Zn, and Ce, constantly stir, insulation 2h, the precooling of coming out of the stove, treat that coverture begins crystallization and the salt grain occurs after, skim rapidly, then casting.
Embodiment 4: contain the tin zinc gallium lead-free brazing 100g of rare earth, its component and percentage by weight are respectively: 7%Zn, 1.0%Ga, 0.01%Ce, 5%Bi, surplus is Sn.Utilize under the resistance furnace argon shield condition and carry out alloy melting; the alloy addition sequence is Sn, Ga, Bi, Zn, Ce, and alloy all melts the back and keeps 45min at 500 ℃, to guarantee the uniformity of composition; reduce heating power, treat the solder melt temperature reduce to 250 ℃ begin the cast.
Embodiment 5: contain the tin zinc gallium lead-free brazing 100g of rare earth, its component and percentage by weight are respectively: 9%Zn, 0.5%Ga, 0.15%Gd, and 0.5%Ni, surplus is Sn.Utilize under the resistance furnace argon shield condition and carry out alloy melting; the alloy addition sequence is Sn, SnNi, Ga, SnGd, Zn, and alloy all melts the back and keeps 45min at 600 ℃, to guarantee the uniformity of composition; reduce heating power, treat the solder melt temperature reduce to 250 ℃ begin the cast.
Embodiment 6: contain the tin zinc gallium lead-free brazing 100g of rare earth, its component and percentage by weight are respectively: 10%Zn, 0.3%Ga, 0.05%Gd, and 5%Ge, surplus is Sn.Utilize under the resistance furnace argon shield condition and carry out alloy melting; the alloy addition sequence is Sn, SnGe, Ga, SnGd, Zn, and alloy all melts the back and keeps 45min at 600 ℃, to guarantee the uniformity of composition; reduce heating power, treat the solder melt temperature reduce to 250 ℃ begin the cast.
Embodiment 7: contain the tin zinc gallium lead-free brazing 100g of rare earth, its component and percentage by weight are respectively: 8%Zn, 0.5%Ge, 0.05%Ce, 0.8%Ni, 3Bi, surplus is Sn.Utilize under the resistance furnace argon shield condition and carry out alloy melting; the alloy addition sequence is Sn, SnGe, Ga, SnGd, Zn, and alloy all melts the back and keeps 45min at 600 ℃, to guarantee the uniformity of composition; reduce heating power, treat the solder melt temperature reduce to 250 ℃ begin the cast.
Table 1: chemical composition analysis the results list
The mechanical property of table 2 brazing filler metal alloy and physical property
Claims (5)
1, a kind of leadless welding alloy of electronic component welding usefulness, it is characterized in that: the percentage by weight of alloying element is as follows in the described leadless welding alloy: zinc is 5～10%, and gallium is 0.1～5%, and rare earth element is 0.01～1%, and surplus is a tin.
2, leadless welding alloy according to claim 1 is characterized in that: described rare earth element is La, Ce, one or more among the Gd.
3, leadless welding alloy according to claim 2 is characterized in that: also comprise in the described Welding Sn-Zn material being 5% Bi to the maximum.
4, leadless welding alloy according to claim 3 is characterized in that: state and comprise also in the Welding Sn-Zn material that percentage by weight is 0.1～2% Ni.
5, leadless welding alloy according to claim 4 is characterized in that: comprise also in the described Welding Sn-Zn material that percentage by weight is 5% Ge to the maximum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101762375A CN101417375B (en) | 2007-10-23 | 2007-10-23 | Leadless welding alloy for welding electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101762375A CN101417375B (en) | 2007-10-23 | 2007-10-23 | Leadless welding alloy for welding electronic elements |
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| CN101417375A true CN101417375A (en) | 2009-04-29 |
| CN101417375B CN101417375B (en) | 2010-12-29 |
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| CN2007101762375A Expired - Fee Related CN101417375B (en) | 2007-10-23 | 2007-10-23 | Leadless welding alloy for welding electronic elements |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152022A (en) * | 2011-04-18 | 2011-08-17 | 宁波喜汉锡焊料有限公司 | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance |
| CN102825396A (en) * | 2012-09-18 | 2012-12-19 | 金华市双环钎焊材料有限公司 | Sn-Zn leadless brazing filler metal containing Pr, Ga and Te |
| CN102896439A (en) * | 2011-07-28 | 2013-01-30 | 北京有色金属研究总院 | Sn-Sb-X high-temperature lead-free solder |
| CN104588909A (en) * | 2014-12-11 | 2015-05-06 | 徐国华 | Environment-friendly lead-free solder and preparation method |
| CN106001981A (en) * | 2016-06-23 | 2016-10-12 | 南昌大学 | Lead-free solder added with rare earth carbonate and preparation method |
| CN107447128A (en) * | 2017-07-10 | 2017-12-08 | 西安理工大学 | A kind of low-melting alloy and preparation method thereof |
| CN108213767A (en) * | 2018-02-28 | 2018-06-29 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi-Ga brazing filler metal alloys |
| CN108213765A (en) * | 2017-12-29 | 2018-06-29 | 广西汇智生产力促进中心有限公司 | For the indium containing solder of electronic component welding |
| CN109262163A (en) * | 2018-11-30 | 2019-01-25 | 长沙浩然医疗科技有限公司 | A kind of leadless welding alloy and preparation method thereof |
| CN109465562A (en) * | 2018-11-28 | 2019-03-15 | 东莞理工学院 | A kind of lead-free brazing and its with applying scaling powder |
| CN109926750A (en) * | 2019-05-17 | 2019-06-25 | 云南锡业集团（控股）有限责任公司研发中心 | A kind of low temperature lead-free solder alloy and its vacuum casting method |
| WO2021043708A1 (en) * | 2019-09-06 | 2021-03-11 | Henkel Ag & Co. Kgaa | Solder alloy and solder paste containing said alloy |
| CN114888481A (en) * | 2022-05-31 | 2022-08-12 | 杭州华光焊接新材料股份有限公司 | High-reliability lead-free solder alloy |
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| JPS56134404A (en) * | 1980-03-24 | 1981-10-21 | Sony Corp | Conductive material and method of prdoducing same |
| US6027575A (en) * | 1997-10-27 | 2000-02-22 | Ford Motor Company | Metallic adhesive for forming electronic interconnects at low temperatures |
| CN100377832C (en) * | 2005-11-22 | 2008-04-02 | 南京航空航天大学 | Cd-free silver solder containing Ga and Ce |
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2007
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| CN102896439B (en) * | 2011-07-28 | 2015-08-26 | 北京有色金属研究总院 | A kind of Sn-Sb-X high-temperature lead-free solder |
| CN102825396A (en) * | 2012-09-18 | 2012-12-19 | 金华市双环钎焊材料有限公司 | Sn-Zn leadless brazing filler metal containing Pr, Ga and Te |
| CN102825396B (en) * | 2012-09-18 | 2015-06-03 | 金华市双环钎焊材料有限公司 | Sn-Zn leadless brazing filler metal containing Pr, Ga and Te |
| CN104588909A (en) * | 2014-12-11 | 2015-05-06 | 徐国华 | Environment-friendly lead-free solder and preparation method |
| CN106001981A (en) * | 2016-06-23 | 2016-10-12 | 南昌大学 | Lead-free solder added with rare earth carbonate and preparation method |
| CN107447128A (en) * | 2017-07-10 | 2017-12-08 | 西安理工大学 | A kind of low-melting alloy and preparation method thereof |
| CN108213765A (en) * | 2017-12-29 | 2018-06-29 | 广西汇智生产力促进中心有限公司 | For the indium containing solder of electronic component welding |
| CN108213767A (en) * | 2018-02-28 | 2018-06-29 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi-Ga brazing filler metal alloys |
| CN109465562A (en) * | 2018-11-28 | 2019-03-15 | 东莞理工学院 | A kind of lead-free brazing and its with applying scaling powder |
| CN109262163A (en) * | 2018-11-30 | 2019-01-25 | 长沙浩然医疗科技有限公司 | A kind of leadless welding alloy and preparation method thereof |
| CN109926750A (en) * | 2019-05-17 | 2019-06-25 | 云南锡业集团（控股）有限责任公司研发中心 | A kind of low temperature lead-free solder alloy and its vacuum casting method |
| WO2021043708A1 (en) * | 2019-09-06 | 2021-03-11 | Henkel Ag & Co. Kgaa | Solder alloy and solder paste containing said alloy |
| CN114888481A (en) * | 2022-05-31 | 2022-08-12 | 杭州华光焊接新材料股份有限公司 | High-reliability lead-free solder alloy |
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