CN107447128A - A kind of low-melting alloy and preparation method thereof - Google Patents
A kind of low-melting alloy and preparation method thereof Download PDFInfo
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- CN107447128A CN107447128A CN201710556842.9A CN201710556842A CN107447128A CN 107447128 A CN107447128 A CN 107447128A CN 201710556842 A CN201710556842 A CN 201710556842A CN 107447128 A CN107447128 A CN 107447128A
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- Prior art keywords
- low
- bismuth
- zinc
- tin
- melting alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
Abstract
It is composed of the following components by weight percentage the invention discloses a kind of low-melting alloy：Tin 82% 90%, zinc 9%, bismuth 1% 9%, the percentage by weight sum of above-mentioned each component is 100%, can be melted in a narrow temperature province.The invention also discloses the preparation method of above-mentioned low-melting alloy, weigh tin 82% 90% respectively by weight percentage, zinc 9%, bismuth 1% 9%, the percentage by weight sum of above-mentioned each component is 100%, the tin that will be weighed, zinc and bismuth are mixed and are put into ultrasonic washing instrument, add alcohol washes, by the tin through over cleaning, zinc and bismuth mixture are put into graphite crucible, then appropriate KCl LiCl salt is added to surface, graphite crucible is placed into chamber type electric resistance furnace again and melted, the molten metal melted, molten metal bath is quickly cooled down again, form Sn Zn Bi low-melting alloys.
Description
Technical field
The invention belongs to a kind of low-melting alloy technical field, it is related to a kind of low-melting alloy, the invention further relates to above-mentioned
The preparation method of low-melting alloy.
Background technology
In the Self-Protection Subsystems such as some crucial electrician, electronics, machineries, generally use has the material of transient melting characteristic
Material carries out system protection as fuse.At present, most widely used low-melting alloy is mostly Sn-Pb systems alloy, because it is molten
Point is low, and intensity is high, and processing performance is good, is easy to processing forming under low temperature.Often widely it is used as solder, and electrical equipment, steam, is disappeared
The temperature-sensitive components such as fuse, fuse in the devices such as anti-, fire alarm, it is that a kind of quite potential low-melting alloy is new
Section bar material.But because lead is a kind of toxic element, long-term use can also have environmental pollution and pollution to people, so needing to find
Alloying element replaces lead.Sn-Zn eutectic melting points are superior to Sn-Pb systems closest to Sn-Pb systems alloy, its intensity, plasticity and toughness,
And cost is cheap.
But the existing Sn-Zn alloy melting points temperature range upper limit is all higher than 205 DEG C, and can not be in a narrower temperature
Spend in region and melt, it is impossible to meet the needs of some temperature control (195-204 DEG C) protection devices.
The content of the invention
It is an object of the invention to provide a kind of low-melting alloy, can be melted in the range of a narrow temperature province.
It is a further object to provide the preparation method of above-mentioned low-melting alloy.
The technical solution adopted in the present invention is a kind of low-melting alloy, composed of the following components by weight percentage：Tin
82%-90%, zinc 9%, bismuth 1%-9%, the percentage by weight sum of above-mentioned each component is 100%.
Preferably, tin, zinc, bismuth are respectively pure tin grain, pure zinc granule, pure bismuth granule.
Another technical solution adopted in the present invention is that a kind of preparation method of low-melting alloy, specifically according to following
Step is implemented：
Step 1, tin 82%-90%, zinc 9%, bismuth 1%-9%, the weight of above-mentioned each component are weighed respectively by weight percentage
It is 100% to measure percentage sum；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then added in right amount to surface
KCl-LiCl salt, then graphite crucible is placed into chamber type electric resistance furnace and melted, the molten metal melted, then will melting gold
Category liquid quickly cools down, and forms Sn-Zn-Bi low-melting alloys.
Preferably, it is 20~30min with the time of alcohol washes in step 2.
Preferably, the condition in step 3 in chamber type electric resistance furnace fusing is in 400-550 DEG C of chamber type electric resistance furnace, is incubated 20-
40min, during which stirred once per 5-10min.
Preferably, tin, zinc, bismuth are respectively pure tin grain, pure zinc granule, pure bismuth granule.
Preferably, it is cooled to water cooling in step 3.
The invention has the advantages that a kind of low-melting alloy of the present invention, Sn-Zn systems alloy close for non-pollution lower melting point
Gold, by adding Bi elements, eutectic reaction occurs, forms uniform single organization, now alloy internal energy raises, and chemical bond is not
Stable, so its fusing can be made compared with low energy by obtaining, its preparation process is simple.
Brief description of the drawings
Fig. 1 is the metallograph of the Sn-Zn-Bi low-melting alloys prepared by the embodiment of the present invention 5；
Fig. 2 is differential thermal analysis (DSC) curve map of the Sn-Zn-Bi low-melting alloys prepared by the embodiment of the present invention 5.
Embodiment
The present invention is described in detail with reference to the accompanying drawings and detailed description.
It is composed of the following components by weight percentage the invention provides a kind of low-melting alloy：Tin 82%-90%, zinc
9%, bismuth 1%-9%, the percentage by weight sum of above-mentioned each component is 100%.
Preferably, tin, zinc, bismuth are respectively pure tin grain, pure zinc granule, pure bismuth granule.
Present invention also offers the preparation method of above-mentioned low-melting alloy, specifically implement according to following steps：
Step 1, tin 82%-90%, zinc 9%, bismuth 1%-9%, the weight of above-mentioned each component are weighed respectively by weight percentage
It is 100% to measure percentage sum；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then added in right amount to surface
KCl-LiCl salt, then graphite crucible is placed into chamber type electric resistance furnace and melted, the molten metal melted, then will melting gold
Category liquid quickly cools down, and forms Sn-Zn-Bi low-melting alloys.
Preferably, it is 20-30min with the time of alcohol washes in step 2.
Preferably, the condition in step 3 in chamber type electric resistance furnace fusing is in 400-550 DEG C of chamber type electric resistance furnace, is incubated 20-
40min, during which stirred once per 5-10min.
Preferably, tin, zinc, bismuth are respectively pure tin grain, pure zinc granule, pure bismuth granule.
Preferably, it is cooled to water cooling in step 3.
Sn-Zn systems alloy is non-pollution lower melting point alloy, by adding Bi elements, instead gives birth to eutectic reaction, is formed uniformly single
One tissue, now alloy internal energy rise, chemical bond is unstable, so its fusing can be made compared with low energy by obtaining, so as to fusing point
Reduce, form Sn-Zn-Bi low-melting alloys.
The preparation method of low-melting alloy of the present invention, its interface fusing point is minimum up to less than 205 DEG C, and its preparation technology is simple
Reliably, it is green.
Embodiment 1
A kind of low-melting alloy of the present embodiment, it is composed of the following components by weight percentage：Tin 90%, zinc 9%, bismuth
1%, the percentage by weight sum of above-mentioned each component is 100%.
The preparation method of the low-melting alloy is as follows：
Step 1, weigh tin 90% respectively by weight percentage, zinc 9%, bismuth 1%, the percentage by weight of above-mentioned each component it
With for 100%；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes
20min；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then added in right amount to surface
KCl-LiCl salt, then graphite crucible is placed into 400 DEG C of chamber type electric resistance furnace inside holding 20min and melted, during which per 5min
Stir once, the molten metal melted, then molten metal bath is quickly cooled down, form Sn-Zn-Bi low-melting alloys.Pass through
Water cooling forms obtained Sn-Zn-Bi low-melting alloys, and fusing point is up to 201.6 DEG C.
Embodiment 2
A kind of low-melting alloy of the present embodiment, it is composed of the following components by weight percentage：Tin 88%, zinc 9%, bismuth
3%, the percentage by weight sum of above-mentioned each component is 100%.
The preparation method of the low-melting alloy is as follows：
Step 1, weigh tin 88% respectively by weight percentage, zinc 9%, bismuth 3%, the percentage by weight of above-mentioned each component it
With for 100%；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes
25min；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then added in right amount to surface
KCl-LiCl salt, then graphite crucible is placed into 450 DEG C of chamber type electric resistance furnace inside holding 25min and melted, during which per 5min
Stir once, the molten metal melted, then molten metal bath is quickly cooled down, form Sn-Zn-Bi low-melting alloys.Pass through
Water cooling forms obtained Sn-Zn-Bi low-melting alloys, and fusing point is up to 200.1 DEG C.
Embodiment 3
A kind of low-melting alloy of the present embodiment, it is composed of the following components by weight percentage：Tin 86%, zinc 9%, bismuth
5%, the percentage by weight sum of above-mentioned each component is 100%.
The preparation method of the low-melting alloy is as follows：
Step 1, weigh tin 86% respectively by weight percentage, zinc 9%, bismuth 5%, the percentage by weight of above-mentioned each component it
With for 100%；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes
30min；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then added in right amount to surface
KCl-LiCl salt, then graphite crucible is placed into 450 DEG C of chamber type electric resistance furnace inside holding 30min and melted, during which per 5min
Stir once, the molten metal melted, then molten metal bath is quickly cooled down, form Sn-Zn-Bi low-melting alloys.Pass through
Water cooling forms obtained Sn-Zn-Bi low-melting alloys, and fusing point is up to 198.8 DEG C.
Embodiment 4
A kind of low-melting alloy of the present embodiment, it is composed of the following components by weight percentage：Tin 84%, zinc 9%, bismuth
7%, the percentage by weight sum of above-mentioned each component is 100%.
The preparation method of the low-melting alloy is as follows：
Step 1, weigh tin 84% respectively by weight percentage, zinc 9%, bismuth 7%, the percentage by weight of above-mentioned each component it
With for 100%；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes
30min；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then added in right amount to surface
KCl-LiCl salt, then graphite crucible is placed into 500 DEG C of chamber type electric resistance furnace inside holding 30min and melted, during which per 8min
Stir once, the molten metal melted, then molten metal bath is quickly cooled down, form Sn-Zn-Bi low-melting alloys.Pass through
Water cooling forms obtained Sn-Zn-Bi low-melting alloys, and fusing point is up to 196.6 DEG C.
Embodiment 5
A kind of low-melting alloy of the present embodiment, it is composed of the following components by weight percentage：Tin 82%, zinc 9%, bismuth
9%, the percentage by weight sum of above-mentioned each component is 100%.
The preparation method of the low-melting alloy is as follows：
Step 1, weigh tin 82% respectively by weight percentage, zinc 9%, bismuth 9%, the percentage by weight of above-mentioned each component it
With for 100%；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes
30min；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then added in right amount to surface
KCl-LiCl salt, then graphite crucible is placed into 500 DEG C of chamber type electric resistance furnace inside holding 30min and melted, during which per 10min
Stir once, the molten metal melted, then molten metal bath is quickly cooled down, form Sn-Zn-Bi low-melting alloys.Pass through
Water cooling forms obtained Sn-Zn-Bi low-melting alloys, and fusing point is up to 195.4 DEG C.
As shown in figure 1, the metallograph of the Sn-Zn-Bi alloys prepared for embodiment 5, even tissue, without significantly scarce
Fall into and be uniformly dispersed with the rich Zn phases of black, with increasing for Bi elements, the fusing point of alloy is gradually lowered.
As shown in Fig. 2 preparing differential thermal analysis (DSC) curve map of Sn-Zn-Bi alloys for embodiment 5, Fig. 2 illustrates weight
It is tin 82% respectively to measure percentage, and zinc 9%, the fusing point of the Sn-Zn-Bi alloys of bismuth 9% is up to 195.4 DEG C.
Claims (7)
1. a kind of low-melting alloy, it is characterised in that composed of the following components by weight percentage：Tin 82%-90%, zinc 9%,
Bismuth 1%-9%, the percentage by weight sum of above-mentioned each component is 100%.
A kind of 2. low-melting alloy according to claim 1, it is characterised in that the tin, zinc, bismuth be respectively pure tin grain,
Pure zinc granule, pure bismuth granule.
3. a kind of preparation method of low-melting alloy, it is characterised in that specifically implement according to following steps：
Step 1, tin 82%-90%, zinc 9%, bismuth 1%-9%, the weight hundred of above-mentioned each component are weighed respectively by weight percentage
It is 100% to divide than sum；
Step 2, tin, zinc and bismuth step 1 weighed is mixed and is put into ultrasonic washing instrument, adds alcohol washes；
Step 3, the tin, zinc and the bismuth mixture that are cleaned by step 2 are put into graphite crucible, then add appropriate KCl- to surface
LiCl salt, then graphite crucible is placed into chamber type electric resistance furnace and melted, the molten metal melted, then by molten metal bath
Cooling, form Sn-Zn-Bi low-melting alloys.
4. the preparation method of a kind of low-melting alloy according to claim 3, it is characterised in that clear with alcohol in step 2
The time washed is 20~30min.
5. the preparation method of a kind of low-melting alloy according to claim 4, it is characterised in that in box electricity in step 3
The condition for hindering stove fusing is in 400-550 DEG C of chamber type electric resistance furnace, is incubated 20-40min, and during which every 5-10min stirrings are once.
6. the preparation method of a kind of low-melting alloy according to claim 3-5 any one, it is characterised in that described
Tin, zinc, bismuth are respectively pure tin grain, pure zinc granule, pure bismuth granule.
7. the preparation method of a kind of low-melting alloy according to claim 6, it is characterised in that cold described in step 3
But it is water cooling.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109226992A (en) * | 2018-08-31 | 2019-01-18 | 西安理工大学 | A kind of method that low temperature diffusion prepares Cu-Al bimetal material |
| CN109234566A (en) * | 2018-11-07 | 2019-01-18 | 广州宇智科技有限公司 | A kind of high heat storage density tin alloy and its technique of the operating temperature less than 100 degree |
| CN109252068A (en) * | 2018-11-07 | 2019-01-22 | 广州宇智科技有限公司 | Heat accumulation resistance to oxidation kamash alloy and technique between a kind of 100-150 degree |
| CN113414237A (en) * | 2021-06-21 | 2021-09-21 | 西安理工大学 | Method for preparing high-performance Al-Cu-Al composite material by rolling |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09206983A (en) * | 1996-02-02 | 1997-08-12 | Sony Corp | Soldering material |
| CN101417375A (en) * | 2007-10-23 | 2009-04-29 | 北京有色金属研究总院 | Leadless welding alloy for welding electronic elements |
| CN101914702A (en) * | 2010-06-13 | 2010-12-15 | 深圳市亿铖达工业有限公司 | Preparation method of reinforced lead-free solder |
| CN103192194A (en) * | 2013-03-28 | 2013-07-10 | 天津市恒固科技有限公司 | Solder wire for aluminum and aluminum alloy soldering and preparation method thereof |
| CN103331533A (en) * | 2013-06-20 | 2013-10-02 | 天津市恒固科技有限公司 | Lead-free soldering paste for soldering aluminum and aluminum alloy and soldering flux |
| CN104353840A (en) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder |
| CN104759783A (en) * | 2015-03-24 | 2015-07-08 | 广东工业大学 | Low-silver lead-free solder and preparation method thereof |
-
2017
- 2017-07-10 CN CN201710556842.9A patent/CN107447128A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09206983A (en) * | 1996-02-02 | 1997-08-12 | Sony Corp | Soldering material |
| CN101417375A (en) * | 2007-10-23 | 2009-04-29 | 北京有色金属研究总院 | Leadless welding alloy for welding electronic elements |
| CN101914702A (en) * | 2010-06-13 | 2010-12-15 | 深圳市亿铖达工业有限公司 | Preparation method of reinforced lead-free solder |
| CN103192194A (en) * | 2013-03-28 | 2013-07-10 | 天津市恒固科技有限公司 | Solder wire for aluminum and aluminum alloy soldering and preparation method thereof |
| CN103331533A (en) * | 2013-06-20 | 2013-10-02 | 天津市恒固科技有限公司 | Lead-free soldering paste for soldering aluminum and aluminum alloy and soldering flux |
| CN104353840A (en) * | 2014-11-25 | 2015-02-18 | 北京康普锡威科技有限公司 | Low-cost lead-free soldering flux alloy powder for LED (light emitting diode) and preparation method of alloy powder |
| CN104759783A (en) * | 2015-03-24 | 2015-07-08 | 广东工业大学 | Low-silver lead-free solder and preparation method thereof |
Non-Patent Citations (5)
| Title |
|---|
| TOMASZ GANCARZ: "Density, surface tension and viscosity of Sn-Zn alloys with Ag，Bi，Ga and Na additions", 《FLUID PHASE EQUILIBRIA》 * |
| 吴文云，等: "Bi 、Ag对Sn-Zn无铅钎料性能与组织的影响", 《中国有色金属学报》 * |
| 吴文云，等: "Sn-Zn-Bi无铅钎料成分设计", 《吉林大学学报》 * |
| 周健，等: "低熔点Sn-Zn-Bi无铅钎料的组织和性能", 《金属学报》 * |
| 康四伟，等: "Bi对Sn-Zn无铅焊料的性能影响", 《世界有色金属》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109226992A (en) * | 2018-08-31 | 2019-01-18 | 西安理工大学 | A kind of method that low temperature diffusion prepares Cu-Al bimetal material |
| CN109234566A (en) * | 2018-11-07 | 2019-01-18 | 广州宇智科技有限公司 | A kind of high heat storage density tin alloy and its technique of the operating temperature less than 100 degree |
| CN109252068A (en) * | 2018-11-07 | 2019-01-22 | 广州宇智科技有限公司 | Heat accumulation resistance to oxidation kamash alloy and technique between a kind of 100-150 degree |
| CN113414237A (en) * | 2021-06-21 | 2021-09-21 | 西安理工大学 | Method for preparing high-performance Al-Cu-Al composite material by rolling |
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Application publication date: 20171208 |