CN104339099A - Medium-temperature solder containing copper and copper alloy - Google Patents
Medium-temperature solder containing copper and copper alloy Download PDFInfo
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- CN104339099A CN104339099A CN201410501536.1A CN201410501536A CN104339099A CN 104339099 A CN104339099 A CN 104339099A CN 201410501536 A CN201410501536 A CN 201410501536A CN 104339099 A CN104339099 A CN 104339099A
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- solder
- copper
- alloy
- silver
- cerium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a medium-temperature solder containing copper and a copper alloy. The medium-temperature solder comprises the following components by weight percent: 1-5 percent of silver, 5-8 percent of phosphor, 1-6 percent of tin, 0.1-2.5 percent of silicon, 0.01-0.1 percent of cerium and the balance of copper. The medium-temperature solder disclosed by the invention has the advantages that the melting temperature of the solder is reduced, and the flowability is good; besides, the solder has good permeability and ductility and can infiltrate into a tiny clearance without generating a sand hole; meanwhile, the solder is used in an environment with greater temperature difference, and the damage to a weld seam is avoided. The medium-temperature solder disclosed by the invention is greatly used in the refrigeration industry.
Description
Technical field
The present invention relates to brazing material field, be specifically related to a kind of a large amount of for the cupric of refrigeration industry and the intermediate temperature solder of alloy thereof.
Background technology
Along with industry developments such as electronics and information industry, household electrical appliances, automobile and refrigeration, soldering tech is more and more important in these industries, and increasing to the demand of solder.Solder can be divided into ten multiclass such as money base, copper base, aluminium base, manganese base by alloy system, copper base solder occupies very large ratio in solder, need containing the higher copper-based material of silver content in the brazing process of the higher copper alloy parts of ask for something, but silver is going up as noble metal price at present always, therefore enterprise is needing when seeking interests to reduce silver content.
Also the copper base solder having some silver contents less at present, as the BCu89PAg copper base solder of argentiferous 5%, the BCu91PAg copper base solder etc. of argentiferous 2%, although these copper base solder prices are lower, but fusion temperature is higher, the mechanical strength of soldering processes performance and soldered fitting does not all reach instructions for use, cannot meet the requirement of client.
China Patent No. 201010588473.X discloses the patent that name is called " a kind of low silver-colored electrovacuum solder for electronic device soldering and sealing ", it with the addition of tin, plugs with molten metal and nickel in the ag-cu solder of routine, reduce silver content, and reduce fusing point, alternative BAg72Cu solder, but its tin, plug with molten metal with the addition of nickel higher.
China Patent No. 200610161439.8 discloses the patent that name is called " a kind of Cu-P-Ag solder containing transferring, pluging with molten metal and adorn ", it with the addition of and transfers in the silver-bearing copper phosphorus brazing alloy of routine, plug with molten metal and adorn, reduce silver content, and reduce fusing point, but it is transferred, to plug with molten metal and to adorn addition higher, the ratio of phosphorus is also higher.
On the other hand, solder can be divided into soft solder and hard solder again according to its fusion temperature.Solder liquidus curve lower than 450 DEG C be called soft solder, liquidus curve higher than 450 DEG C be called hard solder, in some material connection procedure, adopt soft solder, but adopt soft solder soldering joint strength and use operating temperature not meet the demands; And adopt hard solder soldering, required soldering strength can be reached, but due to the physical arrangement of hard solder and physicochemical property temperature influence rather responsive, the pull resistance of material, shear resistance are weakened, in soldering, cause weldering split or produce pore, reduce soldering and sealing effect.
In sum, how providing the copper base intermediate temperature solder that a kind of melt temperature is suitable for, soldering strength is high, soldering and sealing is effective, is the technical barrier that those skilled in the art are badly in need of solving.
Summary of the invention
The object of the present invention is to provide the intermediate temperature solder of a kind of cupric and alloy thereof, each composition proportion is suitable for, and solves the defect that above-mentioned prior art exists.
For achieving the above object, the invention provides following technical scheme: the intermediate temperature solder of a kind of cupric and alloy thereof, comprise each component formed as following weight percent: silver is 1-5wt%, phosphorus is 5-8wt%, and tin is 1-6wt%, and silicon is 0.1-2.5wt%, cerium is 0.01-0.1wt%, and surplus is copper.
As preferably, the present invention includes each component formed as following weight percent: silver is 1-4.5wt%, and phosphorus is 6-7.5wt%, and tin is 2-5wt%, and silicon is 1-2wt%, and cerium is 0.02-0.1wt%, and surplus is copper.
As preferably, the present invention includes each component formed as following weight percent: silver is 3.9wt%, phosphorus 6.5wt%, and tin 2wt%, silicon 1.5wt%, cerium 0.08wt%, surplus is copper.
Prepare a method for the intermediate temperature solder of cupric and alloy thereof, comprise the steps:
1) silver of group component, copper and copper-phosphorus alloy are put into graphite crucible, heat up heating, adds coverture; Described coverture is any one or several mixing in plant ash, rice husk ash, charcoal;
2) to be heated to metal roastingization formation solder liquid, stirring, after leaving standstill 10 ~ 20min, desurfacing oxide, then the copper cerium alloy adding group component, continue heating, add coverture after stirring;
3) stating step 2) the solder liquid 10 ~ 20min of gained, continue the signal bronze adding group component, limit heating is dissolved limit and is stirred, and leaves standstill 10 ~ 20min after adding coverture;
4) finally add cupro silicon, add and stir, after leaving standstill 10 ~ 20min, desurfacing oxide, stops heating;
5) get the solder liquid of step 4) gained, continuous casting growth ingot, polishing, extruding, drawing is shaping.
Change the fusing point of solder by adding tin in the present invention, according to alloying element to brazing filler metal melts characteristic, and the impact of soldered fitting mechanical property, and observation and analysis has been carried out to the microstructure of soldered fitting, pass through differential thermal analysis, show the increase of Theil indices in the middle of brazing filler metal alloy, the fusing point of solder can decrease, simultaneously because the degree of superheat of viscosity and liquid metal is inversely proportional to, when brazing temperature one timing, the fusion temperature of metal reduces, then the degree of superheat of liquid metal increases, metal viscosity will be caused to reduce, mobility strengthens, thus the existence of tin improves the spreading property of solder from another point of view.
Chemical element silicon in the present invention serves the effect of inhibitor on the other hand when reducing fusing point, due in heating process, easily make phosphorus volatilize and cause the loss of phosphorus content, the ignition point of phosphorus itself is lower simultaneously, in the process of preparation, silicon add the volatilization and splashing that make effectively to inhibit phosphorus in brazing process, use safer and improve service efficiency.Rare-earth element cerium refinement in the present invention institutional framework of solder, accelerate the alloying of copper base solder, improve the degree of supercooling of solder, reduce solid liquid phase temperature range, cerium is enriched in grain boundaries with rare-earth phase form, play strengthening crystal boundary, the effect of the tissue of refinement solder, improve the processing characteristics of solder.
The present invention compared with the existing technology, has following beneficial effect: 1, containing less silver, has greatly saved cost of material; 2, when this solder uses, have excellent wettability and spreadability, soldering and sealing is effective; 3, this solder melt temperature is suitable, soldering strength is high; 4, the plasticity of this solder is good, can process in all size, the welding rod, welding wire, weld-ring, weld tabs etc. of size; Highly versatile, can the electric resistance welding pricker of the industry such as extensive use and refrigeration, machinery, electromechanics, flame welding pricker and high frequency induction welding pricker.
Detailed description of the invention
Technical solution of the present invention is not limited to following cited detailed description of the invention, also comprises any combination between each detailed description of the invention.
Design parameter in each embodiment is see table 1-table 4, table 1 is the related data of the embodiment of the present invention 1 to embodiment 6, table 2 is the related data of the embodiment of the present invention 7 paper embodiment 12, table 3 is the related data of the embodiment of the present invention 13 paper embodiment 18, and table 4 is the related data of the embodiment of the present invention 19 paper embodiment 24.
Table 1 is the related data of the embodiment of the present invention 1 to embodiment 6.
Table 2 is the related data of the embodiment of the present invention 7 to embodiment 12.
Table 3 is the related data of the embodiment of the present invention 13 to embodiment 18.
Table 4 is the related data of the embodiment of the present invention 19 to embodiment 24.
The present embodiment 1 ~ 24 shows: 1. silver content is less, reduces production cost, and solder fusing point is lower than the solder identical relative to other silver content simultaneously; 2. spreadability reaches A level, exceedes general professional standard, and solder result of use is good, and 3. the tensile strength of the tensile strength height solder of solder can reach 532-555MPa; The tensile strength of its weld seam can reach 218-259MPa, and shearing can reach 131-149MPa, has higher mechanical performance; 4. the plasticity of this solder is good, can process in all size, the welding rod, welding wire, weld-ring, weld tabs etc. of size; There is stronger versatility simultaneously, be applicable to different working environments.
According to the known silicone content of table 1 the closer to 1wt%, be solder tensile strength or the enhancing all to a certain extent of the intensity of weld seam;
During according to the known silicone content of table 2 between 1 ~ 1.5wt%, good relative to the solder intensity effect made by table 1;
Be less than relative to silicone content when 1.5wt% according to intensity effect when table 3 and the known silicone content of table 4 are between 1.55 ~ 2.5wt%.
Therefore the technical program silicone content is when 1.5wt%, the weld seam tensile strength produced after the tensile strength of solder and solder use and shearing strength the best.
Solder manufacture craft of the present invention, comprises the steps:
1) silver of group component, copper and copper-phosphorus alloy are put into graphite crucible, heat up heating, adds coverture; Described coverture is any one or several mixing in plant ash, rice husk ash, charcoal;
2) to be heated to metal roastingization formation solder liquid, stirring, after leaving standstill 10 ~ 20min, desurfacing oxide, then the copper cerium alloy adding group component, continue heating, add coverture after stirring;
3) stating step 2) the solder liquid 10 ~ 20min of gained, continue the signal bronze adding group component, limit heating is dissolved limit and is stirred, and leaves standstill 10 ~ 20min after adding coverture;
4) finally add cupro silicon, add and stir, after leaving standstill 10 ~ 20min, desurfacing oxide, stops heating;
5) get the solder liquid of step 4) gained, continuous casting growth ingot, polishing, extruding, drawing is shaping.
Formula Design of the present invention is reasonable, melting temperature reduces, good fluidity, simultaneously solder has good permeability, and can infiltrating in tiny gap and can not produce husky hole, solder also has good spreadability, use in the great environment of the temperature difference simultaneously, weld seam also can not destroy, steady quality, can replace the wlding material such as BAg40CuZnCd, BAg45CuZn that the scope of application is wide, consumption is large.
In addition, it should be noted that, the specific embodiment described in this description, its formula, title that technique is named etc. can be different.All equivalences of doing according to structure, feature and the principle described in inventional idea of the present invention or simple change, be included in the protection domain of patent of the present invention.Those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment; only otherwise depart from structure of the present invention or surmount this scope as defined in the claims, protection scope of the present invention all should be belonged to.
Claims (4)
1. an intermediate temperature solder for cupric and alloy thereof, comprises each component formed as following weight percent: silver is 1-5wt%, and phosphorus is 5-8wt%, and tin is 1-6wt%, and silicon is 0.1-2.5wt%, and cerium is 0.01-0.1wt%, and surplus is copper.
2. the intermediate temperature solder of a kind of cupric according to claim 1 and alloy thereof, is characterized in that: comprise each component formed as following weight percent: silver is 1-4.5wt%, and phosphorus is 6-7.5wt%, tin is 2-5wt%, silicon is 1-2wt%, and cerium is 0.02-0.1wt%, and surplus is copper.
3. the intermediate temperature solder of a kind of cupric according to claim 2 and alloy thereof, is characterized in that: comprise each component formed as following weight percent: silver is 3.9wt%, phosphorus 6.5wt%, and tin 2wt%, silicon 1.5wt%, cerium 0.08wt%, surplus is 86.02wt%.
4. prepare a method for the intermediate temperature solder of a kind of cupric according to claim 1 and alloy thereof, comprise the steps:
1) silver of group component, copper and copper-phosphorus alloy are put into graphite crucible, heat up heating, adds coverture; Described coverture is any one or several mixing in plant ash, rice husk ash, charcoal;
2) to be heated to metal roastingization formation solder liquid, stirring, after leaving standstill 10 ~ 20min, desurfacing oxide, then the copper cerium alloy adding group component, continue heating, add coverture after stirring;
3) stating step 2) the solder liquid 10 ~ 20min of gained, continue the signal bronze adding group component, limit heating is dissolved limit and is stirred, and leaves standstill 10 ~ 20min after adding coverture;
4) finally add cupro silicon, add and stir, after leaving standstill 10 ~ 20min, desurfacing oxide, stops heating;
5) get the solder liquid of step 4) gained, continuous casting growth ingot, polishing, extruding, drawing is shaping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410501536.1A CN104339099B (en) | 2014-09-27 | 2014-09-27 | A kind of containing the intermediate temperature solder of copper and alloy thereof |
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| CN201410501536.1A CN104339099B (en) | 2014-09-27 | 2014-09-27 | A kind of containing the intermediate temperature solder of copper and alloy thereof |
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| CN104339099A true CN104339099A (en) | 2015-02-11 |
| CN104339099B CN104339099B (en) | 2016-06-01 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181123A (en) * | 2016-08-19 | 2016-12-07 | 佛山晓世科技服务有限公司 | A kind of low silver middle temperature brazing material |
| CN108381058A (en) * | 2018-02-27 | 2018-08-10 | 江苏远方动力科技有限公司 | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof |
| CN108381060A (en) * | 2018-05-16 | 2018-08-10 | 中原工学院 | Copper phosphorus base solder and its application |
| CN108465974A (en) * | 2018-02-27 | 2018-08-31 | 江苏远方动力科技有限公司 | A kind of low-silver copper-base high-performance solder and preparation method thereof |
| CN113843546A (en) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | CuPSnAg Ni-Re ultra-silver solder, preparation method and application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS63313695A (en) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | Silver alloy filler metal for brazing |
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN103358048A (en) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | Silver, copper and phosphorus system vacuum brazing filler |
-
2014
- 2014-09-27 CN CN201410501536.1A patent/CN104339099B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63313695A (en) * | 1987-06-12 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | Silver alloy filler metal for brazing |
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN103358048A (en) * | 2013-07-25 | 2013-10-23 | 杭州华光焊接新材料股份有限公司 | Silver, copper and phosphorus system vacuum brazing filler |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181123A (en) * | 2016-08-19 | 2016-12-07 | 佛山晓世科技服务有限公司 | A kind of low silver middle temperature brazing material |
| CN108381058A (en) * | 2018-02-27 | 2018-08-10 | 江苏远方动力科技有限公司 | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof |
| CN108465974A (en) * | 2018-02-27 | 2018-08-31 | 江苏远方动力科技有限公司 | A kind of low-silver copper-base high-performance solder and preparation method thereof |
| CN108381060A (en) * | 2018-05-16 | 2018-08-10 | 中原工学院 | Copper phosphorus base solder and its application |
| CN113843546A (en) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | CuPSnAg Ni-Re ultra-silver solder, preparation method and application |
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| Publication number | Publication date |
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| CN104339099B (en) | 2016-06-01 |
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Effective date of registration: 20200629 Address after: 430000 705, 706a, building 1, Huigu spacetime, No.206, laowuhuang highway, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Tuozhijia Information Technology Co.,Ltd. Address before: Hemudu Site in Yuyao City, Zhejiang Province town Luojiang village 315000 Jiang Ningbo home Patentee before: NINGBO YINMA WELDING TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20201103 Address after: Jiangdong Road, Shuichang Road, Gulou District, Nanjing City, Jiangsu Province, 210000 Patentee after: Li Wenkang Address before: 430000 705, 706a, building 1, Huigu spacetime, No.206, laowuhuang highway, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Tuozhijia Information Technology Co.,Ltd. |