CN103978323A - Lead-free solder - Google Patents
Lead-free solder Download PDFInfo
- Publication number
- CN103978323A CN103978323A CN201410228913.9A CN201410228913A CN103978323A CN 103978323 A CN103978323 A CN 103978323A CN 201410228913 A CN201410228913 A CN 201410228913A CN 103978323 A CN103978323 A CN 103978323A
- Authority
- CN
- China
- Prior art keywords
- nanometer
- particle
- leadless welding
- welding alloy
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Abstract
The invention relates to lead-free solder used for the microelectronic field of welding of electronic components and circuit boards. The lead-free solder is characterized by adding nanometer Ni particles and nanometer Fe2O3 particles with improved welding performance into low-nano-silver tin based solder to form particle added low-nano-silver lead-free solder. The lead-free solder is composed of, by mass percentage, 0.3-0.7% of Ag, 0.5-1.0% of Cu, 0.025-0.2% of nanometer Ni particles, 0.2-1.0% of nanometer Fe2O3, and the balance of Sn. Compared with common lead-free solder, the lead-free solder is low in melting point and higher in wetting power and shearing resistance. Besides, the thickness of interface pessimum intermetallic compound Cu3Sn is reduced, and welding performance is more excellent.
Description
Technical field
The present invention relates to a kind of lead-free solder for microelectronics such as electronic devices and components and wiring board welding, in the tin solder that it is characterized in that to low silver being, add the Ni nano particle that improves welding performance and the Fe that improves welding point anti-shear performance
2o
3nano particle, forms the low silver-colored series lead-free solder that a kind of particle adds.
Background technology
Along with the arrival of information age, electronics industry has obtained swift and violent development, and the products such as computer, mobile phone rapidly universal makes electronic industry become the most noticeable and one of the most potential industry.The prosperity of electronic industry has also driven the development of closely-related electronics manufacturing with it, and as the key links in electronics manufacture process, the importance of Electronic Packaging is also day by day remarkable.And soldering becomes the desirable technique of guaranteeing conductive interconnection between Electronic Packaging components and parts.Scolder, as a kind of connecting material, is being undertaken the task of functions such as realizing mechanical connection, electrical equipment connection and heat exchange in Electronic Packaging process.
Sn-Pb solder alloy, with its cheap cost, good electric conductivity and good soldering processes performance, is widely used in for a long time in components and parts encapsulation and printed circuit board (PCB) assembling, thereby becomes very important brazing material in Electronic Packaging technique.Yet Pb is a kind of noxious material, very large to the threat of health.The compound of Pb and Pb is listed in 17 kinds to one of chemical substance of human body and environmental hazard maximum by Environmental Protection Agency (EPA).In 21 century, new green scolder---lead-free solder will become the main flow welding material that electronics manufacturing is used
Due to Sn have suitable electrical and thermal conductivity, suitable wetability, easily with the advantage such as other element formation alloy, with low cost, aboundresources, and it meets the relevant criterion in the fields such as metallography, environmentology and economics substantially, therefore, unanimously generally acknowledge lead-free solder is defined as and take Sn as substrate in the world, add wherein the alloy of other metal constituent elements.That is to say, current the developed lead-free solder overwhelming majority is all Sn base alloy, usually improves the performance of pure Sn metal, to reach the instructions for use of lead-free solder by adding wherein the units such as In, Bi, Zn, Ag, Cu, Sb and Mg.
The leadless welding alloy system of main application has at present: the bianry alloys such as Sn-Bi, Sn-Ag, Sn-In, Sn-Zn, Sn-Cu, Sn-Sb; The ternary alloy three-partalloys such as Sn-Ag-Bi, Sn-Ag-Cu, Sn-Zn-Bi, Sn-Zn-Ag, Sn-In-Bi, Sn-Zn-In, also have minority by quaternary or five yuan of alloys that metallic element forms.By contrast, because Sn-Ag-Cu (SAC) scolder has added Cu constituent element on the Sn-Ag of original better performances scolder basis, guaranteeing under the prerequisite of its good mechanical properties, make fusing point obtain suitable reduction, also reduce the corrosion of scolder to Cu element in interconnection line or substrate simultaneously, therefore developed into gradually the lead-free solder of international standard.
No matter be the SAC3906 of U.S.'s recommendation at present, the SAC3807 that European Union is recommended, or SAC305 leadless welding alloy is recommended by Japan, on market, existing Sn-Ag-Cu scolder is higher containing Ag amount, all more than 3.0wt.%, and Ag's is expensive, and the cost of Ag accounts for 40%～50% in scolder, the fluctuation of international market Ag valency is also increasing, and this makes 2-3 that the Sn-Ag-Cu scolder price of Gao Yin can reach traditional Sn-Pb scolder doubly.But after the content of solder alloy Ag element reduces, its fusing point uprises, wetability variation, reliability of solder joints reduces, the too thick joint causing of weld interface IMC degradation under the life-span.
Summary of the invention
For the above-mentioned problem of mentioning, technical problem to be solved by this invention is that exploitation is a kind of for microelectronics such as electronic devices and components and wiring board welding, has the low silver-colored series lead-free solder of fine wettability and anti-shear performance.Feature of the present invention is by nanometer Ni particle and nanometer Fe
2o
3the low silver that adds to of particle is in tin-base lead-free solder.
The object of the invention is to be achieved through the following technical solutions.
A kind of nanometer Ni particle and nanometer Fe
2o
3the low silver-colored series lead-free solder that particle adds, is characterized in that: tin solder silver content is 0.3-0.7 (wt.%) only; Cu content is 0.5-1.0 (wt.%); The nanometer Ni grain diameter adding is 20--70nm, and its content is 0.025-0.2 (wt.%); The nanometer Fe of adding
2o
3grain diameter is 1--40nm, and its content is 0.2-1.0 (wt.%), and all the other are Sn.
Wherein the interpolation of nanometer Ni particle makes it in the process of welding, become the heterogeneous nuclei of intermetallic compound forming core, promotes the wetting of scolder and Cu substrate, thereby improves welding performance; And in the process of being on active service in long term device, the existence of nanometer Ni particle, has effectively suppressed the diffusion of Cu, has suppressed Cu
3the growth of Sn, the intensity of raising welding point; The nanometer Fe of adding
2o
3particle is mainly present in the middle of scolder, plays the effect of dispersion-strengtherning, has improved the anti-shear performance of scolder part in welding point.
As preferably, in above-mentioned leadless welding alloy, the percentage by weight that described leadless welding alloy contains following composition is:
Ag:0.4-0.7%; Cu:0.6%-0.8%; Nanometer Ni particle: 0.1-0.2%; Nanometer Fe
2o
3particle: 0.2-1.0%; All the other are Sn.
As preferably, in above-mentioned leadless welding alloy, the percentage by weight that described leadless welding alloy contains following composition is:
Ag:0.4-0.7%; Cu:0.6%-0.8%; Nanometer Ni particle: 0.1-0.2%; Nanometer Fe
2o
3particle: 0.3-0.6%; All the other are Sn.
As preferably, in above-mentioned leadless welding alloy, the percentage by weight that described leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.1-0.2%; Nanometer Fe
2o
3particle: 0.3-0.6%; All the other are Sn.
As preferably, in above-mentioned leadless welding alloy, the percentage by weight that described leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.3-0.6%; All the other are Sn.
As preferably, in above-mentioned leadless welding alloy, the percentage by weight that described leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.4%; All the other are Sn.
Accompanying drawing explanation
Compound sectional view between the interface metal that Fig. 1 scolder of the present invention and Cu substrate form through reflux digestion;
Fig. 2 scolder of the present invention (each composition percetage by weight: Ag:0.5% wherein; Cu:0.7%; Nanometer Ni particle: x%; Nanometer Fe
2o
3particle: 0.4%; All the other are Sn) and Cu substrate compound thickness statistical chart through between the interface metal of reflux digestion formation.
The specific embodiment
Below in conjunction with embodiment, describe the present invention, but the present invention is not limited to these embodiment.
Embodiment 1
1. scolder preparation
Sn ball, Ag powder, Cu powder, nanometer Ni particle and nanometer Fe in prepared scolder
2o
3it is as shown in the table for Particle Phase related parameter.
Scolder melting: take in proportion fused salt (mass ratio KCl:LiCl=1.3:1.0), gross mass is about 1/3 of required smelting metal weight.Fused salt is put into Al
2o
3in ceramic crucible, and be heated to 480 ℃, insulation 10min, makes its fusing.By Sn ball, Ag powder, Cu powder, nanometer Ni particle and nanometer Fe
2o
3particle mixes and puts into another crucible according to certain proportioning, and the fused salt after fusing is poured in the crucible that metal dust is housed, and object is that metal dust is protected, anti-oxidation.Then with resistance furnace, continue heating, furnace temperature is set to 600 ℃.After fusing, start timing completely, then be incubated 120min.During this period, every 10min, with ceramic rod, stir once, make full and uniformization of alloying component.After two hours, hot crucible is taken out from stove, be placed in air and be cooled to room temperature (20 ℃), then from crucible, take out.The cooling rear alloy cast ingot any surface finish of mold, no significant defect.Said process all carries out under nitrogen protection.
2. scolder detects
A. melted scolder is made to Φ 4 * 4mm
3cylinder do wetting power test.
B. melted scolder is placed in and processes on clean copper coin, through classical reflux temperature curve, reflux, form good solder joint, do the strength test of paster shearing force.
C. melted scolder is placed in and processes on clean copper coin, through classical reflux temperature curve, reflux, form good solder joint.Through 48-300 hours agings, observe the growth thickness of compound between interface metal again.
Embodiment 2
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.5%; Nanometer Ni particle: 0.025%; Nanometer Fe
2o
3particle: 0.2%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 3
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.025%; Nanometer Fe
2o
3particle: 0.2%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 4
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.1%; Nanometer Fe
2o
3particle: 0.2%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 5
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.2%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 6
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.4%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 7
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.6%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 8
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.8%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Embodiment 9
A leadless welding alloy with good wet power and anti-shearing force, the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 1.0%; All the other are Sn, also can comprise inevitable impurity.
The preparation method of leadless welding alloy in this embodiment with good wet power is consistent with preparation method and the detection method of solder alloy in embodiment 1, and difference is only that the percentage by weight of each composition of leadless welding alloy takes according to ratio in the present embodiment.
Choose the test result of the leadless welding alloy with good wet power and anti-shear ability obtaining in above-mentioned part embodiment, as shown in the table:
Table 1:
| ? | Maximum wetting power (mN) | Wetting time (s) | Paster shearing force intensity (gf) | Fusing point (℃) |
| Embodiment 3 | 2.01 | 2.67 | 8098 | 230.09 |
| Embodiment 4 | 2.65 | 2.74 | 8259 | 228.76 |
| Embodiment 5 | 2.23 | 2.86 | 8193 | 229.05 |
| Embodiment 6 | 3.46 | 2.71 | 8976 | 228.43 |
| Embodiment 7 | 3.27 | 2.44 | 7673 | 229.31 |
| Embodiment 8 | 3.15 | 2.83 | 7521 | 229.98 |
| Embodiment 9 | 3.09 | 2.91 | 7313 | 231.12 |
Specific embodiment described in invention is only to the explanation for example of the present invention's spirit, those skilled in the art in the invention can do various Revision and supplements or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the appended claims institute range of definition.
Claims (6)
1. one kind has been added nanometer Ni particle and nanometer Fe
2o
3the low silver-colored series lead-free solder of particle, has good wetting power and anti-shear performance, it is characterized in that at low silver being in tin-base lead-free solder, to add nanometer Ni particle and nanometer Fe
2o
3particle, the composition of this scolder is by percentage to the quality:
Ag:0.3-0.7%; Cu:0.5-1.0%; Nanometer Ni particle: 0.025-0.2%; Nanometer Fe
2o
3particle: 0.2-1.0%, all the other are Sn,
Wherein nanometer Ni grain diameter is 20--70nm, nanometer Fe
2o
3grain diameter is 1--40nm.
2. there is according to claim 1 good wetting power and anti-shear performance leadless welding alloy, it is characterized in that the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.4-0.7%; Cu:0.6%-0.8%; Nanometer Ni particle: 0.1-0.2%; Nanometer Fe
2o
3particle: 0.2-1.0%; All the other are Sn.
3. there is according to claim 2 good wetting power and anti-shear performance leadless welding alloy, it is characterized in that the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.4-0.7%; Cu:0.6%-0.8%; Nanometer Ni particle: 0.1-0.2%; Nanometer Fe
2o
3particle: 0.3-0.6%; All the other are Sn.
4. there is according to claim 3 good wetting power and anti-shear performance leadless welding alloy, it is characterized in that the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.1-0.2%; Nanometer Fe
2o
3particle: 0.3-0.6%; All the other are Sn.
5. there is according to claim 4 good wetting power and anti-shear performance leadless welding alloy, it is characterized in that the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.3-0.6%; All the other are Sn.
6. there is according to claim 5 good wetting power and anti-shear performance leadless welding alloy, it is characterized in that the percentage by weight that this leadless welding alloy contains following composition is:
Ag:0.5%; Cu:0.7%; Nanometer Ni particle: 0.2%; Nanometer Fe
2o
3particle: 0.4%; All the other are Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410228913.9A CN103978323A (en) | 2014-05-27 | 2014-05-27 | Lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410228913.9A CN103978323A (en) | 2014-05-27 | 2014-05-27 | Lead-free solder |
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|---|---|
| CN103978323A true CN103978323A (en) | 2014-08-13 |
Family
ID=51270623
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|---|---|---|---|
| CN201410228913.9A Pending CN103978323A (en) | 2014-05-27 | 2014-05-27 | Lead-free solder |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104476006A (en) * | 2014-11-18 | 2015-04-01 | 南京航空航天大学 | Submerged-arc welding high-moisture oxidation-resistant lead-free solder and preparation method thereof |
| CN106384720A (en) * | 2016-10-19 | 2017-02-08 | 北京理工大学 | Method and device for manufacturing solder bumps and electronic component |
| CN106624433A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point lead-free solder alloy |
| CN106624434A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin antimony solder alloy |
| CN111843279A (en) * | 2020-07-22 | 2020-10-30 | 昆山市宏嘉焊锡制造有限公司 | High-temperature oxidation-resistant SnSbCu lead-free solder |
| CN113977132A (en) * | 2014-08-18 | 2022-01-28 | （株）庆东One | Lead-free solder alloy composition and method for preparing lead-free solder alloy |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113977132A (en) * | 2014-08-18 | 2022-01-28 | （株）庆东One | Lead-free solder alloy composition and method for preparing lead-free solder alloy |
| CN113977132B (en) * | 2014-08-18 | 2024-03-19 | （株）庆东One | Lead-free solder alloy composition and method for preparing lead-free solder alloy |
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| CN106384720A (en) * | 2016-10-19 | 2017-02-08 | 北京理工大学 | Method and device for manufacturing solder bumps and electronic component |
| CN106624433A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Low-melting-point lead-free solder alloy |
| CN106624434A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin antimony solder alloy |
| CN111843279A (en) * | 2020-07-22 | 2020-10-30 | 昆山市宏嘉焊锡制造有限公司 | High-temperature oxidation-resistant SnSbCu lead-free solder |
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Application publication date: 20140813 |