CN108381060A - Copper phosphorus base solder and its application - Google Patents
Copper phosphorus base solder and its application Download PDFInfo
- Publication number
- CN108381060A CN108381060A CN201810467097.5A CN201810467097A CN108381060A CN 108381060 A CN108381060 A CN 108381060A CN 201810467097 A CN201810467097 A CN 201810467097A CN 108381060 A CN108381060 A CN 108381060A
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- China
- Prior art keywords
- solder
- copper
- phosphorus base
- brazing
- temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Abstract
The invention belongs to be brazed field, and in particular to a kind of copper phosphorus base solder.Copper phosphorus base solder of the present invention, it includes the raw material of following weight percentage：2~10% P, 0~8% Ag, 0~8% Sn, 73~98% Cu.The present invention can improve the wetting ability of copper-phosphorus brazing alloy, reduce its fusing point, the solid liquid phase range of solder is relatively narrow, and the function admirable of soldered fitting.
Description
Technical field
The invention belongs to be brazed field, and in particular to a kind of copper phosphorus base pricker and its application.
Background technology
The basic definition of solder is to realize the combination of two kinds of materials or part, in the gap of connected piece or gap
The necessary filler that side is added, the fusing point of solder have to the fusing point less than base material.The mobility of copper-phosphorus brazing alloy is relatively
It is good, relative low price, function admirable, therefore there is very high cost performance, copper-phosphorus brazing alloy cannot be only used for the pricker of ferrous metal
Weldering, can be used for brazed copper and brass.Under normal conditions, in order to reduce solder fusing point, improve solder mobility, copper phosphorus
The phosphorus content of solder needs to be maintained at 5% or more, but when phosphorus content is excessively high, a large amount of brittleness chemical combination are just had in solder matrix
Object causes brazing filler metal alloy, by prodigious brittleness, to lead to the processing difficulties of solder under room temperature environment.In addition, copper-phosphorus brazing alloy intolerant to
Sulfidation corrosion, it is very poor to the wetability of ferrous metal, it is easy to the element interactions such as iron and nickel and generates brittlement phase, therefore to a certain degree
On limit its application range.Develop the more excellent copper-phosphorus brazing alloy of brazing property, development and application for copper-phosphorus brazing alloy
There is vital meaning.
Invention content
It is higher, poor to ferrous metal wetability low with soldering joint strength that the invention solves traditional copper-phosphorus brazing alloy fusing points
The problem of, to solve the above problems, the present invention provides, a kind of fusing point is low, wetability is good, the new copper of soldered fitting better performances
Phosphorus brazing alloy.
The purpose of the present invention is what is realized in the following manner：
A kind of copper phosphorus base solder, it includes the raw material of following weight percentage：2~10% P, 0~8% Ag, 0~
8% Sn, 73~98% Cu.
Optionally, the weight percent of Ag is 2~8% in the solder, is such as 2~5%.
Optionally, the weight percent of Sn is 7~9% in the solder, is such as 7~8%, preferably 7%.
Optionally, the weight percent of P is 3~7% in the solder, is such as 3~4% or 6~7%.
Optionally, in the solder Cu weight percent be 89~91%, or for P, Ag and Sn weight percent more than
Amount, i.e., the described solder form 100% (if if Ag or Sn exists) by Cu, P, Ag or Sn.
As example：
A kind of copper phosphorus base solder, it includes the raw material of following weight percentage：The Cu of 7% P, 2% Ag and 91%.
A kind of copper phosphorus base solder, it includes the raw material of following weight percentage：The Cu of 6% P, 5% Ag and 89%.
A kind of copper phosphorus base solder, it includes the raw material of following weight percentage：The Cu of 3% P, 7% Sn and 90%.
Above-mentioned copper phosphorus base solder is applied to the soldering of red copper or brass.
Compared with the existing technology, the addition of Ag elements of the present invention can improve the wetting ability of copper-phosphorus brazing alloy, and it is strong to increase it
Degree and toughness, while its fusing point is reduced, the addition of Sn elements makes the reduction of copper-phosphorus brazing alloy fusing point become apparent, the solid liquid phase model of solder
Enclose relatively narrow, the function admirable of soldered fitting.
Description of the drawings
Fig. 1 is Cu in embodiment 191P7Ag2Solder spreading area comparison diagram on copper plate and brass sheet；
Fig. 2 is Cu in embodiment 191P7Ag2Solder brazing copper connector metallographic structure figure；
Fig. 3 is Cu in embodiment 289P6Ag5Solder spreading area comparison diagram on copper plate and brass sheet；
Fig. 4 is Cu in embodiment 289P6Ag5Solder brazing copper connector metallographic structure figure；
Fig. 5 is Cu in embodiment 390P3Sn7Solder spreading area comparison diagram on copper plate and brass sheet；
Fig. 6 is Cu in embodiment 390P3Sn7Solder brazing copper connector metallographic structure figure.
Specific implementation mode
With reference to specific embodiment, the present invention is described further, but protection scope of the present invention is not limited to
This.
Embodiment 1：
A kind of copper phosphorus base solder, it is made of the raw material of following weight percentage：7% P, 2% Ag and 91%
Cu.The alloy expression formula of solder is Cu91P7Ag2。
1.Cu91P7Ag2The fusing point of solder is tested
The instrument that the fusing point test of solder uses is the resistance to TG-DTA/DSC synchronous solvings of speeding of Germany, specific operation step
It is rapid as follows：
(1) water bath with thermostatic control is opened, it is best that 2-3 hours in advance, which open and keep water temperature higher than 2-3 DEG C of room temperature,；
(2) according to experiment equipment instruction, first the host of instrument is opened, then open the Survey Software on computer.Most
After open hydrogen cylinder, by the flow set of protective gas be 20ml/min, purge 30min；
(3) when the balance displays temperature of instrument reaches room temperature and keeps stablizing, start to test；
(4) since brazing filler metal fusing point temperature is not higher than 1000 DEG C, so heating rate is maintained at 5K/min to 30K/min, this
20K/min is chosen in experiment (K is Fahrenheit temperature, Fahrenheit temperature=Celsius temperature+273.15K)；
(5) vacuum controller is opened in Survey Software judgement；
(6) terminate experiment, according to operation regulations shutdown：(the total meter pressure of pressure reducing valves is waited to be shown as 1. closing hydrogen gas cylinder
Zero) knob that output is adjusted 2., is screwed to zero-bit, 3. closes software, computer, instrument, water-bath and regulated power supply.
The fusing point of traditional copper-phosphorus brazing alloy is about 710 DEG C.By testing to obtain Cu91P7Ag2The solidus temperature of solder is 648
DEG C, liquidus temperature is 810 DEG C.Cu91P7Ag2The fusing point of solder is 648 DEG C, and the fusing point of solder is relative to traditional copper-phosphorus brazing alloy
It decreases.
2.Cu91P7Ag2The wetability of solder is tested
Under certain heating temperature and soaking time, the solder spreading area melted on metallic plate is measured, with this
As the wettability according to analysis solder, the wettability of the larger solder of spreading area is preferable.Test equipment and tool：Case
Formula resistance furnace, high-temperature-resistant glove, crucible tongs, graphite cake, tool tong, cooling container etc..Main operational steps are as follows：
(1) it checks equipment, confirms whether instrument state is good, and whether inner facility is complete, whether keeps clean and tidy in stove, really
Power on after recognizing；
(2) after powering on, the fusing point of identified solder is tested according to fusing point, furnace temperature is made to be raised to predetermined temperature.This
In experiment, due to the temperature-controlled heat situation of chamber type electric resistance furnace, so the heating temperature of each solder is unified in fusion temperature
50 DEG C added above；
(3) preprepared graphite cake is preheated；
(4) on the copper plate for being positioned ready for solder sample, take appropriate brazing flux that solder sample surfaces are completely covered；
(5) open fire door, coupon level is accommodated rapidly, is steadily placed on graphite cake, should make sample be maintained at one by
In hot uniform experimental enviroment；
(6) fire door is closed, when temperature is raised to specified temperature, and keeps the temperature one minute；
(7) after keeping the temperature, fire door is opened, takes out sample, sample is put into preprepared cooling container, is carried out
Water cooling；
(8) under a tap, the remaining brazing flux of cleaning specimen surface and sundries are rinsed, laboratory sample is obtained.Take 5 in purple
Test of the preferable sample of effect for wetability is sprawled on copper coin；
(9) terminate experiment, close laboratory apparatus, arrange experiment article, cleaning.
Wetting test operating procedure on brass sheet is consistent with copper plate operating procedure.
Cu91P7Ag2Test results are shown in figure 1 for the wetability of solder.As seen from the figure, solder sprawls face on copper plate
Product is about 305mm2。
3.Cu91P7Ag2The Braze tests step of solder brazing red copper and the Mechanics Performance Testing of connector
(1) copper plate is cut into the sample that specification is 60mm × 15mm × 4mm by the stock of copper plate with wire cutting machine.
(2) both ends are polished with coarse sandpaper, grinds off the flash generated when cutting and the oxide layer formed before, and anhydrous
Cleaning degreases in ethyl alcohol, natural air drying or is dried up using hair-dryer after the completion of cleaning；
(3) two pieces of copper plates are placed using docking mode, and there are natural gaps；
(4) solder of section shape and powdered brazing flux are deposited on the gap of the two pieces of copper plates to be connected docking；
(5) the soldered fitting sample after the completion of assembly is subjected to air atmosphere soldering in chamber type electric resistance furnace, it must before soldering
It need be preheated, two welding torch preheated joints of generally use H01-6 and H01-12.The color of soldered fitting is observed when preheating,
When soldered fitting becomes kermesinus, preheating is just achieved the effect that.Final brazing temperature selects 690 DEG C, and soaking time is
2min；
(6) after the completion of being brazed, when brazed coupon temperature is brought down below 200 DEG C, soldered fitting is cleaned with warm water, then use hair
The slag and brazing flux of brush handle face of weld clean up, to prevent from corroding.
(7) the copper connector sample that 5 solderings are completed is chosen, tension test is carried out to sample with omnipotent mechanics machine,
Record test data.
Cu91P7Ag2Solder is 690 DEG C in brazing temperature, the tensile strength of red copper soldered fitting when soaking time is 2min
As shown in table 1.Cu is known by table 191P7Ag2Solder brazing copper connector intensity is about 230MPa.
1 Cu of table91P7Ag2The copper sleeve tensile strength of solder brazing red copper
| Sample | 1 | 3 | 4 | 5 |
| Tensile strength/MPa | 198 | 264 | 233 | 228 |
4. fine welding line structure observation
Fig. 2 is Cu91P7Ag2The metallurgical tissue picture of solder brazing red copper sample connector.As seen from the figure, metallographic structure causes
Close uniform, soldering connection situation is preferable.
Embodiment 2：
A kind of copper phosphorus base solder, it is made of the raw material of following weight percentage：6% P, 5% Ag and 89%
Cu.The alloy expression formula of solder is Cu89P6Ag5。
Cu89P6Ag5The fusing point test of solder, wetability test method detailed in Example 1.
Cu can be obtained by test89P6Ag5The solidus temperature of solder is 652 DEG C, and liquidus temperature is 800 DEG C.Cu89P6Ag5
The fusing point of solder is 652 DEG C, and the fusing point of solder decreases relative to traditional copper-phosphorus brazing alloy.
Cu89P6Ag5Test results are shown in figure 3 for the wetability of solder.As seen from the figure, solder sprawls face on copper plate
Product is about 285mm2。
Cu89P6Ag5The operating procedure detailed in Example 1 of solder brazing red copper, final brazing temperature is 830 in step (5)
DEG C, soaking time 2min.
Cu89P6Ag5Solder is 830 DEG C in brazing temperature, the tensile strength such as table 2 of copper connector when soaking time is 2min
It is shown.Cu is known by table 289P6Ag5Solder brazing copper connector intensity is about 240MPa, and soldering joint strength is higher.
2 Cu of table89P6Ag5The copper sleeve tensile strength of solder brazing red copper
| Sample | 1 | 2 | 3 | 4 | 5 |
| Tensile strength/MPa | 239 | 245 | 241 | 236 | 224 |
Fig. 4 is Cu89P6Ag5The metallurgical tissue picture of solder brazing red copper sample connector.As seen from the figure, metallographic structure causes
It is close uniform, and crystal grain is tiny, soldering connection situation is preferable.
Embodiment 3：
A kind of copper phosphorus base solder, it is made of the raw material of following weight percentage：3% P, 7% Sn and 90%
Cu.The alloy expression formula of solder is Cu90P3Sn7。
Cu90P3Sn7The fusing point test of solder, wetability test method detailed in Example 1.
Cu can be obtained by test90P3Sn7The solidus temperature of solder is 643 DEG C, and liquidus temperature is 685 DEG C.Cu90P3Sn7
The fusing point of solder is 643 DEG C, and the fusing point of solder decreases relative to traditional copper-phosphorus brazing alloy, and the solid-liquid phase line model of solder
Enclose the relatively narrow fusing for being conducive to solder.
Cu90P3Sn7Test results are shown in figure 5 for the wetability of solder.As seen from the figure, solder sprawls face on copper plate
Product is about 335mm2。Cu90P3Sn7Solder is very good to the wetability of copper plate.Comparison diagram 1, Fig. 3 and Fig. 5 can obtain three kinds of solders
All compared with it, effect is good on brass sheet for wetting effect on copper plate.
Cu90P3Sn7The operating procedure of solder brazing red copper is shown in embodiment 1, and final brazing temperature is 830 DEG C in step (5),
Soaking time is 2min.
Cu90P3Sn7Solder is 830 DEG C in brazing temperature, the tensile strength such as table 3 of copper connector when soaking time is 2min
It is shown.Cu is known by table 390P3Sn7Solder brazing copper connector intensity is about 231MPa.
3 Cu of table90P3Sn7The copper sleeve tensile strength of solder brazing red copper
| Sample | 1 | 2 | 3 | 4 | 5 |
| Tensile strength/MPa | 207 | 231 | 234 | 219 | 228 |
Fig. 6 is the metallurgical tissue picture for being brazed red copper sample connector.As seen from the figure, metallographic structure dense uniform, soldering
Connection is preferable.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those skilled in the art,
Under the premise of not departing from general idea of the present invention, several changes and improvements can also be made, these should also be considered as the present invention's
Protection domain.
Claims (10)
1. a kind of copper phosphorus base solder, which is characterized in that it includes the raw material of following weight percentage：2~10% P, 0~8%
Ag, 0~9% Sn, 73~98% Cu.
2. copper phosphorus base solder as described in claim 1, which is characterized in that in the solder weight percent of Ag be 2~
8%.
3. copper phosphorus base solder as claimed in claim 2, which is characterized in that in the solder weight percent of Ag be 2~
5%.
4. copper phosphorus base solder as described in claim 1, which is characterized in that in the solder weight percent of Sn be 7~
9%, such as it is 7~8%.
5. the copper phosphorus base solder as described in any first claim, which is characterized in that the weight percent of P is in the solder
3~7%, such as it is 3~4% or 6~7%.
6. the copper phosphorus base solder as described in any first claim, which is characterized in that the Cu weight percent in the solder
It is 89~91%, or is the weight percent surplus of P, Ag and Sn.
7. copper phosphorus base solder as described in claim 1, which is characterized in that it includes the raw material of following weight percentage：7%
P, the Cu of 2% Ag and 91%.
8. copper phosphorus base solder as described in claim 1, which is characterized in that it includes the raw material of following weight percentage：6%
P, the Cu of 5% Ag and 89%.
9. copper phosphorus base solder as described in claim 1, which is characterized in that it includes the raw material of following weight percentage：3%
P, the Cu of 7% Sn and 90%.
10. the application of the copper phosphorus base solder according to any first claim, which is characterized in that it is applied to red copper or Huang
The soldering of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810467097.5A CN108381060A (en) | 2018-05-16 | 2018-05-16 | Copper phosphorus base solder and its application |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810467097.5A CN108381060A (en) | 2018-05-16 | 2018-05-16 | Copper phosphorus base solder and its application |
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ID=63071854
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| CN201810467097.5A Withdrawn CN108381060A (en) | 2018-05-16 | 2018-05-16 | Copper phosphorus base solder and its application |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110977242A (en) * | 2019-12-02 | 2020-04-10 | 金华市三环焊接材料有限公司 | Special environment-friendly low-silver brazing filler metal for machine room air conditioner and manufacturing method thereof |
| CN111468861A (en) * | 2020-04-17 | 2020-07-31 | 中车青岛四方机车车辆股份有限公司 | Copper-phosphorus brazing filler metal soldering lug and preparation method thereof |
| CN115647647A (en) * | 2022-06-02 | 2023-01-31 | 郑州机械研究所有限公司 | Low-melting-point copper-phosphorus solder wire and preparation method thereof |
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| CN101003109A (en) * | 2006-12-29 | 2007-07-25 | 哈尔滨工业大学 | Active mesothermal copper base solder, and preparation method |
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| CN104907728A (en) * | 2015-05-25 | 2015-09-16 | 郑州机械研究所 | Environment-friendly coated copper brazing filler metal |
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| CN106181123A (en) * | 2016-08-19 | 2016-12-07 | 佛山晓世科技服务有限公司 | A kind of low silver middle temperature brazing material |
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| CN101003109A (en) * | 2006-12-29 | 2007-07-25 | 哈尔滨工业大学 | Active mesothermal copper base solder, and preparation method |
| CN102284805A (en) * | 2011-07-25 | 2011-12-21 | 浙江信和焊材制造有限公司 | Preparation method of copper phosphorus-based alloy solder |
| CN104339099A (en) * | 2014-09-27 | 2015-02-11 | 宁波银马焊材科技有限公司 | Medium-temperature solder containing copper and copper alloy |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110977242A (en) * | 2019-12-02 | 2020-04-10 | 金华市三环焊接材料有限公司 | Special environment-friendly low-silver brazing filler metal for machine room air conditioner and manufacturing method thereof |
| CN111468861A (en) * | 2020-04-17 | 2020-07-31 | 中车青岛四方机车车辆股份有限公司 | Copper-phosphorus brazing filler metal soldering lug and preparation method thereof |
| CN115647647A (en) * | 2022-06-02 | 2023-01-31 | 郑州机械研究所有限公司 | Low-melting-point copper-phosphorus solder wire and preparation method thereof |
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