CN102642099A - Sn-Zn-based lead-free solder alloy for aluminum bronze soldering and method for preparing same - Google Patents
Sn-Zn-based lead-free solder alloy for aluminum bronze soldering and method for preparing same Download PDFInfo
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Abstract
A Sn-Zn-based lead-free solder alloy for aluminum bronze soldering and a method for preparing the same belong to the technical field of new materials. The solder alloy comprises the components in percentage by weight of: 7-8.5% of Zn, 0.2-0.49% of Al, 0.55-0.7% of Ag, 0-0.1% of P, 0-1% of Ni, 0-0.5% of RE and the balance of Sn. Steps for preparing the solder alloy are that: (1) Zn-Al intermediate alloy smelting: the alloy is smelted in the protective atmosphere of 450 DEG C according to the proportion of Zn-6Al, Zn is firstly smelted, then Al is added, and the mixture is uniformly stirred and cooled; and (2) solder alloy smelting: according to the proportion of the alloy, pure metal and the intermediate alloy are sealed in a quartz tube, the quartz tube is vacuumized and heated, the alloy is uniformly stirred after being completely smelted, thermally insulated for 3 hours, and are then water cooled and taken out. Compared with the existing Sn-based lead-free solder alloy, the Sn-Zn-based lead-free solder alloy has better wettability on copper and aluminum, thus having good welding performance; and a welding point has excellent mechanical property, and is more suitable to aluminum bronze soldering than the existing Sn-Ag-Cu and Sn-9Zn solder.
Description
Technical field
The present invention relates to a kind of Sn-Zn base leadless solder alloy that is used for the aluminum bronze solder and preparation method thereof, belong to new material technology field.
Background technology
Copper has good electrical conductivity, thermal conductivity, plastic deformation ability, braze ability and corrosion resistance; Therefore, in the fields such as transmission, exchange heat and daily necessities of electricity, obtained to use widely, particularly refrigeration industry air-conditioning and refrigerator all are to adopt the material of copper pipe as refrigeration pipe system.Yet along with the shortage of resources of copper, the price of copper is high always in recent years, but also soaring what continue.This substitute of impelling people to begin to seek copper reduces cost.Because the aluminium price is relatively low and have good electric conductivity, thermal conductivity, corrosion resistance and workability ability, can satisfies the requirement on the serviceability fully in a lot of original occasions of copper of using, and its product cost is reduced greatly.Refrigeration industry is the bigger industry of copper consumption; The copper valency goes up and has influence on the competitiveness of whole industry with the exhaustion of copper resource; Not only can reduce the cost of refrigeration product greatly with the aluminium instead of copper; And do not reduce the performance of refrigerator, therefore in recent years both at home and abroad the parts such as evaporimeter in the refrigerator pipe-line system adopt the aluminum pipe manufacturing to become trend.
But, just at present, obtain low cost, high-performance, easily manufactured joint of aluminium and copper still has certain degree of difficulty technically simultaneously.This be because: 1. fusing point differs greatly: the fusing point of fine aluminium is 660 ℃, and the fusing point of fine copper is 1085 ℃.Because the fusing point of aluminium and copper differs greatly (425 ℃), be difficult to fusion simultaneously.2. be prone to oxidation: the aluminium surface is prone to form the fine and close Al of one deck in air
2O
3Oxide-film hinders the combination of aluminium and copper during welding, brought difficulty to welding.3. be prone to crack: when welding, generate eutectic Al-Al
2Cu becomes fragile weld seam, and about 0.5 times than the coefficient of expansion of copper of the coefficient of expansion of while aluminium causes weld seam to crack easily.4. perishable: the difference in Electrode Potential between aluminium and the copper is 1.997V, is prone to cause electrochemical corrosion (standard electrode potential of aluminium is 1.66V, and the standard electrode potential of copper is 0.337V).5. be prone to form pore: aluminium and copper liquid during high temperature can dissolve and absorb a large amount of gas (like hydrogen), Gas Solubility decline and have little time to overflow rapidly in alloy solution during cooling, and in weld seam, form pore.So realize aluminium substitution copper, what at first will solve is exactly the problem that aluminum bronze connects.
Existing welding manner between the copper aluminium mainly contains melting, Pressure Welding and three kinds of methods of soldering: the fusing point of aluminium and copper differs greatly, and often aluminium has melted and copper also is in solid-stately, be prone to form incomplete fusion and is mingled with, and the welding difficulty is bigger.Aluminium is strong oxidation in welding process, contains a certain amount of adsorbed water and the crystallization water in the oxide-film, is easy to generate pore.The thermal coefficient of expansion of aluminium is big, and coefficient of elasticity is little, and the distortion of welding back is bigger.Pressure Welding is that present aluminum bronze connects the main method that adopts.But it receives the restriction of design of part form, all can not use in a lot of occasions, and its complex process, production cost is high.But the method for welding cost is low, the good online production of adaptability, is the aluminum bronze interconnection technique with better development prospect; Soldering is divided into solder brazing and solder again by the height of solder fusing point.American Welding Society (AWS) (AWS) regulation solder liquidus temperature is higher than 450 ℃ and is called solder brazing, is lower than 450 ℃ and is called solder.Aluminum pipe is connected existing solder brazing and mainly selects aluminium silicon brazing filler metal with copper pipe, for example: Al-12.6wt%Si eutectic (577 ℃ of eutectic temperatures) or add the solder of the 3rd constituent element.Usually adopt heating in vacuum or automatic flame heat.The solder brazing flame welding also exists the deficiency of self: the fusing point of (1) Al is 660 ℃, and temperature control is bad, and aluminum pipe can the part thawing cause the tube wall attenuation, and high temperature can aggravate the ablation of joint in addition, influences the performance of joint.Especially be difficult to recover after the copper pipe surface bright layer of handling through light being destroyed, seriously influence follow-up brazing quality; To aluminum pipe, ablated surface is more serious, and the stretching experiment of joint shows that this zone is weak link, and fracture occurs in the aluminum pipe heat affected area near joint.(2) generally about 500 ℃, Al, Cu atom diffusion form meltable fragility Al-CuAl than very fast to brazing temperature easily
2Cocrystalization compound causes strength of joint to reduce.(3) generally use the strong brazing flux of corrosivity to remove the oxide-film of aluminium, the residue of brazing flux has strong corrosivity, corrodes tube wall and is difficult to cleaning.(4) joint after the soldering can easily not dismantled in producing the process of debugging machine, for butt joint reprocess with the secondary welding process in the specification requirement of flame welding higher, be difficult to reach high-quality soldering requirement.The method applicability of solder is strong, flexibility good; Can select different solders as the case may be for use; Obtain the soldered fitting of varying strength and different operating temperature, be applicable to various occasions, satisfy environmental protection under the new situation the requirement of aluminum bronze soldering with lead-free brazing.Therefore develop and be applicable to that the solder of aluminum bronze dissimilar metal, the lead-free brazing that can form good joint are the keys that realizes aluminium substitution copper.
The Sn-Pb brazing filler metal is to use low temperature brazing solder very widely, and wherein the most widely used is that fusing point is 183 ℃ a 63Sn-37Pb eutectic composition solder.Therefore Sn-Pb solder fusing point under this composition is minimum, can directly change solid phase into without the semi-molten state by liquid phase, and wetability is fabulous, and this solder adopts maximum in electronic component little interconnected.But heavy metal lead is a kind of poisonous element, and is plumbous along with discarded electronic product gets into nature, can be dissolved in the acid rainwater, infiltrates soil, finally dissolves in underground water.The people drinks leaded underground water can make the health of body suffer damage.For preventing plumbous pollution to natural environment, various countries have made strict restriction to lead in Industrial Application in succession.European Union has forbidden in electronics industry, using the solder that lead is arranged in 2006, Japanese Environmental Agency advocates and in industry, reduces plumbous consumption gradually, and the U.S. exposed bill in 1991 through lead, discarded electronic product was imposed the handling of great number.From the trend analysis of various countries' legislation, adopting lead-free to replace lead-containing materials to become inevitable choice.
Sn-9Zn brazing filler metal alloy commonly used at present, its fusing point is 198 ℃, Sn-Pb is approaching with eutectic, has good and economic and mechanical property.Zn in the Sn-9Zn solder and copper base and aluminium base all have affinity preferably, discover that the reaction of Sn-9Zn solder and copper base generates the Cu-Zn intermetallic compound; Zn, Al mutual solubility are bigger, in very large range generate solid solution, and Sn-9Zn solder and aluminium sheet reaction generate the Al-Zn-Sn solution area at the interface at aluminium, and Zn also can form thorn-like solid solution whisker and inserts solder and embed combination on aluminium base simultaneously.But the Zn element is active strong metal; A large amount of Zn is easy to the solder surface oxidation and causes alloy to have bigger surface tension under molten condition, have a strong impact on the wetability and the non-oxidizability of solder, and the keeping quality of Sn-Zn brazing filler metal braze welding system is relatively poor; Long-term placement can cause many problems such as bond strength step-down; Not corrosion-resistant owing to the simple substance Zn phase utmost point simultaneously, the perishable inefficacy of solder joint under wet environment, these problems have influenced the application of this alloy to a certain extent.
Summary of the invention
The objective of the invention is deficiency not good to the Sn-9Zn solder wetting property of prior art existence, the soldered fitting poor mechanical property; A kind of wetability preferably that on copper coin and aluminium sheet, all has is provided; Can effectively connect this two kinds of metals, and form the nearly eutectic lead-free solder alloy of Sn-Zn base that is applicable to the solder of aluminum bronze dissimilar metal of the higher soldered fitting of intensity.
The technical solution that the present invention takes is: a kind of Sn-Zn base leadless solder alloy that is used for the aluminum bronze solder; Said Sn-Zn base leadless solder alloy comprises that following components in weight percentage: Zn is 7-8.5%, and Al is 0.2-0.49%, and Ag is 0.55-0.7%; P is 0-0.1%; Ni is 0-1%, and RE is 0-0.5%, and all the other are Sn.
Described a kind of preparation method who is used for the Sn-Zn base leadless solder alloy of aluminum bronze solder, its preparation process may further comprise the steps:
(1) melting Zn-Al intermediate alloy
According to percentage by weight, Al is 6%, and Zn is that to require the block purity of weighing be that 99.99% Metal Zn and purity are 99.99% metal A l to the Zn-Al intermediate alloy of surplus; Under nitrogen or argon shield atmosphere, be warming up to 450-500 ℃ of at first deposite metal Zn, add metal A l then, after fully stirring, cooling is taken out behind the insulation 10-15min;
(2) the nearly eutectic lead-free solder alloy of melting Sn-Zn base
1. to be to use purity be that 99.99% metal Sn, Zn-6Al intermediate alloy, purity are that 99.99% metal A g, purity are that be weight percentage 15% commercially available Sn-P alloy and RE of 99.99% metal Ni, P content smelts in the preparation of the nearly eutectic lead-free solder alloy of Sn-Zn base; Press quality than each part of proportioning brazing filler metal alloy; Totally 200 grams are placed in the high-temperature resistant tube;
2. use hydrogen flame that high-temperature resistant tube one end scorification is sealed, other end scorification is for thin mouthful and use vavuum pump to vacuumize processing, behind the air in the emptying pipe, with thin mouthful of place's scorification sealing;
3. high-temperature resistant tube is put in the resistance furnace, is heated to 400 ℃ of meltings, treat that all constituent elements all melt after; Be incubated 2-3 hour, during per half an hour high-temperature resistant tube upset is stirred once, make the alloy homogenising; After treating that alloy is even liquid state, cooling is cooled to room temperature, takes out solder.
Said high-temperature resistant tube adopts quartz ampoule or earthenware.
Compare traditional Sn-9Zn brazing filler metal alloy, behind the adding Al, owing between the Zn-Al bigger solid solubility is arranged, Al exists with the form of solid solution in Zn in solder in the Sn-Zn solder.Because Al element density is less, when solder melts, can forms the thin oxide layer of one deck, and then stop the oxidation of Zn in the solder, thereby improve the non-oxidizability and the wetability of Sn-Zn base solder attached to the surface.The adding of simultaneously an amount of Al element can improve the intensity of Sn-Zn base solder, has improved the intensity of soldered fitting to a certain extent.However, too high Al content (being higher than 1%) can form blocked up oxide layer on the solder surface, and wetability is descended.
On the other hand, though the Al element can play the effect of solution strengthening to solder, the hardness of solder is increased, decrease ductility in rolling process, cracking phenomena occurs easily simultaneously.Further research shows, behind the adding Ag element, the plasticity of solder is improved, and cracking phenomena in plastic processing, do not occur, has good plastic working property in the solder; And, add the decay resistance that Ag can improve solder.In order to study the Ag element to the corrosion proof influence of solder, the inventor has carried out the electrochemical corrosion test to Sn-8.4Zn-0.73Ag and two kinds of solders of Sn-8.4Zn-0.44Al, and etchant solution is 3.5% NaCl solution.The corrosion potential that experiment records two kinds of solders is respectively-0.96V and-1.07V; Can know that from experimental result under the situation of identical Zn content, the corrosion resistance of solder is superior to adding the Al element behind the adding Ag element.Theoretical and experiment all shows, in the Sn-Zn solder, adds the Ag element, and the Ag element can form intermetallic compound AgZn with the Zn element
3Phase reduces the oxidation of solder surface Zn, has improved the wetability of solder, and then has improved the welding performance of solder; A spot of AgZn of while
3The existence of particle can be played the effect of dispersion-strengtherning to soldered fitting, improves the mechanical property of joint; And the adding of Ag element can improve the corrosion resistance of solder; When the Ag that adds 3% among the Sn-9Zn, can generate the AgZn of a large amount of bulks yet simultaneously, the inventor also discovers in the soldered fitting tissue
3Phase, thus cause that joint mechanical property descends.
The Ni element can form Ni with the Zn in the solder
5Zn
21Phase can reduce simple substance Zn content in the solder, improves the corrosion resistance of solder, but excessive N i joins the fusing point that can improve alloy among the solder, increases melting range, is unfavorable for welding.Discover when the content of Ni element surpasses 1% the Ni in the solder simultaneously
5Zn
21Be grown to big bulk mutually, Ni is arranged in addition
3Sn
4From wherein separating out, the intensity of joint descends thereupon, so the content of Ni element should not surpass 1%.
The P element can suppress the alloy melt surface oxidation, and it replaces the Zn oxidation on the alloy melt surface, forms the barrier layer; And the oxide of P is not static, but constantly generates and volatilize, so can residual too much oxidation product on the surface of melt; And then the raising alloy is to the wetability of substrate; The P element is littler than Al element density simultaneously, under molten condition, also can protect the excessive scaling loss of Al element, suppresses blocked up oxide-film and generates.
The adding of trace rare-earth element is little to the influence of brazing filler metal alloy fusing point; But the adding of rare earth can significantly suppress the generation of thick Sn crystal grain, and the rich Zn phase of refinement, makes it become less than 1 micron by several microns; Improve the intensity of joint, also can improve the creep-resistant property of joint.Simultaneously, rare earth element has certain suction-operated to oxygen, can improve the non-oxidizability of solder, for the use and the popularization of solder positive role is arranged.
Because Zn element and Al element are prone to scaling loss; Alloying component is inaccurate when causing melting, so melting Zn-Al intermediate alloy at first during melting solder of the present invention is confirmed the Zn-Al percentage composition through chemical analysis; Then with this intermediate alloy preparation brazing filler metal alloy of preparing burden; Be to prevent the mass loss that in smelting process, brings because of the Zn evaporation, the present invention is placed on alloy through smelting in the high-temperature resistant tube that vacuumizes processing, obtain composition accurately, the brazing filler metal alloy of even tissue.
Effect of the present invention and benefit are: 1. because the adding of an amount of Al element and Ag element makes it that wetability preferably all arranged on copper coin and aluminium sheet, the Ni element adds makes solder have good anti-corrosion; 2. the adding of P, RE has purified alloy structure, has more good welding performance therefrom, makes its welding point have excellent mechanical property; 3. the Sn-Zn-Ag-Al-Ni-P-RE group member of the present invention's use is nontoxic element, satisfies the requirement of Electronic Packaging field to lead-free brazing; 4. preparation method used in the present invention can obtain composition accurately, the brazing filler metal alloy of even tissue.
Description of drawings
Fig. 1 is the soldering rework profile of the said solder of embodiment.
The specific embodiment
Be described in detail the specific embodiment of the present invention below in conjunction with technical scheme.
Embodiment 1: each component is respectively by weight percentage: Zn 8%, and Al 0.2%, and Ag 0.6%, and surplus is Sn.
Alloy preparation method is following:
(1) melting Zn-Al intermediate alloy
According to percentage by weight Al 6%, Zn is that the Zn-Al intermediate alloy of surplus requires block simple metal Zn (purity 99.99%) of weighing and Al (purity 99.99%).Under protective atmosphere, be warming up to 450-500
℃ at first deposite metal Zn adds metal A l then, after fully stirring, and insulation 10-15min, cooling is taken out.
(2) the nearly eutectic lead-free solder alloy of melting Sn-Zn base
1. the preparation of the nearly eutectic lead-free solder alloy of Sn-Zn base is to use pure Sn (purity 99.99%), Zn-6Al intermediate alloy, pure Ag (purity 99.99%), pure Ni (purity 99.99%), commercially available Sn-P alloy (containing P 15%) and RE to smelt; By weight each part of proportioning brazing filler metal alloy; About altogether 200 grams are placed in the quartz ampoule.
2. use hydrogen flame with quartz ampoule one end scorification sealing, other end scorification is for thin mouthful and use vavuum pump to vacuumize processing, behind the air in the emptying quartz ampoule, and will thin mouthful of place's scorification sealing.
3. quartz ampoule is put in the resistance furnace, is heated to 400 ℃ of meltings, treat that all constituent elements all melt after, insulation 2-3 hour, during per half an hour the quartz ampoule upset is stirred once, make the alloy homogenising.After alloy is even liquid state, the quartz ampoule cooling is cooled to room temperature, takes out solder.
Brazing filler metal alloy in the foregoing description has been carried out the DSC test, wetability test and the soldered fitting tensile property test of solder on copper, aluminium base.The wetability experiment condition is following: solder is processed the solder ball that diameter is 1.5mm; Solder ball is placed on the copper coin and aluminium sheet of the commercially available commercial brazing flux that applies 12mg; And put it in the reflow machine and heat; Rework profile is seen Fig. 1, the spreading area of brazing filler metal alloy after the use graphics software measurement Reflow Soldering.The identical rework profile welding of same use is processed soldered fitting and is carried out the shear tension test.
The lead-free brazing solidus that said ratio obtains is at 200.67 ℃, and liquidus curve is 204.70
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 6.54cm
2, spreading area is 23.61cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 32.22MPa, the corrosion potential of solder is-0.956V.
We are routine as a comparison with Sn-9Zn, and it is 6.26cm at the spreading area on the TP2 copper coin
2, spreading area is 22.99cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 32.08MPa, the corrosion potential of solder is-0.886V.
Embodiment 2: each component is respectively by weight percentage: Zn 7.4%, and Al 0.3%, and Ag 0.7%, and surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 197.32 ℃, and liquidus curve cooperates commercially available commercial brazing flux at 206.59 ℃, and the spreading area on the TP2 copper coin is 6.43m
2, spreading area is 22.60cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 33.81MPa, the corrosion potential of solder is-0.937V.
Embodiment 3: each component is respectively by weight percentage: Zn 7.5%, and Al 0.25%, and Ag 0.6%, and surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 197.45 ℃, and liquidus curve is 205.57
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 6.96m
2, spreading area is 24.61cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 33.84MPa, the corrosion potential of solder is-0.962V.
Embodiment 4: each component is respectively by weight percentage: Zn 7%, and Al 0.44%, and Ag 0.6%, and surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 197.93 ℃, and liquidus curve is 206.04
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 6.57m
2, spreading area is 28.34cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 32.65MPa, the corrosion potential of solder is-0.972V.
Embodiment 5: each component is respectively by weight percentage: Zn 7.5%, and Al 0.25%, and Ag 0.6%, and Ni 0.1%, and surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 200.43 ℃, and liquidus curve is 208.12
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 6.32m
2, spreading area is 27.56cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 31.21MPa, the corrosion potential of solder is-0.743V.
Embodiment 6: each component is respectively by weight percentage: Zn 7%, and Al 0.44%, and Ag 0.6%, and P 0.01%, and surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 198.93 ℃, and liquidus curve is 207.32
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 8.08m
2, spreading area is 37.11cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 37.42MPa, the corrosion potential of solder is-0.987V.
Embodiment 7: each component is respectively by weight percentage: Zn 7%, and Al 0.44%, and Ag 0.6%, and P 0.01%, and RE 0.01% surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 199.24 ℃, and liquidus curve is 209.35
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 8.21m
2, spreading area is 35.11cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 39.42MPa, the corrosion potential of solder is-0.947V.
Embodiment 9: each component is respectively by weight percentage: Zn 8.5%, and Al 0.35%, and Ag 0.7%, and P 0.1%, and Ni 0.1%, and RE 0.01%, and surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 199.75 ℃, and liquidus curve is 207.31
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 8.15m
2, spreading area is 43.06cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 42.51MPa, the corrosion potential of solder is-0.819V.
Embodiment 10: each component is respectively by weight percentage: Zn 8.2%, and Al 0.2%, and Ag 0.55%, and P 0.01%, and Ni 1%, and RE 0.5%, and surplus is Sn.Alloy melting method and performance test methods are with embodiment 1.The lead-free brazing solidus that said ratio obtains is at 203.83 ℃, and liquidus curve is 214.62
℃, cooperating commercially available commercial brazing flux, the spreading area on the TP2 copper coin is 8.2m
2, spreading area is 43.11cm on 3003 aluminium sheets
2, the shear strength of the Cu/Al soldered fitting that obtains is 43.12MPa, the corrosion potential of solder is-0.753V.
Claims (3)
1. Sn-Zn base leadless solder alloy that is used for the aluminum bronze solder; It is characterized in that: said Sn-Zn base leadless solder alloy comprises that following components in weight percentage: Zn is 7-8.5%, and Al is 0.2-0.49%, and Ag is 0.55-0.7%; P is 0-0.1%; Ni is 0-1%, and RE is 0-0.5%, and all the other are Sn.
2. a kind of preparation method who is used for the Sn-Zn base leadless solder alloy of aluminum bronze solder according to claim 1, it is characterized in that: the preparation process may further comprise the steps:
(1) melting Zn-Al intermediate alloy
According to percentage by weight, Al is 6%, and Zn is that to require the block purity of weighing be that 99.99% Metal Zn and purity are 99.99% metal A l to the Zn-Al intermediate alloy of surplus; Under nitrogen or argon shield atmosphere, be warming up to 450-500 ℃ of at first deposite metal Zn, add metal A l then, after fully stirring, be incubated cooling taking-up after 10-15 minute;
(2) melting Sn-Zn base leadless solder alloy
1. to be to use purity be that 99.99% metal Sn, Zn-6Al intermediate alloy, purity are that 99.99% metal A g, purity are that be weight percentage 15% commercially available Sn-P alloy and RE of 99.99% metal Ni, P content smelts in the preparation of Sn-Zn base leadless solder alloy; Each component of components by weight percentage brazing filler metal alloy; Totally 200 grams are placed in the high-temperature resistant tube;
2. use hydrogen flame that high-temperature resistant tube one end scorification is sealed, other end scorification is for thin mouthful and use vavuum pump to vacuumize processing, behind the air in the emptying pipe, with thin mouthful of place's scorification sealing;
3. high-temperature resistant tube is put in the resistance furnace, is heated to 400 ℃ of meltings, treat that all constituent elements all melt after; Be incubated 2-3 hour, during per half an hour high-temperature resistant tube upset is stirred once, make the alloy homogenising; After treating that alloy is even liquid state, cooling is cooled to room temperature, takes out solder.
3. a kind of preparation method who is used for the Sn-Zn base leadless solder alloy of aluminum bronze solder according to claim 2 is characterized in that: said high-temperature resistant tube adopts quartz ampoule or earthenware.
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| CN103706962A (en) * | 2013-12-30 | 2014-04-09 | 大连理工大学 | Sn-Zn-Ni lead-free solder alloy for aluminum copper soldering |
| CN103934590A (en) * | 2014-04-13 | 2014-07-23 | 北京工业大学 | ZnAlMgIn high temperature lead-free solder |
| CN104002058A (en) * | 2013-02-25 | 2014-08-27 | 北京有色金属与稀土应用研究所 | Sn-Zn-Ag-Ni alloy lead-free solder and preparation method thereof |
| CN105479030A (en) * | 2016-01-07 | 2016-04-13 | 哈尔滨工业大学 | Active anti-corrosion SnZn base brazing filler metal, manufacturing method thereof and low-temperature ultrasonic brazing method of ceramic and/or composite material and aluminum and magnesium alloy |
| CN106392365A (en) * | 2016-11-11 | 2017-02-15 | 江苏师范大学 | 3D packaging interconnection solder for MEMS devices |
| CN110170763A (en) * | 2019-06-03 | 2019-08-27 | 浙江康盛股份有限公司 | Copper-aluminium solder |
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| CN104002058A (en) * | 2013-02-25 | 2014-08-27 | 北京有色金属与稀土应用研究所 | Sn-Zn-Ag-Ni alloy lead-free solder and preparation method thereof |
| CN104002058B (en) * | 2013-02-25 | 2017-04-05 | 北京有色金属与稀土应用研究所 | A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof |
| CN103706962A (en) * | 2013-12-30 | 2014-04-09 | 大连理工大学 | Sn-Zn-Ni lead-free solder alloy for aluminum copper soldering |
| CN103706962B (en) * | 2013-12-30 | 2015-12-30 | 大连理工大学 | A kind of Sn-Zn-Ni lead-free solder alloy for aluminum bronze solder |
| CN103934590A (en) * | 2014-04-13 | 2014-07-23 | 北京工业大学 | ZnAlMgIn high temperature lead-free solder |
| CN103934590B (en) * | 2014-04-13 | 2016-08-17 | 北京工业大学 | A kind of ZnAlMgIn high-temp leadless solder |
| CN105479030A (en) * | 2016-01-07 | 2016-04-13 | 哈尔滨工业大学 | Active anti-corrosion SnZn base brazing filler metal, manufacturing method thereof and low-temperature ultrasonic brazing method of ceramic and/or composite material and aluminum and magnesium alloy |
| CN106392365A (en) * | 2016-11-11 | 2017-02-15 | 江苏师范大学 | 3D packaging interconnection solder for MEMS devices |
| CN110170763A (en) * | 2019-06-03 | 2019-08-27 | 浙江康盛股份有限公司 | Copper-aluminium solder |
| CN110170763B (en) * | 2019-06-03 | 2021-03-23 | 浙江康盛股份有限公司 | Copper-aluminum low-temperature solder |
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