CN104002058B - A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof - Google Patents
A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof Download PDFInfo
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- CN104002058B CN104002058B CN201310058881.8A CN201310058881A CN104002058B CN 104002058 B CN104002058 B CN 104002058B CN 201310058881 A CN201310058881 A CN 201310058881A CN 104002058 B CN104002058 B CN 104002058B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof, the solder is mainly used in the low temperature brazing of fine aluminium and aluminium alloy, by following content into being grouped into：Zn8.0 ~ 10.0wt%, Ag0.5 ~ 1.5wt%, Ni0.5 ~ 1.2wt%, Sn surpluses.The brazing filler metal melts temperature is low, and brazing manufacturability is good, and with good wetability, rate of deposition is higher than 75%, weld seam tensile strength sigma b >=50MPa, it is adaptable to the low temperature brazing of various aluminium alloys such as fine aluminium and 3A21,6063,6061.
Description
Technical field
The present invention relates to the low-temperature brazing filler metal of a kind of aluminium and aluminium alloy, and in particular to Sn-Zn-Ag-Ni solder alloys.
Background technology
Fine aluminium and aluminium alloy have a wide range of applications in fields such as space flight, aviation, building, electrical equipment, automobile and ships, fine aluminium
And aluminium alloy connection and its preparation technology very important effect is played in product manufacturing.The connected mode of aluminium alloy is various
Various, low temperature brazing is highly important one kind, and especially for part electronic component or device, implementing low temperature brazing both can be with
Meet connection request, can also fully ensure that device performance.
A kind of metal connecting material used when low-temperature brazing filler metal is low temperature brazing.In order to obtain the soldered fitting of high-quality, lead to
Often low-temperature brazing filler metal should meet following requirement：(1) mother metal can be soaked, and formed firm connection；(2) good mobility
Can, solder is sprawled within a fitting by capillarity, forms fine and close brazed seam；(3) composition is uniform, and fusing interval is little；(4) soldering
Strength of joint performance is good, corrosion-resistant, and can meet the requirement of other properties.
Aluminium-optional lead-free solder of aluminium low temperature brazing has Sn-Ag, Sn-Ag-Cu, Sn-Cu, Sn-Zn etc., wherein Sn-Zn eutectics
Solder, 198 DEG C of fusion temperature have the advantages that brazing manufacturability is good, color and luster is consistent with mother metal, joint is firm, and application is the widest
It is general.But which has the disadvantage joint corrosion-resistant, there is data to show, the joint of Sn-Zn brazed aluminums is soaked in running water, under room temperature
3～4 week corroded disconnection.Soak in 5%NaCl water, disconnected less than 48 hours.
The content of the invention
For the problems referred to above of prior art, the present invention provides a kind of with stronger corrosion resistance and tensile strength
Sn-Zn-Ag-Ni solder alloys.
For achieving the above object, the present invention includes following technical scheme：
A kind of Sn-Zn-Ag-Ni alloy lead-frees solder, the solder is by following content into being grouped into：Zn8.0～
10.0wt%, Ag0.5～1.5wt%, Ni0.5～1.2wt%, Sn surplus.
Sn-Zn-Ag-Ni alloy lead-free solders as above, it is preferable that the solder is by following content into packet
Into：Zn8.0wt%, Ag0.7wt%, Ni1.2wt%, Sn surpluses.
Sn-Zn-Ag-Ni alloy lead-free solders as above, it is preferable that the solder is by following content into packet
Into：Zn8.5wt%, Ag0.8wt%, Ni1.1wt%, Sn surpluses.
Sn-Zn-Ag-Ni alloy lead-free solders as above, it is preferable that the solder is by following content into packet
Into：Zn9.0wt%, Ag1.0wt%, Ni1.0wt%, Sn surpluses.
Sn-Zn-Ag-Ni alloy lead-free solders as above, it is preferable that the solder is by following content into packet
Into：Zn9.5wt%, Ag1.1wt%, Ni0.8wt%, Sn surpluses
Sn-Zn-Ag-Ni alloy lead-free solders as above, it is preferable that the solder is by following content into packet
Into：Zn10.0wt%, Ag1.2wt%, Ni0.7wt%, Sn surpluses.
Sn-Zn-Ag-Ni alloy lead-free solders as above, it is preferable that the form of the solder is silk, paper tinsel or powder.
Sn-Zn-Ag-Ni alloy lead-frees solder as above is in low temperature brazing fine aluminium, 3A21 aluminium alloys, 6063 aluminium alloys
Or 6061 applications in aluminium alloy.
The preparation method of Sn-Zn-Ag-Ni alloy lead-free solders as above, the method comprise the steps：
A. Zn, Ag, Ni and Sn raw metal is weighed according to the composition proportion of the solder；
B. Sn and Ni raw metals are shelved in graphite crucible, using intermediate frequency furnace, are heated to 600 DEG C of meltings, pour
SnNi intermediate alloys are made in casting；
C. intermediate frequency furnace is utilized, by remaining Sn, Zn, Ag raw metal and SnNi intermediate alloys at 250 DEG C to 300 DEG C
Founding is carried out, the Sn-Zn-Ag-Ni alloy cast ingots of bar-shaped or tabular are made；
D. by alloy bar-shaped cast ingot obtained in founding, make through extruder extruding, mill milling or gas-atomized powder method
Welding wire, weldering paper tinsel or welding powder.
The preparation method of Sn-Zn-Ag-Ni alloy lead-free solders as above, it is preferable that step D is by founding
Obtained alloy bar-shaped cast ingot, extrudes through extruder, makes diameter 0.5～1.5mm welding wires；Or by alloy sheets obtained in founding
Shape ingot casting, through mill milling, makes 0.05～0.15mm of thickness weldering paper tinsels；Or gas-atomized powder method is adopted, with nitrogen as mist
Change gas, obtained bar-shaped cast ingot is placed in into pressure for 0.5MPa～1.0MPa, under conditions of temperature is 250 DEG C～280 DEG C, gas
Alloy powder is made in atomization, by the alloy powder, by screening, obtains alloy welding powder of the granularity in 25um～45um.
A kind of Sn-Zn-Ag-Ni alloy lead-frees solder, which is prepared using method as above.
The beneficial effects of the present invention is the following aspects：
1st, Sn-Zn-Ag-Ni solder alloys of the invention are applied to various aluminium such as fine aluminium and 3A21,2A50,6063 and 6061
The low temperature brazing of alloy.
2nd, the fusion temperature of Sn-Zn-Ag-Ni solder alloys of the invention is suitable, is 195 DEG C～210 DEG C, to fine aluminium and aluminium
Not higher than 250 DEG C of alloy brazed temperature.
3rd, Sn-Zn-Ag-Ni solder alloys of the invention have good wetability, soldering processes to fine aluminium and aluminium alloy
Property is good.
4th, soldered fitting rate of deposition is higher than 75%, weld seam tensile strength sigmab>=50MPa, soaks in 5%NaCl water, 198
Hour does not ftracture.
5th, the present invention prepares Sn-Zn-Ag-Ni solder alloy forms includes silk, paper tinsel, powder, and preparation method is simple, beneficial to batch
Production.
Description of the drawings
Fig. 1 is the process chart that the present invention prepares Sn-Zn-Ag-Ni solder alloys.
Fig. 2 is the differential thermal analysis collection of illustrative plates of the Sn-Zn-Ag-Ni solder alloys that the embodiment of the present invention 2 is obtained.
Fig. 3 is that the Sn-Zn-Ag-Ni solder alloys that the embodiment of the present invention 2 is obtained are used for fine aluminium Braze tests, obtained T-shaped
Joint photo.
Specific embodiment
The composition of each component in following examples, respectively：
Embodiment 1：Sn-Zn-Ag-Ni solder alloys (Zn8.0wt%, Ag0.7wt%, Ni1.2wt%, Sn surpluses)
Preparation process is as shown in Figure 1.
Step 1：Raw metal is weighed
By weight percentage, 80 grams of Zn, 7 grams of Ag, 12 grams of Ni and 901 gram of Sn are weighed respectively；
Step 2：Intermediate alloy founding
120 grams of Sn are weighed again, are shelved in graphite crucible with 12 grams of Ni raw metals, using intermediate frequency furnace, are heated to
SnNi intermediate alloys are made in 600 DEG C of meltings, casting；
Step 3：Alloy casting
Using intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloys are entered at 250 DEG C to 300 DEG C
Row founding, makes the bar-shaped Sn-Zn-Ag-Ni alloy cast ingots of diameter 30mm；
Step 4：It is prepared by welding wire
By the alloy bar-shaped cast ingot after founding, extrude through extruder, make diameter 1mm welding wires.
Embodiment 2：Sn-Zn-Ag-Ni solder alloys (Zn8.5wt%, Ag0.8wt%, Ni1.1wt%, Sn surpluses)
Step 1：Raw metal is weighed
By weight percentage, 85 grams of Zn, 8 grams of Ag, 11 grams of Ni and 896 gram of Sn are weighed respectively；
Step 2：Intermediate alloy founding
110 grams of Sn are weighed again, are shelved in graphite crucible with 11 grams of Ni raw metals, using intermediate frequency furnace, are heated to
SnNi intermediate alloys are made in 600 DEG C of meltings, casting；
Step 3：Alloy casting
Using intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloys are entered at 250 DEG C to 300 DEG C
Row founding, makes the Sn-Zn-Ag-Ni alloy cast ingots of thickness 5mm tabulars；
Step 4：It is prepared by weldering paper tinsel
By the alloy tabular ingot casting after founding, through mill milling, thickness 0.1mm weldering paper tinsels are made.
Embodiment 3：Sn-Zn-Ag-Ni solder alloys (Zn9.0wt%, Ag1.0wt%, Ni1.0wt%, Sn surpluses)
Step 1：Raw metal is weighed
By weight percentage, 90 grams of Zn, 10 grams of Ag, 10 grams of Ni and 890 gram of Sn are weighed respectively；
Step 2：Intermediate alloy founding
100 grams of Sn are weighed again, are shelved in graphite crucible with 10 grams of Ni raw metals, using intermediate frequency furnace, are heated to
SnNi intermediate alloys are made in 600 DEG C of meltings, casting；
Step 3：Alloy casting
Using intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloys are entered at 250 DEG C to 300 DEG C
Row founding, makes the bar-shaped Sn-Zn-Ag-Ni alloy cast ingots of diameter 30mm；
Step 4：It is prepared by welding powder
Using gas-atomized powder method, with nitrogen as atomization gas, bar-shaped alloy cast ingot obtained in step 3 is placed in into pressure
For 0.5MPa～1.0MPa, under conditions of temperature is 260 DEG C, alloy powder is made in aerosolization, by the alloy powder, by sieve
Point, obtain alloy welding powder of the granularity in 25um～45um.
Embodiment 4：Sn-Zn-Ag-Ni solder alloys (Zn9.5wt%, Ag1.1wt%, Ni0.8wt%, Sn surpluses)
Step 1：Raw metal is weighed
By weight percentage, 95 grams of Zn, 11 grams of Ag, 8 grams of Ni and 886 gram of Sn are weighed respectively；
Step 2：Intermediate alloy founding
80 grams of Sn are weighed again, are shelved in graphite crucible with 8 grams of Ni raw metals, using intermediate frequency furnace, are heated to 600
SnNi intermediate alloys are made in DEG C melting, casting；
Step 3：Alloy casting
Using intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloys are entered at 250 DEG C to 300 DEG C
Row founding, makes the bar-shaped Sn-Zn-Ag-Ni alloy cast ingots of diameter 30mm；
Step 4：It is prepared by welding wire
By the alloy bar-shaped cast ingot after founding, extrude through extruder, make diameter 1mm welding wires.
Embodiment 5：Sn-Zn-Ag-Ni solder alloys (Zn10.0wt%, Ag1.2wt%, Ni0.7wt%, Sn surpluses)
Step 1：Raw metal is weighed
By weight percentage, 100 grams of Zn, 12 grams of Ag, 7 grams of Ni and 881 gram of Sn are weighed respectively；
Step 2：Intermediate alloy founding
70 grams of Sn are weighed again, are shelved in graphite crucible with 7 grams of Ni raw metals, using intermediate frequency furnace, are heated to 600
SnNi intermediate alloys are made in DEG C melting, casting；
Step 3：Alloy casting
Using intermediate frequency furnace, remaining Sn, Zn, Ag raw metal and SnNi intermediate alloys are entered at 250 DEG C to 300 DEG C
Row founding, makes the Sn-Zn-Ag-Ni alloy cast ingots of thickness 5mm tabulars；
Step 4：It is prepared by weldering paper tinsel
By the alloy tabular ingot casting after founding, through mill milling, thickness 0.1mm weldering paper tinsels are made.
Embodiment 6
Carry out physical testing and fine aluminium low temperature brazing test respectively to solder prepared by embodiment 1-5, obtain test data
It is shown in Table 1.Solder differential thermal analysis curve obtained in embodiment 2 is shown in Figure of description 2, and wherein Te refers to solder solid-state temperature, and Tf refers to pricker
Material liquidus temperature.Fig. 3 is that the Sn-Zn-Ag-Ni solder alloys that obtain of embodiment 2 are used for fine aluminium Braze tests, obtained T-shaped to connect
Head photo.
Table 1
| Solid-state temperature | Liquidus temperature | Mother metal | Soldering maximum temperature | Rate of deposition | Joint tensile strength | |
| Embodiment 1 | 196℃ | 204℃ | Fine aluminium | 250℃ | 78.5% | 50.5MPa |
| Embodiment 2 | 195℃ | 205℃ | Fine aluminium | 250℃ | 79.2% | 52.0MPa |
| Embodiment 3 | 195℃ | 206℃ | Fine aluminium | 250℃ | 82.8% | 53.5MPa |
| Embodiment 4 | 195℃ | 208℃ | Fine aluminium | 250℃ | 83.7% | 56.0MPa |
| Embodiment 5 | 196℃ | 210℃ | Fine aluminium | 250℃ | 84.2% | 57.5MPa |
The embodiment of Sn-Zn-Ag-Ni solder alloys part of the present invention is only enumerated in above-described embodiment, is sent out at above-mentioned
In bright technical scheme：Zinc in described alloy compositions, silver, nickel content in the prescribed limit can unrestricted choice, herein no longer
Enumerate, therefore the technical scheme that included of the explanation of the above should be regarded as exemplary, and be not used to limit the present patent application patent
Protection domain.
Claims (4)
- The preparation method of 1.Sn-Zn-Ag-Ni alloy lead-free solders, it is characterised in that the method comprises the steps：A. Zn, Ag, Ni and Sn raw metal is weighed according to the composition proportion of solder, wherein, 8.0～10.0wt% of Zn, Ag 0.5 ～1.5wt%, 0.5～1.2wt% of Ni, Sn surpluses；B. the Sn raw materials of 7～20 weight % and whole Ni raw materials are shelved in graphite crucible, using intermediate frequency furnace, are heated to SnNi intermediate alloys are made in 590～610 DEG C of meltings, casting；C. intermediate frequency furnace is utilized, Zn, Ag, remaining Sn raw materials and SnNi intermediate alloys is melted at 250 DEG C to 300 DEG C Casting, makes the Sn-Zn-Ag-Ni alloy cast ingots of bar-shaped or tabular；D. by tabular obtained in founding or bar-shaped alloy cast ingot, through extruder extruding, mill milling or gas-atomized powder legal system Into welding wire, weldering paper tinsel or welding powder.
- 2. the preparation method of Sn-Zn-Ag-Ni alloy lead-frees solder as claimed in claim 1, it is characterised in that step D It is, by alloy bar-shaped cast ingot obtained in founding, to extrude through extruder, make diameter 0.5～1.5mm welding wires；Or founding is obtained Alloy tabular ingot casting, through mill milling, make 0.05～0.15mm of thickness weldering paper tinsel；Or gas-atomized powder method is adopted, with nitrogen Used as atomization gas, it is 0.5MPa～1.0MPa that obtained bar-shaped cast ingot is placed in pressure to gas, and temperature is 250 DEG C～280 DEG C Under the conditions of, alloy powder is made in aerosolization, by the alloy powder, by screening, obtains gold alloy solder of the granularity in 25um～45um Powder.
- 3. a kind of Sn-Zn-Ag-Ni alloy lead-frees solder, it is characterised in which is using method as claimed in claim 1 or 2 Prepare.
- 4. Sn-Zn-Ag-Ni alloy lead-frees solder as claimed in claim 3 low temperature brazing fine aluminium, 3A21 aluminium alloys, 6063 Application in aluminium alloy or 6061 aluminium alloys.
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Families Citing this family (4)
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| CN106392365A (en) * | 2016-11-11 | 2017-02-15 | 江苏师范大学 | 3D packaging interconnection solder for MEMS devices |
| CN109352207B (en) * | 2018-11-14 | 2020-10-20 | 北京联金新材科技有限公司 | Preparation method of SnZn-based low-temperature lead-free solder |
| CN109706342B (en) * | 2018-12-29 | 2021-04-30 | 郑州机械研究所有限公司 | Copper-zinc-silicon-based powdery brazing material containing alterant and preparation method thereof |
| CN111872600B (en) * | 2020-07-08 | 2021-06-08 | 中国矿业大学 | MOFs carbonized product, preparation method and application in lead-free solder modification |
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|---|---|---|---|---|
| US6554180B1 (en) * | 1999-08-20 | 2003-04-29 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
| CN1586793A (en) * | 2004-07-16 | 2005-03-02 | 北京工业大学 | SnZn series lead-free welding flux |
| CN1621195A (en) * | 2004-12-17 | 2005-06-01 | 北京工业大学 | Rare earth Er contained SnZn based leadless solder and its preparation method |
| CN102528314A (en) * | 2010-12-31 | 2012-07-04 | 北京有色金属与稀土应用研究所 | Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof |
| CN102642099A (en) * | 2012-05-05 | 2012-08-22 | 大连理工大学 | Sn-Zn-based lead-free solder alloy for aluminum bronze soldering and method for preparing same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012719A1 (en) * | 1995-09-29 | 1997-04-10 | Matsushita Electric Industrial Co., Ltd. | Lead-free solder |
-
2013
- 2013-02-25 CN CN201310058881.8A patent/CN104002058B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6554180B1 (en) * | 1999-08-20 | 2003-04-29 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
| CN1586793A (en) * | 2004-07-16 | 2005-03-02 | 北京工业大学 | SnZn series lead-free welding flux |
| CN1621195A (en) * | 2004-12-17 | 2005-06-01 | 北京工业大学 | Rare earth Er contained SnZn based leadless solder and its preparation method |
| CN102528314A (en) * | 2010-12-31 | 2012-07-04 | 北京有色金属与稀土应用研究所 | Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof |
| CN102642099A (en) * | 2012-05-05 | 2012-08-22 | 大连理工大学 | Sn-Zn-based lead-free solder alloy for aluminum bronze soldering and method for preparing same |
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