CN104526180A - Lead-free solder containing cerium, rubidium and zinc and preparation method thereof - Google Patents
Lead-free solder containing cerium, rubidium and zinc and preparation method thereof Download PDFInfo
- Publication number
- CN104526180A CN104526180A CN201410755023.3A CN201410755023A CN104526180A CN 104526180 A CN104526180 A CN 104526180A CN 201410755023 A CN201410755023 A CN 201410755023A CN 104526180 A CN104526180 A CN 104526180A
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- CN
- China
- Prior art keywords
- zinc
- lead
- rubidium
- free solder
- tin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses lead-free solder containing cerium, rubidium and zinc and a preparation method of the lead-free solder. The lead-free solder comprises, by mass, 0.2-0.5% of cerium, 0.05-0.1% of rubidium, 5-10% of zinc and the balance tin. The lead-free solder can avoid the hazard of lead, has good welding performance and good electric and mechanical performance, and is simple in technology, and safe and reliable.
Description
Technical field
The present invention relates to a kind of circuit welding material, be specifically related to a kind of lead-free solder containing cerium rubidium zinc and preparation method thereof.
Background technology
Terne metal is a kind of welding material be once commonly used, but because lead is to the huge toxicity of people, causes the world greatly to pay close attention to, and has risen unleaded trend.The existing requirement to lead-free solder mainly contains: 1, lead content is lower than 0.1%; 2, fusing point is more better close to slicker solder eutectic gold; 3, electrical and thermal conductivity is good; 4, have certain intensity and ductility, machinability is good; 5, raw material supply is sufficient, cheap; 6, composition can not be too complicated, is convenient to recycle.
Existing lead-free solder, representational, if Sn35Ag in tin Silver Alloys is tin silver eutectic alloy, there is lower fusion temperature, but silver-colored high price is expensive, and fusing point is slightly high, in order to reduce its fusion temperature, common way adds a large amount of bismuths and/or indium, but adding of bismuth makes alloy become hard and crisp, not only make processing difficulties, and make plumb joint can not withstand shock, be easy to snap; And the reserves added because of indium of indium are limited, price is high, and makes cost high-leveled and difficult to accept.Another kind of representational lead-free solder, as the Sn5Sb in tin antimony series alloy, its solidus temperature is 235 DEG C, and liquidus temperature is 240 DEG C, and the way reducing fusing point is the same with sn-ag alloy series with drawback.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, provide a kind of harm can avoiding lead, there is again lead-free solder containing cerium rubidium zinc of good welds performance and electricapparatus performance and preparation method thereof.
To achieve these goals, present invention employs following technical scheme:
Containing a lead-free solder for cerium rubidium zinc, with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium (Ce) 0.2 ~ 0.5%, rubidium (Rb) 0.05 ~ 0.1%, zinc (Zn) 5 ~ 10%, and surplus is tin (Sn).
As present invention further optimization, above-described lead-free solder contains cerium 0.3 ~ 0.4%, rubidium 0.05 ~ 0.08%, zinc 5 ~ 8%, and surplus is tin.
As present invention further optimization, above-described lead-free solder contains cerium 0.35%, rubidium 0.07%, zinc 7%, and surplus is tin.
In the present invention, as helper component, not only increase cerium (rare earth element) and zinc, also add rubidium element, the air invaded in tin liquor can be removed in preparation (stirring) process, further increase welding performance and the electricapparatus performance of lead-free solder.
Prepare a method for the above-mentioned lead-free solder containing cerium rubidium zinc, comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 60 ~ 90 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing cerium, rubidium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing cerium, rubidium element, continue stirring 30 ~ 60 minutes; Then while stirring the solder containing cerium rubidium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lead-free solder finished product.
Advantage of the present invention:
1, need not add lead element in solder of the present invention, the solder finished product of gained possesses good welding performance and electricapparatus performance, environmental protection equally, does not endanger the health of welding job personnel.
2, in tin, add the elements such as a small amount of cerium, zinc, rubidium, the ductility of finished product solder can be significantly increased, reduce its melting point; In addition, cerium, rubidium just add on a small quantity, and therefore, solder preparation cost of the present invention is lower, are also compare to promote the use of.
3, technique is simple, safe and reliable.With zinc-base intermediate alloy, cerium, rubidium element mainly think that form adds, this than adding simple cerium, rubidium element is well a lot, avoid the active attribute due to it, before stirring, just react, thus affect solder end properties.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further described.
Embodiment 1:
Containing a lead-free solder for cerium rubidium zinc, with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium 0.2%, rubidium 0.05%, zinc 5%, and surplus is tin.
Embodiment 2:
Containing a lead-free solder for cerium rubidium zinc, with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium 0.5%, rubidium 0.1%, zinc 10%, and surplus is tin.
Embodiment 3:
Containing a lead-free solder for cerium rubidium zinc, with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium 0.35%, rubidium 0.07%, zinc 7%, and surplus is tin.
Prepare the method for the lead-free solder containing cerium rubidium zinc of above-described embodiment 1-3, comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 90 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing cerium, rubidium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing cerium, rubidium element, continue stirring 30 minutes; Then while stirring the solder containing cerium rubidium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lead-free solder finished product.
Embodiment 4:
Containing a lead-free solder for cerium rubidium zinc, with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium 0.3%, rubidium 0.05%, zinc 5%, and surplus is tin.
Embodiment 5:
Containing a lead-free solder for cerium rubidium zinc, with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium 0.4%, rubidium 0.08%, zinc 8%, and surplus is tin.
Embodiment 6:
Containing a lead-free solder for cerium rubidium zinc, with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium 0.35%, rubidium 0.05%, zinc 8%, and surplus is tin.
Prepare the method for the lead-free solder containing cerium rubidium zinc of above-described embodiment 4-6, comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 60 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing cerium, rubidium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing cerium, rubidium element, continue stirring 60 minutes; Then while stirring the solder containing cerium rubidium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lead-free solder finished product.
Claims (4)
1., containing a lead-free solder for cerium rubidium zinc, it is characterized in that: with the quality of this lead-free solder for benchmark, described lead-free solder contains cerium 0.2 ~ 0.5%, rubidium 0.05 ~ 0.1%, zinc 5 ~ 10%, and surplus is tin.
2. the lead-free solder containing cerium rubidium zinc according to claim 1, it is characterized in that: described lead-free solder contains cerium 0.3 ~ 0.4%, rubidium 0.05 ~ 0.08%, zinc 5 ~ 8%, surplus is tin.
3. the lead-free solder containing cerium rubidium zinc according to claim 1, it is characterized in that: described lead-free solder contains cerium 0.35%, rubidium 0.07%, zinc 7%, surplus is tin.
4. prepare as arbitrary in claim 1-3 as described in the method for lead-free solder containing cerium rubidium zinc, it is characterized in that: comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 60 ~ 90 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing cerium, rubidium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing cerium, rubidium element, continue stirring 30 ~ 60 minutes; Then while stirring the solder containing cerium rubidium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lead-free solder finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410755023.3A CN104526180A (en) | 2014-12-11 | 2014-12-11 | Lead-free solder containing cerium, rubidium and zinc and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410755023.3A CN104526180A (en) | 2014-12-11 | 2014-12-11 | Lead-free solder containing cerium, rubidium and zinc and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104526180A true CN104526180A (en) | 2015-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410755023.3A Pending CN104526180A (en) | 2014-12-11 | 2014-12-11 | Lead-free solder containing cerium, rubidium and zinc and preparation method thereof |
Country Status (1)
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| CN (1) | CN104526180A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106001981A (en) * | 2016-06-23 | 2016-10-12 | 南昌大学 | Lead-free solder added with rare earth carbonate and preparation method |
| CN107309573A (en) * | 2017-06-20 | 2017-11-03 | 华北水利水电大学 | A kind of high intensity nickel-based solder and its method of smelting containing boron alkene |
| CN107309574A (en) * | 2017-06-20 | 2017-11-03 | 华北水利水电大学 | A kind of high intensity silver-base solder and its method of smelting containing graphene |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2552935A (en) * | 1949-11-16 | 1951-05-15 | Ici Ltd | Solders |
| CN1586792A (en) * | 2004-08-24 | 2005-03-02 | 陈明汉 | Improved Sn-0.7 wt% Cu lead-free welding flux |
| CN1634677A (en) * | 2004-09-11 | 2005-07-06 | 戴国水 | Solder containing rare earth, tin and zinc, and preparation method thereof |
| CN1915575A (en) * | 2006-09-08 | 2007-02-21 | 昆山成利焊锡制造有限公司 | Soft soldering material with no lead |
| CN103978319A (en) * | 2014-05-14 | 2014-08-13 | 张海鹏 | Lead-free solder used for manufacturing piezoresistor and preparation method of lead-free solder |
-
2014
- 2014-12-11 CN CN201410755023.3A patent/CN104526180A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2552935A (en) * | 1949-11-16 | 1951-05-15 | Ici Ltd | Solders |
| FR1024823A (en) * | 1949-11-16 | 1953-04-07 | Ici Ltd | Welding improvements |
| CN1586792A (en) * | 2004-08-24 | 2005-03-02 | 陈明汉 | Improved Sn-0.7 wt% Cu lead-free welding flux |
| CN1634677A (en) * | 2004-09-11 | 2005-07-06 | 戴国水 | Solder containing rare earth, tin and zinc, and preparation method thereof |
| CN1915575A (en) * | 2006-09-08 | 2007-02-21 | 昆山成利焊锡制造有限公司 | Soft soldering material with no lead |
| CN103978319A (en) * | 2014-05-14 | 2014-08-13 | 张海鹏 | Lead-free solder used for manufacturing piezoresistor and preparation method of lead-free solder |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106001981A (en) * | 2016-06-23 | 2016-10-12 | 南昌大学 | Lead-free solder added with rare earth carbonate and preparation method |
| CN107309573A (en) * | 2017-06-20 | 2017-11-03 | 华北水利水电大学 | A kind of high intensity nickel-based solder and its method of smelting containing boron alkene |
| CN107309574A (en) * | 2017-06-20 | 2017-11-03 | 华北水利水电大学 | A kind of high intensity silver-base solder and its method of smelting containing graphene |
| CN107309573B (en) * | 2017-06-20 | 2020-06-02 | 华北水利水电大学 | High-strength nickel-based brazing filler metal containing boron alkene and smelting method thereof |
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Application publication date: 20150422 |
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