CN1915575A - Soft soldering material with no lead - Google Patents
Soft soldering material with no lead Download PDFInfo
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- CN1915575A CN1915575A CN 200610113051 CN200610113051A CN1915575A CN 1915575 A CN1915575 A CN 1915575A CN 200610113051 CN200610113051 CN 200610113051 CN 200610113051 A CN200610113051 A CN 200610113051A CN 1915575 A CN1915575 A CN 1915575A
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- lead
- alloy
- soft soldering
- tin
- soldering material
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Abstract
A non-lead soft solder with low smelting point, high wetting performance and fine crystal grains contains Zn (3-11 Wt%), La or (Ce (0.01-0.1) and Sn (rest).
Description
Technical field
The present invention relates to a kind of no-lead soft soldering, particularly contain the no-lead soft soldering that is applicable to electronics assembling usefulness of cerium or lanthanum, belong to welding material.
Background technology
Along with being gradually improved and strictness of environmental regulation, though tin-lead solder has excellent advantages such as wetability, weldability, good mechanical performance and low price, lead and compound thereof are the poisonous and harmful substance of harm humans health and contaminated environment.Therefore, the development no-lead soft soldering has become a urgent task in the microelectronics surface installation technique field.
The lead-free solder that uses mainly is SnCu, SnAg, SnZn binary alloy system and SnAgCu ternary alloy system at present, or more multicomponent alloy solder based on this.But the wetability and the corrosion resistance of SnZn bianry alloy are relatively poor, contain thick β-Sn crystal grain in the alloy structure, and soldering reliability is affected.
Connect in the invention
Purpose of the present invention is just in order to overcome above-mentioned technical disadvantages with not enough and provide a kind of and have that fusing point is low, wetability good, the no-lead soft soldering of grain refinement, thereby no-lead soft soldering is applied.
The objective of the invention is to realize by following technical proposal:
A kind of no-lead soft soldering is characterized in that it is made up of following weight percentages:
Zn 3～11%, La or Ce 0.01～0.1% and surplus Sn.
The preferred weight percent of described La or Ce is 0.01～0.05%.
The consumption of Zn is controlled between 3～11% in the no-lead soft soldering of the present invention, makes the alloy melting temperature range little, and the soldering processes performance is better.The consumption of Zn is less than 3% or surpass 11%, all can
Make alloy away from eutectic composition, it is big that molten temperature region becomes, and makes welding that difficulty take place; Its consumption of La or Ce is controlled between 0.01～0.1%, can suppress thick β-Sn crystal grain and generate, and makes the obvious refinement of alloy structure, and then has improved the mechanical property of alloy.La simultaneously or Ce add the wetability of significantly improving alloy.In addition; La or Ce are as lively as a cricket metallic elements; under antivacuum molten situation; alloy inevitably can suck a small amount of gas in fusion process, when having La or Ce to exist in the alloy, La or Ce at first with these gas chemical combination; form the form emersion motlten metal liquid level of compound with slag; thereby play except that the gas effect, make the alloy structure densification, can protect interior metal to be unlikely further oxidation.But as addition＜0.01%, then want solid solution in nascent crystalline substance and eutectic, can not produce La or Ce metallographic, its effect is not remarkable, and is excessive as dosage, and the oxidation La or the Ce compound that can produce viscous are mingled with, and effect reduces on the contrary.So La or the most preferred scope of Ce consumption are 0.01～0.05%.
Series of products of the present invention are smelted by following method:
(a) refined tin is added be warming up to 900 ℃～950 ℃ after melting in the graphite crucible and add the topped liquid levels of potassium chloride, add metallic cerium or lanthanum again, stir with wooden stirring rod then and be smelted into liquid tin cerium or tin lanthanum alloy, leave standstill the intermediate alloy that is cast as stanniferous cerium or tin lanthanum after 30 minutes.
(b) tin is melted in the input tin stove earlier, then Zn is joined in the tin liquor, constantly stir simultaneously, after it is melted fully, more a kind of intermediate alloy among SnCe or the SnLa is joined in the tin zinc liquation, constantly stir simultaneously, it is melted fully, be incubated half an hour, make the alloy homogenising.
(c) the scolder slag of removal alloy surface becomes product at the casting film top-pour.
Product of the present invention and SnZn are than the school, and its result is as follows:
Wetting power sees Table 1
Table 1 wetting power comparative result
| Performance | SnZn | SnZnCe | SnZnLa |
| Wetting power (mN) | 0.501 | 0.587 | 0.599 |
Has the good wetting property energy from above-mentioned comparative result product of the present invention as can be seen.
Owing to take technique scheme, make that compared with the prior art the technology of the present invention has that fusing point is low, wetability good, the advantage of grain refinement and effect.
The specific embodiment
Embodiment
| Embodiment | Raw material consumption (Kg) | |||
| Sn | Zn | Ce | La | |
| 1 | 96.99 | 3.0 | 0.01 | |
| 2 | 91.95 | 80 | 0.05 | |
| 3 | 88.90 | 11.0 | 0.10 | |
| 4 | 95.90 | 4.0 | 0.1 | |
| 5 | 94.95 | 5.0 | 0.05 | |
| 6 | 92.99 | 7.0 | 0.01 | |
| 7 | 93.45 | 6.5 | 0.05 | |
| 8 | 90.99 | 9.0 | 0.01 | |
| 9 | 95.45 | 4.5 | 0.05 | |
| 10 | 89.99 | 10.0 | 0.01 | |
Claims (2)
1, a kind of no-lead soft soldering is characterized in that it is made up of following weight percentages:
Zn 3～11%, La or Ce 0.01～0.1% and surplus Sn.
2, no-lead soft soldering according to claim 1 is characterized in that described La or Ce percentage by weight are 0.01～0.05%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610113051 CN1915575A (en) | 2006-09-08 | 2006-09-08 | Soft soldering material with no lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610113051 CN1915575A (en) | 2006-09-08 | 2006-09-08 | Soft soldering material with no lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1915575A true CN1915575A (en) | 2007-02-21 |
Family
ID=37736720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610113051 Pending CN1915575A (en) | 2006-09-08 | 2006-09-08 | Soft soldering material with no lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1915575A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526180A (en) * | 2014-12-11 | 2015-04-22 | 徐国华 | Lead-free solder containing cerium, rubidium and zinc and preparation method thereof |
| CN104588909A (en) * | 2014-12-11 | 2015-05-06 | 徐国华 | Environment-friendly lead-free solder and preparation method |
| CN104607817A (en) * | 2014-12-11 | 2015-05-13 | 徐国华 | Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof |
-
2006
- 2006-09-08 CN CN 200610113051 patent/CN1915575A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526180A (en) * | 2014-12-11 | 2015-04-22 | 徐国华 | Lead-free solder containing cerium, rubidium and zinc and preparation method thereof |
| CN104588909A (en) * | 2014-12-11 | 2015-05-06 | 徐国华 | Environment-friendly lead-free solder and preparation method |
| CN104607817A (en) * | 2014-12-11 | 2015-05-13 | 徐国华 | Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |