CN100534700C - No-lead soft soldering alloy - Google Patents
No-lead soft soldering alloy Download PDFInfo
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- CN100534700C CN100534700C CNB2006101511048A CN200610151104A CN100534700C CN 100534700 C CN100534700 C CN 100534700C CN B2006101511048 A CNB2006101511048 A CN B2006101511048A CN 200610151104 A CN200610151104 A CN 200610151104A CN 100534700 C CN100534700 C CN 100534700C
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- soft soldering
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Abstract
The present invention relates to welding material, and is especially one kind of no-lead soft soldering alloy. In order to inhibiting the growth of the intermetallic compound between the soldering alloy and the soldering pad, the no-lead soft soldering alloy of the present invention has Zn in 0.05-2.0 wt% added and no toxic Pb. The no-lead soft soldering alloy is environment friendly, and may be formed into soldering tin bar, soldering tin wire, etc. for use in PCB mounting, SMT of microelectronic device, etc.
Description
Technical field
The present invention relates to a kind of scolder.
Background technology
Along with the enhancing of people's environmental consciousness, the Sn-Pb soft soldering alloy that tradition is adopted in the electronics industry begins to be replaced by no-lead soft soldering gradually.
In presently used no-lead soft soldering, composition is mainly Sn-Cu, Sn-Ag and Sn-Ag-Cu system.Based on these systems, can improve the performance of solder alloy by the interpolation alloying element.For example, US6,361,742 propose to add the La less than 5wt%, the no-lead soft soldering that the Ce mishmetal is formed on Sn-Ag (1.5-6.0%) basis; On Sn-Ag (3.5-6.0%) basis, add micro-Ni among the CN132964A to suppress the diffusion of Cu in soldering alloy.Japan Nihon is at US6,180, the leadless solder be made up of Sn-(0.3～0.7) Cu-(0.04～0.1) Ni is proposed on the basis of SnCu eutectic composition in 055, element Ni can suppress the dissolving of Cu in fusion welding, reduces the dissolution velocity of Cu in molten solder and the possibility of bridging generation.
In the welding process, form intermetallic compound between pads such as these solders and Cu, Ni, thereby form firm solder joint.In later stage military service process, intermetallic compounds layer in the solder joint between solder and pad can continue to grow up, because the fragility essence of intermetallic compound, the reliability of meeting severe exacerbation Joint Strength and solder joint, therefore growing up of intermetallic compounds layer that need be by suppressing soft soldering alloy and pad in the solder joint, thereby indirect lifting Joint Strength and welding spot reliability.
Summary of the invention
In order to address the above problem, suppress the problem of growing up in the process under arms of intermetallic compounds layer between solder and pad, the object of the present invention is to provide a kind of no-lead soft soldering, this leadless solder adds alloy element Zn in existing Sn-Cu no-lead soft soldering system, the addition of control Zn is 0.2～1.0wt.%; The addition of Cu is 0.7wt.% in the leadless solder.
Leadless solder involved in the present invention does not use the lead of hypertoxicity in the basic composition as solder, belong to feature of environmental protection leadless solder.Lead-free brazing of the present invention with above-mentioned composition can be smelted by conventional method, and promptly Sn, Cu, Zn heat in crucible and stirring with the raw metal supply, and casting can obtain brazing filler metal alloy.Brazing filler metal alloy of the present invention can be processed to form into the form of soldering tin bar, scolding tin rod, solder stick, solder ball and soldering paste etc. by traditional handicraft, thereby can satisfy needed brazing filler metal alloys such as PCB assembling, SMT microelectronics surface encapsulation and surface mount.
Description of drawings
Fig. 1 is a Sn-0.7Cu/Cu interfacial structure feature photo under aging 10 days time conditions of 150 ℃ of constant temperature, Fig. 2 is a Sn-0.7Cu-0.2Zn/Cu interfacial structure feature photo under aging 10 days time conditions of 150 ℃ of constant temperature, Fig. 3 is a Sn-0.7Cu-1.0Zn/Cu interfacial structure feature photo under aging 10 days time conditions of 150 ℃ of constant temperature, and Fig. 4 is Cu
6Sn
5The power spectrum of layer is figure as a result, and Fig. 5 is Cu
3The power spectrum of Sn layer is figure as a result, and Fig. 6 is Cu
6Sn
5The power spectrum of layer is figure as a result, and Fig. 7 is Cu
5Zn
8The power spectrum of layer is figure as a result.
The specific embodiment
The specific embodiment one: the leadless solder of present embodiment is that Sn and unavoidable impurities are formed by 0.1～3.0wt.%Cu, 0.05～2.0wt.%Zn, surplus.
Describe effect and the optimum content thereof that respectively adds element in the present embodiment below in detail.
Add Cu and can form binary eutectic to reduce the fusing point of scolder at 0.7wt.%Cu, 227 ℃ the time with Sn.Compare with traditional Sn-Pb scolder, the Sn-Cu eutectic has series of advantages, comprises the density (7.4g/mm of scolder
3) than Sn-Pb (8.4g/mm
3) low, high heat conductance, low-resistivity, mechanical performance and welding spot reliability etc.The preferable range of copper content is 0.1～2.0wt.%, and preferred content range is 0.3～1.0wt.%.
Add Zn and can suppress between solder and printed circuit board formed intermetallic compounds layer growing up in later stage military service process between the Cu pad.When the Zn content that adds during less than 0.8wt.%, can hinder elemental diffusion, suppress the purpose that interface compound is grown up thereby reach; When the Zn content that adds during, can change the form of interface compound, from Cu greater than 0.8wt.%
6Sn
5Change Cu into
5Zn
8, reached equally and suppressed the purpose that interface compound is grown up.The preferable range of zinc content is 0.05-1.5wt.%, and preferred content range is 0.1-1.2wt.%.
The specific embodiment two: according to present embodiment in detail the present invention is described in detail, but the scope of the invention is not the embodiment that is limited to here to be proposed.In the following description, the percentage all about alloying component all is percetage by weight.
Embodiment 1, and leadless solder is by 0.7%Cu, 0.2%Zn, and remainder is that 99.1%Sn forms.
Conventional case, leadless solder are by 0.7%Cu, and remainder is 99.3%Sn.
To the embodiment of the invention and conventional case by and the Cu pad of printed circuit board between form welding point, and it is aging to have carried out the high temperature constant temperature of a period of time, is about to scolder and observes the variation of intermetallic compound at the interface in insulation under 150 ℃ of temperature after 10 days.Conventional case, the result of the test that embodiment 1 is corresponding with solder alloy described in the embodiment 2 are seen Fig. 1-3 respectively.In three figure, figure top is that solder alloy, centre are intermetallic compounds layer, and the bottom is the Cu pad.As shown in Figure 1, the described solder alloy/Cu of conventional case has formed compound between double layer of metal at the interface in ageing process, be respectively Cu
6Sn
5Layer and Cu
3Sn layer, power spectrum the results are shown in Figure 4 and Fig. 5, and thickness is about 6 μ m.In Fig. 2, embodiment 1 described solder alloy is compared with conventional case and has been added 0.2%Zn, and solder alloy/Cu has only formed the layer of metal compound layer at the interface, and power spectrum the results are shown in Figure 6, shows that interface compound is Cu
6Sn
5, thickness is about 3 μ m, shows that the Zn of 0.2% content has suppressed Cu fully
3The formation of Sn and growing up.In embodiment 2, as shown in Figure 3, the interface has equally only formed compound layer between layer of metal, and power spectrum the results are shown in Figure 7, and interface compound changes Cu into
5Zn
8Layer, thickness is about 3 μ m.
Therefrom find out, in traditional Sn-0.7Cu (comparative example), add element Zn (embodiment 1 and embodiment 2) and can obviously suppress growing up of compound between interface metal.
Claims (3)
1, a kind of leadless solder is characterized in that leadless solder is made up of 0.7wt.%Cu, 0.2～1.0wt.%Zn and 98.3～99.1wt.%Sn.
2, leadless solder according to claim 1 is characterized in that described leadless solder is made up of 0.7wt.%Cu, 0.2wt.%Zn and 99.1wt.%Sn.
3, leadless solder according to claim 1 is characterized in that described leadless solder is made up of 0.7wt.%Cu, 1.0wt.%Zn and 98.3wt.%Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101511048A CN100534700C (en) | 2006-12-06 | 2006-12-06 | No-lead soft soldering alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101511048A CN100534700C (en) | 2006-12-06 | 2006-12-06 | No-lead soft soldering alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1986142A CN1986142A (en) | 2007-06-27 |
| CN100534700C true CN100534700C (en) | 2009-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101511048A Active CN100534700C (en) | 2006-12-06 | 2006-12-06 | No-lead soft soldering alloy |
Country Status (1)
| Country | Link |
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| CN (1) | CN100534700C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101780607A (en) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101381826B (en) * | 2008-09-26 | 2012-11-07 | 南昌大学 | Sn-Cu base leadless solder alloy and preparation method |
| CN102184905A (en) * | 2011-04-26 | 2011-09-14 | 哈尔滨工业大学 | Micro-interconnection welding spot structure of single intermetallic compounds |
| CN104972241B (en) * | 2015-07-30 | 2017-11-10 | 好利来（中国）电子科技股份有限公司 | Tin zinc-copper system high temperature lead-free solder |
| CN112077478A (en) * | 2020-09-14 | 2020-12-15 | 哈尔滨理工大学 | Low-melting-point In-Sn-Zn alloy solder and preparation method thereof |
| CN113798723B (en) * | 2021-10-13 | 2022-10-04 | 浙江强力控股有限公司 | Zinc-containing soldering-flux-free solder wire and preparation method thereof |
-
2006
- 2006-12-06 CN CNB2006101511048A patent/CN100534700C/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101780607A (en) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN1986142A (en) | 2007-06-27 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Lead-free solder alloy Effective date of registration: 20221215 Granted publication date: 20090902 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: YIK SHING TAT INDUSTRIAL Co.,Ltd. Registration number: Y2022980027687 |
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