CN113798723B - Zinc-containing soldering-flux-free solder wire and preparation method thereof - Google Patents
Zinc-containing soldering-flux-free solder wire and preparation method thereof Download PDFInfo
- Publication number
- CN113798723B CN113798723B CN202111191090.3A CN202111191090A CN113798723B CN 113798723 B CN113798723 B CN 113798723B CN 202111191090 A CN202111191090 A CN 202111191090A CN 113798723 B CN113798723 B CN 113798723B
- Authority
- CN
- China
- Prior art keywords
- component
- zinc
- solder wire
- wire
- imide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a zinc-containing soldering-flux-free solder wire and a preparation method thereof, wherein the solder wire comprises 3-7% of a first component and 93-97% of a second component by mass percentage; the first component comprises 40-60% of aqueous polyamide-imide resin solution and 60-40% of zinc-copper compound powder; the second component comprises 98 percent of electrolytic tin, 1.4 percent of electrolytic bismuth and 0.6 percent of electrolytic silver; wherein the mass percentage content of the water-based polyamide-imide resin in the water-based polyamide-imide resin aqueous solution is 3 percent, and the granularity of the zinc compound powder is 0.5-1.2 microns; the purity of the electrolytic tin is 99.5%, and the purity of the electrolytic bismuth and the electrolytic silver is 99%. The solder wire containing zinc and free of soldering flux obtained by the invention is suitable for assembling and welding various electronic components, can meet requirements of copper-based welding parts and welding parts with multiple alloy components such as nickel plating, silver plating, gold plating and the like, can produce solder wire finished products with the diameter of 0.8-3.5 mm, and has wide application range and strong applicability.
Description
Technical Field
The invention relates to a solder-free solder wire used in the technical field of electronic welding production, in particular to a zinc-containing solder-free solder wire and a preparation method thereof.
Background
The soldering tin wire is used as a main welding material for assembling in the electronic welding industry, the welding quality and reliability are firstly ensured, and the quality of the soldering tin wire directly influences the service life of an assembled product.
At present, a soldering tin wire used in the electronic industry at home and abroad can complete the soldering process only by assisting a certain soldering flux, the soldering flux is necessary to be arranged inside the soldering tin wire or coated with the soldering flux in the soldering process, and the main components of the soldering flux are rosin-based soldering flux and various organic acid activators. Because of the existence of the organic acid activator, the activator is not easy to completely decompose in the high-speed welding process and remains on the surface of the weldment together with the rosin, and the active ingredients in the residue are easy to chemically react with the weldment or the welding spot when meeting a high-temperature or humid environment, so that the welding spot is continuously corroded, and the service life of the product is influenced.
Disclosure of Invention
In order to overcome the defects, the invention provides the zinc-containing soldering-flux-free solder wire and the preparation method thereof, which can effectively improve the service life and reliability of a welding spot or a weldment while ensuring the welding effect.
The technical scheme adopted by the invention for solving the technical problem is as follows: a zinc-containing solder-flux-free solder wire comprises, by mass, 10% -20% of a first component and 80% -90% of a second component; the first component is prepared from 40-60% of aqueous polyamide imide resin aqueous solution and 60-40% of zinc-copper compound powder, wherein the mass percentage of the aqueous polyamide imide resin in the aqueous polyamide imide resin aqueous solution is 3%, and the granularity of the zinc-copper compound powder is 0.8-1.2 microns; the second component is electrolytic tin with a purity of 99.95%. The preparation method of the zinc-containing solder-free solder wire comprises the following steps:
step 1, uniformly mixing the aqueous polyamide imide resin solution and the zinc-copper compound powder in the first component, heating to 90-105 ℃, and keeping continuously stirring to obtain a first component;
step 2, pouring the uniformly mixed first component into a pressure injection barrel with heat preservation and stirring functions for later use;
step 3, weighing the electrolytic tin in the second component, putting the second component into an intermediate frequency heating furnace, keeping the temperature within a range of 380-400 ℃, and continuously stirring for 2 hours to obtain a second component;
step 4, casting the second component into a section to be extruded, and cooling for later use;
step 5, putting the extruded section obtained in the step 4 into an extruder for extrusion, pressing the uniformly mixed first component into the second component through a pressurized and sealed injection barrel, wherein the pressing proportion is controlled to be 10-20% through a flow regulating valve, and the pressing proportion is the mass proportion of the first component to the second component;
and 6, controlling the thickness of the wire diameter of the extruded product through a wire drawing die, and reaching the final required wire diameter to obtain the zinc-containing solder-free solder wire finished product.
As a further improvement of the invention, the composition of the zinc-copper compound comprises at least: cu 5 Zn 8 、CuZn。
The beneficial effects of the invention are: the invention adopts the water-based polyamide-imide resin and the zinc-copper compound as auxiliary materials of the soldering-flux-free solder wire, the effect of the soldering-flux-free solder wire can replace the traditional rosin soldering flux, the wettability is good in the soldering process, and the soldering-flux-free solder wire can form an intermetallic compound layer (namely an IMC layer and a soldered joint) with a tin alloy solder and a soldered alloy in a very short time; the traditional welding process utilizes the action of the soldering flux, under the condition of continuous welding high temperature, the formation of intermetallic compounds is also promoted, and the main component of the formed intermetallic compounds is just the zinc-copper compound; meanwhile, after welding, the soldered joint has no residues, and the reliability of the soldered joint is effectively improved. The added zinc and silver elements can effectively improve the heat conductivity and the electric conductivity of the solder and reduce the self-energy consumption of products. In a word, the solder wire is simple in formula and process, and the service life and reliability of the traditional rosin type solder wire after welding are improved.
Detailed Description
The technical solution of the present invention will be described in detail with reference to examples.
Example 1:
a zinc-containing soldering flux-free solder wire comprises, by mass, 10% of a first component and 90% of a second component;
weighing a first component comprising 4Kg of 3 percent aqueous polyamide-imide resin solution and 6Kg of zinc-copper compound powder;
weighing 100Kg of electrolytic tin as a second component, wherein the purity is 99.95%;
wherein the mass percentage content of the water-based polyamide-imide resin in the water-based polyamide-imide resin aqueous solution is 3 percent, the median particle size of the zinc-copper compound powder is 1.0 micron, and the zinc-copper compound powder at least comprises the following components: cu 5 Zn 8 、CuZn。
The preparation method comprises the following steps:
step 1, uniformly mixing a weighed aqueous polyamide imide resin aqueous solution in the first component with zinc-copper compound powder, heating to 90-105 ℃, and keeping continuously stirring to obtain a first component;
step 2, pouring the uniformly mixed first component into a pressure injection barrel with heat preservation and stirring functions for later use;
step 3, weighing the electrolytic tin, the electrolytic bismuth and the electrolytic silver in the second component according to the mass ratio, putting the second component into an intermediate frequency heating furnace, keeping the temperature in a range of 380-400 ℃, and continuously stirring for 2 hours to obtain a second component;
step 4, casting the second component into a section to be extruded, and cooling for later use;
step 5, putting the extruded section obtained in the step 4 into an extruder for extrusion, pressing the uniformly mixed first component into a second component through a pressurized and sealed injection barrel, wherein the pressing proportion is controlled at 10% through a flow regulating valve, and the pressing proportion is the mass proportion of the first component to the second component;
and 6, controlling the thickness of the wire diameter of the extruded product through a wire drawing die, and reaching the zinc-containing solder-free solder wire with the wire diameter of 1.5mm to obtain the sample to be tested in the embodiment 1.
Example 2:
a zinc-containing solder-free solder wire comprises 15% of a first component and 85% of a second component by mass percentage;
weighing a first component comprising 6Kg of 3 percent aqueous polyamide-imide resin solution and 9Kg of zinc-copper compound powder;
weighing 100Kg of electrolytic tin as a second component, wherein the purity is 99.95%;
wherein the mass percentage content of the water-based polyamide-imide resin in the water-based polyamide-imide resin aqueous solution is 3 percent, the median particle size of the zinc-copper compound powder is 1.0 micron, and the zinc-copper compound powder at least comprises the following components: cu 5 Zn 8 、CuZn。
The preparation method comprises the following steps:
step 1, uniformly mixing a weighed aqueous polyamide imide resin aqueous solution in the first component with zinc-copper compound powder, heating to 90-105 ℃, and keeping continuously stirring to obtain a first component;
step 2, pouring the uniformly mixed first component into a pressure injection barrel with heat preservation and stirring functions for later use;
step 3, weighing the electrolytic tin, the electrolytic bismuth and the electrolytic silver in the second component according to the mass ratio, putting the second component into an intermediate frequency heating furnace, keeping the temperature in a range of 380-400 ℃, and continuously stirring for 2 hours to obtain a second component;
step 4, casting the second component into a section to be extruded, and cooling for later use;
step 5, putting the extruded section obtained in the step 4 into an extruder for extrusion, pressing the uniformly mixed first component into a second component through a pressurized and sealed injection barrel, wherein the pressing proportion is controlled to be 15% through a flow regulating valve, and the pressing proportion is the mass proportion of the first component to the second component;
and 6, controlling the thickness of the wire diameter of the extruded product through a wire drawing die, and obtaining the zinc-containing solder-free solder wire with the wire diameter of 1.5mm, thereby obtaining the sample to be tested in the embodiment 2.
Example 3:
a zinc-containing solder-free solder wire comprises 20% of a first component and 80% of a second component by mass percentage;
weighing a first component comprising 8Kg of 3 percent aqueous polyamide-imide resin solution and 12Kg of zinc-copper compound powder;
weighing 100Kg of electrolytic tin as a second component, wherein the purity is 99.95%;
wherein the mass percentage content of the water-based polyamide-imide resin in the water-based polyamide-imide resin aqueous solution is 3 percent, the median particle size of the zinc-copper compound powder is 1.0 micron, and the zinc-copper compound powder at least comprises the following components: cu 5 Zn 8 、CuZn。
The preparation method comprises the following steps:
step 1, uniformly mixing a weighed aqueous polyamide imide resin aqueous solution in the first component with zinc-copper compound powder, heating to 90-105 ℃, and keeping continuously stirring to obtain a first component;
step 2, pouring the uniformly mixed first component into a pressure injection barrel with heat preservation and stirring functions for later use;
step 3, weighing the electrolytic tin, the electrolytic bismuth and the electrolytic silver in the second component according to the mass ratio, putting the second component into an intermediate frequency heating furnace, keeping the temperature in a range of 380-400 ℃, and continuously stirring for 2 hours to obtain a second component;
step 4, casting the second component into a section to be extruded, and cooling for later use;
step 5, putting the extruded section obtained in the step 4 into an extruder for extrusion, pressing the uniformly mixed first component into a second component through a pressurized and sealed injection barrel, wherein the pressing proportion is controlled to be 20% through a flow regulating valve, and the pressing proportion is the mass proportion of the first component to the second component;
and 6, controlling the thickness of the wire diameter of the extruded product through a wire drawing die, and reaching the zinc-containing solder-free solder wire with the wire diameter of 1.5mm to obtain the sample to be tested in the embodiment 1.
The three samples of the above examples were compared with a conventional solder wire of "1.5 mm wire diameter of tin-copper (sn0.7cu) and 2.0% rosin content" in a solder wire bonding process in which a brass wire having a wire diameter of 1.0mm was bonded to a T2 copper plate, and then "residual state and dryness after bonding, solder spreading rate and bonding strength" were observed and tested, and the test results were shown in table 1:
table 1: examples test data sheet
| Contrast item | Degree of dryness after welding | Spreading rate of solder （%） | Welding spot strength (Kg) |
| Test conditions | According to the GB/T9491 standard: welding of The surface of the agent residue should not be sticky Or chalk on surfaces The powder should be easily removed | According to GB/T9491 5.8.1 method measurement Test (meet at > 85%) Alloy welding requirements) | 1, fixing a T2 copper plate by using a clamp; 2, clamping one end of the welded copper wire on a lifting head of a tensile machine; 3, the adopted tensile machine model is a domestic TK-8203 computer type full-automatic shearing tester The peak value tension of the tension sensor is 30Kg;4, the welding strength is that when the welding spot is cracked and broken, the tensile machine The displayed reading indicates that the strength of the welding spot is greater than the strength of the copper wire with the thickness of 1.0mm if the copper wire is broken. |
| Example 1 | No visible residue, solder joint table Dry non-sticky chalk powder | 87.2% | 4.1 |
| Example 2 | No visible residue, solder joint table Dry non-sticky chalk powder | 86.8% | 4.2 |
| Example 3 | No visible residue, solder joint table Dry non-stick chalk powder | 88.1% | 4.2 |
| Traditional solder wire (Sn0.7Cuh Diameter of gold wire 1.5mm/2.0% Rosin content) | The rosin has a light yellow color and remains, slightly dried and welded for 5 minutes Coated chalk powder having 30% failed to remove | 87.4% | 3.9 |
According to the experimental data, the solder wire without the soldering flux obtained by the technical scheme of the invention has the following advantages: firstly, no residue is left after welding, and the chalk powder is dry and does not stick to the chalk powder, thereby meeting the GB/T9491 standard; secondly, the spreading rate of the solder during welding reaches over 86 percent, meets the standard requirement and has little difference with the traditional rosin soldering wire; finally, in the pull-out test of the solder strength test, the overall strength was all stronger than the conventional solder wire.
The zinc-containing soldering tin wire free of soldering flux is suitable for assembling and welding various electronic components, can meet requirements of copper-based weldments and weldments with multiple alloy components such as nickel plating, silver plating, gold plating and the like, can produce 0.8-3.5 mm of soldering tin wire finished products through diameter, and is wide in application and strong in applicability.
Therefore, the soldering flux-free solder wire obtained by the invention adopts the main component of the intermetallic compound formed by the soldered joint (IMC) in the traditional soldering process as a part of the solder wire alloy, and is fused with the tin solder through a certain process, so that the soldering flux-free soldering is realized, the residues are basically avoided after the soldering, the soldering form (expansion rate) is better, the soldering strength is higher, and the soldering flux-free solder wire can completely meet and replace the traditional rosin type solder wire. The invention provides a novel material for the electronic welding industry, and the novel material has wider application scene and higher application reliability.
In a word, the invention has breakthrough of new technology on the basis of reaching the weldability and reliability of the traditional soldering wire. In the application process of a client, the original process is not required to be changed, and a better welding effect is achieved.
In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the present invention. The foregoing description is that of the preferred embodiment of the invention only, and the invention can be practiced in many ways other than as described herein, so that the invention is not limited to the specific implementations disclosed above. And that those skilled in the art will be able to make many changes and modifications to the invention using the method and techniques disclosed above, or to modify and adapt equivalent embodiments to equivalent variations, without departing from the scope of the invention. Any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the scope of the technical solution of the present invention.
Claims (2)
1. The solder wire containing zinc and free of soldering flux is characterized in that: according to the mass percentage, the zinc-containing solder-free solder wire consists of 10-20% of a first component and 80-90% of a second component;
the first component is prepared from 40-60% of aqueous polyamide-imide resin solution and 60-40% of zinc-copper compound powder, wherein the mass percentage of the aqueous polyamide-imide resin in the aqueous polyamide-imide resin solution is 3%, and the granularity of the zinc-copper compound powder is 0.8-1.2 microns;
the second component is electrolytic tin with the purity of 99.95 percent;
the preparation method of the zinc-containing soldering flux-free solder wire comprises the following steps:
step 1, uniformly mixing the aqueous polyamide imide resin solution and the zinc-copper compound powder in the first component, heating to 90-105 ℃, and keeping continuously stirring to obtain a first component;
step 2, pouring the uniformly mixed first component into a pressure injection barrel with heat preservation and stirring functions for later use;
step 3, weighing the electrolytic tin in the second component, putting the second component into an intermediate frequency heating furnace, keeping the temperature within a range of 380-400 ℃, and continuously stirring for 2 hours to obtain a second component;
step 4, casting the second component into a section to be extruded, and cooling for later use;
step 5, putting the extruded section obtained in the step 4 into an extruder for extrusion, pressing the uniformly mixed first component into the second component through a pressurized and sealed injection barrel, wherein the pressing proportion is controlled to be 10-20% through a flow regulating valve, and the pressing proportion is the mass proportion of the first component to the second component;
and 6, controlling the thickness of the wire diameter of the extruded product through a wire drawing die to reach the final required wire diameter, and obtaining the zinc-containing solder wire finished product without soldering flux.
2. The solder-free solder wire containing zinc according to claim 1, characterized in that: the zinc-copper compound at least comprises the following components: cu 5 Zn 8 、CuZn。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111191090.3A CN113798723B (en) | 2021-10-13 | 2021-10-13 | Zinc-containing soldering-flux-free solder wire and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111191090.3A CN113798723B (en) | 2021-10-13 | 2021-10-13 | Zinc-containing soldering-flux-free solder wire and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113798723A CN113798723A (en) | 2021-12-17 |
| CN113798723B true CN113798723B (en) | 2022-10-04 |
Family
ID=78897691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111191090.3A Active CN113798723B (en) | 2021-10-13 | 2021-10-13 | Zinc-containing soldering-flux-free solder wire and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113798723B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289493A (en) * | 2005-03-17 | 2006-10-26 | Tamura Kaken Co Ltd | Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate |
| CN1986142A (en) * | 2006-12-06 | 2007-06-27 | 深圳市亿铖达工业有限公司 | No-lead soft soldering alloy |
| CN101208173A (en) * | 2005-05-25 | 2008-06-25 | 千住金属工业株式会社 | Lead-free solder paste |
| CN108581276A (en) * | 2018-05-16 | 2018-09-28 | 深圳市绿色千田锡业科技有限公司 | A kind of water solubility lead-free soldering wire |
| CN111482733A (en) * | 2020-04-21 | 2020-08-04 | 浙江力强科技有限公司 | Anti-oxidation soldering flux for tinned copper strip coating and preparation method thereof |
| CN112338386A (en) * | 2020-11-01 | 2021-02-09 | 江苏常铝铝业集团股份有限公司 | Brazing flux-free brazing aluminum alloy composite strip and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101618485B (en) * | 2009-08-03 | 2011-10-19 | 浙江强力焊锡材料有限公司 | Lead free brazing material |
| JP5093373B2 (en) * | 2011-03-08 | 2012-12-12 | 住友金属鉱山株式会社 | Pb-free solder paste |
-
2021
- 2021-10-13 CN CN202111191090.3A patent/CN113798723B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289493A (en) * | 2005-03-17 | 2006-10-26 | Tamura Kaken Co Ltd | Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate |
| CN101208173A (en) * | 2005-05-25 | 2008-06-25 | 千住金属工业株式会社 | Lead-free solder paste |
| CN1986142A (en) * | 2006-12-06 | 2007-06-27 | 深圳市亿铖达工业有限公司 | No-lead soft soldering alloy |
| CN108581276A (en) * | 2018-05-16 | 2018-09-28 | 深圳市绿色千田锡业科技有限公司 | A kind of water solubility lead-free soldering wire |
| CN111482733A (en) * | 2020-04-21 | 2020-08-04 | 浙江力强科技有限公司 | Anti-oxidation soldering flux for tinned copper strip coating and preparation method thereof |
| CN112338386A (en) * | 2020-11-01 | 2021-02-09 | 江苏常铝铝业集团股份有限公司 | Brazing flux-free brazing aluminum alloy composite strip and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113798723A (en) | 2021-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101380699B (en) | Pig tin series leadless alloy soldering paste and preparation method thereof | |
| CN102574251A (en) | Low-silver-content solder alloy and solder paste composition | |
| CN101491866B (en) | Low-temperature leadless cored solder alloy and produced solder paste | |
| CN100443245C (en) | Nickel soldering paste for automatic brazing | |
| CN104985350B (en) | A kind of unleaded composite solder material of Sn Bi/Cu | |
| CN111318832B (en) | Low-temperature lead-free soldering paste and preparation method thereof | |
| US8790472B2 (en) | Process for producing a solder preform having high-melting metal particles dispersed therein | |
| CN114986023A (en) | Process for prefabricating low-melting-point brazing filler metal, low-melting-point brazing filler metal and preparation method thereof | |
| CN113798723B (en) | Zinc-containing soldering-flux-free solder wire and preparation method thereof | |
| CN113770590B (en) | Antimony-containing soldering tin wire free of soldering flux and preparation method thereof | |
| CN102642097A (en) | Low-silver lead-free solder alloy | |
| CN113798724B (en) | Soldering tin wire free of soldering flux and preparation method thereof | |
| CN111482730A (en) | Solder wire for automatic soldering robot and preparation method thereof | |
| CN113798725B (en) | Solder-free lead-free solder for selective wave soldering and preparation method thereof | |
| CN108788512A (en) | A kind of low voidage leadless environment-friendly solder(ing) paste of low melting point | |
| US4647308A (en) | Soldering compositions, fluxes and methods of use | |
| CN103084749B (en) | The lead-free brazing in a kind of high service life | |
| JP2019136774A (en) | Solder alloy composition, solder, and production method thereof | |
| CN108098185A (en) | A kind of low-melting point leadless scolding tin of MPY solder machines | |
| CN114871629B (en) | Nickel-ball-containing solder wire and preparation method thereof | |
| JP2022026896A (en) | Solder alloy and molding solder | |
| CN112894195A (en) | Low-silver lead-free solder alloy for brazing and preparation method thereof | |
| CN100488703C (en) | Copper powder reinforced composite Sn-Zn brazing alloy and its preparation process | |
| CN113996972B (en) | Anti-blushing soldering flux for solder wires and preparation method thereof | |
| JP2016026883A (en) | Bi-Sn-Zn BASED SOLDER ALLOY FOR MEDIUM TO LOW TEMPERATURES AND SOLDER PASTE |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |