CN112894195A - Low-silver lead-free solder alloy for brazing and preparation method thereof - Google Patents
Low-silver lead-free solder alloy for brazing and preparation method thereof Download PDFInfo
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- CN112894195A CN112894195A CN202110363069.0A CN202110363069A CN112894195A CN 112894195 A CN112894195 A CN 112894195A CN 202110363069 A CN202110363069 A CN 202110363069A CN 112894195 A CN112894195 A CN 112894195A
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 94
- 239000000956 alloy Substances 0.000 title claims abstract description 94
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 238000005219 brazing Methods 0.000 title claims abstract description 38
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 34
- 239000004332 silver Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000002994 raw material Substances 0.000 claims abstract description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 40
- 239000002245 particle Substances 0.000 claims description 39
- 238000002844 melting Methods 0.000 claims description 25
- 230000008018 melting Effects 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 25
- 239000000155 melt Substances 0.000 claims description 24
- 150000003839 salts Chemical class 0.000 claims description 22
- 230000005496 eutectics Effects 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 21
- 239000011780 sodium chloride Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 13
- 238000005303 weighing Methods 0.000 claims description 13
- 229910052797 bismuth Inorganic materials 0.000 claims description 11
- 238000009210 therapy by ultrasound Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 238000004321 preservation Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 238000010923 batch production Methods 0.000 abstract description 3
- 239000000945 filler Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 7
- 239000011259 mixed solution Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910017692 Ag3Sn Inorganic materials 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910021652 non-ferrous alloy Inorganic materials 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a low-silver lead-free solder alloy for brazing, which comprises the following raw materials in percentage by mass: the mass fraction of Sn is 96-97%, the mass fraction of Ag is 0.8-0.85%, and the mass fraction of Cu is 0.5-0.55%: the mass fraction of Bi is 1.60-2.5%: the mass fraction of Ni is 0.05-0.1%, and the sum of the above components is 100%. The alloy has the characteristics of oxidation resistance, good tissue uniformity and good creep resistance, and the preparation method is simple and easy to operate, is convenient to operate and can be used for batch production.
Description
Technical Field
The invention belongs to the technical field of non-ferrous alloys, and particularly relates to a low-silver lead-free solder alloy for brazing and a preparation method of the solder alloy.
Background
The brazing technology is widely applied to the field of electronic packaging, can realize interconnection between electronic packaging devices and materials, various lead-free solders are developed by alloying, particle strengthening and other methods in the prior art to become the main microelectronic interconnection material at present, elemental metals of Sn, Ag, Cu, Bi and Ni are adopted in the preparation process of the SACBN solder, the melting points of the elemental metals of Ag, Cu and Ni are much higher than those of Sn and Bi, and in the preparation process, Sn and Bi are melted, but Ag, Cu and Ni are possibly not melted, so that the tissue components are not uniform; meanwhile, the density difference among the components is large, and gravity segregation can be caused by long-time heat preservation; moreover, a high silver content causes generation of a large amount of Ag3Sn intermetallic compounds in the solder, and reduces impact resistance of soldered joints, and more importantly, a high silver content increases the cost of the solder, but the reduction of the silver content in the solder causes reduction of Ag3Sn compounds formed in the solder, and the solder has reduced hardness, strength and the like, and has obviously reduced reliability under high-temperature service aging conditions, and the reduction of the silver content also causes deterioration of welding characteristics such as melting point, wettability and the like. The existing solder preparation method has the advantages of high Ag content, increased preparation cost, easy oxidation of solder for soldering, poor component uniformity during salt bath soldering, poor creep resistance, high use limitation and no contribution to large-scale application.
Disclosure of Invention
The invention aims to provide a low-silver lead-free solder alloy for soldering, which has the characteristics of oxidation resistance, good tissue uniformity and good creep resistance.
Another object of the present invention is to provide a method for preparing a low-silver lead-free solder alloy for soldering.
The invention adopts the technical scheme that the low-silver lead-free solder alloy for brazing comprises the following raw materials in percentage by mass: the mass fraction of Sn is 96-97%, the mass fraction of Ag is 0.8-0.85%, the mass fraction of Cu is 0.5-0.55%, and the mass fraction of Bi is 1.60-2.5%: the mass fraction of Ni is 0.05-0.1%, and the sum of the above components is 100%.
The invention adopts the technical scheme that a preparation method of a low-silver lead-free solder alloy for brazing comprises the following specific steps:
step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy, wherein the components meet the following conditions in percentage by mass: the mass fraction of Sn is 96-97%, the mass fraction of Ag is 0.8-0.85%, and the mass fraction of Cu is 0.5-0.55%: the mass fraction of Bi is 1.60-2.5%: the mass fraction of Ni is 0.05-0.1%, and the sum of the above substance components is 100%;
step 2, preparing NaCl and KCl liquid eutectic salt;
step 3, sequentially adding the Sn particles, the Bi particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metal is completely melted to obtain a melt;
and 4, preserving the heat of the melt obtained in the step 3, performing ultrasonic vibration treatment on the melt in the heat preservation process to obtain a uniform melt, then performing air cooling, and performing ultrasonic treatment simultaneously in the air cooling process until solidification to obtain the low-silver lead-free solder alloy for brazing.
The present invention is also characterized in that,
the specific preparation method of the step 2 comprises the following steps: NaCl and KCl are added according to the molar ratio of 0.9-1.1: 0.9-1.1, and mixing uniformly.
The frequency of the ultrasonic vibration processed by the ultrasonic vibration in the step 4 is 20-100 KHz, and the amplitude is 1-10 μm.
And 2, putting the uniformly mixed NaCl and KCl mixture into a crucible, heating to 650-720 ℃, preserving heat for 0.5-1 h, and melting to form liquid eutectic salt.
The ultrasonic vibration treatment time in the step 4 is 30-40 min.
In the step 1, the surfaces of the Sn particles, the Bi particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy and the SnNi0.5 intermediate alloy are subjected to primary cleaning treatment.
The invention has the beneficial effects that: the invention reduces the manufacturing cost of the brazing filler metal by changing the proportion of the materials for preparing the brazing filler metal, has the characteristics of oxidation resistance, good tissue uniformity and good creep resistance, ensures that the performance of the brazing filler metal meets the use requirement, and has better electrical conductivity and excellent brazing performance; the preparation method of the brazing alloy is simple, the operation is convenient, the brazing alloy can be used for batch production, the pollution to the ecological environment can be reduced by the popularization and the application of the process technology, and the brazing alloy has deep environmental protection benefits and wide application prospects.
Detailed Description
The present invention will be described in detail with reference to the following embodiments.
The invention provides a low-silver lead-free solder alloy for brazing, which comprises the following raw materials in percentage by mass: the mass fraction of Sn is 96-97%, the mass fraction of Ag is 0.8-0.85%, and the mass fraction of Cu is 0.5-0.55%: the mass fraction of Bi is 1.60-2.5%: the mass fraction of Ni is 0.05-0.1%, and the sum of the above components is 100%.
The other technical scheme adopted by the invention is as follows: a method for preparing a low-silver lead-free solder alloy for brazing comprises the following specific steps:
step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy, wherein the components meet the following conditions in percentage by mass: the mass fraction of Sn is 96-97%, the mass fraction of Ag is 0.7-0.8%, and the mass fraction of Cu is 0.5-0.55%: the mass fraction of Bi is 1.60-2.5%: the mass fraction of Ni is 0.05-0.1%, and the sum of the above substance components is 100%;
in the step 1, the surfaces of the Sn particles, the Bi particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy and the SnNi0.5 intermediate alloy are subjected to primary cleaning treatment.
Step 2, preparing NaCl and KCl liquid eutectic salt;
the specific preparation method of the step 2 comprises the following steps: NaCl and KCl are added according to the molar ratio of 0.9-1.1: 0.9-1.1, uniformly mixing, putting the uniformly mixed NaCl and KCl mixture into a crucible, heating to 650-720 ℃, preserving heat for 0.5-1 h, and melting to form liquid eutectic salt. The NaCl and KaCl eutectic salt are utilized to smelt the brazing filler metal, so that on one hand, the oxidation of the brazing filler metal can be avoided; the heat of the liquid eutectic salt is utilized to melt all components in the brazing filler metal, and the heating time is short; the furnace temperature is uniformly distributed, and the phenomenon of non-melting of metal with higher melting point is avoided.
And 3, sequentially adding the Sn particles, the Bi particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metal is completely melted to obtain a melt.
And 4, preserving the heat of the melt obtained in the step 3, performing ultrasonic vibration treatment on the melt in the heat preservation process to obtain a uniform melt, then performing air cooling, and performing ultrasonic treatment simultaneously in the air cooling process until solidification to obtain the low-silver lead-free solder alloy for brazing.
The ultrasonic vibration treatment time in the step 4 is 30-40 min; in the step 4, the frequency of ultrasonic vibration treatment is 20-100 KHz, the amplitude is 1-10 mu m, and when the brazing filler metal is in a liquid state, atomic diffusion is increased by ultrasonic treatment, so that the homogenization of the brazing filler metal is increased; the ultrasonic treatment refines the crystal grains in the solidification process, and avoids the generation of a coarse structure.
Example 1
Step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy; the components meet the following conditions in percentage by mass: 96.65% of Sn, 0.80% of Ag, 0.50% of Cu, 2.00% of Bi and 0.05% of Ni.
Step 2, mixing NaCl and KCl according to the molar number of 1: 1, weighing 200g of the mixed solution, uniformly mixing, putting the uniformly mixed NaCl and KCl mixture into a crucible, heating to 650 ℃, preserving heat for 0.5h, and melting to form liquid eutectic salt.
And 3, sequentially adding the Sn particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy, the Bi particles and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metals are completely melted to obtain a melt.
And 4, preserving the heat of the melt obtained in the step 3, carrying out ultrasonic vibration treatment on the melt in the heat preservation process, wherein the frequency of the ultrasonic vibration is 80KHz, the amplitude is 5 microns, and then carrying out air cooling on the obtained uniform melt, and simultaneously carrying out ultrasonic treatment in the air cooling process until the uniform melt is solidified to obtain the low-silver lead-free solder alloy for brazing.
The solder alloy prepared in the example 1 has a melting point of 210.5 ℃, a conductivity of 7.21Ms/m, good structure uniformity and good creep resistance.
Example 2
Step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy; the components meet the following conditions in percentage by mass: 96.15% of Sn, 0.85% of Ag, 0.51% of Cu, 2.47% of Bi and 0.02% of Ni.
Step 2, mixing NaCl and KCl according to the molar number of 0.9: 1, weighing 200g of the mixed solution, uniformly mixing, putting the uniformly mixed NaCl and KCl mixture into a crucible, heating to 660 ℃, preserving heat for 0.6h, and melting to form liquid eutectic salt.
And 3, sequentially adding the Sn particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy, the Bi particles and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metals are completely melted to obtain a melt.
And 4, preserving the heat of the melt obtained in the step 3, carrying out ultrasonic vibration treatment on the melt for 30min in the heat preservation process, wherein the frequency of the ultrasonic vibration is 80KHz, the amplitude is 5 microns, and then carrying out air cooling on the obtained uniform melt, and simultaneously carrying out ultrasonic treatment in the air cooling process until the uniform melt is solidified to obtain the low-silver lead-free solder alloy for brazing.
The solder alloy prepared in the embodiment 2 has the advantages of melting point of 200 ℃, electric conductivity of 7.2Ms/m, good structure uniformity and good creep resistance.
Example 3
Step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy; the components meet the following conditions in percentage by mass: 96.2% of Sn, 0.82% of Ag, 0.53% of Cu, 2.40% of Bi and 0.05% of Ni.
Step 2, mixing NaCl and KCl according to the molar number of 1: 0.9, weighing 200g of the mixed solution, uniformly mixing, putting the uniformly mixed NaCl and KCl mixture into a crucible, heating to 690 ℃, preserving heat for 0.8h, and melting to form liquid eutectic salt.
And 3, sequentially adding the Sn particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy, the Bi particles and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metals are completely melted to obtain a melt.
And 4, preserving the heat of the melt obtained in the step 3, carrying out ultrasonic vibration treatment on the melt for 35min in the heat preservation process, wherein the frequency of the ultrasonic vibration is 50KHz, the amplitude is 7 microns, and then carrying out air cooling on the obtained uniform melt, and simultaneously carrying out ultrasonic treatment in the air cooling process until the uniform melt is solidified to obtain the low-silver lead-free solder alloy for brazing.
The solder alloy prepared in example 3 has a melting point of 209.8 ℃, a conductivity of 7.01Ms/m, good uniformity of structure and good creep resistance.
Example 4
Step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy; the components meet the following conditions in percentage by mass: 96.95% of Sn, 0.81% of Ag, 0.54% of Cu, 1.60% of Bi and 0.10% of Ni.
Step 2, mixing NaCl and KCl according to the molar number of 0.9: 1.1, weighing 200g of the mixed solution, uniformly mixing, putting the uniformly mixed NaCl and KCl mixture into a crucible, heating to 700 ℃, preserving heat for 0.9h, and melting to form liquid eutectic salt.
And 3, sequentially adding the Sn particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy, the Bi particles and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metals are completely melted to obtain a melt.
And 4, preserving the heat of the melt obtained in the step 3, carrying out ultrasonic vibration treatment on the melt in the heat preservation process, wherein the frequency of the ultrasonic vibration is 100KHz, the amplitude is 8 mu m, obtaining a uniform melt, then carrying out air cooling, and simultaneously carrying out ultrasonic treatment in the air cooling process until the uniform melt is solidified, thus obtaining the low-silver lead-free solder alloy for brazing.
The solder alloy prepared in the embodiment 4 has the melting point of 211.2 ℃, the conductivity of 7.17Ms/m, good structure uniformity and good creep resistance.
Example 5
Step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy; the components meet the following conditions in percentage by mass: 97% of Sn, 0.85% of Ag, 0.5% of Cu, 1.6% of Bi and 0.05% of Ni.
Step 2, mixing NaCl and KCl according to the molar number of 1: 1, weighing 200g of the mixed solution, uniformly mixing, putting the uniformly mixed NaCl and KCl mixture into a crucible, heating to 720 ℃, preserving heat for 1h, and melting to form liquid eutectic salt.
And 3, sequentially adding the Sn particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy, the Bi particles and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metals are completely melted to obtain a melt.
And 4, preserving the heat of the melt obtained in the step 3, carrying out ultrasonic vibration treatment on the melt in the heat preservation process, wherein the frequency of the ultrasonic vibration is 100KHz, the amplitude is 10 mu m, obtaining a uniform melt, then carrying out air cooling, and simultaneously carrying out ultrasonic treatment in the air cooling process until the uniform melt is solidified, thus obtaining the low-silver lead-free solder alloy for brazing.
The solder alloy prepared in example 5 has a melting point of 208.1 ℃, a conductivity of 7.33Ms/m, good uniformity of structure and good creep resistance.
The low-silver lead-free solder alloy for brazing has the advantages of low melting point, good conductivity and excellent brazing performance; the SACBN brazing filler metal welding spot has good shearing strength, greatly improves the wettability while saving the cost, and shows better reliability and better comprehensive mechanical property under the long-time aging effect. The preparation method of the low-silver lead-free solder alloy for brazing is simple, is convenient to operate, and can be used for batch production.
Claims (7)
1. The low-silver lead-free solder alloy for brazing is characterized by comprising the following raw materials in percentage by mass: the mass fraction of Sn is 96-97%, the mass fraction of Ag is 0.8-0.85%, the mass fraction of Cu is 0.5-0.55%, and the mass fraction of Bi is 1.60-2.5%: the mass fraction of Ni is 0.05-0.1%, and the sum of the above components is 100%.
2. A preparation method of a low-silver lead-free solder alloy for brazing is characterized by comprising the following specific steps:
step 1, respectively weighing Sn particles with the purity of 99.99%, Bi particles, Sn3.5Ag intermediate alloy, SnCu0.7 intermediate alloy and SnNi0.5 intermediate alloy, wherein the components meet the following conditions in percentage by mass: the mass fraction of Sn is 96-97%, the mass fraction of Ag is 0.8-0.85%, and the mass fraction of Cu is 0.5-0.55%: the mass fraction of Bi is 1.60-2.5%: the mass fraction of Ni is 0.05-0.1%, and the sum of the above substance components is 100%;
step 2, preparing NaCl and KCl liquid eutectic salt;
step 3, sequentially adding the Sn particles, the Bi particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy and the SnNi0.5 intermediate alloy weighed in the step 1 into the liquid eutectic salt obtained by melting in the step 2, and stirring until the metal is completely melted to obtain a melt;
and 4, preserving the heat of the melt obtained in the step 3, performing ultrasonic vibration treatment on the melt in the heat preservation process to obtain a uniform melt, then performing air cooling, and performing ultrasonic treatment simultaneously in the air cooling process until solidification to obtain the low-silver lead-free solder alloy for brazing.
3. The method for preparing the low-silver lead-free solder alloy for brazing according to claim 2, wherein the specific preparation method in the step 2 is as follows: NaCl and KCl are added according to the molar ratio of 0.9-1.1: 0.9-1.1, and mixing uniformly.
4. The method for preparing a low-silver lead-free solder alloy for soldering according to claim 2, wherein the ultrasonic vibration of the ultrasonic vibration treatment in the step 4 has a frequency of 20 to 100KHz and an amplitude of 1 to 10 μm.
5. The preparation method of the low-silver lead-free solder alloy for brazing according to claim 3, wherein in the step 2, the uniformly mixed NaCl and KCl mixture is put into a crucible to be heated to 650-720 ℃, and the temperature is kept for 0.5-1 h, so that the mixture is melted to form liquid eutectic salt.
6. The method for preparing a low-silver lead-free solder alloy for soldering according to claim 2, wherein the time of the ultrasonic vibration treatment in the step 4 is 30min to 40 min.
7. The method for preparing the low-silver lead-free solder alloy for brazing as claimed in claim 2, wherein the surfaces of the Sn particles, the Bi particles, the Sn3.5Ag intermediate alloy, the SnCu0.7 intermediate alloy and the SnNi0.5 intermediate alloy in the step 1 are subjected to primary cleaning treatment.
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