CN100488703C - Copper powder reinforced composite Sn-Zn brazing alloy and its preparation process - Google Patents
Copper powder reinforced composite Sn-Zn brazing alloy and its preparation process Download PDFInfo
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- CN100488703C CN100488703C CNB200610122722XA CN200610122722A CN100488703C CN 100488703 C CN100488703 C CN 100488703C CN B200610122722X A CNB200610122722X A CN B200610122722XA CN 200610122722 A CN200610122722 A CN 200610122722A CN 100488703 C CN100488703 C CN 100488703C
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Abstract
The present invention discloses one kind of copper powder reinforced composite Sn-Zn brazing alloy and its preparation process. The copper powder reinforced composite Sn-Zn brazing alloy paste consists of Sn-Zn brazing alloy powder in 83-87.5 weight portions, copper powder in 0.5-5 weight portions and active paste flux in 10-15 weight portions mixed homogeneously. The copper powder reinforced composite Sn-Zn brazing alloy has creep resistance and fatigue resistance similar to that of common composite brazing alloy, as well as effects of inhibiting the growth of the boundary metal compound, lowering the zinc substance content in the joint and raising the reliability of joint. It has the same smelting point and brazing process as the Sn-Zn brazing alloy, and simple preparation process.
Description
Technical field
The present invention relates to the leadless composite solder technical field, specifically be meant composite Sn-Zn brazing alloy that a kind of copper powder strengthens and preparation method thereof.
Background technology
Because plumbous harm to environment reaches the murder by poisoning of human body is more and more caused people's attention, electronic product is unleaded to be globalization tendency.In the process of the substitute of seeking traditional tin-lead solder, tin zinc lead-free brazing since fusing point near the fusing point of tin-lead solder, and have excellent mechanical performance and good and economic and be considered to one of potential substitute of tin-lead solder.But tin spelter solder during soldering/copper brazing joint interface intermetallic compound is a copper zinc intermetallic compound, at high temperature can grow fast, because the fragility and the temperature instability of copper zinc compound in use cause the solder joint cracking; In tin spelter solder solder joint, zinc is to exist with simple substance zinc in addition, because zinc electrode current potential height causes electrochemical corrosion, and solder joint is peeled off, and reduces the soldered fitting reliability.Be growth that limits tin spelter solder/copper brazing joint interface copper zinc intermetallic compound and the content that reduces simple substance zinc in the solder joint, the activity of zinc in solder when name is called No. 200410021039.8 Chinese invention patent applications of " tin zinc-copper lead-free solder alloy ", No. 200510047022.4 Chinese invention patent applications that name is called " tin-zinc-copper-nickel lead-free solder alloy " and has proposed to add copper and mickel reduce soldering in the tin spelter solder, thereby the content of simple substance zinc in the thickness of minimizing interface copper zinc compound and the reduction solder, but the adding of copper and mickel causes the solder fusing point to raise; No. 02122018.2 Chinese invention patent application that name is called " with unleaded Welding Sn-Zn material fixed electronic element and do not reduce the method for bonding strength " has proposed nickel plating on Copper Foil, gold-plated method again, nickel electrodeposited coating on copper foil surface is as the barrier layer, can prevent from soldered fitting, to form copper zinc conversion zone, otherwise copper zinc conversion zone can cause bonding strength to reduce.Though this method can stop the growth of copper zinc compound, increase electroplating technology, complex technical process, production cost increases, and can not reduce the content of simple substance zinc in the solder joint simultaneously.
Summary of the invention
Purpose of the present invention is exactly in order to solve above-mentioned the deficiencies in the prior art part, and composite Sn-Zn brazing alloy of a kind of copper powder enhancing and preparation method thereof is provided.This composite Sn-Zn brazing alloy also has the growth that suppresses the interface metal compound except that having general composite soldering high creep-resistant property and fatigue performance; Reduce the effect of simple substance zinc content in the joint.
Purpose of the present invention is achieved through the following technical solutions: the preparation method of the composite Sn-Zn brazing alloy that described a kind of copper powder strengthens, comprise the steps and process conditions: in parts by weight, 83～87.5 parts of powdery tin spelter solders, 0.5～5 part of copper powder and 10～15 portions of high activity paste brazing fluxes are mixed and stir, make the composite Sn-Zn brazing alloy that the paste copper powder strengthens.
In order to realize the present invention better, by weight percentage, comprise 8～9% zinc, 0～3% bismuth in the described tin spelter solder, all the other are tin; The particle diameter of described powdery tin spelter solder is 40～80 μ m; The particle diameter of described copper powder is 1～10 μ m.
The composite Sn-Zn brazing alloy that described a kind of copper powder strengthens forms by method for preparing exactly.
The present invention compared with prior art has following advantage and beneficial effect:
1, the composite Sn-Zn brazing alloy of the copper powder enhancing of the present invention's preparation is except that having general composite soldering high creep-resistant property and fatigue performance, also has the growth that suppresses the interface metal compound, reduce the effect of the content of simple substance zinc in the joint, therefore can further improve Joint Reliability.Because this composite soldering does not change the fusing point of original Sn-Zn material, therefore can carry out soldering in lower temperature, do not change original soldering processes.
2, preparation technology of the present invention is simple.
The specific embodiment
Below in conjunction with embodiment, the present invention is done detailed description further, but embodiments of the present invention are not limited to this.
Embodiment one
In parts by weight, at 86 parts of particle diameters is to add 2 parts of copper powders that particle diameter is 8 μ m in the Sn-9Zn powdery tin spelter solder of 45 μ m, with 12 portions of high activity paste brazing fluxes above-mentioned powdery tin spelter solder and copper powder are mixed by churned mechanically method, mixing time is 30min, modulate the composite Sn-Zn brazing alloy that strengthens of paste copper powder.With this composite soldering cream put into refrigerator preserve standby, the soldered fitting that this composite soldering cream can be used for reflow welding and obtains high reliability.
Embodiment two
In parts by weight, at 83 parts of particle diameters is to add 2 parts of copper powders that particle diameter is 10 μ m in the Sn-9Zn powdery tin spelter solder of 80 μ m, with 15 portions of high activity paste brazing fluxes above-mentioned powdery tin spelter solder and copper powder are mixed by churned mechanically method, mixing time is 30min, modulate the composite Sn-Zn brazing alloy that strengthens of paste copper powder.With this composite soldering cream put into refrigerator preserve standby, the soldered fitting that this composite soldering cream can be used for reflow welding and obtains high reliability.
Embodiment three
In parts by weight, at 87.5 parts of particle diameters is to add 0.5 part of copper powder that particle diameter is 8 μ m in the SSn-9Zn powdery tin spelter solder of 45 μ m, with 12 portions of high activity paste brazing fluxes above-mentioned powdery tin spelter solder and copper powder are mixed by churned mechanically method, mixing time is 30min, modulate the composite Sn-Zn brazing alloy that strengthens of paste copper powder.With this composite soldering cream put into refrigerator preserve standby, the soldered fitting that this composite soldering cream can be used for reflow welding and obtains high reliability.
Embodiment four
In parts by weight, at 87.5 parts of particle diameters is to add 0.5 part of copper powder that particle diameter is 1 μ m in the Sn-8Zn-3Bi powdery tin spelter solder of 40 μ m, with 12 portions of high activity paste brazing fluxes above-mentioned powdery tin spelter solder and copper powder are mixed by churned mechanically method, mixing time is 30min, modulate the composite Sn-Zn brazing alloy that strengthens of paste copper powder.With this composite soldering cream put into refrigerator preserve standby, the soldered fitting that this composite soldering cream can be used for reflow welding and obtains high reliability.
Embodiment five
In parts by weight, at 86 parts of particle diameters is to add 2 parts of copper powders that particle diameter is 1 μ m in the Sn-8Zn-3Bi powdery tin spelter solder of 40 μ m, with 12 portions of high activity paste brazing fluxes above-mentioned powdery tin spelter solder and copper powder are mixed by churned mechanically method, mixing time is 30min, modulate the composite Sn-Zn brazing alloy that strengthens of paste copper powder.With this composite soldering cream put into refrigerator preserve standby, the soldered fitting that this composite soldering cream can be used for reflow welding and obtains high reliability.
Embodiment six
In parts by weight, at 85 parts of particle diameters is to add 5 parts of copper powders that particle diameter is 4 μ m in the Sn-8Zn-3Bi powdery tin spelter solder of 60 μ m, with 10 portions of high activity paste brazing fluxes above-mentioned powdery tin spelter solder and copper powder are mixed by churned mechanically method, mixing time is 30min, modulate the composite Sn-Zn brazing alloy that strengthens of paste copper powder.With this composite soldering cream put into refrigerator preserve standby, the soldered fitting that this composite soldering cream can be used for reflow welding and obtains high reliability.
Claims (5)
1, a kind of preparation method of composite Sn-Zn brazing alloy of copper powder enhancing, it is characterized in that, comprise the steps and process conditions: in parts by weight, 83～87.5 parts of powdery tin spelter solders, 0.5～5 part of copper powder and 10～15 portions of high activity paste brazing fluxes are mixed and stir, make the composite Sn-Zn brazing alloy that the paste copper powder strengthens.
2, the preparation method of the composite Sn-Zn brazing alloy of a kind of copper powder enhancing according to claim 1 is characterized in that by weight percentage, comprise 8～9% zinc, 0～3% bismuth in the described tin spelter solder, all the other are tin.
3, the preparation method of the composite Sn-Zn brazing alloy of a kind of copper powder enhancing according to claim 1 and 2 is characterized in that the particle diameter of described powdery tin spelter solder is 40～80 μ m.
4, the preparation method of the composite Sn-Zn brazing alloy of a kind of copper powder enhancing according to claim 1 is characterized in that the particle diameter of described copper powder is 1～10 μ m.
5, a kind of composite Sn-Zn brazing alloy of copper powder enhancing is prepared from by the described method of claim 1 exactly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610122722XA CN100488703C (en) | 2006-10-13 | 2006-10-13 | Copper powder reinforced composite Sn-Zn brazing alloy and its preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610122722XA CN100488703C (en) | 2006-10-13 | 2006-10-13 | Copper powder reinforced composite Sn-Zn brazing alloy and its preparation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1931509A CN1931509A (en) | 2007-03-21 |
| CN100488703C true CN100488703C (en) | 2009-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB200610122722XA Expired - Fee Related CN100488703C (en) | 2006-10-13 | 2006-10-13 | Copper powder reinforced composite Sn-Zn brazing alloy and its preparation process |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101323061B (en) * | 2008-07-16 | 2010-06-02 | 太仓市南仓金属材料有限公司 | Magnesium boride granule enhancement type tin-silver-zinc compound solder and manufacture method thereof |
| CN104625466B (en) * | 2015-01-21 | 2017-11-24 | 哈尔滨工业大学深圳研究生院 | A kind of tin solder/copper Particles dispersed solder that can quickly form high temperature solder joint at low temperature |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5718868A (en) * | 1995-11-30 | 1998-02-17 | Mitsui Mining & Smelting Co., Ltd. | Lead-free tin-zinc-based soldering alloy |
| CN1315895A (en) * | 1998-07-02 | 2001-10-03 | 松下电器产业株式会社 | Solder powder and method for preparing same and solder paste |
| US20020040624A1 (en) * | 2000-10-05 | 2002-04-11 | Sinzo Nakamura | Solder paste |
| JP2002248596A (en) * | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | Leadless solder ball excellent in oxidation resistance |
| US20040069974A1 (en) * | 2000-11-29 | 2004-04-15 | Toshihiko Taguchi | Solder pastes |
| CN1555960A (en) * | 2004-01-10 | 2004-12-22 | 大连理工大学 | Tin zinc copper leadless solder alloy |
| CN1562553A (en) * | 2004-03-25 | 2005-01-12 | 戴国水 | Tin-zinc-copper solder with no lead |
-
2006
- 2006-10-13 CN CNB200610122722XA patent/CN100488703C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5718868A (en) * | 1995-11-30 | 1998-02-17 | Mitsui Mining & Smelting Co., Ltd. | Lead-free tin-zinc-based soldering alloy |
| CN1315895A (en) * | 1998-07-02 | 2001-10-03 | 松下电器产业株式会社 | Solder powder and method for preparing same and solder paste |
| US20020040624A1 (en) * | 2000-10-05 | 2002-04-11 | Sinzo Nakamura | Solder paste |
| US20040069974A1 (en) * | 2000-11-29 | 2004-04-15 | Toshihiko Taguchi | Solder pastes |
| JP2002248596A (en) * | 2001-02-27 | 2002-09-03 | Toshiba Tungaloy Co Ltd | Leadless solder ball excellent in oxidation resistance |
| CN1555960A (en) * | 2004-01-10 | 2004-12-22 | 大连理工大学 | Tin zinc copper leadless solder alloy |
| CN1562553A (en) * | 2004-03-25 | 2005-01-12 | 戴国水 | Tin-zinc-copper solder with no lead |
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| CN1931509A (en) | 2007-03-21 |
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Assignee: Shenzhen Tongfang Electronic New Material Co., Ltd. Assignor: South China University of Technology Contract record no.: 2011440020484 Denomination of invention: Copper powder reinforced composite Sn-Zn brazing alloy and its prepn process Granted publication date: 20090520 License type: Exclusive License Open date: 20070321 Record date: 20111219 |
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Granted publication date: 20090520 Termination date: 20121013 |