TW200817126A - Electronic connecting materials for the Sn-Zn-Ag system lead-free solder alloys - Google Patents
Electronic connecting materials for the Sn-Zn-Ag system lead-free solder alloys Download PDFInfo
- Publication number
- TW200817126A TW200817126A TW95137617A TW95137617A TW200817126A TW 200817126 A TW200817126 A TW 200817126A TW 95137617 A TW95137617 A TW 95137617A TW 95137617 A TW95137617 A TW 95137617A TW 200817126 A TW200817126 A TW 200817126A
- Authority
- TW
- Taiwan
- Prior art keywords
- alloy
- weight
- bal
- wetting
- tin
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
200817126 九、發明說明: 【發明所屬之技術領域】 本發明係-種電子連接材料為無錯銲錫合金,有目Sn—Zn,系統之四元和五元無錯 銲錫合金。其熔點低於200X,而且接近鉛錫共晶合金之熔點183. 。 ^ 【先前技術】 典型的銲錫合金材料主要的成分是鉛-錫合金,鉛對人體有害,也會造成環境的污 • 染,因此研發無鉛銲錫材料是目前刻不容缓的事。錫-銀共晶合金其抗拉強度高於傳統 乱鍚σ金,但其熔點太南,約為22i°c,比錯-錫共晶合金之溶點(以3 5°C)高出甚多, 容易造成設備須更換及相關製程成本的提高,且在焊接工作中將因高溫易造成電子元件 的損壞。雖然許多專利文獻試圖以錫·銀共晶合金為主之三元、西元及五元合金系統中, 加入少量的其他合金成分,如Cu,Zn,Bi,也及邠,以降低錫銀共晶合金的熔點,但其熔 點有些依然兩於200°C。雖然加入大量的扭及in可降低合金的熔點,卻使得成本大幅提 高,例如·· Sn-Ag-Cu,USP 5,527,629 (1996); Sn-Ag-Zn-Bi,USP 5,993,736 (1999);200817126 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to an electronic connection material which is a non-error solder alloy, a S-Zn, a quaternary and a five-element error-free solder alloy. Its melting point is lower than 200X, and is close to the melting point of lead-tin eutectic alloy 183. ^ [Prior Art] The main component of typical solder alloy materials is lead-tin alloy. Lead is harmful to the human body and can cause environmental pollution. Therefore, it is urgent to develop lead-free solder materials. The tensile strength of tin-silver eutectic alloy is higher than that of traditional 钖σ gold, but its melting point is too south, about 22i °c, and the melting point of the wrong-tin eutectic alloy (at 35 °C) is higher. Many, it is easy to cause the equipment to be replaced and the related process cost is increased, and the electronic components will be damaged due to high temperature during the welding work. Although many patent documents attempt to use tin-silver eutectic alloys as the main ternary, ternary and pentad alloy systems, a small amount of other alloying constituents such as Cu, Zn, Bi, and yttrium are added to reduce tin-silver eutectic. The melting point of the alloy, but some of its melting point is still at 200 ° C. Although the addition of a large number of twists and ins can lower the melting point of the alloy, the cost is greatly increased, for example, Sn-Ag-Cu, USP 5,527,629 (1996); Sn-Ag-Zn-Bi, USP 5,993,736 (1999);
Sn-Ag-Bi-In, USP 5,958,333 (1999), USP 5,843,371 (1998), USP 5,658,528(1997);Sn-Ag-Bi-In, USP 5,958,333 (1999), USP 5,843,371 (1998), USP 5,658,528 (1997);
Sn-Ag-Bi-Cu-In,USP 5,918,795 (1999); Sn-Ag-In-Bi-Sb,USP 5,733,501 (1998); _ Sn-AgHBi’USP5;?62,866^8)。因此,本發明將以錫鋅銀基合金為主,添加、銘、 鉍或銦等元素,以銲接首要的潤濕性質與成本為發明考量,以適當的重量百分比,得本 發明之Sn-Zn-Ag-Bi和S〜Zn-Ag-In之四元無鉛銲錫合金以及Sn-Zn-Ag4Bi和 Sn-Zn-Ag-A14n之五元無鉛銲錫合金。 【發明内容】 本發明的一目的是提供一稱無鉛的鍚-鋅基銲錫合金,其具有取代傳統的鉛·錫共晶 合金且有較佳的潤濕性質,如職時間及難力;成本低;而且低於細T的溶點,甚 至低於鉛-錫共晶合金之熔點(183 5。〇,而不會對冗構裝元件造成損壞。 本發明的另一目的是提供一無鉛的錫_鋅基銲錫合金,其具有高的潤濕能力。為了 200817126 達成上述的本發明目的,本發明内容所完成的一種無鉛銲錫合金,成份包含下列組成 -、740 wt%Zn (鋅)’ (M.〇w%Ag (銀),认8 wt%Bi ⑻,其餘細(锡)。 二、 7-10wt%Zii (鋅),㈣ wt%Ag (銀),〇·5·_%Ιη (銦),其餘為如(锡)。 三、 740wt%Zn (鋅),(M wt% Ag (銀),0-0.3 wt% A1 (銘),5_22 Bi (叙), 其餘組成為Sn (锡)。 四、 7-10 wt%Ζϋ (鋅),(M.O wt% Ag (銀),0-0.3 wt% A1 (銘),〇-8 以% In (铜), 其餘為Sn (錫)。 - 我們發現加入Bi和1元素不僅降低Sn-Zn-Ag及Sn-Zn-Ag-Al合金之熔點,同時可改善 合金的潤濕性質。Βί在Sn的固溶度為4_5wt%(5(TC),超出固溶度限以外的Bi,主要析出 _ 於如基地中形成胸ch。而_Sn基地中形成InSn化合物,Ag和办形成AgZn3AAg5Zns 之化合物。 目前的發明是提供一無鉛的錫鋅銀基銲錫合金,在熔點溫度方面,與錫鋅共晶、錫 鋅共晶等合金比較,更接近於鉛鍚共晶合金(183 5T),如表丨和表2所示。其中以8〜8 % M%Zn-0.5威Ag-xAM0wt%Bi(x = 0、〇.〇卜_和aiwt%),最接近錯錫共晶合金熔 點,隨著鉍(Bi)的含量增加,其合金的熔點溫度越低;反之,其合金的熔點溫度越高。 另外 ’ Sn-8.55 wt% Zn-0.5 wt% Ag-xAI-7.5 wt% In (X = 〇、〇.(Η、〇·〇5和〇.1游0),最接近 錯錫共晶合金熔點,隨著銦(In)的含量減少,其合金的熔點溫度越高。 在潤濕力和潤濕時間方面,本發明以潤濕天平伽量結果如圖1-圖4所示。Sn-8.55 響 Zn-0.5禮〇 Ag-7.5wt% Bi、Sn-8.55wt% Ζη-0·5德 Ag-OJ痛 A1 德Sn-Ag-Bi-Cu-In, USP 5,918,795 (1999); Sn-Ag-In-Bi-Sb, USP 5,733,501 (1998); _Sn-AgHBi'USP5;?62,866^8). Therefore, the present invention will be based on tin-zinc-silver-based alloys, adding elements such as ing, yttrium or indium, taking the primary wetting properties and cost of welding as considerations, and obtaining the Sn-Zn of the present invention at an appropriate weight percentage. a quaternary lead-free solder alloy of Ag-Bi and S~Zn-Ag-In and a five-element lead-free solder alloy of Sn-Zn-Ag4Bi and Sn-Zn-Ag-A14n. SUMMARY OF THE INVENTION An object of the present invention is to provide a lead-free bismuth-zinc-based solder alloy which has the advantages of replacing the conventional lead-tin eutectic alloy and having better wetting properties, such as time and difficulty; Low; and lower than the melting point of fine T, even lower than the melting point of lead-tin eutectic alloy (183 5 〇, without causing damage to redundant components. Another object of the present invention is to provide a lead-free Tin-zinc-based solder alloy having high wetting ability. For the purpose of the present invention as set forth in 200817126, the present invention provides a lead-free solder alloy comprising the following composition - 740 wt% Zn (zinc)' ( M.〇w%Ag (silver), 8 wt% Bi (8), the rest fine (tin). 2, 7-10 wt% Zii (zinc), (iv) wt% Ag (silver), 〇·5·_%Ιη ( Indium), the rest is as (tin). Third, 740wt% Zn (zinc), (M wt% Ag (silver), 0-0.3 wt% A1 (Ming), 5_22 Bi (Sui), the rest of the composition is Sn (tin) 4, 7-10 wt% 锌 (zinc), (MO wt% Ag (silver), 0-0.3 wt% A1 (inscription), 〇-8 in % In (copper), the rest in Sn (tin). - we discover The addition of Bi and 1 elements not only reduces the melting point of Sn-Zn-Ag and Sn-Zn-Ag-Al alloys, but also improves the wetting properties of the alloy. The solid solubility of Sn in the Sn is 4_5wt% (5(TC), exceeding Bi other than the solid solubility limit, mainly precipitates - forms a chest ch in the base, and forms an InSn compound, Ag and a compound forming AgZn3AAg5Zns in the _Sn base. The present invention provides a lead-free tin-zinc-silver-based solder alloy. In terms of melting point temperature, compared with alloys such as tin-zinc eutectic and tin-zinc eutectic, it is closer to lead-bismuth eutectic alloy (183 5T), as shown in Table 丨 and Table 2. Among them, 8~8 % M% Zn-0.5 wei Ag-xAM0wt% Bi (x = 0, 〇. 〇 _ and aiwt%), which is closest to the melting point of the stigmatized eutectic alloy. As the content of bismuth (Bi) increases, the melting temperature of the alloy is lower. On the contrary, the higher the melting point temperature of the alloy. In addition, 'Sn-8.55 wt% Zn-0.5 wt% Ag-xAI-7.5 wt% In (X = 〇, 〇. (Η, 〇·〇5 and 〇.1 swim 0), closest to the melting point of the staggered eutectic alloy, as the content of indium (In) decreases, the melting point temperature of the alloy is higher. In terms of wetting force and wetting time, the present invention uses the wetting balance gamma results as 1 to FIG. 4 .Sn-8.55 Li ring shown Zn-0.5 billion Ag-7.5wt% Bi, Sn-8.55wt% Ζη-0 · 5 Ag-OJ de pain de A1
Sn-8.55wt% Zn-0.5鳩 Ag捕-7·5邊 In (X = 〇、〇·〇卜 〇·〇5 和 〇 lwt騎 質-濶濕時間和潤濕力均可與鉛錫共晶合金的濁濕性質相比擬。 此發明_鋅銀基賴合金沒有含錄的鉛,不會造成環境赌染,而且其溶點低 於200 C ’甚至比錯錫共晶合金之熔點還低,可解決锡銀共晶、锡銅共晶和锡銀銅系無 鉛銲錫合金的溫度過高的問題,在電子構裝過程中不會對κ電子元件造成損壞。同時, 亦可解決鍚銦共晶和錫絲共晶系無鉛銲錫合金的溫度過低,電子產品不適合用於工作較 /皿度的環i兄。以成本考量,本發明降低叙㈣和銦⑽的含量在接近美國 C咖fOT Ma_cturing Sciences)所建議的條件,鉍㈣的含量應低於观,銦⑽的含量 6 200817126 應低於l·5% ’遠低於錫銦共晶和錫鉍共晶系合金所含的鉍卜58%和銦⑽〜52%的含 主要是要降低合金的 電子封裝之銲接特性。 量。本發明的錫鋅銀基銲鍚合金中,添加银(Bi)和銦(坤元素, 熔點溫度(Bi的熔點為271.3T與to的熔點為156|6。〇,進一步改善 200817126 表1·Sn-8.55wt% Zn-0.5鸠Ag catches -7·5 sides In (X = 〇, 〇·〇卜〇·〇5 and 〇lwt riding quality - 濶 wet time and wetting force can be eutectic with lead tin The turbidity and wettability of the alloy is comparable. The invention _ zinc-silver-based alloy does not contain the recorded lead, does not cause environmental gambling, and its melting point is lower than 200 C ' even lower than the melting point of the staggered tin eutectic alloy, It can solve the problem of excessive temperature of tin-silver eutectic, tin-copper eutectic and tin-silver-copper lead-free solder alloy, and will not damage κ electronic components during electronic assembly. At the same time, it can also solve yttrium indium eutectic. The temperature of the tin-free eutectic lead-free solder alloy is too low, and the electronic product is not suitable for the work of the cabinet. In terms of cost, the present invention reduces the content of the (four) and indium (10) in the US C coffee. The conditions recommended by Sciences), the content of bismuth (four) should be lower than that of view, the content of indium (10) 6 200817126 should be lower than l·5% 'far less than the inclusion of tin indium eutectic and tin-bismuth eutectic alloy 58 The inclusion of % and indium (10) to 52% is mainly to reduce the soldering characteristics of the electronic package of the alloy. the amount. In the tin-zinc-silver-based solder 钖 alloy of the present invention, silver (Bi) and indium are added (Kun element, melting point temperature (the melting point of Bi is 271.3T and the melting point of to is 156|6. 〇, further improvement 200817126 Table 1·
合金成分(wt%) Sn Zn Ag A1 Bi 固相線溫度 (°C) 液相線溫度 (。〇 Bal. 8.55 0.5 一一 198.3 199.8 BaL 8.55 0.5 0.01 ---- 198.51 199.37 Bal 8.55 0.5 0.05 ---- 198.49 199.39 Bal 8.55 0.5 0.1 一一 198.51 201.97 Bal 8.55 0.5 -一 7.5 184.46 190.76 Bal 8.55 0.5 — 10 181.4 188.3 Bal. 8.55 0.5 一一 15 176 184.6 Bal. 8.55 0.5 — 20 165.5 178.5 Bal. 8.55 0.5 0.01 7.5 187.3 191.9 Bal. 8.55 ;0.5 0.01 10 181.8 189.1 Bal. 8.55 0.5 0.01 15 173.7 184.5 Bal. 8.55 0.5 0.01 20 165.7 178.2 Bal. 8.55 0.5 0.05 7.5 186.5 191.6 Bal 8.55 0.5 005 10 181.9 189 Bal. 8.55 0.5 0.05 15 173.8 184.3 BaL 8.55 0.5 0.05 20 165.6 178.4 Bal. 8.55 0.5 0.1 7.5 186.6 191.2 Bal 8.55 0:5 0.1 10 182 188.8 Bal 8.55 0,5 0.1 15 173.8 183.7 Bal. 8.55 0.5 0.1 20 165.4 178.2 Bal. 9 一一- — •~_ 198.4 200.8 63Sn_37Pb 183.50 185.42 200817126 表2·Alloy composition (wt%) Sn Zn Ag A1 Bi Solidus temperature (°C) Liquidus temperature (.〇Bal. 8.55 0.5 One 198.3 199.8 BaL 8.55 0.5 0.01 ---- 198.51 199.37 Bal 8.55 0.5 0.05 -- -- 198.49 199.39 Bal 8.55 0.5 0.1 one 198.51 201.97 Bal 8.55 0.5 - one 7.5 184.46 190.76 Bal 8.55 0.5 — 10 181.4 188.3 Bal. 8.55 0.5 One 15 176 184.6 Bal. 8.55 0.5 — 20 165.5 178.5 Bal. 8.55 0.5 0.01 7.5 187.3 191.9 Bal. 8.55 ;0.5 0.01 10 181.8 189.1 Bal. 8.55 0.5 0.01 15 173.7 184.5 Bal. 8.55 0.5 0.01 20 165.7 178.2 Bal. 8.55 0.5 0.05 7.5 186.5 191.6 Bal 8.55 0.5 005 10 181.9 189 Bal. 8.55 0.5 0.05 15 173.8 184.3 BaL 8.55 0.5 0.05 20 165.6 178.4 Bal. 8.55 0.5 0.1 7.5 186.6 191.2 Bal 8.55 0:5 0.1 10 182 188.8 Bal 8.55 0,5 0.1 15 173.8 183.7 Bal. 8.55 0.5 0.1 20 165.4 178.2 Bal. 9 One--- •~ _ 198.4 200.8 63Sn_37Pb 183.50 185.42 200817126 Table 2·
合金成份(wt%) Sn Zn Ag A1 In 固相線溫度 (°C) 液相線溫度 (。〇 Bal. 8.55 0.5 — 198.3 199.8 Bal. 8.55 0.5 0.01 —- 198.51 199.37 Bal. 8.55 0.5 0.05 ---- 198.49 19939 Bal. 8.55 0.5 0.1 ~-一 198.51 201.97 Bal. 8.55 0.5 —— 1 191.9 200.1 Bal· 8.55 0.5 3 192.3 197.1 Bal. 8.55 0.5 一一 5 187.3 191.4 BaL 8.55 0.5 一一 7.5 182.3 188.3 Bal. 8.55 0.5 0.01 1 191.9 197.1 BaL 8.55 0.5 0.01 3 192.3 194.4 Bal. 8.55 0.5 0.01 5 190 191.6 Bal. 8.55 0.5 0.01 7.5 185.5 188.5 Bal. 8.55 0.5 0.05 1 195.2 197.4 Bal. 8.55 0.5 0.05 3 192.2 194.3 Bal. 8.55 0.5 0.05 5 189.5 191.6 Bal. 8.55 0.5 0.05 7.5 185.5 188.6 Bal. 8.55 0.5 0.1 1 195.1 1973 Bal 8.55 0.5 0.1 3 191.4 194 Bal. 8.55 0.5 0.1 5 189.2 191.6 Bal· 8.55 0.5 0.1 7.5 184.7 188.3 BaL 9 一— ---- 一. 198.4 200.8 63Sn-37Pb 183.50 185.42 9 200817126 【實施方式】 對照例Alloy composition (wt%) Sn Zn Ag A1 In Solidus temperature (°C) Liquidus temperature (.〇Bal. 8.55 0.5 — 198.3 199.8 Bal. 8.55 0.5 0.01 —- 198.51 199.37 Bal. 8.55 0.5 0.05 --- - 198.49 19939 Bal. 8.55 0.5 0.1 ~- a 198.51 201.97 Bal. 8.55 0.5 —— 1 191.9 200.1 Bal· 8.55 0.5 3 192.3 197.1 Bal. 8.55 0.5 One to five 187.3 191.4 BaL 8.55 0.5 One 7.5 182.3 188.3 Bal. 8.55 0.5 0.01 1 191.9 197.1 BaL 8.55 0.5 0.01 3 192.3 194.4 Bal. 8.55 0.5 0.01 5 190 191.6 Bal. 8.55 0.5 0.01 7.5 185.5 188.5 Bal. 8.55 0.5 0.05 1 195.2 197.4 Bal. 8.55 0.5 0.05 3 192.2 194.3 Bal. 8.55 0.5 0.05 5 189.5 191.6 Bal. 8.55 0.5 0.05 7.5 185.5 188.6 Bal. 8.55 0.5 0.1 1 195.1 1973 Bal 8.55 0.5 0.1 3 191.4 194 Bal. 8.55 0.5 0.1 5 189.2 191.6 Bal· 8.55 0.5 0.1 7.5 184.7 188.3 BaL 9 I— ---- I. 198.4 200.8 63Sn-37Pb 183.50 185.42 9 200817126 [Embodiment] Comparative example
Sn-Zn共晶合金的準備是使用純度99.99%的Sn和Zn純金屬材料,以鍚鋅共晶的重量 百分比比例混合,放入高溫加熱爐中,加熱至700 °C,持溫3小時後使材料成份均句化, 而化合成Sn-9 wt%Zn共晶合金。再取Sn-9wt%Zn共晶合金,重量為i〇mg,利用熱差分The Sn-Zn eutectic alloy is prepared by mixing a pure metal material of Sn and Zn with a purity of 99.99%, mixing in a weight percentage of bismuth zinc eutectic, placing it in a high temperature heating furnace, heating to 700 ° C, and holding the temperature for 3 hours. The material composition is homogenized, and the Sn-9 wt% Zn eutectic alloy is synthesized. Then take Sn-9wt% Zn eutectic alloy, the weight is i〇mg, using thermal difference
析儀(Differential Scanning Calorimeter ; DSC)來測得Sn-Zn共晶合金之固相點為 1984 °C 和液相點為200.8 °C。 以直徑為1mm的銅線為基材,純度為99.9%,在潤濕實驗前先浸入7〇〇c^5wt%氮 氧化鈉(NaOH)鹼液中,保持五分鐘去除油脂後,即以去離子水清洗。再將其放入1〇城0/〇 的硝酸(HN〇3)溶液中,持續5秒鐘除去氧化物後,即以去離子水清洗乾淨。最後再以純 度為98%的酒精清洗五秒鐘後乾燥。經過上述的前處理後,將把鋼線基材分別置入助熔 劑内三十秒後,再以60T烘乾20秒後,做潤濕平衡的實驗,浸鍍於25(rc Sn_Zn共晶合 金溶液。得知Sn-Zn共晶合金與銅線基材間的潤濕性質,最大潤濕力為〇41mN和潤濕時 間為1.33秒。 實施例1Differential Scanning Calorimeter (DSC) was used to measure the solid phase of the Sn-Zn eutectic alloy at 1984 °C and the liquidus point at 200.8 °C. The copper wire with a diameter of 1mm was used as the substrate, and the purity was 99.9%. It was immersed in 7〇〇c^5wt% sodium oxynitride (NaOH) lye before the wetting experiment, and after removing the grease for five minutes, it went Ion water cleaning. Then, it was placed in a nitric acid (HN〇3) solution of 1 〇City 0/〇, and after removing the oxide for 5 seconds, it was washed with deionized water. Finally, it was washed with 98% pure alcohol for five seconds and then dried. After the above pretreatment, the steel wire substrate is placed in the flux for 30 seconds, and then dried at 60T for 20 seconds, and then wet balance test, immersion plating on 25 (rc Sn_Zn eutectic alloy) Solution: The wetting property between the Sn-Zn eutectic alloy and the copper wire substrate was found, the maximum wetting force was 〇41 mN and the wetting time was 1.33 seconds.
Sn-8.55%Zn-0.5%Ag-7.5%Bi合金之準備及測試方法與對照例相同。由潤濕平衡結果 得知,其平均最大潤濕力分別為〇94mN。平均潤濕時間分別為〇64秒。較Sn_9Zn共晶銲 錫合金的潤濕力(〜0·41ιηΝ)大約二倍,其潤濕時間(〜1.32秒)優越。且較接近於63Sn_37Pb 的潤濕力(U66Nm)以及潤濕時間(0.47秒)。 實施例2The preparation and test methods of the Sn-8.55% Zn-0.5% Ag-7.5% Bi alloy were the same as those of the comparative example. From the wetting balance results, the average maximum wetting force was 〇94 mN. The average wetting time was 〇64 seconds. Compared with the Sn_9Zn eutectic solder, the wetting force (~0·41ιηΝ) of the tin alloy is about twice, and the wetting time (~1.32 seconds) is superior. It is closer to the wetting force (U66Nm) of 63Sn_37Pb and the wetting time (0.47 seconds). Example 2
Sn_8i55%Zn-0,5%Ag-0.1%AM0%Bi合金之準備及測試方法與對照例相同。由潤濕平 衡結果得知,其平均最大潤濕力為〗14 ,較接近於63Sn-37Pb (1.166 Nm)。其平均 潤濕時間為0·59秒,較接近於63Sn-37Pb (0.47秒)。在平均最大潤濕力及平均潤濕時間 的表現皆較Sn-9Zti共晶銲錫合金優異。Sn_8.55%Zn-0.5%Ag-0.1%Al- 10%Bi合金之溶點 (固相線為182°C ’液相線為188.8°C),接近於63 Sn-37 Pb合金之熔點(固相線為i83.5°C, 液相線為185·4°〇。同時,較低於Sn-9Zn共晶銲錫合金之溶點(固相線為198.4°C,液相 線為200.8°C)。 200817126 實施例3The preparation and test methods of Sn_8i55%Zn-0, 5%Ag-0.1%AM0%Bi alloy were the same as those of the comparative example. According to the wetting balance, the average maximum wetting force is 14 and closer to 63Sn-37Pb (1.166 Nm). The average wetting time is 0.59 seconds, which is closer to 63Sn-37Pb (0.47 seconds). The average maximum wetting force and average wetting time are superior to those of the Sn-9Zti eutectic solder alloy. The melting point of Sn_8.55%Zn-0.5%Ag-0.1%Al-10%Bi alloy (solid phase line is 182 °C 'liquidus line is 188.8 °C), close to the melting point of 63 Sn-37 Pb alloy The solidus line is i83.5 ° C, the liquidus is 185·4 ° 〇. At the same time, it is lower than the melting point of Sn-9Zn eutectic solder alloy (solid phase line is 198.4 ° C, liquidus is 200.8 °) C). 200817126 Example 3
Sn-8.55%Zn-0.5%Ag-7.5%In合金之準備及測試方法與對照例相同。由潤濕平衡結果 得知,其平均最大潤濕力為0.94mN,平均潤濕時間為〇·54秒。接近於63Sn-37Pb最大潤 濕力(U66Nm)以及潤濕時間(0.47秒)。合金之熔點(固相線為18Z3°C,液相線為 188.3〇C),接近於63 Sn-37Pb合金之熔點(固相線為183.5〇C,液相線為185.40C) 〇 實施例4The preparation and test methods of the Sn-8.55% Zn-0.5% Ag-7.5% In alloy were the same as those of the comparative example. From the results of the wetting balance, the average maximum wetting force was 0.94 mN, and the average wetting time was 〇·54 seconds. It is close to 63Sn-37Pb maximum wettability (U66Nm) and wetting time (0.47 seconds). The melting point of the alloy (solid phase line is 18Z3 ° C, liquidus is 188.3 〇C), close to the melting point of 63 Sn-37Pb alloy (solid phase line is 183.5 〇C, liquidus is 185.40 C) 实施 Example 4
Sn-&55%Zn-0.5%Ag-0.01%Al-7.5%In合金之準備及測試方法與對照例相同。由潤濕 平衡結果得知’其平均最大潤濕力分別為1 17 mN,平均潤濕時間為0.55秒。接近於 63Sn-37Pb最大潤濕力以及潤濕時間。合金之熔點(固相線為185 ,液相線為188.5。〇, 接近於63 Sn-37Pb合金之固相線及液相線。 實施例5The preparation and test methods of Sn-&55%Zn-0.5%Ag-0.01%Al-7.5%In alloy were the same as those of the comparative example. From the results of the wetting equilibrium, the average maximum wetting force was 1 17 mN and the average wetting time was 0.55 seconds. Close to 63Sn-37Pb maximum wetting force and wetting time. The melting point of the alloy (solid phase line is 185, liquidus is 188.5. 〇, close to the solidus and liquidus of the 63 Sn-37Pb alloy. Example 5
Sn_8j5%Zn_a5%Ag-0.05%Al-T5%In合金之準備及測試方法與對照例相同。由潤濕 平衡結果得知,其平均最大潤濕力為1.345 mN,平均潤濕時間為〇.55秒。接近於 63Sn-37Pb最大潤濕力以及潤濕時間。合金之熔點(固相線為185 5。€,液相線為188 6 °C),接近於63 Sn-37Pb合金之固相線及液相線。 實施例6 。8’55/°Zn 〇 5/eAg-01%AiJ7‘5%In合金之準備及測試方法與對照例相同。由潤濕 φ 平衡…果知知’其平均最大潤濕力為U6mN,平均潤濕時間為0,58秒。接近於6施-3刑 最大潤濕力以及濶濕時間。合金之熔點_線為184r>c,液相線為膨。c),接近於 63 Sn-37Pb合金之固相線及液相線。 11 200817126 【圖式簡單說明】 圖1為本發明的Sn{55ZiM).5Ag-xAl-yBi銲錫合金及63Sn-37Pb銲鍚合金的潤濕力關係 圖。其中正方形()為〇重量%…,圓形(*)為0·01重量%A1,菱形(♦)為〇〇5重 4%A1 ’及三角形(▲)為0.1重量%A1。 圖2為本發明的sn-8.55Zn-0.5Ag-xAl-yBi銲錫合金及63Sn-37Pb銲錫合金的潤濕時間關 係圖。其中正方形()為〇重量%…,圓形(修)為0.01重量%A1,菱形(令)為〇()5 重量%A1,及三角形(▲)為0.1重量%A1。The preparation and test methods of Sn_8j5%Zn_a5%Ag-0.05%Al-T5%In alloy were the same as those of the comparative example. From the wetting equilibrium results, the average maximum wetting force was 1.345 mN and the average wetting time was 〇.55 seconds. Close to 63Sn-37Pb maximum wetting force and wetting time. The melting point of the alloy (solid phase line is 185 5 €, liquidus line is 188 6 ° C), which is close to the solidus and liquidus of the 63 Sn-37Pb alloy. Example 6. The preparation and test methods of 8'55/°Zn 〇 5/eAg-01%AiJ7 '5%In alloy were the same as those of the comparative example. By wetting φ balance... it is known that its average maximum wetting force is U6mN and the average wetting time is 0,58 seconds. Close to 6 Shi-3 punishment Maximum wetting force and dampness time. The melting point of the alloy _ line is 184r>c, and the liquidus is expanded. c), close to the solidus and liquidus of the 63 Sn-37Pb alloy. 11 200817126 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a graph showing the wetting force relationship of a Sn{55ZiM).5Ag-xAl-yBi solder alloy and a 63Sn-37Pb solder alloy of the present invention. Wherein square () is 〇 weight %..., circle (*) is 0. 01% by weight A1, diamond (♦) is 〇〇5 weight 4% A1 ' and triangle (▲) is 0.1% by weight A1. Fig. 2 is a graph showing the wetting time of the sn-8.55Zn-0.5Ag-xAl-yBi solder alloy and the 63Sn-37Pb solder alloy of the present invention. Wherein square () is 〇% by weight, round (repair) is 0.01% by weight of A1, diamond is 〇() 5% by weight of A1, and triangle (?) is 0.1% by weight of A1.
圖3為本發明的8η-8·55Ζη·0·5Α§-χΑΐ5ΐη銲錫合金及63Sn-37Pb銲錫合金的潤濕力關係 圖。其中正方形()為〇重量%^1,圓形(♦)為0.01重量%A1,菱形(♦)為〇05重 量%A1,及三角形(▲)為0.1重量%A1。 圖4為本發明的sn-g.55Zn-0.5Ag-xAl-yIn銲鍚合金及63Sn-37Pb銲鍚合金的潤濕力關係 圖。其中正方形()為0重量%A1,圓形(_)為0.01重量%A卜菱形(命)為〇〇5重 i%Al,及三角形(▲)為〇·1重量%A1。 12Fig. 3 is a graph showing the wetting force relationship of the 8η-8·55Ζη·0·5Α§-χΑΐ5ΐη solder alloy and the 63Sn-37Pb solder alloy of the present invention. Wherein square () is 〇 weight %^1, circle (♦) is 0.01% by weight of A1, diamond (♦) is 〇05 by weight% A1, and triangle (▲) is 0.1% by weight of A1. Fig. 4 is a graph showing the wetting force of the Sn-g.55Zn-0.5Ag-xAl-yIn soldered aluminum alloy and the 63Sn-37Pb soldered aluminum alloy according to the present invention. Wherein square () is 0% by weight of A1, round (_) is 0.01% by weight, A diamond is 〇〇5 weight, i% Al, and triangle (▲) is 〇·1% by weight A1. 12
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95137617A TWI301781B (en) | 2006-10-13 | 2006-10-13 | Electronic connecting materials for the sn-zn-ag system lead-free solder alloys |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95137617A TWI301781B (en) | 2006-10-13 | 2006-10-13 | Electronic connecting materials for the sn-zn-ag system lead-free solder alloys |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200817126A true TW200817126A (en) | 2008-04-16 |
TWI301781B TWI301781B (en) | 2008-10-11 |
Family
ID=44769276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95137617A TWI301781B (en) | 2006-10-13 | 2006-10-13 | Electronic connecting materials for the sn-zn-ag system lead-free solder alloys |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI301781B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112404791A (en) * | 2020-11-18 | 2021-02-26 | 昆明理工大学 | Tin-zinc series lead-free solder alloy and preparation method thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014024271A1 (en) * | 2012-08-08 | 2014-02-13 | 千住金属工業株式会社 | High-temperature lead-free solder alloy |
TWI460046B (en) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
-
2006
- 2006-10-13 TW TW95137617A patent/TWI301781B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112404791A (en) * | 2020-11-18 | 2021-02-26 | 昆明理工大学 | Tin-zinc series lead-free solder alloy and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI301781B (en) | 2008-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI383052B (en) | Low silver solder alloy and solder paste composition | |
JP6730999B2 (en) | Highly reliable lead-free solder alloy for electronic applications in harsh environments | |
JP5943065B2 (en) | Bonding method, electronic device manufacturing method, and electronic component | |
JP2009506203A (en) | Solder alloy | |
CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
CN1861311A (en) | Lead-free antioxidant rare earth-containing SnZn alloy solder and preparation method thereof | |
WO2014084242A1 (en) | Low melting point brazing material | |
JP4554713B2 (en) | Lead-free solder alloy, fatigue-resistant solder joint material including the solder alloy, and joined body using the joint material | |
CN102085604A (en) | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder | |
JP6247819B2 (en) | Aluminum solder and solder joints | |
JP4282482B2 (en) | Solder alloys and solder joints | |
JP2012125783A (en) | Lead-free solder alloy | |
TW200817126A (en) | Electronic connecting materials for the Sn-Zn-Ag system lead-free solder alloys | |
JP3386009B2 (en) | Solder alloy | |
GB2431412A (en) | Lead-free solder alloy | |
JP4076182B2 (en) | Lead-free solder alloy | |
JP6165294B2 (en) | Aluminum solder and solder joints | |
JP2001287082A (en) | Solder | |
TW200821391A (en) | Electronic connecting materials for the Sn-Zn system lead-free solder alloys | |
JP5080946B2 (en) | Lead-free solder alloy for manual soldering | |
TWI821211B (en) | Cost-effective lead-free solder alloy for electronic applications | |
JP2004330260A (en) | LEAD-FREE SnAgCu SOLDER ALLOY | |
WO2014142153A1 (en) | Solder alloy and joint thereof | |
CN103753047B (en) | Lead-free solder | |
JP6389553B2 (en) | Aluminum solder and solder joints |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |