CN113798725B - Solder-free lead-free solder for selective wave soldering and preparation method thereof - Google Patents
Solder-free lead-free solder for selective wave soldering and preparation method thereof Download PDFInfo
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- CN113798725B CN113798725B CN202111191116.4A CN202111191116A CN113798725B CN 113798725 B CN113798725 B CN 113798725B CN 202111191116 A CN202111191116 A CN 202111191116A CN 113798725 B CN113798725 B CN 113798725B
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- intermetallic compound
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The solder-free lead-free solder for selective wave soldering comprises the following components in percentage by mass: 89.0% -94.0% of electrolytic tin; 1.5-3.0% of indium-copper intermetallic compound; 2.0-3.8% of zinc-copper intermetallic compound; 2.5 to 4.2 percent of antimony-copper intermetallic compound; the purity of the electrolytic tin is 99.95%, and the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound are all compound particles with the particle size of 5-10 mm. The soldering flux-free lead-free solder for selective wave soldering is suitable for various selective wave soldering processes, can meet requirements of copper-based weldments and weldments with multiple alloy components such as nickel plating, silver plating, gold plating and the like, and has the advantages of working temperature of 265-285 ℃, wide process window and strong applicability.
Description
Technical Field
The invention relates to a lead-free solder used in the technical field of electronic welding production, in particular to a solderless lead-free solder for selective wave soldering and a preparation method thereof.
Background
The lead-free solder is used as a main welding material for assembly in the electronic welding industry, the welding quality and reliability are firstly ensured, and the quality of the lead-free solder directly influences the service life of an assembled product.
At present, in the electronic industry at home and abroad, aiming at partial precise electronic welding process, the PCBA as a whole does not need to be completely welded, only individual devices need to be welded, a selective wave soldering process can be used, the traditional selective wave soldering process can be completed only by assisting certain soldering flux, and the soldering flux coating mode comprises a foaming mode, a spraying mode and the like. The main components of the soldering flux are rosin-based soldering flux and various organic acid activators. Because of the existence of the organic acid activator, the activator is not easy to completely decompose in the high-speed welding process and remains on the surface of the weldment together with the rosin, and the active ingredients in the residue are easy to chemically react with the weldment or the welding spot when meeting a high-temperature or humid environment, so that the welding spot is continuously corroded, and the service life of the product is influenced.
Disclosure of Invention
In order to overcome the defects, the invention provides the solder-free lead-free solder for selective wave soldering and the preparation method thereof, which can effectively prolong the service life and reliability of a welding point or a weldment while ensuring the soldering effect.
The technical scheme adopted by the invention for solving the technical problem is as follows:
the solder-free lead-free solder for selective wave soldering comprises the following components in percentage by mass:
the purity of the electrolytic tin is 99.95%, the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound are all compound particles, and the particle size is 5-10 mm.
As a further improvement of the invention, the indium-copper intermetallic compound comprises at least Cu 9 In 4 、CuIn 2 And CuIn 3 The zinc-copper intermetallic compound at least comprises Cu 5 Zn 8 And CuZn, the antimony copper intermetallic compound at least comprises Cu 4 Sb and Cu 2 Sb。
The invention also provides a preparation method of the solder-free lead-free solder for selective wave soldering, which comprises the following steps:
step 1, weighing electrolytic tin according to a mass ratio, putting the electrolytic tin into an intermediate frequency heating furnace, keeping the temperature of 360-380 ℃, and continuously stirring for 1.5-2.5 hours;
step 2, maintaining the stirring process in the step 1, weighing the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound according to the mass ratio, adding the weighed materials into the high-temperature tin liquid in the step 1, and maintaining stirring for about 1.5 hours;
step 3, casting the section to be extruded obtained in the step 2, and cooling for later use;
step 4, putting the extrusion section obtained in the step 3 into an extruder for continuous extrusion, extruding into a strip-shaped object with the width of 1.5 cm and the thickness of about 0.6 cm, and cutting off the strip-shaped object to the length of 27-30 cm; thus obtaining the finished product of the lead-free solder without the soldering flux for selective wave soldering.
The invention has the beneficial effects that: the invention adopts the fusion of the indium copper intermetallic compound, the zinc copper intermetallic compound and the antimony copper intermetallic compound with the electrolytic tin, thereby ensuring that the solder can be self-wetted in the welding process and can form an intermetallic compound layer (namely an IMC layer and a soldered joint) with the soldered alloy in a very short time; the traditional soldering process utilizes the function of the soldering flux, under the condition of continuous high-temperature soldering, the formation of intermetallic compounds is also promoted, and the main components of the formed intermetallic compounds are just indium-copper intermetallic compounds, zinc-copper intermetallic compounds and antimony-copper intermetallic compounds. The invention can obviously reduce the welding temperature and reduce the thermal shock of the welding high temperature to the components; meanwhile, after welding, the soldered joint has no residues, and the reliability of the soldered joint is effectively improved. The antimony and silver elements added in the invention can effectively improve the heat conductivity and the electric conductivity of the solder and reduce the self-energy consumption of the product. In a word, the formula and the process are simple, and the service life and the reliability of the lead-free solder after selective wave soldering are improved.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following examples.
Example 1:
a solder-free lead-free solder for selective wave soldering comprises the following components in percentage by mass:
wherein the purity of the electrolytic tin is 99.95 percent, and the indium copper intermetallic compound, the zinc copper intermetallic compound and the antimony copper intermetallic compound are compound granules with the granularity of 8 mm; the compound between indium and copper includes at least Cu 9 In 4 、CuIn 2 、CuIn 3 The zinc-copper intermetallic compound comprises Cu 5 Zn 8 The CuZn and antimony copper intermetallic compound comprises: cu 4 Sb、Cu 2 Sb。
The preparation method of the solder-free lead-free solder for selective wave soldering comprises the following steps:
step 1, weighing electrolytic tin according to a mass ratio, putting the electrolytic tin into an intermediate frequency heating furnace, keeping the temperature of 360-380 ℃, and continuously stirring for about 2 hours;
step 2, maintaining the stirring process in the step 1, weighing the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound according to the mass ratio, adding the weighed materials into the high-temperature tin liquid in the step 1, and maintaining stirring for about 1.5 hours;
step 3, casting the section to be extruded obtained in the step 2, and cooling for later use;
step 4, putting the extruded section material obtained in the step 3 into an extruder for continuous extrusion, extruding the extruded section material into a strip-shaped object with the width of 1.5 cm and the thickness of about 0.6 cm, and cutting the strip-shaped object to be about 28 cm in length; thus obtaining the sample piece 1 to be tested of the solder-free lead-free solder for selective wave soldering.
Example 2:
a solder-free lead-free solder for selective wave soldering comprises the following components in percentage by mass:
wherein the purity of the electrolytic tin is 99.95%, and the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound are compound particles with the particle size of 8 mm. The indium-copper intermetallic compound comprises Cu 9 In 4 、CuIn 2 、CuIn ， The zinc-copper intermetallic compound comprises Cu 5 Zn 8 The CuZn, antimony copper intermetallic compound comprises: cu (copper) 4 Sb、Cu 2 Sb。
A preparation method of the solderless and lead-free solder for selective wave soldering comprises the following steps:
step 1, weighing electrolytic tin according to a mass ratio, putting the electrolytic tin into an intermediate frequency heating furnace, keeping the temperature of 360-380 ℃, and continuously stirring for about 2 hours;
step 2, maintaining the stirring process in the step 1, weighing the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound according to the mass ratio, adding the weighed materials into the high-temperature tin liquid in the step 1, and maintaining stirring for about 1.5 hours;
step 3, casting the section to be extruded obtained in the step 2, and cooling for later use;
step 4, putting the extruded section material obtained in the step 3 into an extruder for continuous extrusion, extruding the extruded section material into a strip-shaped object with the width of 1.5 cm and the thickness of about 0.6 cm, and cutting the strip-shaped object to be about 28 cm in length; thus obtaining the sample piece 2 to be tested of the solder-free lead-free solder for selective wave soldering.
Example 3:
the solder-free lead-free solder for selective wave soldering comprises the following components in percentage by mass:
wherein, the purity of the electrolytic tin is 99.95 percent, and the indium copper intermetallic compound, the zinc copper intermetallic compound and the antimony copper intermetallic compound are compound granules, and the granularity of the compound granules is about 8 mm of the granularity of the antimony copper compound powder. The intermetallic compound of indium and copper includes Cu 9 In 4 、CuIn 2 、CuIn 3 The zinc-copper intermetallic compound comprises Cu 5 Zn 8 The CuZn, antimony copper intermetallic compound comprises: cu 4 Sb、Cu 2 Sb。
A preparation method of the solderless and lead-free solder for selective wave soldering comprises the following steps:
step 1, weighing electrolytic tin according to a mass ratio, putting the electrolytic tin into an intermediate frequency heating furnace, keeping the temperature of 360-380 ℃, and continuously stirring for about 2 hours;
step 2, maintaining the stirring process in the step 1, weighing the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound according to the mass ratio, adding the weighed materials into the high-temperature tin liquid in the step 1, and maintaining stirring for about 1.5 hours;
step 3, casting the section to be extruded obtained in the step 2, and cooling for later use;
step 4, putting the extrusion section obtained in the step 3 into an extruder for continuous extrusion, extruding into a strip-shaped object with the width of 1.5 cm and the thickness of about 0.6 cm, and cutting off the strip-shaped object to be about 28 cm in length; thus obtaining the sample 3 to be tested of the solder-free lead-free solder for selective wave soldering.
The three examples were compared with a conventional soldering process of "tin-copper (sn0.7cu) lead-free solder + rosin type flux" in which a brass wire having a wire diameter of 1.0mm was soldered to a T2 copper plate, and then "residual state and dryness after soldering, solder spreading rate and soldering strength" were observed and tested, and the test results were shown in table 1:
table 1: examples test data sheet
According to the experimental data, the soldering flux-free solder wire obtained by adopting the technical scheme of the invention has no residue after welding, is dry and does not stick chalk powder, and meets the GB/T9491 standard; secondly, the spreading rate of the solder during welding reaches more than 87 percent, meets the standard requirement and has little difference with the traditional rosin soldering wire; finally, in the drawing experiment of the welding strength test, the overall strength is stronger than that of the traditional soldering tin wire.
The soldering flux-free lead-free solder for selective wave soldering is suitable for various selective wave soldering processes, can meet requirements of copper-based weldments and weldments with multiple alloy components such as nickel plating, silver plating, gold plating and the like, and has the advantages of working temperature of 265-285 ℃, wide process window and strong applicability.
Therefore, the flux-free lead-free solder for selective wave soldering is obtained, the main components of intermetallic compounds (indium copper intermetallic compounds, zinc copper intermetallic compounds, antimony copper intermetallic compounds and the like) formed by a soldered joint (IMC) in the traditional soldering process are used as a part of a lead-free solder alloy, and are fused with tin solder through a certain process, so that the flux-free soldering is realized, the residual after soldering is basically avoided, the soldering form (expansion rate) is better, the soldering strength is higher, and the flux-free lead-free solder can completely meet and replace the traditional soldering process (needing to be coated with flux). The invention provides a novel material for the electronic welding industry, and the novel material has the advantages of simple manufacturing process, wider application scene and higher application reliability.
In a word, the invention has breakthrough of new technology on the basis of reaching the solderability and reliability of the traditional lead-free solder. In the process of customer application, the flux coating process is reduced, the process efficiency is improved, the process cost is saved, and meanwhile, a better welding effect is achieved.
In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the present invention. The foregoing description is only a preferred embodiment of the invention, which can be embodied in many different forms than described herein, and therefore the invention is not limited to the specific embodiments disclosed above. And that those skilled in the art may, using the methods and techniques disclosed above, make numerous possible variations and modifications to the disclosed embodiments, or modify equivalents thereof, without departing from the scope of the claimed embodiments. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are within the scope of the technical solution of the present invention.
Claims (2)
1. A solder-free lead-free solder for selective wave soldering is characterized in that: the composite material comprises the following components in percentage by mass:
89.0% -94.0% of electrolytic tin;
1.5-3.0% of indium-copper intermetallic compound;
2.0-3.8% of zinc-copper intermetallic compound;
2.5 to 4.2 percent of antimony-copper intermetallic compound;
wherein the purity of the electrolytic tin is 99.95%, the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound are compound particles, and the granularity is 5-10 mm;
the indium-copper intermetallic compound at least comprises Cu 9 In 4 、CuIn 2 And CuIn 3 Said zinc-copper intermetallic compound comprises at least Cu 5 Zn 8 And CuZn, the antimony-copper intermetallic compound at least including Cu 4 Sb and Cu 2 Sb。
2. A method of making a solder-free, lead-free solder for selective wave soldering in accordance with claim 1, comprising the steps of:
step 1, weighing electrolytic tin according to a mass ratio, putting the electrolytic tin into an intermediate frequency heating furnace, keeping the temperature of 360-380 ℃, and continuously stirring for 1.5-2.5 hours;
step 2, maintaining the stirring process in the step 1, weighing the indium-copper intermetallic compound, the zinc-copper intermetallic compound and the antimony-copper intermetallic compound according to the mass ratio, adding the weighed materials into the high-temperature tin liquid in the step 1, and maintaining stirring for about 1.5 hours;
step 3, casting the section to be extruded obtained in the step 2, and cooling for later use;
step 4, putting the extrusion section obtained in the step 3 into an extruder for continuous extrusion, extruding into a strip-shaped object with the width of 1.5 cm and the thickness of about 0.6 cm, and cutting off the strip-shaped object to the length of 27-30 cm; thus obtaining the finished product of the solder-free lead-free solder for selective wave soldering.
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| CN202111191116.4A CN113798725B (en) | 2021-10-13 | 2021-10-13 | Solder-free lead-free solder for selective wave soldering and preparation method thereof |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101618485A (en) * | 2009-08-03 | 2010-01-06 | 浙江强力焊锡材料有限公司 | Lead free brazing material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3074649B1 (en) * | 1999-02-23 | 2000-08-07 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | Lead-free solder powder, lead-free solder paste, and methods for producing them |
| SG139507A1 (en) * | 2001-07-09 | 2008-02-29 | Quantum Chem Tech Singapore | Improvements in or relating to solders |
| CN100491053C (en) * | 2003-04-01 | 2009-05-27 | 千住金属工业株式会社 | Solder paste and printed circuit board |
| CN102896439B (en) * | 2011-07-28 | 2015-08-26 | 北京有色金属研究总院 | A kind of Sn-Sb-X high-temperature lead-free solder |
| JP6369620B1 (en) * | 2017-12-31 | 2018-08-08 | 千住金属工業株式会社 | Solder alloy |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101618485A (en) * | 2009-08-03 | 2010-01-06 | 浙江强力焊锡材料有限公司 | Lead free brazing material |
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