JP2006289493A - Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead-free solder capable of suppressing the generation of tin whiskers in the solder solidified after melting and does not impair the wettability of the solder in an Sn-Zn based lead-free solder, its soldering work, solder past and electronic component soldering substrate. <P>SOLUTION: There are provided the Sn-Zn based solder containing 0.003 to 5wt.% zinc or zinc compound and the balance basically tin or tin compound, and is characterized in that the zinc or zinc compound is a pseudo corrosion preventive section within the solder or on its surface, the solder work such as bar solder using the same, the solder paste and electronic part soldering substrate using the same. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a Sn—Zn solder, lead-free solder, solder processed material using these, a solder paste, and an electronic component soldering substrate, in which whisker generation is suppressed in a solidified solder after melting.

  In recent years, surface mounting technology has rapidly developed along with the multi-functionalization, miniaturization, and miniaturization of wiring boards for electronic devices. When surface mounting electronic components, reflow soldering methods that use solder paste are mostly used. ing. The solder powder used for the solder paste is mostly Sn-Pb-based. However, if the electronic equipment is disposed of after it has been used, etc., it is disassembled and part of it is recovered, but the mounting board on which the electronic components are mounted is crushed and landfilled without being recovered. The current situation is that some are left in nature. Since electronic components are soldered on the mounting board dumped in nature, if this solder contains lead, it will be eluted as a soluble lead compound due to acid rain, etc., and pollutes nature. In addition, contaminated water and animal and plant foods may be ingested by humans through groundwater, which is becoming a serious problem because of its high toxicity. Therefore, solder materials not containing lead have been developed, and so-called lead-free solder alloy powders (lead-free solder alloy powders) such as Sn—Ag alloys and Sn—Ag—Cu alloys have been used. In particular, Sn is mainly used for Pb-free solder used for plating.

  However, since the above lead-free solder alloy powder (Pb-free solder alloy powder) has a high melting point of about 200 to 220 ° C., the reflow soldering method using the solder paste containing the solder powder has a peak temperature during heating. 230-240 ° C, and in the case of lead-based Sn-Pb alloy, the eutectic composition (63Sn / 37Pb) has a melting point as low as 183 ° C, and the solder paste containing the solder powder is used. In the conventional reflow soldering method, the heating peak temperature may be about 230 ° C., and heat-sensitive electronic components can be soldered without damage, but there is a problem of causing functional deterioration due to the heat damage. is there. In order to avoid this problem, the appearance of lead-free solder having as low a melting point as possible is desired. In order to meet this requirement, Sn—Ag—Cu-based lead-free solder alloy (Patent No. 3027441, US Pat. Various lead-free solder alloys such as Sn-Ag-Cu-Bi-based lead-free solder alloys (US Pat. No. 4,879,096) have been proposed, and Sn-Ag-Cu-based lead-free solder alloys are currently being used in Japan. Has become the mainstream.

Recently, as a lead-free solder alloy having a melting temperature lower than that of a Sn—Ag alloy, a Sn—Zn alloy having a composition of 91Sn / 9Zn and having a melting temperature of 199 ° C. has attracted attention. In order to improve wettability and adhesive strength, lead-free solder alloys to which Bi, In, Ag, Cu, Ni, etc. are added have also been proposed.
For example, in Japanese Patent Publication No. 6-49238, when a member to be joined made of a Cu-based alloy is soldered with a Sn-based alloy solder containing Zn, a reaction phase such as Cu-Sn is formed, and this reaction phase grows in a high-temperature atmosphere. However, electrical resistance and the like increase, which is not preferable. However, by adding Zn, an alloy phase of Cu—Zn—Sn is formed and has an effect of suppressing the formation of the Cu—Sn phase. There is a statement that cracks are less likely to occur in the soldered part.
Japanese Patent No. 3091098 discloses a solder alloy composed of Sn, Cu, and Zn, which is suitable for joining heat exchangers such as car radiators and car heaters, and the addition of Zn is a solder alloy. There is a description that the strength of the steel is increased, the melting point is lowered, and the creep strength is also increased.
Japanese Patent No. 3379679 discloses an organic acid having a molecular weight of 200 or less and having at least one carboxyl group and one hydroxyl group in one molecule in order to suppress an increase in viscosity due to the change of Sn-Zn alloy solder paste over time. And phthalate esters or organic compounds of sorbitan aliphatic esters are described to be added together.

Japanese Patent Publication No. 6-49238 Japanese Patent No. 3091098 Japanese Patent No. 3379679

  However, since the lead-free solder described in each of these publications is mostly Sn, it avoids the generation of tin whiskers called needle-like whiskers (髭) that are generated by Sn recrystallization. I can't. Until now, whiskers have been recognized as a problem only with plated solder, but it has been found that whiskers are also generated in solder used for joining. In recent years, with the downsizing of electronic boards (printed boards), the circuit interval has become shorter than 100 μm (fine pattern circuit), and in the situation where the interval between mounted components has become narrower, it has grown to 50 μm or more. When tin whiskers are generated, a short circuit may occur, which raises a problem in reliability of use performance.

  The present invention has been made in view of the above circumstances, and the object thereof is a lead-free solder that can suppress the generation of whiskers when solidified after soldering and does not impair the wettability of the solder, and a solder processed product using the lead-free solder Another object of the present invention is to provide a solder paste and an electronic component soldered substrate.

As a result of intensive research aimed at achieving the above object, the present inventors have found that when the soldered body is made of a copper-based material (copper or copper alloy), lead containing Sn as a main component. In free soldering, when the solder is melted and brought into contact with a body to be soldered, the Sn-Cu compound grows at the solder-copper interface, which causes the generation of tin whiskers. If a small amount of a specific element is added to the lead-free solder to be added, for example, in a small amount of Zn in the range of 0.003% to 5% by weight, the characteristics of the conventional lead-free solder are impaired or deteriorated. The inventors have found that the growth of Sn—Cu compounds, which are the cause of tin whisker generation, can be suppressed, and that whisker generation can be suppressed, and the present invention has been completed.
Accordingly, the present invention provides (1) 0.003% to 5% by weight of zinc or a zinc compound,
The remainder is basically tin or a tin compound,
Sn-Zn solder containing
The zinc or zinc compound provides an Sn—Zn solder that is a pseudo-corrosion-preventing part in or on the surface of the solder.
The present invention also provides (2) 0.003% to 5% by weight of zinc or a zinc compound,
The remainder is basically tin or a tin compound,
Sn-Zn solder containing
A pseudo-corrosion-proof portion formed on any of the Sn-Zn-based solder portions by the zinc or the zinc compound is formed on the Sn-Zn-based solder;
(3) Sn-Zn solder described in (1) or (2) above, wherein the pseudo-corrosion-proof portion is a means for preventing whiskers generated from Sn-Zn solder, (4), (1 The zinc compound according to any one of (3) to (3) is a Sn—Zn-based solder that is a zinc oxide, (5), and the zinc oxide of (4) above is a Sn—Zn that is a passive film. (6), Sn—Zn solder selected from the group consisting of Mg, Al, P, Ti, Mn, Fe, Co, Ni, Cu, Ga, Ge, Mo, Ag, In, Au, Bi The lead-free solder according to any one of the above (1) to (5), to which at least one kind is added, (7) and the Sn—Zn based solder are 0.003% to 5% by weight of Zn and 0.1% of Ag. Containing 5% to 5% by weight and / or 0.1% to 3% by weight of Cu, the balance being n lead-free solder of any one of (1) to (6) above, (8), bar solder, solder ball or molded solder having the lead-free solder alloy of any of (1) to (7) above (9), a solder paste comprising the lead-free solder powder of any one of (1) to (7) above and a flux component, (10), Zn 5 wt% to 13 wt% %, The remaining lead Sn or the first lead-free solder powder, Mg, Al, P, Ti, Mn, Fe, Co, Ni, Cu, Ga, Ge, Mo, Ag, To the second lead-free solder powder to which at least one selected from the group consisting of In, Au, and Bi is added, and to the third lead-free solder powder whose main component is Sn or the third lead-free solder powder , Mg, Al Claiming a fourth lead-free solder powder to which at least one selected from the group consisting of P, Ti, Mn, Fe, Co, Ni, Cu, Ga, Ge, Mo, Ag, In, Au, and Bi is added. Item 10. A solder paste obtained by blending a lead-free solder powder mixed so that Zn of the lead-free solder has a composition of 0.003% to 5% by weight and a flux, 11) At least one of the electronic component and the printed circuit board has a soldered portion made of a copper-based material, and the Sn—Zn-based solder or lead-free solder according to any one of the above (1) to (7), An electronic component soldering substrate in which the electronic component is soldered to the printed circuit board using the solder processed product of 8) or the solder paste of (9) or (10) above. .
In the above, (1) a lead-free solder containing Sn—Zn-based solder containing 0.003% to 5% by weight of Zn, Co or Ge, and the balance being Sn, (2) a lead-free solder containing Sn-Zn-based solder containing 0.003 to 5% by weight of Zn and the rest Sn. A lead-free solder containing ZnO in the solder from melting the lead-free solder powder to solidifying, (3) the ZnO is present in any one of the lower, middle and upper layers of the solder solidified after melting (2) Lead-free solder, (4), ZnO forms the pseudo-corrosion-preventing part (2) or (3) lead-free solder, (5), ZnO suppresses whisker generation by the pseudo-corrosion-preventing part ( 4) Lead May be as free solder, also, "lead-free solder" is also good, which means these as "lead-free solder powder", "lead-free solder alloy powder", "lead-free solder alloy". In addition, “lead-free solder containing Sn—Zn-based solder” indicates that unavoidable impurities and other components may be included.

According to the present invention, it is possible to provide a Sn-Zn lead-free solder containing Zn or a compound thereof in an amount of 0.003% to 5% by weight. In addition, a solder processed product and a solder paste using the same can be provided. The generation of whiskers can be similarly suppressed after soldering using these. Thus, an electronic component soldering substrate soldered in this manner can be provided.
In this way, if the occurrence of whiskers is suppressed or prevented, the problem caused by short circuits caused by whiskers in fine pattern circuits accompanying the recent downsizing of electronic boards (printed boards) can be solved. Reliability can be further improved.

In the present invention, for lead-free solder containing Sn as a main component to which a specific element is added, if the amount of the added element is small, the whisker suppressing effect is exhibited without impairing the characteristics as the conventional Pb-free solder. In view of this, the selection criteria for the specific element were also considered to have no environmental impact, are inexpensive, and are stable in normal conditions. Specific elements added to the Sn single component include Zn, Co, Ge, Ga and the like. The length of whiskers can be set to 0 to 40 μm, and the elements before this order suppress whisker growth. In the case of Zn, Co, and Ge, the length of the whisker can be set to 0 to 30 μm, and in the case of Zn, the length of the whisker can be set to 0 to 20 μm, and Ni is added to the Sn single component. In some cases, the whisker length is 100 μm, and when Mn is added to the Sn single component, the whisker length can be made shorter than that in which the whisker length may grow to 50 μm.
Further, specific elements added to Sn-Ag-Cu such as Sn-3Ag-0.5Cu include Zn, Ge, etc., and the length of whiskers can be 0 to 40 μm. The whisker growth can be suppressed as much as the previous element, and the whisker length grows to 50 μm when Co and In are added, to 60 μm when Mn is added, and to 80 μm when Ni is added. The whisker can be made shorter than the one with the whisker.
When a specific element is added to a single Sn component, Zn is preferable as the specific element in any case where a specific element is added to a plurality of components such as Sn-Ag-Cu. In verification by dip soldering, whisker The solder surface is free from oxidation and corrosion, maintains a metallic luster, and whisker is generated even with time-dependent changes under high temperature and high humidity conditions (for example, 85 ° C and relative humidity 85%). Can be suppressed. Sn-Zn solder can suppress whisker growth more than Sn37Pb solder, and in both cases of Sn-Ag-Cu-Zn solder and Sn-Zn solder, the effect of suppressing whisker growth is increased while increasing the amount of Zn added. In the case of Sn-3Ag-0.5Cu, it can be made significantly smaller than the whisker length over time under the same conditions. In the case of Sn-3Ag-0.5Cu, the surface of the Cu substrate and the solder interface or the solder It is very different that whiskers with different thickness and length are generated from the place where oxidization occurs.
The main occurrence of whiskers is likely to occur when the thickness of the solder at the end of the fillet is thin. On the contrary, when Sn-3Ag-0.5Cu is used where a large amount of solder is supplied at the center of the fillet, However, whiskers are less likely to occur.

In order to obtain these good performances, the addition amount of Zn is 0.003% to 5% by weight, preferably 0.1% to 1.0% by weight, and less than 0.003% by weight. Although the growth of the Sn—Cu compound can be temporarily suppressed, it cannot be avoided that the Sn—Cu compound grows again with the passage of time to form the Sn—Cu compound layer. On the other hand, when the content is more than 5% by weight, a Cu—Zn compound is generated, whisker is generated due to this generation, and the same problem as in the case of the whisker by the Sn—Cu compound occurs.
In this way, if the amount of Zn added is too large or too small, whisker generation cannot be prevented and an appropriate amount needs to be added. However, Zn is highly oxidizable, and its oxide is Zn-Sn solder. When mixed, the molten solder is liable to impair the wetting of the soldered body (copper foil land of the printed circuit board) on the copper surface, so the smaller the addition amount, the better. 003 wt% to less than 0.3 wt% is preferable. More preferably, the content is 0.003% to 0.2% by weight.
The amount of addition of Co, Ge, Ga, etc. is 0.003% to 5% by weight, preferably 0.1% to 1.0% by weight, which is the same as described above in the case of the amount of Zn added. However, the solder with the addition of Zn is most excellent in the metallic luster of the solder.
Zn is considered to form a zinc oxide film on the solder surface, which is considered to be a rust-preventing effect due to the pseudo (pseudo) anticorrosion action that zinc has conventionally.

The Sn-Zn lead-free solder alloy of the present invention includes, for example, Mg, Al, P, Ti, Mn, Fe, Co, Ni, Cu, Ga, Ge, Mo, Ag, In, Au, and Bi. It is also preferable to improve solder properties such as mechanical strength, solder wettability, and low melting point by adding at least one selected element, that is, one or more elements of each. For example, when Ag is added in an amount of 0.1 wt% to 5 wt% (ratio in the solder composed of all components, the same applies hereinafter), the mechanical strength of the solder can be improved and the corrosion resistance of the Sn—Zn alloy can be improved. . When Ag is added in an amount of less than 0.1% by weight, these effects do not appear, and when it is added in excess of 5% by weight, the liquidus temperature rapidly increases and the soldering temperature increases. As a result, the electronic components are easily damaged by heat.
Addition of 0.1% to 3% by weight of Cu has an excellent effect on improving the mechanical strength of the solder. When soldering is performed by immersing in molten solder, the copper foil of the land of the printed circuit board is used. There is also an effect of suppressing the diffusion of copper in the molten solder. Addition of less than 0.1% by weight has no effect, and if it exceeds 3% by weight, Sn—Cu intermetallic compounds are precipitated, causing not only whisker generation, but also rapidly increasing the liquidus temperature. As a result, the solderability is hindered. Ag and Cu may be added alone, or Ag and Cu may be added simultaneously.
In addition, when Bi, In, Ag, Cu, Ni, or the like is added to the Sn—Zn alloy, wettability can be improved and adhesive strength can be improved.
Other elements are also based on these, and including these metal elements, the amount added is, for example, 0.01 wt% to 4.0 wt%, but may be less than this.

The present invention also provides a solder paste obtained by using a solder alloy such as Sn-Zn or the like, or a solder alloy obtained by adding other elements to each of them, and this solder paste uses the solder powder of the alloy as a flux. It is a mixture. The solder powder is used in the solder paste in an amount of 85% to 92% by weight (flux: 8% to 15% by weight). The solder powder having a spherical shape and a particle size of 10 μm to 45 μm is becoming narrower in the pitch of the soldered lands. It is preferable for reflow soldering on recent printed circuit boards.
The flux includes, for example, a resin component, an activator, and a solvent. Examples of the resin component include rosin resins, and examples thereof include rosin and derivatives thereof such as modified rosin, which can be used in combination. Specific examples include gum rosin, wood rosin, polymerized rosin, phenol-modified rosin and derivatives thereof. The content of the rosin resin can be set to 30% to 70% by weight in a so-called flux which is another component excluding the solder powder of the solder paste composition. If it is less than this, oxidation of the copper foil surface of the soldering land will be prevented, and the solder will be easily wetted on the surface, so-called solderability will be reduced, and solder balls will be easily formed. Become more. Activators include organic amine hydrohalides and organic acids, specifically diphenylguanidine hydrobromide, cyclohexylamine hydrobromide, diethylamine hydrochloride, triethanolamine hydrobromide. Examples include salts, monoethanolamine hydrobromide, adipic acid, sebacic acid, etc. These suppress the corrosiveness caused by the residue and do not impair the insulation resistance. From the point of doing, 0.1 to 3 weight% in a flux is preferable. A thixotropic agent may be used in combination. For example, hydrogenated castor oil, fatty acid amides, and oxy fatty acids are contained in the flux so that the solder paste can be adjusted to a viscosity suitable for its printability. It is preferable to contain 15 to 15 weight%. Examples of the solvent include hexyl carpitol (boiling point: 260 ° C.), butyl carbitol (boiling point: 230 ° C.) and the like, and it is preferable to contain 30 wt% to 50 wt% in the flux.

The solder paste of the present invention can be easily produced by kneading together with the above-described essential components and the additive added as necessary. The solder paste obtained in this way is applied to a printed circuit board, chip parts are placed on the coating film, and then soldering is performed by heating and melting the solder powder, thereby soldering electronic parts. A substrate is obtained.
At that time, the Sn—Cu compound produced at the interface between the solder and copper during soldering further reacts with the specific element such as zinc as a solder component, thereby causing a Cu—Zn compound layer on the solder side of the Sn—Cu compound layer. And a compound layer based on this and other specific elements. Thereby, the diffusion of tin and copper is suppressed, the growth of the Sn—Cu layer, which is the cause of whisker generation, is suppressed, the generation of tin whisker is suppressed, and the stress on the solder fillet can be suppressed. At this time, since a specific element such as Zn is in an appropriate amount, generation of whiskers by the Cu—Zn compound is suppressed, and since the appropriate amount can be said to be a small amount, it does not impair the wetting of the solder.
The lead-free solder paste added with the above-mentioned specific elements such as Sn3Ag0.5Cu1.0Zn can suppress the occurrence of whiskers regardless of the presence of flux residue and changes in reflow conditions, but the Sn3Ag0.5Cu solder paste In the case of reflow soldering, whisker length can be shortened in the case of long-term change over time under high temperature and high humidity (85 ° C, relative humidity 85%) than dip soldering. When the reflow heating temperature is increased or the heating time is increased, whiskers tend to grow more than normal conditions. Moreover, if the flux residue remains, the growth of whiskers tends to be slow. However, there is a trend of whisker growth due to changes in reflow conditions.
The “lead-free solder” of the present invention may be “lead-free solder for soldered joints of copper-based materials”, but has the same characteristics as conventional lead-free solder except that whisker generation is suppressed or prevented. It can be used not only for electronic component soldering but also for mechanical joining, and is not limited to special applications. Further, “lead-free solder (solder paste) used for soldering an electronic component to a fine pattern circuit having a circuit interval of 100 μm or less, and an electronic component soldering substrate soldered by the lead-free solder” may be used. In this case, the specific element which can make the length of said whisker 100 micrometers or less can also be used.

  The present invention will be specifically described below with reference to experimental examples, but the present invention is not limited to these experimental examples. Hereinafter, “parts” means “parts by weight” (may be “parts by mass”, and the same applies to the above), and “%” means “% by weight”.

(Experimental example 1)
Each metal containing 0.5% by weight of Zn and the balance of Sn was taken in a crucible, uniformly melted in an electric furnace, and poured into a mold to prepare a solder alloy. In addition, the solder powder is micronized by a centrifugal atomization method to produce a Sn-Zn alloy lead-free solder powder (particle size: 10 μm to 45 μm) (solder material). The occurrence state was investigated.
(experimental method)
The lead-free solder powder of the Sn-Zn alloy was melted at 250 ° C. The meniscograph measuring device, to the molten solder, flux (TAMURA KAKEN KK: EC-19S-8) JIS2 type comb type substrate in which the coating ( The substrate on which the comb-shaped copper electrode was formed was immersed for about 3 seconds and then taken out, and the adhered molten solder was solidified (dip soldering). Thereafter, the substrate was washed with ethyl acetate for 5 minutes with an ultrasonic device to remove the flux residue. After drying the substrate, it was put into a constant temperature and humidity chamber at 85 ° C. and 85% RH (relative humidity), and taken out after 500 hours, 1000 hours and 2000 hours. The state of whisker (whisker length) was observed with the SEM (scanning electron microscope) (400 times and 1000 times) of the substrate taken out (relation between change with time and whisker).
The results are shown in Table 1 together with the solder composition. In Table 1, “◎” indicates no whisker generation (whisker length 0), “○” indicates almost no whisker generation (whisker length 30 μm or less), and “Δ” indicates a length longer than 30 μm and less than 50 μm. Occurrence of whiskers, “×” indicates the occurrence of whiskers having a length of 40 μm or more (including those corresponding to Δ), and “−” indicates that SEM observation is not performed due to the occurrence of whiskers in the previous stage. The numerical value next to each mark indicates the length (μm) of the whisker.
From this, in the present invention, “whisker generation is suppressed in the solder solidified after melting” may be a whisker length of less than 50 μm, less than 30 μm, or less than 30 μm.

(Experimental Examples 2 to 26)
As shown in Tables 1 and 2, the lead-free solder powders of Experimental Examples 2 to 26 were manufactured according to Experimental Example 1, and the state of whisker generation was examined in the same manner as in Experimental Example 1 using each lead-free solder powder. The results are shown in Tables 1 and 2 in the same manner as in Experimental Example 1.

  From Table 1, it can be seen that in Experimental Example 1, addition of 0.5 wt% Zn to Sn suppresses the generation of whiskers. In Experimental Examples 2 to 9, Bi, Ni, Cu, In, Ge, Mg It can be seen that the effect of suppressing the generation of whiskers by addition of Zn is not lost even if exists. In the Sn-Ag-Cu solders of Experimental Examples 10 to 14, the effect of suppressing whisker generation by Zn addition (Sn-Zn solder) appeared. On the other hand, in Experimental Examples 15 to 20, 22 to 26, whiskers of 40 μm or more are generated in 500 hours, and it can be said that the reliability for preventing short circuits of fine circuits having a circuit interval of 50 μm or less is particularly lacking. In Example 21, although Zn was contained, the amount was too large, and whiskers having a length of 30 μm or more were generated in 1000 hours. It was found that whisker generation can be suppressed by adding an appropriate amount of zinc as in the experimental example, and a decrease in reliability due to a short circuit is avoided.

(Experimental examples 27 to 36)
About 850 g of Sn or Sn-3Ag-0.5Cu solder was placed in a graphite crucible, and was heated and melted at 300 ° C. in a muffle furnace (manufactured by Denken Co., Ltd.) in a nitrogen atmosphere. 36 other metal elements or alloys were added to the molten solder by about 0.1-0.2%. Furthermore, by heating at 500 to 1000 ° C. for 1 to 2 hours in a nitrogen atmosphere, the additive element was dissolved in the solder, and an Sn alloy or a solder alloy containing the additive element (the solder material of Experimental Examples 27 to 36) was manufactured. . Table 3 shows the components of each solder material produced. The composition is expressed by, for example, wt%, which is a general notation, for example, Sn-3Ag-0.5Cu. In the table, each metal element and its wt% are shown separately.
As for the solder powder, similarly to Experimental Example 1, the lead-free solder powder (particle size 10 to 45 μm) of Sn—Zn alloy may be manufactured by micronization by the centrifugal atomization method.
The state of whisker generation was examined by the following experimental method.
(experimental method)
Each of the above solder materials is melted by a meniscograph measuring apparatus, and the others are the same as in the above experimental method (the surface of the JIS2 comb type substrate is polished), and after 500 hours according to the description of the experimental method. The whisker generation was observed with an optical microscope, and the length of whisker generated from the circuit was measured to verify the tendency of whisker generation due to the added metal element. The results are shown in Table 3.
In addition, regarding the relationship between the change with time and the whisker, the measurement after 1500 hours was also performed, and the results after the other time are shown in the graph of FIG. In addition, Table 3 shows values obtained by reading the length of whiskers from the graph.
In FIG. 1, the type of solder such as “SAC0.1Zn” represents the composition shown in FIG. 2, and the composition in FIG.

(About whiskers by dip soldering)
Table 3 shows that whisker growth was relatively suppressed by adding Co and Ge to 0.1 wt% Sn in Experimental Examples 29 and 30, respectively, and Zn was added to 0.1 wt% Sn in Example 27. It can be seen that whisker is not observed.
It is visually observed that the solder surface (fillet surface) of the solder material of Experimental Example 27 is not corroded and maintains a metallic luster, while the solder surface of the solder material of Experimental Example 32 is considerably corroded due to oxidation. It was also observed by taking pictures.
From Table 1, it can be seen that for the solder material of Experimental Example 13 (SAC0.1Zn (FIG. 2)), the SAC alloy solder added with Zn has no whisker, but the solder material of Experimental Example 13 of Table 1 was tested. Solder material manufactured by the same method as that used for manufacturing the solder materials of Examples 27 to 36 (each method is substantially the same method although there is a difference in whether specific conditions are indicated or omitted) As for Example 13 ′ (solder material of SAC0.1Zn), it was found that the SAC alloy solder to which Zn was added had no whiskers (remarkably suppressed).

The solder surface of the solder material of Experimental Example 13 ′ is not corroded and maintains a metallic luster. On the other hand, it is visually confirmed that such metallic luster is maintained with additive elements other than Zn. It was not observed by taking pictures.
In addition, the solder material (Experimental Example 22 ′ (SAC (FIG. 2)) manufactured in the same manner as the solder material of Experimental Example 27 to 36 was manufactured from the solder material of Experimental Example 22 (SAC (FIG. 2)) in Table 2. ), SEM observation results of the solder surface of each of the solder materials of Experimental Example 13 ′ (SAC0.1Zn) are shown by a photograph. The occurrence of whiskers with different thicknesses and lengths was confirmed, but in the case of Experimental Example 13 ′, no solder oxidation or whiskers were confirmed.
Furthermore, when the main occurrences of whiskers were observed in detail, there were many places where the solder thickness at the fillet end (about 40 μm or less) was thin, but on the contrary, a large amount of solder at the center of the fillet was supplied and the thickness (40 μm or more ), The occurrence of whiskers was not confirmed even in Experimental Example 22 ′ (SAC).
Further, when the surface state of the solder is observed, the oxidized portion of the solder is reduced in the sample of Example 22 ′ (SAC) due to the decrease in the total amount of Sn due to the inclusion of Ag and Cu, compared to the sample of Experimental Example 32 (Ni added Sn). ing. However, although the surface state of the solder differs depending on the additive element, the Sn—Ag—Cu—X-based solder added with other than Zn has a different degree of oxidation but has turned black.

  In the case of Zn addition, in both the Sn—Zn alloy and the Sn—Ag—Cu—Zn alloy, the solder surface was not oxidized, and the solder maintained a metallic luster. It is considered that a zinc oxide film (ZnO) is formed on the solder surface. This is considered to be a rust prevention effect due to the pseudo (pseudo) anticorrosion action that zinc has conventionally.

(Relations over time and the relationship between Zn addition amount and whiskers)
As can be seen from the graph of FIG. 1 showing the change over time in the length of whisker under the conditions of high temperature and high humidity (85 ° C., relative humidity 85%), the whisker of Experimental Example 22 ′ (SAC) is over time. In the SAC after 1500 hours, whisker having a maximum length of 160 μm was observed. However, in the case of Experimental Example 13 ′ (SAC0.1Zn), almost no whisker was observed.
In addition, when the amount of added Zn was increased, the effect was more remarkable. In Experimental Example 28 (S1Zn (FIG. 2)), whiskers are suppressed more than Sn-37Pb (Sn / Pb = 63/37 (weight ratio)) solder. Moreover, in the solder material manufactured in the same manner as the solder material of Experimental Example 27 to 36 (the solder material of Experimental Example 14 ′ (SAC1Zn)) of Experimental Example 14 in Table 1 after 1500 hours have passed. The occurrence of whiskers was not confirmed at all.
It can also be seen that the whisker suppressing effect is improved by increasing the amount of Zn added.

(Experimental example 37)
A solder paste having the following composition was prepared.
Hydrogenated rosin (rosin resin) 55.0g
Adipic acid (active agent) 2.0 g
Hydrogenated castor oil (thixotropic agent) 6.0g
Hexyl carbitol (solvent) 37.0g
(Flux 100g)
Flux 11.0g
Lead-free solder powder (Experiment 1) 89.0g
(Solder paste 100g)
A solder paste was obtained by stirring and mixing the flux and the solder powder. When this solder paste was measured with a Malcolm viscometer, it was 230 Pa · s (measurement temperature 25 ° C.).
Using this solder paste, (i) In a printability test (test for inspecting whether a print surface by screen printing using a metal mask having a thickness of 0.15 mm is visually observable for blur or blur), it is blurred. No bleed, (ii) Tackiness test (examines the adhesive strength of parts after printing, according to JIS Z 3284), 1.3N (Newton), (iii) Sagging test during heating (during heating) In the JIS Z 3284 test, 0.2 mm, (iv) Insulation test (measures the resistance value of the flux film separated from the solder). 3284 in accordance with the ^{test), 1.0 × 10 11 (Ω} ) or more, (v) in the soldering state test (reflow soldering apparatus, 180 ° C. preheating temperature, 120 seconds, The soldering state with respect to the copper plate when heated at 240 ° C. for 30 seconds is defined as “5” when the unmelted solder is not seen in the solidified solder after melting, and “1” when it is frequently seen, and “3”. The above test was evaluated as “practical” by a five-step method), which was “5”, which was satisfactory. In addition, what soldered the electronic component to the copper plate in (v) can be regarded as an electronic component soldering board.
(Vi) In the above (v), the solder solidified after being melted on the copper plate was subjected to flux cleaning, removal, etc. in the same manner as the “Experimental Method” in Experimental Example 1, and then 85 ° C. and 85% RH (relative Humidity) It is put into a constant temperature and humidity chamber, taken out after 500 hours, 1000 hours and 2000 hours, and the taken-out copper plate is whisker (whisker length) by SEM (scanning electron microscope) (400 times, 1000 times). When the occurrence state was observed, almost the same result as in Experimental Example 1 was obtained.
A hollow solder ingot made of the above lead-free solder alloy is melted and poured into the hollow solder ingot, and then the cored wire solder (bar solder) and the above lead-free solder alloy are thinned. When a solder ball obtained by cutting and melting and a soldered product of molded solder obtained by forming the lead-free solder alloy into a plate shape were tested according to the above, almost the same results were obtained.

(Examples of solder paste using other lead-free solders in Tables 1 and 2)
The solder pastes manufactured in the same manner as in Experimental Example 37 except that the lead-free solder powders in Experimental Examples 2 to 14 are used instead of the lead-free solder powder in Experimental Example 1 above (i) to ( With respect to vi), almost the same result as in Experimental Example 37 was obtained.
In addition, the solder powder mixture (Zn 0.10 weight%, Ag 3.0 weight%) which mixed lead-free solder powder of Experimental example 21 and lead-free solder powder of Experimental example 22 by 1.1: 98.9 by weight ratio In addition, the solder paste manufactured in the same manner as in Experimental Example 37 except that Cu (0.5 wt%) is used, the same results as in Experimental Example 37 are obtained for the above (i) to (vi). It was.
Moreover, about the solder paste manufactured similarly to Experimental example 37 except using each lead-free solder powder of said Experimental Examples 15-20 and 22-26 instead of the lead-free solder powder of said Experimental Example 1. The results (i) to (v) were almost the same as those of Experimental Example 37, but the solder paste manufactured in the same manner as in Experimental Example 37 except that the lead-free solder powder of Experimental Example 21 was used. As for (v), it was “2”, and the soldering state was deteriorated. As for (vi), almost the same results as those corresponding to Experimental Examples 15 to 20 and 22 to 26 were obtained.

(Experimental example of solder paste using lead-free solder in each experimental example in Table 3)
The solder pastes manufactured in the same manner as in Experimental Example 37 except that the lead-free solder powders in Experimental Examples 27 to 35 are used instead of the lead-free solder powder in Experimental Example 1 also apply to the above (i) to ( With respect to vi), almost the same result as in Experimental Example 37 was obtained.

(Experimental example 38) (Whisker evaluation of solder paste)
In Experimental Example 37, instead of the lead-free solder powder of Experimental Example 1, the lead-free solder powders of the solder materials of Experimental Example 14 ′ (SAC1Zn) and Experimental Example 22 ′ (SAC) (Experimental Example 1 for pulverization) The same solder paste (Solder paste of Experimental Example 14 ′, Solder paste of Experimental Example 22 ′) was manufactured except that the Pb-free solder powder manufactured in the same manner as the Pb-free solder powder manufacturing method was used, The same test substrate used for dip soldering was used, and the experiment was performed with or without cleaning the flux residue on the test substrate. Furthermore, the reflow heating conditions were changed for the preheating temperature, time, peak temperature, and melting time, and the whisker generation situation was also compared. The reflow was performed under the conditions shown in FIG. 3 using a stationary reflow apparatus.
FIGS. 4 to 6 show SAC1Zn solder joints and SAC solder joints produced using the solder paste of Experimental Example 14 ′ (FIG. 6) and the solder paste of Experimental Example 22 ′ (FIGS. 4 and 5) under various reflow conditions. The time-dependent change of the whisker length (the length measured in the same manner as the “experimental method” in Experimental Examples 27 to 36) when the part is left at 85 ° C. and 85% (relative humidity) is shown.

In the case of the solder paste of Experimental Example 22 ′ (SAC), the whisker length at 1500 hours was shorter than that of dip soldering. Also, from FIG. 4, when the reflow heating temperature was increased or the heating time was lengthened, the whisker tended to grow more than the normal conditions (◯ mark, 1500 hours, 90 s). Moreover, from FIG. 5, when the flux residue remained, the tendency for the growth of a whisker to become slow was seen. However, when the reflow conditions were high temperature and long time as described above, there was a tendency for whiskers to grow.
In the case of the solder paste of Experimental Example 14 ′ (SAC1Zn) solder material), no whisker was observed from FIG. 6 regardless of the presence or absence of the flux residue and the change in reflow conditions.

(Experimental example 39)
(Whisker Occurrence Cause and Suppression Mechanism) As described above, from the observation results of SEM photographs of the solder materials of Experimental Example 22 ′ (SAC (FIG. 2)) and Experimental Example 13 ′ (SAC0.1Zn), whisker The occurrence of whiskers was concentrated at the end portion of the solder fillet and at the oxidized location, so the cause of whisker generation is considered to be solder oxidation.
Therefore, SAC (Experimental Example 22 ′), SAC0.1Zn (Experimental Example 13 ′), 60 ° C., 90% relative humidity, and 85 ° C. oven (no humidification) by changing the high-temperature and high-humidity conditions due to changes in solder environment The whisker evaluation of Sn-37Pb (Experimental Example 36) was performed by the method described above, and the results are shown in FIG.
From FIG. 7, in the environment of 60 ° C. and relative humidity of 90%, it was confirmed that only SAC generated 40 μm whiskers in 1000 hours. The growth rate of whiskers is much slower than that in an environment of 85 ° C. and 85% relative humidity. In addition, no whisker was observed in any solder under 85 ° C. oven conditions.

Furthermore, in order to confirm whether or not the oxidation of Sn in the solder has an influence on the generation of whiskers, a cross section of the whisker generation site after 1500 hours was observed by EPMA in an environment of 85 ° C. and 85% relative humidity (EPMA observation atoms). mapping), SAC (Experimental Example 22 ′) and SAC1Zn (Experimental Example 14 ′) Sn and O distribution states, an electron diffraction view, an oxygen mapping view, and a tin distribution chart (tin) It was investigated by mapping view).
As a result, it was confirmed that oxides were generated in the SAC, and whiskers were generated from the solder sandwiched between them. In SAC1Zn, the generation of such an oxide has not been confirmed, and it has been confirmed that the cause of whisker is due to the oxidation of Sn in the solder. From the above results, it is considered that the whiskerano generation mechanism is as follows.
(1) Sn, which is the main component of solder, is oxidized by moisture in the air and becomes a low-density oxide.
(2) Stress increases in the solder fillet due to the increase in volume of Sn due to oxidation, and internal stress is accumulated at the end of the fillet because the amount of solder is small and stress is likely to concentrate.
(3) It is considered that Sn at the fillet end is pushed out to release internal stress, and whiskers are generated.
Since the metallic luster of the solder alloy to which Zn is added is maintained, by adding Zn, a Zn oxide film (ZnO) is formed on the solder surface, thereby preventing the oxidation of Sn in the solder. It is considered that the internal stress due to the generation of oxide does not occur and the generation of whiskers is suppressed. This is considered to be the pseudo (anti) corrosion action of Zn.

From the above, the following can be said.
(1) When Co or Ge is added to Sn, whisker growth is relatively suppressed, and when 0.1 wt% to 1.0 wt% of Zn is added, whisker generation can be suppressed (not present or notably). It can be said that it can be suppressed).
(2) It was confirmed that whisker generation can be suppressed even when 0.1 wt% to 1.0 wt% of Zn is added to Sn-3Ag-0.5Cu solder, which is a general Pb-free solder. Thus, it was confirmed that the addition of Co or Ge, which was effective in generating whiskers, was not so effective in suppressing the generation of whiskers.
(3) Sn-3Ag-0.5Cu-0.1Zn solder has suppressed whisker generation even when left for 1500 hours under high temperature and high humidity conditions (85 ° C., relative humidity 85%). confirmed.
(4) It was confirmed that the Sn-3Ag-0.5Cu-0.1Zn solder paste, which is expected as a practical Pb-free solder paste, has a whisker suppressing effect. In that case, the whisker suppression effect was recognized also in various reflow conditions.
(5) As a cause of whisker generation, it is considered that generation of internal stress due to oxidation of Sn of the solder component is a main cause.
In addition, the above-mentioned photograph by the optical microscope and EPMA is published in the presentation manuscript of the conference presentation (2006/2/2) of “Electronics Packaging Engineering Society”.

It is a graph which shows the relationship between the elapsed time under the high temperature and high humidity (85 degreeC, relative humidity 85%), and the length of a whisker. It is a table | surface which shows a composition for every kind of solder shown in FIG. It is a table | surface which shows the reflow conditions corresponding to each mark ((circle) etc.) in FIGS. Reflow soldered joints using solder paste (Experimental Example 22 '(SAC) without flux residue washing) under high temperature and high humidity (85 ° C, relative humidity 85%) and whisker It is a graph which shows the relationship of length. FIG. 5 is a graph similar to FIG. 4 except that the flux residue is washed. Under a high temperature and high humidity (85 ° C., relative humidity: 85%) of a reflow soldered joint using a solder paste (Experimental Example 14 ′ (SAC1Zn), with and without flux residue cleaning) It is a graph which shows the relationship between elapsed time and the length of a whisker. It is a graph which shows the relationship between the elapsed time in the dry state (85 degreeC oven), 60 degreeC, and 90% of relative humidity, and the length of a whisker.

Claims (11)

0.003% to 5% by weight of zinc or zinc compound;
The remainder is basically tin or a tin compound,
Sn-Zn solder containing
Sn-Zn-based solder, wherein the zinc or zinc compound is a pseudo-corrosion-preventing part in or on the surface of the solder. 0.003% to 5% by weight of zinc or zinc compound;
The remainder is basically tin or a tin compound,
Sn-Zn solder containing
A pseudo-corrosion-proof portion formed on any of the Sn-Zn-based solder portions by the zinc or zinc compound is formed on the Sn-Zn-based solder.   The Sn-Zn solder according to claim 1 or 2, wherein the pseudo anticorrosion part is a means for preventing whiskers generated from the Sn-Zn solder.   The Sn-Zn solder according to any one of claims 1 to 3, wherein the zinc compound is zinc oxide.   The zinc oxide according to claim 4 is a passive film, Sn-Zn system solder.   At least one selected from the group consisting of Mg, Al, P, Ti, Mn, Fe, Co, Ni, Cu, Ga, Ge, Mo, Ag, In, Au, and Bi was added to the Sn—Zn solder. The lead-free solder according to any one of claims 1 to 5, wherein:   Sn—Zn-based solder contains 0.003% to 5% by weight of Zn, 0.1% to 5% by weight of Ag, and / or 0.1% to 3% by weight of Cu, with the balance being Sn. The lead-free solder according to any one of claims 1 to 6, wherein:   A solder workpiece comprising a bar solder, a solder ball or a molded solder having the lead-free solder alloy according to any one of claims 1 to 7.   A solder paste comprising the lead-free solder powder according to any one of claims 1 to 7 and a flux component.   To the first lead-free solder powder comprising Zn 5 wt% to 13 wt% and the balance Sn or the first lead-free solder powder, Mg, Al, P, Ti, Mn, Fe, Co, Ni, Cu, Ga, A second lead-free solder powder to which at least one selected from the group consisting of Ge, Mo, Ag, In, Au, and Bi is added, and a third lead-free solder powder comprising Sn as a main component, or the third At least one selected from the group consisting of Mg, Al, P, Ti, Mn, Fe, Co, Ni, Cu, Ga, Ge, Mo, Ag, In, Au, and Bi is added to the lead-free solder powder Lead mixed with the fourth lead-free solder powder mixed so that the Sn-Zn solder or lead-free solder Zn in any one of claims 1 to 7 has a composition of 0.003% to 5% by weight. Free solder powder and flat Graphics and solder paste, characterized in that by blending a.   At least one of an electronic component and a printed circuit board has a soldering portion made of a copper-based material, the lead-free solder according to any one of claims 1 to 7, the solder processed product according to claim 8, or the claim 9 or An electronic component soldering board, wherein the electronic component is soldered to the printed board using the solder paste according to 10.