JPH10193171A - Soldering article - Google Patents
Soldering articleInfo
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- JPH10193171A JPH10193171A JP8351057A JP35105796A JPH10193171A JP H10193171 A JPH10193171 A JP H10193171A JP 8351057 A JP8351057 A JP 8351057A JP 35105796 A JP35105796 A JP 35105796A JP H10193171 A JPH10193171 A JP H10193171A
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半田付け物品に関
するものである。The present invention relates to a soldered article.
【０００２】[0002]
【従来の技術】従来より、電子機器や電子部品の電気的
・機械的な接続を得るために半田が用いられている。こ
の半田は、ＳｎとＰｂを主成分としたもの（以下、Ｓｎ
／Ｐｂ系半田とする。）が一般的に用いられてきたが、
地球環境を考慮してＰｂを含まないＳｎを主成分とし残
部がＡｇ、Ｂｉ、Ｃｕ、Ｉｎ、Ｓｂなどからなる半田
（以下、Ｐｂフリー半田とする。）が用いられるように
なってきている。そしてＳｎ／Ｐｂ系半田やＰｂフリー
半田といったＳｎを主成分とする半田を用いることによ
って、半田付け性が良好な電気的接合部を有する半田付
け物品が製造されていた。2. Description of the Related Art Conventionally, solder has been used to obtain electrical and mechanical connections between electronic devices and electronic components. This solder is composed mainly of Sn and Pb (hereinafter referred to as Sn).
/ Pb-based solder. ) Has been commonly used,
In consideration of the global environment, a solder (hereinafter, referred to as Pb-free solder) mainly composed of Sn containing no Pb and having a balance of Ag, Bi, Cu, In, Sb, or the like has been used. By using a solder containing Sn as a main component, such as a Sn / Pb-based solder or a Pb-free solder, a soldered article having an electrical joint with good solderability has been manufactured.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、Ｓｎが
主成分である半田、特にＰｂフリー半田を用いた半田付
け物品では、電気的接合部に電極喰われが起こりやす
い。また、電極としてＳｎへ拡散しやすい組成を用いる
場合には、より一層電極喰われが起こりやすいという問
題点があった。However, in a soldered article using a solder containing Sn as a main component, particularly a Pb-free solder, the electrode is likely to be eroded at the electrical joint. Further, when a composition that easily diffuses into Sn is used as an electrode, there is a problem that the electrode is more likely to be eroded.
【０００４】本発明の目的は、半田付け性が良好である
とともに、充分な耐電極喰われ性を有する半田付け物品
を提供することにある。An object of the present invention is to provide a soldered article which has good solderability and has sufficient resistance to electrode erosion.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記の課題を
解決するために半田付け物品を完成するに至った。本発
明の半田付け物品は、溶融したＳｎへ拡散しやすい組成
の導体を有する部品を半田により接合してなる半田付け
物品であって、前記半田の組成は、Ｚｎ０．０１〜５．
０重量％と、Ａｇ０．５〜９重量％、Ｃｕ０．５〜２重
量％、Ｓｂ０．５〜１４重量％、Ｂｉ０．５〜３０重量
％、Ｉｎ０．５〜２０重量％のうち少なくとも１種類
と、残りＳｎとを含有してなることに特徴がある。SUMMARY OF THE INVENTION The present invention has completed a soldered article to solve the above-mentioned problems. The soldering article of the present invention is a soldering article obtained by joining a component having a conductor having a composition that is easily diffused into molten Sn by soldering, wherein the solder has a composition of Zn 0.01 to 5.
0% by weight and at least one of 0.5 to 9% by weight of Ag, 0.5 to 2% by weight of Cu, 0.5 to 14% by weight of Sb, 0.5 to 30% by weight of Bi, and 0.5 to 20% by weight of In. , And the remaining Sn.
【０００６】また、本発明の半田付け物品においては、
前記導体の具体的組成として、Ａｇ、Ａｇ／Ｐｄ、Ａｇ
／Ｐｔ、Ａｕ、Ｃｕのうち少なくとも１種類などが代表
的である。Further, in the soldering article of the present invention,
Specific examples of the composition of the conductor include Ag, Ag / Pd, and Ag.
At least one of / Pt, Au, and Cu is typical.
【０００７】また、本発明の半田付け物品においては、
前記半田の組成は、Ｚｎ０．０１〜１．０重量％と残り
Ｓｎとを含有してなることが好ましい。In the soldering article of the present invention,
The composition of the solder preferably contains 0.01 to 1.0% by weight of Zn and the balance of Sn.
【０００８】また、本発明の半田付け物品においては、
前記半田の組成は、Ｚｎ０．０５〜１．０重量％と残り
Ｓｎとを含有してなることが好ましい。In the soldering article of the present invention,
It is preferable that the composition of the solder contains 0.05 to 1.0% by weight of Zn and the remaining Sn.
【０００９】また、本発明の半田付け物品においては、
前記半田の組成は、Ｚｎ０．１〜１．０重量％と残りＳ
ｎとを含有してなることが好ましい。Further, in the soldering article of the present invention,
The composition of the solder is 0.1 to 1.0% by weight of Zn and the remaining S
and n.
【００１０】また、本発明の半田付け物品においては、
前記半田の組成は、Ｚｎ０．１〜０．５重量％と残りＳ
ｎとを含有してなることが好ましい。[0010] In the soldering article of the present invention,
The composition of the solder is 0.1-0.5% by weight of Zn and the remaining S
and n.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。本発明の半田付け物品は、溶融したＳｎへ
拡散しやすい組成の導体を有する部品を半田により接合
してなる半田付け物品であり、半田の組成はＺｎ０．０
１〜５．０重量％と、Ａｇ０．５〜９重量％、Ｃｕ０．
５〜２重量％、Ｓｂ０．５〜１４重量％、Ｂｉ０．５〜
３０重量％、Ｉｎ０．５〜２０重量％のうち少なくとも
１種類と、残りＳｎとを含有する組成である。このよう
な構成により、半田付き性が良好であるとともに、充分
な耐電極喰われ性を有する半田付け物品を提供すること
が可能となる。Embodiments of the present invention will be described below. The soldering article of the present invention is a soldering article obtained by joining a component having a conductor having a composition that is easily diffused into molten Sn by soldering.
1 to 5.0 wt%, Ag 0.5 to 9 wt%, Cu0.
5 to 2% by weight, Sb 0.5 to 14% by weight, Bi 0.5 to
The composition contains at least one of 30% by weight, 0.5 to 20% by weight of In, and the rest of Sn. With such a configuration, it is possible to provide a soldered article having good solderability and sufficient electrode erosion resistance.
【００１２】すなわち、微少量添加されたＺｎが導体と
半田の接合界面に濃化層を形成し、導体の溶融半田中へ
の拡散を防ぎ、電極喰われを防止するためである。That is, Zn added in a small amount forms a concentrated layer at the joint interface between the conductor and the solder, thereby preventing the conductor from diffusing into the molten solder and preventing electrode erosion.
【００１３】上記Ｚｎの添加量を全体１００重量％のう
ち０．０１〜５．０重量％としたのは、Ｚｎの添加量が
０．０１重量％未満の場合には、耐電極喰われ性が劣化
するからである。一方、Ｚｎの添加量が５．０重量％を
超える場合には、半田付け性が劣化するからである。The reason why the addition amount of Zn is set to 0.01 to 5.0% by weight of the total 100% by weight is that when the addition amount of Zn is less than 0.01% by weight, the resistance to electrode erosion is reduced. Is deteriorated. On the other hand, if the amount of Zn exceeds 5.0% by weight, the solderability deteriorates.
【００１４】また、上記Ａｇの添加量を全体１００重量
％のうち０．５〜９重量％としたのは、Ａｇの添加量が
０．５重量％未満の場合には、強度の低下が起こるから
である。一方、Ａｇの添加量が９重量％を超える場合に
は、過剰のＡｇＳｎ化合物の生成による強度低下と半田
融点の上昇が起こるからである。The reason why the addition amount of Ag is 0.5 to 9% by weight of the total 100% by weight is that when the addition amount of Ag is less than 0.5% by weight, the strength is reduced. Because. On the other hand, when the amount of Ag exceeds 9% by weight, the strength is reduced and the melting point of the solder is increased due to the generation of the excess AgSn compound.
【００１５】また、上記Ｃｕの添加量を全体１００重量
％のうち０．５〜２重量％としたのは、Ｃｕの添加量が
０．５重量％未満の場合には、強度の低下が起こるから
である。一方、Ｃｕの添加量が２重量％を超える場合に
は、過剰のＣｕＳｎ化合物の生成による強度低下と半田
融点の上昇が起こるからである。The reason why the addition amount of Cu is 0.5 to 2% by weight of the total 100% by weight is that when the addition amount of Cu is less than 0.5% by weight, the strength decreases. Because. On the other hand, when the added amount of Cu exceeds 2% by weight, the strength is reduced and the melting point of the solder is increased due to the generation of an excessive CuSn compound.
【００１６】また、上記Ｓｂの添加量を全体１００重量
％のうち０．５〜１４重量％としたのは、Ｓｂの添加量
が０．５重量％未満の場合には、強度の低下が起こるか
らである。一方、Ｓｂの添加量が１４重量％を超える場
合には、過剰のＳｂＳｎ化合物の生成による強度低下と
半田融点の上昇が起こるからである。The reason why the addition amount of Sb is 0.5 to 14% by weight of the total 100% by weight is that when the addition amount of Sb is less than 0.5% by weight, the strength is reduced. Because. On the other hand, if the added amount of Sb exceeds 14% by weight, the strength is reduced and the melting point of the solder is increased due to the generation of an excessive SbSn compound.
【００１７】また、上記Ｂｉの添加量を全体１００重量
％のうち０．５〜３０重量％としたのは、Ｂｉの添加量
が０．５重量％未満の場合には、強度の低下が起こるか
らである。一方、Ｂｉの添加量が３０重量％を超える場
合には、Ｂｉ自体が脆いため半田の脆化が起こるからで
ある。The reason why the amount of Bi added is set to 0.5 to 30% by weight of the total 100% by weight is that when the amount of Bi added is less than 0.5% by weight, the strength decreases. Because. On the other hand, when the added amount of Bi exceeds 30% by weight, the brittleness of the solder occurs because Bi itself is brittle.
【００１８】また、上記Ｉｎの添加量を全体１００重量
％のうち０．５〜２０重量％としたのは、Ｉｎの添加量
が０．５重量％未満の場合には、強度の低下が起こるか
らである。一方、Ｉｎの添加量が２０重量％を超える場
合には、半田濡れ性の低下が起こるからである。The reason why the addition amount of In is set to 0.5 to 20% by weight of the total 100% by weight is that when the addition amount of In is less than 0.5% by weight, the strength decreases. Because. On the other hand, when the addition amount of In exceeds 20% by weight, the solder wettability decreases.
【００１９】なお、好ましくは半田付け性を向上させる
ためにもＺｎの添加量は０．０１〜１．０重量％であ
る。Preferably, the amount of Zn added is 0.01 to 1.0% by weight to improve the solderability.
【００２０】また、より好ましくは耐電極喰われ性を向
上させるためにもＺｎの添加量は０．０５〜１．０重量
％であり、さらに好ましくはＺｎの添加量は０．１〜
１．０重量％である。Further, more preferably, the addition amount of Zn is 0.05 to 1.0% by weight, and more preferably, the addition amount of Zn is 0.1 to 1.0% in order to improve the electrode erosion resistance.
1.0% by weight.
【００２１】また、最適な範囲はＺｎの添加量が０．１
〜０．５重量％の範囲であり、特にＺｎの添加量が０．
４重量％のときが好ましい。The optimum range is when the amount of Zn added is 0.1.
To 0.5% by weight, in particular, when the amount of Zn added is 0.1%.
4% by weight is preferred.
【００２２】また、本発明でいう溶融したＳｎへ拡散し
やすい導体の組成とは、例えば、Ａｇ、Ａｇ／Ｐｄ、Ａ
ｇ／Ｐｔ、Ａｕ、Ｃｕなどが代表的である。挙げられ
る。このような電極喰われしやすい導体を有する部品に
用いても、半田付け性を維持しつつ電極喰われ抑制が可
能となる。In the present invention, the composition of a conductor which is easily diffused into molten Sn includes, for example, Ag, Ag / Pd, A
g / Pt, Au, Cu and the like are typical. No. Even when used for a component having such a conductor that is liable to be eroded, the erosion of the electrode can be suppressed while maintaining solderability.
【００２３】なお、上記の導体以外にもＮｉ、Ｓｎ、Ａ
ｌ導体などの電極喰われしにくい導体にも用いることが
可能である。In addition to the above conductors, Ni, Sn, A
It is also possible to use a conductor such as a 1 conductor that is not easily eroded by electrodes.
【００２４】また、上記導体には必要に応じてガラスフ
リットや種々の添加剤が添加されるが、導電成分である
金属組成が上記のような組成であれば同様の効果が得ら
れることは勿論である。Further, glass frit and various additives are added to the above-mentioned conductors as necessary. However, if the metal composition as the conductive component is as described above, the same effect can be obtained as a matter of course. It is.
【００２５】ここで、本発明においては、半田組成とし
て上記成分以外にＳｎとＺｎの２成分系を示している
が、不可避不純物を含むものであってもよい。不可避不
純物としては半田を製造するときに混入する元素もしく
は元々入っていた元素、例えばＰｂ、Ｂｉ、Ｃｕ、Ｎａ
などが挙げられる。Here, in the present invention, a two-component system of Sn and Zn is shown as a solder composition in addition to the above-described components, but the solder composition may contain unavoidable impurities. As inevitable impurities, elements mixed in when manufacturing solder or elements originally contained, for example, Pb, Bi, Cu, Na
And the like.
【００２６】また、本発明はＰｂフリー半田を用いるこ
とを目的とした半田付け物品に関するものであるが、本
発明の効果、特に電極喰われ防止効果については従来の
Ｓｎ／Ｐｂ系半田に対しても同様の効果が得られること
を確認している。The present invention also relates to a soldering article for the purpose of using Pb-free solder. The effect of the present invention, particularly the effect of preventing electrode erosion, is compared with that of a conventional Sn / Pb-based solder. Has confirmed that the same effect can be obtained.
【００２７】本発明の半田付け物品は、例えば、主成分
のＳｎに上記添加成分Ｚｎを溶解させた半田をボール状
に加工し、半田ボールを部品上に乗せてフラックスを塗
布した後、大気中で所定の温度に加熱して部品のを用い
て物品の導体を接合することにより容易に作製すること
が可能である。The soldering article of the present invention is obtained, for example, by processing a solder in which the above-mentioned additional component Zn is dissolved in Sn as a main component into a ball shape, placing the solder ball on a component and applying a flux, and then applying the flux to the atmosphere. It can be easily produced by heating to a predetermined temperature and joining the conductors of the article using the parts.
【００２８】なお、一般的に半田付け性向上のためにＮ
2雰囲気中で半田付けすることが多いが、本発明ではＺ
ｎの添加量が少ないために大気中で半田付けすることが
可能である。In general, N is used to improve solderability.
2 Soldering is often performed in an atmosphere.
Since the addition amount of n is small, it is possible to perform soldering in the air.
【００２９】なお、本発明の半田付け物品とは、接合さ
れる部品そのものと、部品の導体同士を電気的、機械的
に接合した半田接合部とを含めた全体を意味するもので
あり、さまざまな形態があるが、例えば、部品搭載基板
に形成された導体と部品に形成された導体を電気的、機
械的に接続させるために半田付けさせたものや、電子部
品素子と端子とを電気的、機械的に接続させるために半
田付けさせたものや、電子部品素子の電極同士を電気
的、機械的に接続させるために半田付けさせたものなど
がある。The soldering article of the present invention means the whole including the parts to be joined and the solder joints where the conductors of the parts are electrically and mechanically joined to each other. For example, a conductor formed on a component mounting board and a conductor formed on a component are soldered for electrical and mechanical connection, or an electronic component element and a terminal are electrically connected. Some of them are soldered for mechanical connection, others are soldered for electrically and mechanically connecting electrodes of electronic component elements.
【００３０】また、上記部品搭載基板としては、例え
ば、ガラスエポキシ製のプリント基板やフェノール製の
プリント基板、アルミナやムライトなどのセラミック基
板、金属の表面にセラミック等の絶縁膜を有する基板な
どが挙げられる。さらに、上記導体としては、プリント
基板等の配線回路、電子部品の端子電極、リード端子な
どが挙げられる。Examples of the component mounting board include a glass epoxy printed board, a phenol printed board, a ceramic board such as alumina and mullite, and a board having an insulating film such as ceramic on a metal surface. Can be Further, examples of the conductor include a wiring circuit such as a printed board, a terminal electrode of an electronic component, and a lead terminal.
【００３１】このようにして作製された本発明の半田付
け物品は、半田付け性が良好であり、かつ、優れた耐電
極喰われ性を有しているため、半田付け温度を自由に設
定することが可能で作業性に優れたものとなり、かつ、
Ａｇ等の高価な電極喰われ抑制元素の添加量を少なくす
ることが可能となる。次に、本発明を実施例に基づき、
さらに具体的に説明するが、本発明はかかる実施例のみ
に限定されるものではない。The soldering article of the present invention thus produced has good solderability and excellent resistance to electrode erosion, so that the soldering temperature can be freely set. And workability is excellent, and
It is possible to reduce the amount of the expensive electrode erosion suppressing element such as Ag. Next, based on the present invention,
Although described more specifically, the present invention is not limited to only such examples.
【００３２】[0032]
【実施例】表１に、本実施例である実施例１〜実施例２
５の組成を示す。なお、参考例として、参考例１〜参考
例３の組成を表１に併せて示す。[Embodiments] Table 1 shows Examples 1 and 2 of the present embodiment.
5 shows the composition. Table 1 also shows the compositions of Reference Examples 1 to 3 as Reference Examples.
【００３３】[0033]
【表１】 [Table 1]
【００３４】さらに表１に示した半田について、半田付
け性、耐電極喰われ性の評価結果を表２に示す。Further, with respect to the solders shown in Table 1, the evaluation results of the solderability and the resistance to electrode erosion are shown in Table 2.
【００３５】[0035]
【表２】 [Table 2]
【００３６】ここで、半田付け性については、半田広が
り率（ＪＩＳＺ３１９７に準拠）を用いて評価をおこな
った。Here, the solderability was evaluated using the solder spread rate (based on JISZ3197).
【００３７】実施例８〜２２、２４〜２５についてはい
ずれも半田広がり率が７０％以上であり半田付け性が非
常に良好であった。また、実施例７、２３は半田広がり
率が６５％以上であり良好な半田付け性であった。ま
た、実施例１〜６は半田広がり率がいずれも６５％以下
であり半田付け性に劣化がみられた。これは、Ｚｎの添
加量が５．０重量％、３．０重量％であるため、Ｚｎの
酸化の影響が出たからである。In Examples 8 to 22 and 24 to 25, the solder spread ratio was 70% or more, and the solderability was very good. In Examples 7 and 23, the solder spread rate was 65% or more, indicating good solderability. Further, in Examples 1 to 6, the solder spread rate was 65% or less, and the solderability was deteriorated. This is because the amount of Zn added was 5.0% by weight and 3.0% by weight, which affected the oxidation of Zn.
【００３８】また、参考例１〜３についてもいずれも半
田広がり率が７０％以上で非常に良好な半田付け性であ
った。In each of Reference Examples 1 to 3, the solder spread ratio was 70% or more, and the solderability was very good.
【００３９】次に、電極喰われ性については電極喰われ
時間という方法で測定を行った。あらかじめ作製した半
田ボールを、Ａｇ電極、Ａｇ／Ｐｄ電極、Ｃｕ電極を印
刷・焼成したアルミナ基板上に乗せ、フラックスを塗布
した後、大気中２７０℃ホットプレート上で加熱したと
きの電極消失時間を電極喰われ時間とした。Next, the electrode erosion was measured by a method called electrode erosion time. A solder ball prepared in advance is placed on an alumina substrate on which an Ag electrode, an Ag / Pd electrode, and a Cu electrode are printed and fired, and after applying a flux, the electrode disappearance time when heated on a hot plate at 270 ° C. in the atmosphere is measured. The electrode erosion time.
【００４０】実施例１〜１０、１３〜２５は電極喰われ
時間が１００秒以上であり、いずれも非常に良好な耐電
極喰われ性を示した。また、実施例１１は電極喰われ時
間が４０秒以上であり良好な耐電極喰われ性を示した。
実施例１２は電極喰われ時間が４０秒以下であり、耐電
極喰われ性に劣化がみられた。これは、添加したＺｎの
量が０．０１重量％と少なく、電極喰われ抑制効果が少
ないためである。また、参考例１〜３は電極喰われ時間
が４０秒以下であり耐電極喰われ性に問題がみられた。In Examples 1 to 10 and 13 to 25, the electrode erosion time was 100 seconds or more, and all exhibited very good electrode erosion resistance. Also, in Example 11, the electrode erosion time was 40 seconds or more, indicating good electrode erosion resistance.
In Example 12, the electrode erosion time was 40 seconds or less, and the electrode erosion resistance was deteriorated. This is because the amount of Zn added is as small as 0.01% by weight, and the effect of suppressing electrode erosion is small. In Reference Examples 1 to 3, the electrode erosion time was 40 seconds or less, and there was a problem in the electrode erosion resistance.
【００４１】[0041]
【発明の効果】本発明の半田付け物品を用いれば、半田
接合部において半田付け性が良好であるとともに、優れ
た耐電極喰われ性を備えることが可能である。したがっ
て、他の電極喰われ抑制元素を添加することなく電極喰
われ対策をおこなうことが可能となるため、コストダウ
ンが可能となる。By using the soldered article of the present invention, it is possible to have good solderability at the solder joint and excellent electrode erosion resistance. Therefore, it is possible to take measures against electrode erosion without adding another electrode erosion suppressing element, thereby enabling cost reduction.
【００４２】また、Ｚｎの添加量が少ないため、Ｎ2雰
囲気中で半田付けしなくても大気中で半田付けすること
が可能である。Further, since the amount of Zn added is small, it is possible to perform soldering in air without soldering in N 2 atmosphere.
【００４３】また、Ｐｂフリー半田で課題となっている
電極喰われを抑制できるため、半田のＰｂフリー化がよ
り実用的となり、環境にやさしい製品を提供することが
可能になる。Further, since the electrode erosion, which is a problem with Pb-free solder, can be suppressed, the use of Pb-free solder becomes more practical, and an environmentally friendly product can be provided.
Claims (6)
を有する部品を半田により接合してなる半田付け物品で
あって、 前記半田の組成は、Ｚｎ０．０１〜５．０重量％と、 Ａｇ０．５〜９重量％、Ｃｕ０．５〜２重量％、Ｓｂ
０．５〜１４重量％、Ｂｉ０．５〜３０重量％、Ｉｎ
０．５〜２０重量％のうち少なくとも１種類と、 残りＳｎとを含有してなることを特徴とする半田付け物
品。1. A soldering article formed by joining a component having a conductor having a composition that is easily diffused into molten Sn by soldering, wherein the composition of the solder is 0.01 to 5.0% by weight of Zn; 0.5 to 9% by weight, Cu 0.5 to 2% by weight, Sb
0.5 to 14% by weight, Bi 0.5 to 30% by weight, In
A soldered article comprising at least one of 0.5 to 20% by weight and the balance of Sn.
Ａｇ／Ｐｔ、Ａｕ、Ｃｕのうち少なくとも１種類である
ことを特徴とする請求項１に記載の半田付け物品。2. The composition of the conductor is Ag, Ag / Pd,
The soldered article according to claim 1, wherein the soldered article is at least one of Ag / Pt, Au, and Cu.
０重量％と残りＳｎとを含有してなることを特徴とする
請求項１または請求項２に記載の半田付け物品。3. A solder composition according to claim 1, wherein the composition of Zn is 0.01-1.
3. The soldered article according to claim 1, comprising 0% by weight and the balance of Sn.
０重量％と残りＳｎとを含有してなることを特徴とする
請求項１から請求項３のいずれかに記載の半田付け物
品。4. The composition of the solder is Zn 0.05-1.
The soldered article according to any one of claims 1 to 3, comprising 0% by weight and the balance of Sn.
重量％と残りＳｎとを含有してなることを特徴とする請
求項１から請求項４のいずれかに記載の半田付け物品。5. The composition of the solder, wherein Zn is 0.1 to 1.0.
The soldering article according to any one of claims 1 to 4, wherein the soldering article comprises a weight percent and the balance of Sn.
重量％と残りＳｎとを含有してなることを特徴とする請
求項１から請求項５のいずれかに記載の半田付け物品。6. The composition of the solder is Zn 0.1 to 0.5.
The soldering article according to any one of claims 1 to 5, wherein the soldering article comprises a weight percent and the balance of Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8351057A JPH10193171A (en) | 1996-12-27 | 1996-12-27 | Soldering article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8351057A JPH10193171A (en) | 1996-12-27 | 1996-12-27 | Soldering article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10193171A true JPH10193171A (en) | 1998-07-28 |
Family
ID=18414755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8351057A Pending JPH10193171A (en) | 1996-12-27 | 1996-12-27 | Soldering article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10193171A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6176947B1 (en) | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| JP2002239780A (en) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | Solder alloy, solder ball and electronic member having solder bump |
| JP2002273596A (en) * | 2001-03-19 | 2002-09-25 | Mitsui Mining & Smelting Co Ltd | Tin-silver-base solder alloy |
| SG98429A1 (en) * | 1999-10-12 | 2003-09-19 | Singapore Asahi Chemical & Solder Ind Pte Ltd | Lead-free solders |
| JP2006289493A (en) * | 2005-03-17 | 2006-10-26 | Tamura Kaken Co Ltd | Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate |
| CN1311950C (en) * | 2003-10-10 | 2007-04-25 | 松下电器产业株式会社 | Pb-free solder alloy, and solder material and solder joint using same |
| JP2009078299A (en) * | 2007-09-07 | 2009-04-16 | Hitachi Metals Ltd | Solder alloy, solder ball using it, and soldered part excellent in drop impact resistance |
| EP2312622A2 (en) | 2009-10-15 | 2011-04-20 | Mitsubishi Electric Corporation | Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| CN107984110A (en) * | 2017-11-08 | 2018-05-04 | 昆明理工大学 | A kind of low temperature lead-free solder alloy |
-
1996
- 1996-12-27 JP JP8351057A patent/JPH10193171A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6176947B1 (en) | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| SG98429A1 (en) * | 1999-10-12 | 2003-09-19 | Singapore Asahi Chemical & Solder Ind Pte Ltd | Lead-free solders |
| JP2002239780A (en) * | 2001-02-09 | 2002-08-28 | Nippon Steel Corp | Solder alloy, solder ball and electronic member having solder bump |
| JP2002273596A (en) * | 2001-03-19 | 2002-09-25 | Mitsui Mining & Smelting Co Ltd | Tin-silver-base solder alloy |
| CN1311950C (en) * | 2003-10-10 | 2007-04-25 | 松下电器产业株式会社 | Pb-free solder alloy, and solder material and solder joint using same |
| JP2006289493A (en) * | 2005-03-17 | 2006-10-26 | Tamura Kaken Co Ltd | Sn-zn based solder, lead-free solder, its solder work, solder paste, and electronic component-soldering substrate |
| JP2009078299A (en) * | 2007-09-07 | 2009-04-16 | Hitachi Metals Ltd | Solder alloy, solder ball using it, and soldered part excellent in drop impact resistance |
| EP2312622A2 (en) | 2009-10-15 | 2011-04-20 | Mitsubishi Electric Corporation | Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| US8334598B2 (en) | 2009-10-15 | 2012-12-18 | Mitsubishi Electric Corporation | Power semiconductor device and manufacturing method therefor |
| EP2750173A2 (en) | 2009-10-15 | 2014-07-02 | Mitsubishi Electric Corporation | Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| CN107984110A (en) * | 2017-11-08 | 2018-05-04 | 昆明理工大学 | A kind of low temperature lead-free solder alloy |
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