JP3684811B2 - Solder and soldered articles - Google Patents
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【０００１】
【発明の属する技術分野】
本発明は、半田ならびに半田付け物品に関するものである。
【０００２】
【従来の技術】
従来より、電子機器や電子部品の電気的・機械的な接続を得るために半田が用いられている。この半田は、ＳｎとＰｂを主成分としたもの（以下Ｓｎ−Ｐｂ系半田とする。）が一般的に用いられてきたが、地球環境を考慮してＰｂを含まないＳｎを主成分とし残部がＡｇ，Ｂｉ，Ｃｕ，Ｉｎ，Ｓｂなどからなる半田（以下、Ｐｂフリー半田とする。）が用いられるようになってきている。
【０００３】
近年においてはこのＰｂフリー半田を用いることによって、半田付け性が良好な電気的接合部を有する半田付け物品が製造されてきた。
【０００４】
【発明が解決しようとする課題】
しかしながら、Ｓｎが主成分である半田、特にＰｂフリー半田を用いた半田付け物品では、半田付け時に電極喰われが起こったり、高温放置や熱エージングを行った場合に、Ｓｎの拡散による電気的、機械的性質の劣化が起こるといった問題点があった。
【０００５】
本発明の目的は、半田付け時または半田付け後熱エージングを行った時に、電極喰われや特性劣化が生じにくいＰｂフリー半田ならびに半田付け物品を提供することにある。
【０００６】
【課題を解決するための手段】
本発明は、上記の課題を解決するためにＰｂフリー半田ならびに半田付け物品を完成するに至った。本願第１の発明のＰｂフリー半田は、不可避不純物を除き、Ｃｏ０．１〜１重量％，Ｆｅ０．１〜０．２重量％，Ｍｎ０．１〜０．２重量％およびＣｒ０．１〜０．２重量％から選ばれる少なくとも１種類と、Ｃｕ０．５〜２重量％と、残部がＳｎと、からなることを特徴とするを特徴とする。
【０００７】
また、本願第２の発明のＰｂフリー半田においては、不可避不純物を除き、Ｍｎ０．１〜０．２重量％およびＣｒ０．１〜０．２重量％から選ばれる少なくとも１種類と、Ａｇ０．５〜９重量％と、残部がＳｎと、からなることを特徴とするを特徴とする。また、本願第３の発明のＰｂフリー半田においては、不可避不純物を除き、Ｍｎ０．０１〜０．２重量％およびＣｒ０．０１〜０．２重量％から選ばれる少なくとも１種類と、Ｓｂ０．５〜５重量％と、残部がＳｎと、からなることを特徴とする。
【０００８】
また、本発明の半田付け物品は、溶融したＳｎへ拡散しやすい遷移金属導体を有する部品を半田により接合してなる半田付け物品であって、半田は、上述の第１または第２の発明のＰｂフリー半田を用いたことを特徴とする。
【０００９】
また、本発明の半田付け物品においては、遷移金属導体は、Ｃｕ，Ａｇ，Ｎｉ，Ａｕ，Ｐｄ，Ｐｔ，Ｚｎの単体もしくはそれらの合金のうち少なくとも１種類を用いることを特徴とする。
【００１０】
以下本発明の実施の形態について説明する。本願第１の発明のＰｂフリー半田は、Ｃｏ，Ｆｅ，ＭｎおよびＣｒから選ばれる少なくとも１種類と、Ｃｕと、Ｓｎと（ただしＰｄを含まず。）、を含有する組成である。また、本願第２の発明のＰｂフリー半田は、ＭｎおよびＣｒから選ばれる少なくとも１種類と、ＡｇおよびＳｂから選ばれる少なくとも１種類と、Ｓｎと（ただしＰｄを含まず。）、を含有する組成である。そして、本発明の半田付け物品は、溶融したＳｎへ拡散しやすい遷移金属導体を有する部品を半田により接合してなる半田付け物品であって、半田は、上述した第１または第２の発明のＰｂフリー半田を用いる。このような組成により、半田付け性、接合強度が良好であるとともに、十分な耐電極喰われ性を有する半田付け物品を提供することが可能となる。
【００１１】
すなわち、微少量添加されたＣｏ，Ｆｅ，Ｍｎ，Ｃｒが導体と半田の接合界面に偏析層を形成し、導体の溶融半田中への拡散を防ぎ、電極喰われを防止するためである。
【００１２】
上記Ｃｏの添加量を全体１００重量％のうち０．０１〜１重量％としたのは、Ｃｏの添加量が０．０１重量％未満の場合には耐電極喰われ性が劣化するからである。一方、Ｃｏの添加量が１重量％を超える場合には液相線温度が上昇し、溶融特性を阻害するからである。なお、より好ましいＣｏ添加量は０．０１〜０．５重量％の範囲であり、特にＣｏ添加量が０．５重量％のときが好ましい。
【００１３】
上記Ｆｅの添加量を全体１００重量％のうち０．０１〜０．２重量％としたのは、Ｆｅの添加量が０．０１重量％未満の場合には耐電極喰われ性が劣化するからである。一方、Ｆｅの添加量が０．２重量％を超える場合には液相線温度が上昇し、溶融特性を阻害するからである。なお、より好ましいＦｅ添加量は０．０１〜０．１重量％の範囲であり、特にＦｅ添加量が０．１重量％のときが望ましい。
【００１４】
上記Ｍｎの添加量を全体１００重量％のうち０．０１〜０．２重量％としたのは、Ｍｎの添加量が０．０１重量％未満の場合には耐電極喰われ性が劣化するからである。一方、Ｍｎの添加量が０．２重量％を超える場合には液相線温度が上昇し、溶融特性を阻害するからである。なお、より好ましいＭｎ添加量は０．０１〜０．１重量％の範囲であり、特にＭｎ添加量が０．１重量％のときが望ましい。
【００１５】
上記Ｃｒの添加量を全体重量１００重量％のうち０．０１〜０．２重量％としたのは、Ｃｒの添加量が０．０１重量％未満の場合には耐電極喰われ性が劣化するからである。一方、Ｃｒの添加量が０．２重量％を超える場合には液相線温度が上昇し、溶融特性を阻害するからである。なお、より好ましいＣｒ添加量は０．０１〜０．１重量％の範囲であり、特にＣｒ添加量が０．１重量％のときが望ましい。
【００１７】
上記Ａｇの添加量を全体重量１００重量％のうち０．５〜９としたのは、Ａｇの添加量が０．５重量％未満の場合には強度改善効果が小さいからである。一方、Ａｇの添加量が９重量％を超える場合には、過剰のＡｇ3Ｓｎ金属間化合物が析出することによる接合強度低下と、半田液相線温度が上昇することによる溶融特性が阻害されるからである。
【００１８】
上記Ｃｕの添加量を全体重量１００重量％のうち０．５〜２重量％としたのは、Ｃｕの添加量が０．５重量％未満の場合には、強度改善効果が小さいからである。一方、Ｃｕの添加量が２重量％を超える場合には、過剰のＣｕ6Ｓｎ5，Ｃｕ3Ｓｎ金属間化合物が析出することによる接合強度低下と、半田液相線温度が上昇することによる溶融特性が阻害されるからである。
【００１９】
上記Ｓｂの添加量を全体重量１００重量％のうち０．５〜５重量％としたのは、Ｓｂの添加量が０．５重量％未満の場合には、強度改善効果が小さいからである。一方、Ｓｂの添加量が５重量％を超える場合には、伸びが低下することによって熱衝撃性や加工性が阻害されるからである。
【００２０】
本発明でいう溶融したＳｎへ拡散しやすい遷移金属導体の組成としては、Ｃｕ，Ａｇ，Ｎｉ，Ａｕ，Ｐｄ，Ｐｔ，Ｚｎの単体などが代表的である。なお、これらの遷移金属の合金、例えばＡｇ／Ｐｄ，Ａｇ／Ｐｔ等でもよい。より好ましくは、Ｃｕ，Ａｇ，Ｎｉの単体もしくはその合金である。このような電極喰われしやすい導体を有する物品に用いても、半田付け性、接合強度を維持しつつ電極喰われ抑制が可能となる。
【００２１】
上記遷移金属導体には必要に応じてガラスフリットや種々の添加剤（金属酸化物など）が添加されるが、導電成分である金属組成が上記のような組成であれば同様の効果が得られることは勿論である。また、半田組成として、作業温度を下げる目的でＢｉ，Ｉｎ等の低融点金属を添加した場合も同様の効果が得られる。
【００２２】
ここで、本発明においては、半田組成として上記成分以外に不可避不純物を含むものであってもよい。不可避不純物としては、半田を製造するときに混入する元素もしくは元々入っていた元素、例えばＰｂ，Ｂｉ，Ｃｕ，Ｎａなどが挙げられる。
【００２３】
本発明の半田付け物品は、例えば、主成分のＳｎに上記添加成分を溶解させたＰｂフリー半田をボール状に加工し、半田ボ−ルを部品上あるいは基板上に載せてフラックスを塗布した後、大気中で所定の温度に加熱して部品の導体を接合することにより容易に作成することが可能である。
【００２４】
なお、一般的には半田付け性向上のためにＮ2雰囲気で半田付けすることが多いが、本発明ではＣｏ，Ｆｅ，Ｍｎ，Ｃｒの添加量が少ないため、大気中で半田付けすることが可能である。
【００２５】
本発明の半田付け物品とは、接合される部品そのものと、部品の導体同士を電気的、機械的に接合した半田接合部とを含めた全体を意味するものであり、さまざまな形態があるが、例えば、部品搭載基板に形成された導体と部品に形成された導体を電気的、機械的に接続させるために半田付けさせたものや、電子部品素子と端子を電気的、機械的に接続させるために半田付けさせたものや、電子部品素子の電極同士を電気的、機械的に接続させるために半田付けさせたものなどが代表的である。
【００２６】
上記部品搭載基板としては、例えば、ガラスエポキシ製のプリント基板やフェノール製のプリント基板、アルミナなどのセラミック基板、金属の表面にセラミック等の絶縁膜を有する基板などが挙げられる。さらに、上記導体としては、プリント基板等の配線回路、電子部品の端子電極、リード端子などが挙げられる。
【００２７】
このようにして作製された本発明のＰｂフリー半田ならびに半田付け物品は、半田付け性、接合強度が良好であり、かつ、優れた耐電極喰われ性を有しているため、半田付け温度を自由に設定することが可能で作業性に優れたものとなる。また、Ａｇ等の高価な電極喰われ抑制元素の添加量を少なくすることが可能となる。次に、本発明を実施例に基づき、さらに具体的に説明するが、本発明はかかる実施例のみに限定されるものではない。
【００２８】
【実施例】
表１に本実施例で用いる半田組成を示す。なお、比較例の組成も表１に併せて示す。また、本発明には含まれないＰｄを、含有する参考例の組成も表１に併せて示す。なお、前記参考例は、実施例７〜１１、実施例１４〜１６および実施例２１〜２３である。
【００２９】
【表１】
さらに表１に示したＰｂフリー半田について、半田付け時の耐電極喰われ性、半田付け性の評価結果を表２に示す。
【００３１】
【表２】
ここで、半田付け時の耐電極喰われ性評価は静電容量変化法で測定をおこなった。Ｃｕ電極（膜厚３μｍ）或いはＡｇ電極（膜厚２０μｍ）を印刷焼成した単板コンデンサを半田に浸漬し、浸漬前後の静電容量の差分値をとり、浸漬前の静電容量に対する前記差分値を求めて電極の残存率を算出した。評価を行った半田付け温度は表２に示す。Ｃｕ電極は１０秒間浸漬後の容量変化、Ａｇ電極は喰われ易いので３秒間浸漬後の容量変化を測定した。
【００３３】
Ｃｕ電極において、いずれの場合も比較例と比較すると、本発明の添加元素が電極食われ抑制に効果があった。実施例１〜３、実施例５〜６、実施例８〜１１、実施例１２〜１３、実施例１５〜２３は電極残存率が９５％以上であり、いずれも非常に良好な耐電極喰われ性を示した。また、代表的なＰｂフリー半田である比較例１〜２では、電極残存率が９０％以下であり、耐電極喰われ性に問題が見られた。
【００３４】
実施例４、７は７７〜８６％の電極残存率であり他の実施例より電極喰われ抑制効果が小さいが、これは有効元素の添加量が少ないためである。但しいずれの組成も、半田付け条件次第では使用可能なレベルである。
【００３５】
またＡｇ電極においてもＣｕと類似の傾向があり、いずれの場合も比較例と比較すると本発明の添加元素が電極食われ抑制に効果があった。
【００３６】
半田付け性については、半田広がり率（ＪＩＳＺ３１９７に準拠）を用いて評価をおこなった。実施例１、実施例４、実施例７〜８、実施例１１、実施例１４〜１７、実施例２１〜２３については、いずれも半田広がり率が７０％以上であり、非常に良好な半田付け性であった。また比較例１〜３についても、いずれも半田広がり率が７０％以上であり、非常に良好な半田付け性であった。
【００３７】
実施例３、実施例６、実施例９〜１０は半田広がり率が低下しているが、これは有効元素の添加量が多いために液相温度が上昇し、半田の流動性が阻害されたためである。また実施例２〜３、実施例５〜６、実施例１２〜１３、実施例１９〜２０は他の実施例より低い半田広がり率を示しているが、これは有効元素（Ｍｎ、Ｃｒ）が酸化しやすいためである。但しいずれの組成も、半田付け条件次第では使用可能なレベルである。
【００３８】
また実施例１６、実施例２３に示すように、Ｓｂ、Ａｇ、Ｃｕの添加量を増加すると半田広がり率が高くなっているが、これは液相温度の上昇に伴い半田付け温度を上昇させた影響がでたものである。
【００３９】
【発明の効果】
このように本発明の半田付け物品を用いれば、半田接合部において半田付け性が良好であるとともに、優れた耐電極喰われ性を備えることが可能である。また、この耐電極喰われ性は、半田付け時の電極喰われにとどまらず、半田付け後の半田付け物品の高温放置時の電極喰われについても抑制可能である。
【００４０】
また、Ｐｂフリー半田で課題となっている電極喰われを抑制できるため、半田のＰｂフリー化がより実用的となり、環境にやさしい製品を提供することが可能になる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to solder and soldered articles.
[0002]
[Prior art]
Conventionally, solder is used to obtain electrical and mechanical connections between electronic devices and electronic components. As this solder, Sn and Pb as main components (hereinafter referred to as Sn-Pb solder) has been generally used, but considering the global environment, Sn containing Pb as a main component and the remainder. However, solder made of Ag, Bi, Cu, In, Sb or the like (hereinafter referred to as Pb-free solder) has been used.
[0003]
In recent years, by using this Pb-free solder, a soldered article having an electrical joint having good solderability has been manufactured.
[0004]
[Problems to be solved by the invention]
However, in a soldered article using Sn as a main component, in particular, Pb-free solder, when the electrode is eroded during soldering, left at high temperature, or subjected to heat aging, There was a problem that mechanical properties deteriorated.
[0005]
An object of the present invention is to provide a Pb-free solder and a soldered article that are less likely to be eroded or deteriorated in characteristics when soldering or after heat aging.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, the present invention has completed Pb-free solder and soldered articles. The Pb-free solder of the first invention of the present application , except for inevitable impurities, is Co 0.1 to 1 wt%, Fe 0.1 to 0.2 wt%, Mn 0.1 to 0.2 wt%, and Cr 0. It is characterized by comprising at least one selected from 1 to 0.2 wt%, Cu 0.5 to 2 wt%, and the balance Sn .
[0007]
In the Pb-free solder of the second invention of the present application , except for inevitable impurities, at least one selected from Mn 0.1 to 0.2% by weight and Cr 0.1 to 0.2% by weight, Ag0. It is characterized by comprising 5 to 9% by weight and the balance being Sn . In the Pb-free solder of the third invention of the present application, except for inevitable impurities, at least one selected from Mn 0.01 to 0.2 wt% and Cr 0.01 to 0.2 wt%, and Sb 0.5 to It is characterized by comprising 5% by weight and the balance being Sn.
[0008]
The soldering article of the present invention is a soldering article formed by joining parts having a transition metal conductor that easily diffuses into molten Sn by soldering, and the solder is the same as that of the first or second invention described above. Pb-free solder is used.
[0009]
In the soldered article of the present invention, the transition metal conductor is characterized by using at least one of a simple substance of Cu, Ag, Ni, Au, Pd, Pt, Zn or an alloy thereof.
[0010]
Embodiments of the present invention will be described below. This application Pb-free solder of the first aspect of the invention, Co, Fe, and at least one member selected either et Mn and Cr, and Cu, (not including but Pd.) Sn and a composition containing. Also, the Pb-free solder of the second invention, at least one kind selected or found Mn and Cr, and at least one selected from Ag and Sb, (not including but Pd.) Sn and contains Composition. The soldered article of the present invention is a soldered article formed by joining components having a transition metal conductor that is easy to diffuse into molten Sn by soldering, and the solder is the same as that of the first or second invention described above. Pb-free solder is used. With such a composition, it is possible to provide a soldered article having good solderability and bonding strength and having sufficient electrode erosion resistance.
[0011]
That is, Co, Fe, Mn, and Cr added in a small amount form a segregation layer at the interface between the conductor and the solder, prevent diffusion of the conductor into the molten solder, and prevent electrode erosion.
[0012]
The reason why the amount of Co added is 0.01 to 1% by weight out of 100% by weight is that when the amount of Co is less than 0.01% by weight, electrode erosion resistance deteriorates. . On the other hand, when the added amount of Co exceeds 1% by weight, the liquidus temperature rises and the melting characteristics are hindered. A more preferable Co addition amount is in the range of 0.01 to 0.5% by weight, and particularly preferable when the Co addition amount is 0.5% by weight.
[0013]
The reason why the addition amount of Fe is set to 0.01 to 0.2% by weight out of 100% by weight is that the resistance to electrode corrosion deteriorates when the addition amount of Fe is less than 0.01% by weight. It is. On the other hand, when the addition amount of Fe exceeds 0.2% by weight, the liquidus temperature rises and the melting characteristics are hindered. A more preferable Fe addition amount is in the range of 0.01 to 0.1% by weight, and it is particularly preferable when the Fe addition amount is 0.1% by weight.
[0014]
The reason why the amount of Mn added is 0.01 to 0.2% by weight out of 100% by weight is that when the amount of Mn added is less than 0.01% by weight, the electrode erosion resistance deteriorates. It is. On the other hand, when the amount of Mn added exceeds 0.2% by weight, the liquidus temperature rises and the melting characteristics are hindered. A more preferable amount of Mn added is in the range of 0.01 to 0.1% by weight, and it is particularly desirable when the amount of Mn added is 0.1% by weight.
[0015]
The reason why the amount of Cr added is 0.01 to 0.2% by weight out of 100% by weight is that when the amount of Cr is less than 0.01% by weight, the electrode erosion resistance deteriorates. Because. On the other hand, when the added amount of Cr exceeds 0.2% by weight, the liquidus temperature rises and the melting characteristics are hindered. A more preferable Cr addition amount is in the range of 0.01 to 0.1% by weight, and it is particularly desirable when the Cr addition amount is 0.1% by weight.
[0017]
The reason why the amount of Ag added is 0.5 to 9 out of the total weight of 100% by weight is that the strength improving effect is small when the amount of Ag added is less than 0.5% by weight. On the other hand, when the added amount of Ag exceeds 9% by weight, the bonding strength decreases due to the precipitation of excess Ag 3 Sn intermetallic compound, and the melting characteristics due to the increase in the solder liquidus temperature are hindered. Because.
[0018]
The reason why the amount of Cu added is 0.5 to 2% by weight out of the total weight of 100% by weight is that the effect of improving the strength is small when the amount of Cu added is less than 0.5% by weight. On the other hand, when the addition amount of Cu exceeds 2% by weight, the fusion strength decreases due to the precipitation of excess Cu 6 Sn 5 , Cu 3 Sn intermetallic compound, and the melting due to the increase of the solder liquidus temperature. This is because the properties are inhibited.
[0019]
The reason why the amount of Sb added is 0.5 to 5% by weight out of the total weight of 100% by weight is that the strength improving effect is small when the amount of Sb added is less than 0.5% by weight. On the other hand, when the added amount of Sb exceeds 5% by weight, the thermal shock resistance and workability are hindered by the decrease in elongation.
[0020]
As the composition of the transition metal conductor that easily diffuses into molten Sn in the present invention, a simple substance such as Cu, Ag, Ni, Au, Pd, Pt, and Zn is typical. An alloy of these transition metals, such as Ag / Pd, Ag / Pt, etc. may be used. More preferably, it is a simple substance of Cu, Ag, Ni or an alloy thereof. Even if it is used for an article having such a conductor that is easily eroded by electrodes, it is possible to suppress the erosion of electrodes while maintaining solderability and bonding strength.
[0021]
If necessary, glass frit and various additives (metal oxide, etc.) are added to the transition metal conductor, but the same effect can be obtained if the metal composition as the conductive component is as described above. Of course. The same effect can be obtained when a low melting point metal such as Bi or In is added as a solder composition for the purpose of lowering the working temperature.
[0022]
Here, in the present invention, the solder composition may contain inevitable impurities in addition to the above components. Inevitable impurities include elements that are mixed in when solder is manufactured or elements that were originally contained, such as Pb, Bi, Cu, and Na.
[0023]
The soldered article of the present invention is obtained, for example, by processing Pb-free solder in which the above-mentioned additive components are dissolved in Sn as a main component into a ball shape, and placing a solder ball on a component or a substrate and applying a flux. It can be easily produced by joining the conductors of components by heating to a predetermined temperature in the atmosphere.
[0024]
In general, soldering is often performed in an N 2 atmosphere in order to improve solderability. However, in the present invention, since the amount of Co, Fe, Mn, and Cr is small, soldering may be performed in the atmosphere. Is possible.
[0025]
The soldered article of the present invention means the whole including the parts to be joined and the solder joints where the conductors of the parts are joined together electrically and mechanically, and there are various forms. For example, a solder formed to electrically and mechanically connect a conductor formed on a component mounting board and a conductor formed on a component, or an electronic component element and a terminal are electrically and mechanically connected. Typical examples are soldered for this purpose, and soldered for electrically and mechanically connecting the electrodes of the electronic component element.
[0026]
Examples of the component mounting board include a glass epoxy printed board, a phenol printed board, a ceramic board such as alumina, and a board having an insulating film such as ceramic on a metal surface. Furthermore, examples of the conductor include a wiring circuit such as a printed board, a terminal electrode of an electronic component, and a lead terminal.
[0027]
The Pb-free solder and soldered article of the present invention thus produced have good solderability and bonding strength, and have excellent electrode erosion resistance. It can be set freely and has excellent workability. Moreover, it becomes possible to reduce the addition amount of expensive electrode erosion suppressing elements such as Ag. Next, the present invention will be described more specifically based on examples. However, the present invention is not limited to the examples.
[0028]
【Example】
Table 1 shows the solder composition used in this example. The composition of the comparative example is also shown in Table 1. In addition, Table 1 also shows the compositions of reference examples containing Pd not included in the present invention. The reference examples are Examples 7 to 11, Examples 14 to 16, and Examples 21 to 23.
[0029]
[Table 1]
Further, with respect to the Pb-free solder shown in Table 1, Table 2 shows the evaluation results of the electrode erosion resistance and solderability during soldering.
[0031]
[Table 2]
Here, the electrode erosion resistance evaluation at the time of soldering was measured by a capacitance change method. A single plate capacitor on which a Cu electrode (film thickness: 3 μm) or an Ag electrode (film thickness: 20 μm) is printed and baked is immersed in solder, and a difference value of capacitance before and after immersion is obtained. The residual ratio of the electrode was calculated. The evaluated soldering temperatures are shown in Table 2. The capacity change after immersion for 3 seconds was measured because the Cu electrode was easily eroded and the capacity change after immersion for 10 seconds.
[0033]
In each case, the additive element of the present invention was effective in suppressing the electrode biting in the Cu electrode as compared with the comparative example. In Examples 1 to 3, Examples 5 to 6, Examples 8 to 11, Examples 12 to 13, and Examples 15 to 23, the electrode residual ratio is 95% or more, and all have very good electrode erosion resistance. Showed sex. Further, in Comparative Examples 1 and 2 which are typical Pb-free solders, the electrode remaining rate was 90% or less, and there was a problem in electrode erosion resistance.
[0034]
Examples 4 and 7 have an electrode residual ratio of 77 to 86%, which is less effective in suppressing electrode erosion than the other examples. This is because the amount of effective elements added is small. However, both compositions are usable levels depending on the soldering conditions.
[0035]
In addition, the Ag electrode also has a tendency similar to Cu, and in any case, the additive element of the present invention was effective in suppressing the electrode erosion as compared with the comparative example.
[0036]
The solderability was evaluated using the solder spread ratio (based on JISZ3197). For Example 1, Example 4, Examples 7 to 8, Example 11, Examples 14 to 17, and Examples 21 to 23, the solder spread ratio is 70% or more, and very good soldering is performed. It was sex. Moreover, also about Comparative Examples 1-3, the solder spreading rate was 70% or more, and was very favorable solderability.
[0037]
In Example 3, Example 6, and Examples 9 to 10, the solder spreading ratio is reduced, but this is because the liquid phase temperature is increased due to the large amount of the effective element added, and the solder fluidity is hindered. It is. Moreover, although Examples 2-3, Examples 5-6, Examples 12-13, and Examples 19-20 have shown the solder spreading rate lower than another Example, this is effective element (Mn, Cr). It is because it is easy to oxidize. However, both compositions are usable levels depending on the soldering conditions.
[0038]
Moreover, as shown in Example 16 and Example 23, the solder spreading ratio increases as the addition amount of Sb, Ag, and Cu increases, but this increases the soldering temperature as the liquidus temperature increases. It was an influence.
[0039]
【The invention's effect】
As described above, when the soldered article of the present invention is used, it is possible to provide good solderability at the solder joint and to provide excellent electrode erosion resistance. Moreover, this electrode erosion resistance is not limited to the electrode erosion at the time of soldering, but can also suppress the electrode erosion when the soldered article after soldering is left at a high temperature.
[0040]
In addition, since it is possible to suppress the biting of the electrode, which is a problem with Pb-free solder, it becomes more practical to make the solder Pb-free, and it is possible to provide an environment-friendly product.
Claims (5)
Ｃｏ０．１〜１重量％，Ｆｅ０．１〜０．２重量％，Ｍｎ０．１〜０．２重量％およびＣｒ０．１〜０．２重量％から選ばれる少なくとも１種類と、
Ｃｕ０．５〜２重量％と、
残部がＳｎと、からなることを特徴とする、電子部品接合用のＰｂフリー半田。 Excluding inevitable impurities,
Co 0.1 to 1 wt%, Fe 0.1 to 0.2 wt%, and at least one selected from Mn 0.1 to 0.2 wt% and Cr 0.1 to 0.2 wt%,
Cu 0.5-2 wt%,
A Pb-free solder for joining electronic parts , characterized in that the balance consists of Sn .
Ｍｎ０．１〜０．２重量％およびＣｒ０．１〜０．２重量％から選ばれる少なくとも１種類と、
Ａｇ０．５〜９重量％と、
残部がＳｎと、からなることを特徴とする、電子部品接合用のＰｂフリー半田。 Excluding inevitable impurities,
At least one selected from Mn 0.1 to 0.2% by weight and Cr 0.1 to 0.2% by weight;
And Ag0.5~9% by weight,
A Pb-free solder for joining electronic parts , characterized in that the balance consists of Sn .
Ｍｎ０．０１〜０．２重量％およびＣｒ０．０１〜０．２重量％から選ばれる少なくとも１種類と、At least one selected from 0.01 to 0.2% by weight of Mn and 0.01 to 0.2% by weight of Cr;
Ｓｂ０．５〜５重量％と、Sb 0.5 to 5 wt%,
残部がＳｎと、からなることを特徴とする、電子部品接合用のＰｂフリー半田。A Pb-free solder for joining electronic components, characterized in that the balance consists of Sn.
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| JP01614298A JP3684811B2 (en) | 1998-01-28 | 1998-01-28 | Solder and soldered articles |
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| Application Number | Priority Date | Filing Date | Title |
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| JP01614298A JP3684811B2 (en) | 1998-01-28 | 1998-01-28 | Solder and soldered articles |
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| JP2002089344A Division JP3700668B2 (en) | 2002-03-27 | 2002-03-27 | Solder and soldered articles |
| JP2004116071A Division JP3685202B2 (en) | 2004-04-09 | 2004-04-09 | Solder and soldered articles |
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| JP3684811B2 true JP3684811B2 (en) | 2005-08-17 |
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Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3544904B2 (en) * | 1999-09-29 | 2004-07-21 | 株式会社トッパンＮｅｃサーキットソリューションズ | Solder, surface treatment method of printed wiring board using the same, and mounting method of electronic component using the same |
| JP3599101B2 (en) * | 2000-12-11 | 2004-12-08 | 株式会社トッパンＮｅｃサーキットソリューションズ | Solder, surface treatment method of printed wiring board using the same, and mounting method of electronic component using the same |
| JP4152596B2 (en) * | 2001-02-09 | 2008-09-17 | 新日鉄マテリアルズ株式会社 | Electronic member having solder alloy, solder ball and solder bump |
| JP2003001482A (en) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | Lead-free solder alloy |
| US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
| JP3724486B2 (en) * | 2002-10-17 | 2005-12-07 | 千住金属工業株式会社 | Lead-free solder ball alloys and solder balls |
| JP2005040847A (en) * | 2003-07-25 | 2005-02-17 | Hitachi Metals Ltd | Manufacturing method of solder bowl |
| JP4577888B2 (en) * | 2004-02-04 | 2010-11-10 | 千住金属工業株式会社 | Fe erosion prevention solder alloy and Fe erosion prevention method |
| TW200529963A (en) | 2004-02-04 | 2005-09-16 | Senju Metal Industry Co | Solder alloy for preventing Fe erosion and method for preventing Fe erosion |
| TW200603932A (en) * | 2004-03-19 | 2006-02-01 | Senju Metal Industry Co | Lead free solder fall |
| JP2007038228A (en) * | 2005-07-29 | 2007-02-15 | Nihon Almit Co Ltd | Solder alloy |
| US7749336B2 (en) | 2005-08-30 | 2010-07-06 | Indium Corporation Of America | Technique for increasing the compliance of tin-indium solders |
| US9175368B2 (en) * | 2005-12-13 | 2015-11-03 | Indium Corporation | MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability |
| US9260768B2 (en) * | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| JP4076182B2 (en) * | 2006-07-27 | 2008-04-16 | トピー工業株式会社 | Lead-free solder alloy |
| WO2008084603A1 (en) * | 2007-01-11 | 2008-07-17 | Topy Kogyo Kabushiki Kaisha | Manual soldering lead-free solder alloy |
| JP5080946B2 (en) * | 2007-01-11 | 2012-11-21 | 株式会社日本フィラーメタルズ | Lead-free solder alloy for manual soldering |
| JP4683015B2 (en) * | 2007-07-04 | 2011-05-11 | セイコーエプソン株式会社 | Lead-free solder alloy |
| WO2015089470A1 (en) * | 2013-12-13 | 2015-06-18 | Schlumberger Canada Limited | Tin-antimony-based high temperature solder for downhole components |
| JP7155677B2 (en) * | 2018-07-05 | 2022-10-19 | 住友金属鉱山株式会社 | Solder joint electrodes and tin alloy targets for film formation of solder joint electrodes |
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