JPS63283184A - Circuit substrate covered with conductor composition - Google Patents
Circuit substrate covered with conductor compositionInfo
- Publication number
- JPS63283184A JPS63283184A JP11824587A JP11824587A JPS63283184A JP S63283184 A JPS63283184 A JP S63283184A JP 11824587 A JP11824587 A JP 11824587A JP 11824587 A JP11824587 A JP 11824587A JP S63283184 A JPS63283184 A JP S63283184A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- powder
- conductor composition
- inorganic binder
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 239000011521 glass Substances 0.000 claims abstract description 34
- 239000011230 binding agent Substances 0.000 claims abstract description 21
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 12
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims abstract description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 150000003284 rhodium compounds Chemical class 0.000 claims abstract description 7
- 229910000416 bismuth oxide Inorganic materials 0.000 claims abstract description 6
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000010304 firing Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 18
- 239000000843 powder Substances 0.000 abstract description 6
- 239000002075 main ingredient Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 229910052703 rhodium Inorganic materials 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、導体組成物による印刷が行われた焼成された
電気回路を形成するための回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to circuit boards for forming fired electrical circuits printed with conductor compositions.
（従来技術とその問題点）
従来の厚膜配線板においては、絶縁基板として９６％ア
ルミナ板が一般的に使用され、市販の導体ペーストの多
くは、該アルミナ基板への適用を前提として金属粉、ガ
ラスフリットの質及び量を選択するようにしている。そ
して前記導体ペーストを焼成することにより導体組成膜
が形成される。(Prior art and its problems) In conventional thick film wiring boards, 96% alumina plates are generally used as insulating substrates, and many commercially available conductor pastes are made with metal powder on the premise of being applied to alumina substrates. , the quality and quantity of the glass frit are selected. A conductor composition film is then formed by firing the conductor paste.
その際無機結合剤としてのガラスフリットの多くは前記
導体組成膜中に残るが、その一部は前記アルミナ基板中
へ拡散して前記導体組成膜と前記アルミナ基板とが両者
中に存在するガラスフリットにより良好な密着性を示す
ことになる。At this time, most of the glass frit as an inorganic binder remains in the conductor composition film, but a part of it is diffused into the alumina substrate, and the conductor composition film and the alumina substrate form a glass frit that exists in both. This results in better adhesion.
一方近年ガラス又はガラスセラミックで形成された基板
に多層配線用絶縁ペーストや導体ペーストを適用するケ
ースが多くなっている。しかしこれらの場合に上記した
ガラスフリットを含有する無機結合剤を使用するとハン
ダ濡れ性が著しく低下する。On the other hand, in recent years, there have been many cases where insulating paste or conductive paste for multilayer wiring is applied to substrates made of glass or glass ceramic. However, in these cases, if an inorganic binder containing the above-mentioned glass frit is used, the solder wettability will be significantly reduced.
（発明の目的）
本発明は、近年その使用が増大しているガラス又はガラ
スセラミック基板に使用してもハンダ濡れ性を低下させ
ることがなく、かつ導体組成物と基板間に十分な密着性
を与えることのできる導体組成物を被覆した回路基板を
堤供することを目的とする。(Objective of the Invention) The present invention does not reduce solder wettability even when used on glass or glass ceramic substrates, which have been increasingly used in recent years, and provides sufficient adhesion between the conductor composition and the substrate. The object of the present invention is to provide a circuit board coated with a conductive composition that can be applied.
（問題点を解決するための手段）
本発明は、銀粉及びパラジウム粉及びロジウム粉及び／
又は有機ロジウム化合物がビヒクル中に分散され、かつ
無機結合剤としてガラスフリットを含有しない導体組成
物をガラス又はガラスセラミック基板上に焼成し被覆し
たことを特徴とする回路基板であり、前記無機結合剤と
して酸化ビスマスを含有するものであってもよい。(Means for solving the problems) The present invention provides silver powder, palladium powder, rhodium powder and/or
Or a circuit board characterized in that a conductor composition in which an organic rhodium compound is dispersed in a vehicle and does not contain glass frit as an inorganic binder is fired and coated on a glass or glass ceramic substrate, and the inorganic binder It may also contain bismuth oxide.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明における導体組成物は、微細に分割された銀粉及
びパラジウム粉を必須成分とし、この他にロジウム粉及
び有機ロジウム化合物の両者又は一方を分散状態でビヒ
クル中に含有している。その比率は、通常銀９９．０〜
５０重量％、パラジウム０．９〜４０重量％、ロジウム
０．１〜ＩＯ重量％である。使用する銀の平均粒径は０
．５〜７μ、比表面積０．５〜ｂ
平均粒径は０．１〜１μ、比表面積５〜２０ｍ／ｇ１０
ジウムの平均粒径は０．１〜１μ、比表面積１０〜４０
ｍ／ｇである。又使用できる有機ロジウム化合物として
は、環式テルペン含硫黄ロジウム化合物等のいわゆるロ
ジウムレジネートがある。The conductor composition of the present invention has finely divided silver powder and palladium powder as essential components, and also contains rhodium powder and/or an organic rhodium compound in a dispersed state in a vehicle. The ratio is usually silver 99.0 ~
50% by weight, palladium from 0.9 to 40% by weight, and rhodium from 0.1 to IO weight%. The average particle size of the silver used is 0
．． 5-7μ, specific surface area 0.5-b Average particle size 0.1-1μ, specific surface area 5-20m/g10
Average particle size of dium is 0.1-1μ, specific surface area 10-40
m/g. Examples of organic rhodium compounds that can be used include so-called rhodium resinates such as cyclic terpene sulfur-containing rhodium compounds.
本発明では無機結合剤を使用してもしなくてもよく、使
用する場合には従来使用されている無機結合剤のうちガ
ラス成分を含まない任意のものを使用することができ、
例えば酸化ビスマスを主成分とする結合剤を使用するこ
とが好ましく、該無機結合剤は通常前記金属性粉に対し
０〜１０重量％とする。In the present invention, an inorganic binder may or may not be used, and when used, any conventionally used inorganic binder that does not contain a glass component can be used.
For example, it is preferable to use a binder containing bismuth oxide as a main component, and the amount of the inorganic binder is usually 0 to 10% by weight based on the metal powder.
前記した金属性粉末及び無機結合剤の分散媒であるビヒ
クル、例えばターピネオールにエチルセルロース樹脂を
溶解させたビヒクルは全体に対して約１０〜３０重量％
を使用する。The vehicle, which is a dispersion medium for the metallic powder and inorganic binder described above, such as a vehicle in which ethyl cellulose resin is dissolved in terpineol, is about 10 to 30% by weight based on the total weight.
use.
又本発明で使用するガラス又はガラスセラミック基板は
、ガラスを主成分とする任意の基板を意味し、従来のア
ルミナ基板を含まない。Further, the glass or glass-ceramic substrate used in the present invention means any substrate whose main component is glass, and does not include conventional alumina substrates.
前記した金属性粉末及び必要ならば無機結合剤をビヒク
ル中に分散させこれを前記ガラス又はガラスセラミック
基板上へ塗布し、次いで約７６０〜９００℃、好ましく
は約８５０℃前後で約５〜３０分焼成して導体組成物が
被覆された回路基板とする。なお該焼成は複数回繰り返
してもよい。The above-mentioned metallic powder and, if necessary, an inorganic binder are dispersed in a vehicle and applied onto the glass or glass ceramic substrate, and then heated at about 760 to 900°C, preferably about 850°C for about 5 to 30 minutes. A circuit board coated with the conductor composition is obtained by firing. Note that the firing may be repeated multiple times.
このように製造された本発明の回路基板は、十分満足で
きるハンダ濡れ性と、導体組成物と回路基板間の良好な
密着性を有している。その理由は必ずしも明らかではな
いが、導体組成物中にガラス・フリットが含有されてい
ないからであると推測される。つまり焼成前の導体組成
物にガラスフリットが含まれていると、導体組成物中の
無機結合剤の拡散が進行せず、又はガラス又はガラスセ
ラミック基板からの拡散が進行する結果、導体表面にお
いてガラスが過剰になり、ハンダ濡れ性が著しく低下す
るのである。これに対し本発明のように導体組成物中に
ロジウムを含有させかつガラスフリットを存在させない
と、上記理由に起因するハンダ濡れ性の低下がなくなる
とともに、良好な密着性で導体組成物を基板に接合する
ことが可能になるのである。The circuit board of the present invention manufactured in this manner has sufficiently satisfactory solder wettability and good adhesion between the conductor composition and the circuit board. Although the reason is not necessarily clear, it is presumed that the conductor composition does not contain glass frit. In other words, if the conductor composition before firing contains glass frit, the inorganic binder in the conductor composition will not diffuse or will diffuse from the glass or glass-ceramic substrate, resulting in glass frit on the conductor surface. becomes excessive, and the solder wettability is significantly reduced. On the other hand, if rhodium is contained in the conductor composition and no glass frit is present as in the present invention, the decrease in solder wettability caused by the above reasons is eliminated, and the conductor composition is attached to the substrate with good adhesion. This makes it possible to join them.
以下実施例に基づいて本発明をより詳細に説明するが、
該実施例は本発明を限定するものではない。The present invention will be explained in more detail based on Examples below.
The examples are not intended to limit the invention.
（実施例）
エチルセルロース樹脂をターピネオールに溶解したビヒ
クル中に、微細に分割された銀粉及びパラジウム粉及び
ロジウム粉と酸化ビスマスを下表に示す配合比（実施例
１〜６）で混合し、混線分散した導体組成物をガラスセ
ラミック基板上に印刷し、コンベア炉中８５０℃におけ
る１０分間の焼成を２回繰り返し、膜厚１０〜１４μの
電気回路を形成した。(Example) Finely divided silver powder, palladium powder, rhodium powder, and bismuth oxide are mixed in a vehicle prepared by dissolving ethyl cellulose resin in terpineol at the compounding ratio shown in the table below (Examples 1 to 6) to disperse crosstalk. The resulting conductor composition was printed on a glass ceramic substrate, and fired twice for 10 minutes at 850° C. in a conveyor furnace to form an electric circuit with a film thickness of 10 to 14 μm.
該電気回路をロジンフラックス中に浸漬し、２２０℃の
鉛−錫共晶ハンダに５秒間浸漬し５×５龍パツドでのハ
ンダ濡れ性を目視した。その後２×２１パツドにハンダ
鏝で直径０．６ｍの錫めっき銅線をハンダ付けし、１５
０℃のオープン中に３００時間放置放置−ルテストによ
り密着強度を測定し下表の結果を得た。The electrical circuit was immersed in rosin flux and immersed in lead-tin eutectic solder at 220°C for 5 seconds, and the solder wettability on a 5×5 dragon pad was visually observed. After that, solder a tin-plated copper wire with a diameter of 0.6 m to the 2 x 21 pad with a soldering iron, and
The adhesion strength was measured by a 300-hour standing test while open at 0°C, and the results shown in the table below were obtained.
同様にロジウム粉を含まずそしてガラスフリットを含む
導体組成物（比較例１．４．５）及びロジウム粉もガラ
スフリットも含まない導体組成物（比較例２．３）を使
用して電気回路を形成し、ハンダ濡れ性及び密着強度を
測定した。その結果を下表に示す。Similarly, electrical circuits were constructed using a conductor composition containing no rhodium powder and glass frit (Comparative Example 1.4.5) and a conductor composition containing neither rhodium powder nor glass frit (Comparative Example 2.3). The solder wettability and adhesion strength were measured. The results are shown in the table below.
下記表から明らかな通り、本実施例によるガラスフリッ
トを含まない導体組成物はハンダ濡れ性が良好であり、
特に酸化ビスマスを含む導体組成物ではハンダ濡れ性が
より以上に改良された。更に１５０℃で３００時間オー
ブン中に放置した後の導体組成物と基板間の密着強度は
極めて高かった。一方比較例の導体組成物は密着強度が
多少高いものもあるが、本実施例と比較するとかなり低
く、ハンダ濡れ性の良好なものは皆無であった。As is clear from the table below, the conductor composition that does not contain glass frit according to this example has good solder wettability.
In particular, conductor compositions containing bismuth oxide showed much improved solder wettability. Further, the adhesion strength between the conductor composition and the substrate after being left in an oven at 150° C. for 300 hours was extremely high. On the other hand, although some of the conductor compositions of Comparative Examples had somewhat high adhesion strength, it was considerably lower than that of the present example, and none had good solder wettability.
これらの結果に対する明確な理由付けは未だ行われてい
ないが、本実施例の導体組成物に含まれるロジウムが銀
とパラジウム粉との焼結を抑制して焼成後の導体組成物
は多孔質度の高い膜となる。Although a clear rationale for these results has not yet been provided, rhodium contained in the conductor composition of this example suppresses sintering of silver and palladium powder, and the conductor composition after firing has a high degree of porosity. The result is a film with a high
この結果基板からのガラスの拡散が見掛は上抑制されハ
ンダ濡れ性を劣化させずに十分な密着強度が確保される
ものと考えられる。As a result, the diffusion of glass from the substrate is apparently suppressed, and it is thought that sufficient adhesion strength is ensured without deteriorating solder wettability.
一方比較例の導体組成物では高い含有量の無機結合剤に
起因してハンダ濡れ性が著しく悪くなり（比較例４及び
５）、又無機結合剤を含まないものでも基板からのガラ
スの拡散のためにハンダ濡れ性が悪くなる（比較例２及
び３）と考えられる。On the other hand, the conductor compositions of Comparative Examples had significantly poor solder wettability due to the high content of inorganic binder (Comparative Examples 4 and 5), and even those that did not contain inorganic binder had poor solderability due to the high content of inorganic binder. This is considered to be the reason for poor solder wettability (Comparative Examples 2 and 3).
（発明の効果）
本発明では、金属性粉末をビヒクル中に分散して成る導
体組成物をガラス又はガラスセラミ、りから成る回路基
板上に被覆するにあたり前記導体組成物中に無機結合剤
としてガラスを含ませないようにしている。これにより
、従来の回路基板と異なり導体組成物中にガラスを含ま
なくとも、回路基板中のガラスが焼成時に導体組成物中
へ拡散して両者間に十分な密着強度が確保され、しかも
導体組成物がガラスを含まないため、回路基板のハンダ
濡れ性が著しく改善される。従って本発明の回路基板は
従来のガラス又はガラスセラミック基板と比較して基板
としての性能の目安となるハンダ濡れ性と密着強度が迩
かに改善された画期的な回路基板である。(Effects of the Invention) In the present invention, when coating a conductor composition comprising metallic powder dispersed in a vehicle on a circuit board made of glass or glass ceramic, glass is used as an inorganic binder in the conductor composition. I try not to include. As a result, unlike conventional circuit boards, even though the conductor composition does not contain glass, the glass in the circuit board diffuses into the conductor composition during firing, ensuring sufficient adhesion strength between the two, and the conductor composition Since the material does not contain glass, the solder wettability of the circuit board is significantly improved. Therefore, the circuit board of the present invention is an epoch-making circuit board that has significantly improved solder wettability and adhesion strength, which are indicators of the performance of a board, as compared to conventional glass or glass ceramic boards.
Claims (4)
有機ロジウム化合物がビヒクル中に分散され、かつ無機
結合剤としてガラスフリットを含有しない導体組成物を
ガラス又はガラスセラミック基板上に焼成し被覆したこ
とを特徴とする回路基板。(1) A conductor composition in which silver powder, palladium powder, rhodium powder, and/or organic rhodium compound are dispersed in a vehicle and does not contain glass frit as an inorganic binder is fired and coated on a glass or glass ceramic substrate. Characteristic circuit board.
うにした特許請求の範囲第１項に記載の回路基板。(2) The circuit board according to claim 1, wherein the firing is performed at about 760 to 900°C for about 5 to 30 minutes.
有機ロジウム化合物がビヒクル中に分散され、かつ無機
結合剤として酸化ビスマスを含有しガラスフリットを含
有しない導体組成物をガラス又はガラスセラミック基板
上に焼成し被覆したことを特徴とする回路基板。(3) A conductor composition in which silver powder, palladium powder, rhodium powder, and/or organic rhodium compound are dispersed in a vehicle, contains bismuth oxide as an inorganic binder, and does not contain glass frit is fired on a glass or glass ceramic substrate. A circuit board characterized by being coated with
うにした特許請求の範囲第３項に記載の回路基板。(4) The circuit board according to claim 3, wherein the firing is performed at about 760 to 900°C for about 5 to 30 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11824587A JPS63283184A (en) | 1987-05-15 | 1987-05-15 | Circuit substrate covered with conductor composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11824587A JPS63283184A (en) | 1987-05-15 | 1987-05-15 | Circuit substrate covered with conductor composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63283184A true JPS63283184A (en) | 1988-11-21 |
Family
ID=14731830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11824587A Pending JPS63283184A (en) | 1987-05-15 | 1987-05-15 | Circuit substrate covered with conductor composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63283184A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01107591A (en) * | 1987-10-20 | 1989-04-25 | Tanaka Massey Kk | Electric circuit board |
| JPH03262187A (en) * | 1990-03-13 | 1991-11-21 | Fujitsu Ltd | Formation of pattern |
| EP0651408A2 (en) * | 1993-10-29 | 1995-05-03 | Nec Corporation | Method of manufacturing laminated ceramic capacitor |
| JP2007084384A (en) * | 2005-09-22 | 2007-04-05 | Seiko Epson Corp | Method of manufacturing ceramic electronic component and ceramic electronic component |
| WO2019064738A1 (en) * | 2017-09-29 | 2019-04-04 | 株式会社村田製作所 | Conductive paste, glass article, and method for producing glass article |
-
1987
- 1987-05-15 JP JP11824587A patent/JPS63283184A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01107591A (en) * | 1987-10-20 | 1989-04-25 | Tanaka Massey Kk | Electric circuit board |
| JPH03262187A (en) * | 1990-03-13 | 1991-11-21 | Fujitsu Ltd | Formation of pattern |
| EP0651408A2 (en) * | 1993-10-29 | 1995-05-03 | Nec Corporation | Method of manufacturing laminated ceramic capacitor |
| US5632833A (en) * | 1993-10-29 | 1997-05-27 | Nec Corporation | Method of manufacturing laminated ceramic capacitor |
| EP0651408A3 (en) * | 1993-10-29 | 1997-07-30 | Nec Corp | Method of manufacturing laminated ceramic capacitor. |
| JP2007084384A (en) * | 2005-09-22 | 2007-04-05 | Seiko Epson Corp | Method of manufacturing ceramic electronic component and ceramic electronic component |
| WO2019064738A1 (en) * | 2017-09-29 | 2019-04-04 | 株式会社村田製作所 | Conductive paste, glass article, and method for producing glass article |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4172919A (en) | Copper conductor compositions containing copper oxide and Bi2 O3 | |
| JPH03141502A (en) | Copper paste composite | |
| US4318830A (en) | Thick film conductors having improved aged adhesion | |
| JPH01192781A (en) | Thick film copper conductor composition | |
| JPS63283184A (en) | Circuit substrate covered with conductor composition | |
| JPH04277406A (en) | Copper conductor paste | |
| JP3798979B2 (en) | Conductive paste and use thereof | |
| JPH01107592A (en) | Electric circuit board | |
| JPH0945130A (en) | Conductor paste composite | |
| JPH0239410A (en) | Conductive composed material for ceramic capacitor terminal electrode | |
| JPH0917232A (en) | Conductor paste composition | |
| JP2941002B2 (en) | Conductor composition | |
| JPH01206508A (en) | Conductive paste for aluminum nitride substrate | |
| JPH0693307A (en) | Thick-film copper conductor paste composition capable of being plated | |
| JPH01107591A (en) | Electric circuit board | |
| JPH06342965A (en) | Ceramic circuit board and manufacture thereof | |
| JP2992958B2 (en) | Conductive paste for low-temperature fired multilayer wiring boards | |
| JPH03246990A (en) | Formation of thick film conductor | |
| JPH0349108A (en) | Copper conductor composition material | |
| JPH0737420A (en) | Conductive paste composition and circuit board using conductive paste composition | |
| JPS6166305A (en) | Conductor composition | |
| JPH06349316A (en) | Conductive paste | |
| JPS58130590A (en) | Ceramic circuit board and thick film hybrid ic using same board | |
| JPH022244B2 (en) | ||
| JPH06338215A (en) | Conductive paste |