CN104607817A - Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof - Google Patents
Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof Download PDFInfo
- Publication number
- CN104607817A CN104607817A CN201410755091.XA CN201410755091A CN104607817A CN 104607817 A CN104607817 A CN 104607817A CN 201410755091 A CN201410755091 A CN 201410755091A CN 104607817 A CN104607817 A CN 104607817A
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- CN
- China
- Prior art keywords
- lanthanum
- selenium
- solder
- zinc
- caesium
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention discloses lanthanum, selenium, cesium, zinc and tin alloy solder and a preparation method of the lanthanum, selenium, cesium, zinc and tin alloy solder. The alloy solder comprises, by mass, 0.2-0.5% of lanthanum, 0.1-0.5% of selenium, 0.05-0.1% of cesium, 5-10% of zinc, and the balance tin and less than 0.1% of impurity. The alloy solder does not contain lead elements, can avoid the harm of the lead, has good welding performance and electric and mechanical performance, and is simple in process and safe and reliable.
Description
Technical field
The present invention relates to a kind of circuit loss material, be specifically related to a kind of lanthanum selenium caesium Zn-Sn alloy solder and preparation method thereof.
Background technology
Terne metal is a kind of welding material be once commonly used, but because lead is to the huge toxicity of people, causes the world greatly to pay close attention to, and has risen unleaded trend.The existing requirement to lead-free solder mainly contains: 1, lead content is lower than 0.1%; 2, fusing point is more better close to slicker solder eutectic gold; 3, electrical and thermal conductivity is good; 4, have certain intensity and ductility, machinability is good; 5, raw material supply is sufficient, cheap; 6, composition can not be too complicated, is convenient to recycle.
Existing lead-free solder, representational, if Sn35Ag in tin Silver Alloys is tin silver eutectic alloy, there is lower fusion temperature, but silver-colored high price is expensive, and fusing point is slightly high, in order to reduce its fusion temperature, common way adds a large amount of bismuths and/or indium, but adding of bismuth makes alloy become hard and crisp, not only make processing difficulties, and make plumb joint can not withstand shock, be easy to snap; And the reserves added because of indium of indium are limited, price is high, and makes cost high-leveled and difficult to accept.Another kind of representational lead-free solder, as the Sn5Sb in tin antimony series alloy, its solidus temperature is 235 DEG C, and liquidus temperature is 240 DEG C, and the way reducing fusing point is the same with sn-ag alloy series with drawback.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, provide a kind of harm can avoiding lead, lanthanum selenium caesium Zn-Sn alloy solder again with good welds performance and electricapparatus performance and preparation method thereof.
To achieve these goals, present invention employs following technical scheme:
A kind of lanthanum selenium caesium Zn-Sn alloy solder, with the quality of this solder for benchmark, described solder contains lanthanum (La) 0.2 ~ 0.5%, selenium (Se) 0.1 ~ 0.5%, caesium (Cs) 0.05 ~ 0.1%, zinc (Zn) 5 ~ 10%, surplus be tin (Sn) and be no more than 0.1% impurity.
As present invention further optimization, above-described solder contains lanthanum 0.3 ~ 0.4%, selenium 0.2 ~ 0.4%, caesium 0.05 ~ 0.08%, zinc 5 ~ 8%, surplus be tin and be no more than 0.1% impurity.
As present invention further optimization, above-described lead-free solder contains lanthanum 0.35%, selenium 0.3%, caesium 0.07%, zinc 7%, surplus be tin and be no more than 0.1% impurity.Impurity main component has the elements such as sulphur, carbon, iron, sodium.
In the present invention, as helper component, not only increase lanthanum (rare earth element) and zinc, also add cesium element, the air invading tin liquor in Non-vacuum type whipping process be can effectively remove, welding performance and the electricapparatus performance of lead-free solder further increased.Add selenium element again, the fusing point of solder is reduced, melting range increases, the formation of solder surface oxide layer when restrained effectively fusing, gas-liquid surface tension force reduces and reduces hardness and the shear strength of solder, makes again the spreading ratio of solder increase, infiltration angle reduces, and improves the solderability of solder; After adding selenium element, inhibit thick β-Sn crystalline substance material to generate, namely by the metamorphism to solder solidification and crystallization process, realize the homogenising of solidified structure, thus improve mechanical property and the creep resistant fatigue properties of solder; Significantly improve the anti-oxidant, corrosion-resistant of solder adding of selenium element simultaneously, improve the performance of welding.
Prepare a method for above-mentioned lanthanum selenium caesium Zn-Sn alloy solder, comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 60 ~ 90 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing lanthanum, cesium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing lanthanum, cesium element, then add sodium selenate, continue stirring 30 ~ 60 minutes; Then while stirring the solder containing lanthanum caesium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lanthanum selenium caesium Zn-Sn alloy solder finished product.
Advantage of the present invention:
1, need not add lead element in solder of the present invention, the solder finished product of gained possesses good welding performance and electricapparatus performance, environmental protection equally, does not endanger the health of welding job personnel.
2, in tin, add the elements such as a small amount of lanthanum, selenium, zinc, caesium, the ductility of finished product solder can be significantly increased, reduce its melting point, improve finished product solder non-oxidizability etc.; In addition, lanthanum, caesium, selenium just add on a small quantity, and therefore, solder preparation cost of the present invention is lower, are also compare to promote the use of.
3, technique is simple, safe and reliable.With zinc-base intermediate alloy, lanthanum, cesium element mainly think that form adds, this than adding simple lanthanum, cesium element is well a lot, avoid the active attribute due to it, before stirring, just react, thus affect solder end properties.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further described.
Embodiment 1:
A kind of lanthanum selenium caesium Zn-Sn alloy solder, with the quality of this solder for benchmark, described solder contains lanthanum 0.2%, selenium 0.1%, caesium 0.05%, zinc 5%, surplus be tin and be no more than 0.1% impurity.
Embodiment 2:
A kind of lanthanum selenium caesium Zn-Sn alloy solder, with the quality of this solder for benchmark, described solder contains lanthanum 0.5%, selenium 0.5%, caesium 0.1%, zinc 10%, surplus be tin and be no more than 0.1% impurity.
Embodiment 3:
A kind of lanthanum selenium caesium Zn-Sn alloy solder, with the quality of this solder for benchmark, described solder contains lanthanum 0.35%, selenium 0.3%, caesium 0.07%, zinc 7%, surplus be tin and be no more than 0.1% impurity.
Prepare the method for the lanthanum selenium caesium Zn-Sn alloy solder of above-described embodiment 1-3, comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 60 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing lanthanum, cesium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing lanthanum, cesium element, then add sodium selenate, continue stirring 30 minutes; Then while stirring the solder containing lanthanum caesium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lanthanum selenium caesium Zn-Sn alloy solder finished product.
Embodiment 4:
A kind of lanthanum selenium caesium Zn-Sn alloy solder, with the quality of this solder for benchmark, described solder contains lanthanum 0.3%, selenium 0.2%, caesium 0.05%, zinc 5%, surplus be tin and be no more than 0.1% impurity.
Embodiment 5:
A kind of lanthanum selenium caesium Zn-Sn alloy solder, with the quality of this solder for benchmark, described solder contains lanthanum 0.4%, selenium 0.4%, caesium 0.08%, zinc 8%, surplus be tin and be no more than 0.1% impurity.
Embodiment 6:
A kind of lanthanum selenium caesium Zn-Sn alloy solder, with the quality of this solder for benchmark, described solder contains lanthanum 0.35%, selenium 0.2%, caesium 0.07%, zinc 8%, surplus be tin and be no more than 0.1% impurity.
Prepare the method for the lanthanum selenium caesium Zn-Sn alloy solder of above-described embodiment 4-6, comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 90 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing lanthanum, cesium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing lanthanum, cesium element, then add sodium selenate, continue stirring 60 minutes; Then while stirring the solder containing lanthanum caesium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lanthanum selenium caesium Zn-Sn alloy solder finished product.
Claims (4)
1. a lanthanum selenium caesium Zn-Sn alloy solder, it is characterized in that: with the quality of this solder for benchmark, described solder contains lanthanum 0.2 ~ 0.5%, selenium 0.1 ~ 0.5%, caesium 0.05 ~ 0.1%, zinc 5 ~ 10%, surplus be tin and be no more than 0.1% impurity.
2. lanthanum selenium caesium Zn-Sn alloy solder according to claim 1, is characterized in that: described solder contains lanthanum 0.3 ~ 0.4%, selenium 0.2 ~ 0.4%, caesium 0.05 ~ 0.08%, zinc 5 ~ 8%, surplus be tin and be no more than 0.1% impurity.
3. lanthanum selenium caesium Zn-Sn alloy solder according to claim 1, is characterized in that: described lead-free solder contains lanthanum 0.35%, selenium 0.3%, caesium 0.07%, zinc 7%, surplus be tin and be no more than 0.1% impurity.
4. prepare as arbitrary in claim 1-3 as described in the method for lanthanum selenium caesium Zn-Sn alloy solder, it is characterized in that: comprise the following steps:
(1) first block tin is fused into tin liquor, then in tin liquor, adds spelter, after spelter fusing, obtain tin zinc mixed liquor, and stir 60 ~ 90 minutes at 450 DEG C of temperature;
(2) the zinc-base intermediate alloy containing lanthanum, cesium element is dropped in tin zinc mixed liquor, heat up, after the zinc-base intermediate alloy fusing containing lanthanum, cesium element, then add sodium selenate, continue stirring 30 ~ 60 minutes; Then while stirring the solder containing lanthanum caesium zinc is cast into circular section extruded stock;
(3) the circular section extruded stock that step (2) is obtained is squeezed into thick line base, then through being repeatedly drawn into lanthanum selenium caesium Zn-Sn alloy solder finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410755091.XA CN104607817A (en) | 2014-12-11 | 2014-12-11 | Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410755091.XA CN104607817A (en) | 2014-12-11 | 2014-12-11 | Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof |
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| CN104607817A true CN104607817A (en) | 2015-05-13 |
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| CN201410755091.XA Pending CN104607817A (en) | 2014-12-11 | 2014-12-11 | Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109628870A (en) * | 2019-01-22 | 2019-04-16 | 陶乐敏 | A kind of environment-friendly type lead-free alloy material and its processing technology |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2552935A (en) * | 1949-11-16 | 1951-05-15 | Ici Ltd | Solders |
| CN1586792A (en) * | 2004-08-24 | 2005-03-02 | 陈明汉 | Improved Sn-0.7 wt% Cu lead-free welding flux |
| CN1634677A (en) * | 2004-09-11 | 2005-07-06 | 戴国水 | Solder containing rare earth, tin and zinc, and preparation method thereof |
| CN1915575A (en) * | 2006-09-08 | 2007-02-21 | 昆山成利焊锡制造有限公司 | Soft soldering material with no lead |
| CN101157161A (en) * | 2006-12-25 | 2008-04-09 | 潘惠凯 | A tin-zinc selenium alloy welding flux |
-
2014
- 2014-12-11 CN CN201410755091.XA patent/CN104607817A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2552935A (en) * | 1949-11-16 | 1951-05-15 | Ici Ltd | Solders |
| FR1024823A (en) * | 1949-11-16 | 1953-04-07 | Ici Ltd | Welding improvements |
| CN1586792A (en) * | 2004-08-24 | 2005-03-02 | 陈明汉 | Improved Sn-0.7 wt% Cu lead-free welding flux |
| CN1634677A (en) * | 2004-09-11 | 2005-07-06 | 戴国水 | Solder containing rare earth, tin and zinc, and preparation method thereof |
| CN1915575A (en) * | 2006-09-08 | 2007-02-21 | 昆山成利焊锡制造有限公司 | Soft soldering material with no lead |
| CN101157161A (en) * | 2006-12-25 | 2008-04-09 | 潘惠凯 | A tin-zinc selenium alloy welding flux |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109628870A (en) * | 2019-01-22 | 2019-04-16 | 陶乐敏 | A kind of environment-friendly type lead-free alloy material and its processing technology |
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