CN101700606A - Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof - Google Patents
Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof Download PDFInfo
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- CN101700606A CN101700606A CN200910246135A CN200910246135A CN101700606A CN 101700606 A CN101700606 A CN 101700606A CN 200910246135 A CN200910246135 A CN 200910246135A CN 200910246135 A CN200910246135 A CN 200910246135A CN 101700606 A CN101700606 A CN 101700606A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 69
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229910001122 Mischmetal Inorganic materials 0.000 title abstract 6
- 229910017944 Ag—Cu Inorganic materials 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 47
- 239000000956 alloy Substances 0.000 claims abstract description 47
- 229910052709 silver Inorganic materials 0.000 claims abstract description 41
- 238000005219 brazing Methods 0.000 claims abstract description 27
- 238000003756 stirring Methods 0.000 claims abstract description 24
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910001950 potassium oxide Inorganic materials 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 235000011164 potassium chloride Nutrition 0.000 claims abstract description 11
- 239000001103 potassium chloride Substances 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 37
- 239000004332 silver Substances 0.000 claims description 37
- 239000011833 salt mixture Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 9
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 8
- 238000005660 chlorination reaction Methods 0.000 claims description 8
- 229910052700 potassium Inorganic materials 0.000 claims description 8
- 239000011591 potassium Substances 0.000 claims description 8
- 229910052684 Cerium Inorganic materials 0.000 claims description 5
- 229910020785 La—Ce Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 3
- 229910052772 Samarium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 abstract description 7
- 230000008018 melting Effects 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 150000003839 salts Chemical class 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 19
- 239000010949 copper Substances 0.000 description 12
- 229910052761 rare earth metal Inorganic materials 0.000 description 11
- 238000003723 Smelting Methods 0.000 description 8
- 150000002910 rare earth metals Chemical class 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910017692 Ag3Sn Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910008433 SnCU Inorganic materials 0.000 description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PPIIGEJBVZHNIN-UHFFFAOYSA-N [Cu].[Sn].[Pb] Chemical compound [Cu].[Sn].[Pb] PPIIGEJBVZHNIN-UHFFFAOYSA-N 0.000 description 1
- -1 after tested Substances 0.000 description 1
- 230000003026 anti-oxygenic effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Abstract
The invention relates to a Sn-Ag-Cu misch metal lead-free solder with low content of Cu and a preparation method thereof. The method solves the problems of overhigh content of Ag and inferior brazing performance in current lead-free solder. The lead-free solder is composed of the following components by weight percent: 0.1-2.0% of Ag; 0.2%-2.5% of Cu; 0.1%-3.0% of misch metal; and Sn and unavoidable impurity elements as the balance. The preparation method thereof comprises the following steps: A: completely melting the metal Sn; B: adding the metal Ag and Cu into the molten metal of Sn and sufficiently stirring the molten metal to form alloy liquid; and C: adding the misch metal into the alloy liquid fast until the misch metal is completely molten, removing the mixed salt of potassium chloride and potassium oxide on the surface to result in the lead-free solder. The Sn-Ag-Cu misch metal lead-free solder with low content of Cu according to the invention has the advantages of low content of Ag, low cost, excellent brazing performance, etc.
Description
Technical field
The present invention relates to a kind of lead-free brazing and preparation method thereof, relate in particular to SAC mishmetal series leadless solder of a kind of low silver content and preparation method thereof; Belong to microelectronic industry surface installation technique field.
Background technology
Because plumbous harm to the mankind prevents that lead contamination from having become the irreversible trend in the world.Two instructions of European Union, promptly " The EU Directive on Waste of Electric and Electronic Equipment " is (WEEE) (RoHS) formally effective with " about ban use of some harmful substance instruction in electric/electronic device ".The promulgation of these environmental protection laws, can make the electronics manufacturing of China face new trade and technology barriers, the power electronic product that requirement is sold on the European market is necessary for lead-free product, and lead-free brazing begins in microelectronic industry surface installation technique Application for Field.Electronic product is unleaded, keeps up with the trend of the times just.Along with " green welding " rise of notion and the appearance of global a series of environmental protection policies, replace traditional tin-lead solder, exploitation has the leadless electronic welding material of independent intellectual property right and supporting auxiliary material, and breaking external monopolization to this art and product has been extremely urgent task.Research and development become the key subjects of electronics industry towards the lead-free brazing of 21st century to replace traditional tin-lead solder.
In the relevant patent of lead-free brazing, the patent that relates to tin copper, SAC has multinomial, wherein comprises multicomponent alloy, as U.S. Patent application (publication number: US6325279) be the SnAgCuBiIn solder, because the existence of In significantly improves the solder cost.Present universally recognized SnAgCu series alloy solder has U.S. Patent application (publication number: US5527628), contain the Ag that percentage by weight is 3.5-7.7% in the solder alloy; Japanese patent application (publication number: JP5050286A), contain the Ag that percentage by weight is 3.0-5.0% in the solder alloy; Chinese patent application (publication number: CN1385280A) be the SnAgCuCe solder alloy, it is 2～5% Ag that solder alloy contains percentage by weight, above-mentioned solder alloy contains the Ag than the height ratio row, though the more common SnCu solder of the performance of this solder alloy is better, but expensive one times than common SnCu solder of price, cost is higher.
The Sn-3.0Ag-0.5Cu solder alloy that Sn-3.8Ag0.7Cu solder alloy that European Union is recommended and Japan are recommended, the weight percent content of Ag all is not less than 3.0%, the problem of bringing thus is: (1) Ag helps the generation of ELECTROMIGRATION PHENOMENON, causes the bridge joint short circuit.(2) the increasing of Ag in the brazing filler metal alloy will cause the Ag3Sn intermetallic compound to increase, because the Ag3Sn intermetallic compound is strip in solder tissue, have a strong impact on the mechanical property of solder and joint, the reliability of reduction joint.(3) cost rises, because a large amount of Ag that use in the SnAgCu solder, the price of Ag sharp rises at present, and if continue to use and contain Ag and surpass 3.0% solder, with consuming a large amount of Ag, certainly will cause the higher of solder cost, be not suitable for market-oriented demand.
Summary of the invention
The present invention is directed to the defective that prior art exists, provide a kind of Ag content lower, brazing property is better, tensile strength and percentage elongation height, lower-cost SAC mishmetal series leadless solder.
Above-mentioned purpose of the present invention can realize by following technical proposal: a kind of SAC mishmetal series leadless solder of low silver content, and this lead-free brazing is made up of following components in weight percentage: Ag:0.1%～2.0%; Cu:0.2%～2.5%; Mishmetal: 0.1%～3.0%; All the other are Sn and the impurity element that is difficult to avoid.
The SAC mishmetal series leadless solder of low silver content provided by the present invention, one of them key character is: Ag content is lower, Ag content 0.1%～2.0%.But the content that is not the Ag metal is low more good more, when metal A g content is lower than 0.1%, Sn, Ag can not constitute eutectic ratio or DeGrain in the alloy, after tested, silver content is lower than the brazing alloy of its formation in 0.1% o'clock aspect the key technical indexes such as mechanical performance, croop property, solderability, wetability, compares almost with the technical indicator of gun-metal.So, in order to guarantee that lead-free brazing has mechanical performance index etc. preferably, metal A g content is higher than 0.1% and is lower than 2.0% in the SAC mishmetal series leadless solder of the low silver content that the present invention proposes, so not only can save the Ag resource, reduce the solder cost, but also improve mechanical performance, croop property, wettability and the solderability etc. of SAC mishmetal series leadless solder.
The present invention adds norium, has reduced the consumption of noble metal silver in the solder by adding norium, when reducing cost, has improved cold oxidation resistance and wetability, and the mechanical mechanics property of solder joint and electrical property.Because very active its simple substance of rare earth element is difficult for preserving, and its alloy or compound are very stable, so interpolation form of the present invention is a norium, and the lead-free brazing that obtains with norium and Sn, Ag, Cu melting, its chemical property is stable, good in oxidation resistance.
To add the performance impact of mishmetal to the SAC mishmetal series leadless solder of low silver content in order estimating, to adopt the form of the little lap joint of single face, carry out the life-span of creep rupture test, mother metal is the thick copper sheet of 0.1mm, overlap joint area 1mm
2Dead load is stretching under different loads and the different temperatures carries out, and as can be seen, the interpolation of the mishmetal of trace can improve the life-span of creep rupture of SnAgCu soldered fitting significantly.
The present invention as raw material, makes lead-free brazing have very high antioxygenic property and corrosion resistance without zinc.Adopt the lower metal of fusing point, avoided the smelting temperature of superhigh temperature; As adopting lead-free brazing of the present invention, manufacturing enterprise need not change former smelting equipment.User enterprise need not to change former Welding Technology and Equipment as using the substitute of lead-free brazing of the present invention as solder containing lead, can significantly reduce the scrap build expense of enterprise.Through detecting, lead content of the present invention is much smaller than the maximum requirement of lead-free brazing.
Manual welding, wave soldering and reflow welding that the SAC mishmetal series leadless solder of low silver content of the present invention can be used for the microelectronics assembling connect technology, and silver content is 0.1%～2.0% in the solder, and cost is lower; The molten temperature region of solder has mechanical property preferably at 213 ℃～220 ℃ simultaneously.
In the SAC mishmetal series leadless solder of above-mentioned low silver content, this lead-free brazing is made up of the component of following preferred weight percent: Ag:0.5%～1.5%; Cu:0.8%～2.0%; Mishmetal: 0.5%～2.0%; All the other are Sn and the impurity element that is difficult to avoid.
In the SAC mishmetal series leadless solder of above-mentioned low silver content, described mishmetal is a La-Ce base mishmetal, and wherein the each component weight percent content is in the mishmetal: La＞28.0%, Ce＞50%, Pr＞4%, Nd＞15%, Fe＜0.2%, P＜0.01%, Sm＜0.3%, Mg＜0.1%, S＜0.01%, Zn＜0.1%.The effect of adding rare earth element is very tangible, and rare earth element is famous alterant in metal material.Usually to the general name of 17 kinds of elements in the 3rd subgroup in the periodic table of elements, comprise 15 kinds of lanthanide series such as lanthanum, cerium and scandium and yttrium.Rare earth element has very active chemical property, and is wherein active with lanthanum, cerium.But La, very active its simple substance of Ce element are difficult for preserving, and its alloy or compound are very stable, so La of the present invention, Ce interpolation form are La/Ce base norium; There are bigger difference in this norium and common rare earth aspect element Pr, the Nd content: the Pr weight percent content of common rare earth is about 0.44%, and the Nd weight percent content is about 0.5%; The La/Ce base mishmetal that the present invention selects for use, the Pr weight percent content is greater than 4%, and the Nd weight percent content is greater than 15%.Element wt degrees such as P, S are controlled in 0.01% simultaneously.
Another object of the present invention is to provide the preparation method of the SAC mishmetal series leadless solder of this low silver content, and this method may further comprise the steps:
A: be cast on the metal Sn after the salt-mixture fusing with potassium chloride and potassium oxide, under temperature 600-800 ℃ condition, metal Sn melted fully then;
B: will be that 0.1%～2.0% metal A g and percentage by weight are that 0.2%～2.5% metal Cu joins fully to stir in the Sn liquid and forms alloy liquid according to percentage by weight;
C, will be that 0.1%～3.0% norium joins rapidly constantly to stir in the above-mentioned alloy liquid norium is melted fully according to percentage by weight, insulation be 0.5-3 hour under 400-600 ℃ condition, stirs; The salt-mixture for the treatment of to remove behind the alloy graining surface chlorination potassium and potassium oxide promptly obtains the SAC mishmetal series leadless solder of low silver content.
In the preparation method of the SAC mishmetal series leadless solder of above-mentioned low silver content, as preferably, the weight ratio of potassium chloride described in the steps A and potassium oxide is 1-1.7: 0.8-1.3, and the temperature during described salt-mixture fusing is 450-600 ℃.
In the preparation method of the SAC mishmetal series leadless solder of above-mentioned low silver content, as preferably, the temperature when metal Sn melts fully in the steps A is 650-750 ℃.
In the preparation method of the SAC mishmetal series leadless solder of above-mentioned low silver content, as preferably, the temperature among the step C during insulation is 450-500 ℃, and temperature retention time is 1-2 hour.
In sum, the present invention has the following advantages:
1, the SAC mishmetal series leadless solder of low silver content of the present invention makes lead-free brazing have brazing properties such as favorable mechanical performance, croop property, solderability, wetability owing to add a certain amount of Ag.
2, the present invention is directed in the market silver solder height in the lead-free brazing, contain the Ag amount and surpass 2.0%, the percentage by weight of Ag element in alloy welding powder in the lead-free brazing is controlled at 0.1%～2.0%, both guaranteed good brazing property, reduced cost again, have very high cost performance, economic benefit is obvious, is suitable for market-oriented demand.
3, add norium in the SAC mishmetal series leadless solder of low silver content of the present invention, improved SnAgCu alloy microscopic structure, intermetallic compound size, improved mechanics and creep-resistant property.The advantage of adding norium at the SAC mishmetal series leadless solder of low silver content is, excellent performance is cheap.
The specific embodiment
Below by specific embodiment, technical scheme of the present invention is described in further detail; But the present invention is not limited to these embodiment.
Table 1: the percentage by weight of each component in the embodiment 1-5 lead-free brazing
Wherein said mishmetal is a La-Ce base mishmetal, and wherein the each component weight percent content is in the mishmetal: La＞28.0%, Ce＞50%, Pr＞4%, Nd＞15%, Fe＜0.2%, P＜0.01%, Sm＜0.3%, Mg＜0.1%, S＜0.01%, Zn＜0.1%.
Embodiment 1
With potassium chloride: potassium oxide=(1～1.7): the salt-mixture of (0.8～1.3) (percentage by weight) adds smelting furnace, after dissolving under 580 ℃, adds the tin of percentage by weight 98.79%; After treating that tin melts fully, the Cu of the Ag of percentage by weight 0.2% and percentage by weight 1.0% is joined in the middle of the tin liquor, stir, form alloy; La-Ce base mishmetal with percentage by weight 0.01% adds in the above-mentioned alloy liquid rapidly simultaneously, and constantly stirs, till melting fully to rare earth; 460 ℃ of insulations 1.5 hours, stir, make the alloy homogenising.Cooling treats to go out behind the alloy graining salt-mixture of surface chlorination potassium, potassium oxide, promptly obtains the SAC mishmetal series leadless solder of low silver content.
Embodiment 2
With potassium chloride: potassium oxide=(1～1.7): the salt-mixture of (0.8～1.3) (percentage by weight) adds smelting furnace, after dissolving under 580 ℃, adds the tin of percentage by weight 98.35%; After treating that tin melts fully, the Cu of the Ag of percentage by weight 0.6% and percentage by weight 0.8% is joined in the middle of the tin liquor, stir, form alloy; La/Ce base mishmetal with percentage by weight 0.25% adds in the above-mentioned alloy liquid rapidly simultaneously, and constantly stirs, till melting fully to rare earth; 460 ℃ of insulations 1.5 hours, stir, make the alloy homogenising.Cooling treats to go out behind the alloy graining salt-mixture of surface chlorination potassium, potassium oxide, promptly obtains the SAC mishmetal series leadless solder of low silver content.
Embodiment 3
With potassium chloride: potassium oxide=(1～1.7): the salt-mixture of (0.8～1.3) (percentage by weight) adds smelting furnace, after dissolving under 580 ℃, adds the tin of percentage by weight 96.6%; After treating that tin melts fully, the Cu of the Ag of percentage by weight 1.5% and percentage by weight 1.4% is joined in the middle of the tin liquor, stir, form alloy; La/Ce base mishmetal with percentage by weight 0.5% adds in the above-mentioned alloy liquid rapidly simultaneously, and constantly stirs, till melting fully to rare earth; 460 ℃ of insulations 1.5 hours, stir, make the alloy homogenising.Cooling treats to go out behind the alloy graining salt-mixture of surface chlorination potassium, potassium oxide, promptly obtains the SAC mishmetal series leadless solder of low silver content.
Embodiment 4
With potassium chloride: potassium oxide=(1～1.7): the salt-mixture of (0.8～1.3) (percentage by weight) adds smelting furnace, after dissolving under 580 ℃, adds the tin of percentage by weight 96.9%; After treating that tin melts fully, the Cu of the Ag of percentage by weight 1.0% and percentage by weight 2.0% is joined in the middle of the tin liquor, stir, form alloy; La/Ce base mishmetal with percentage by weight 0.1% adds in the above-mentioned alloy liquid rapidly simultaneously, and constantly stirs, till melting fully to rare earth; 460 ℃ of insulations 1.5 hours, stir, make the alloy homogenising.Cooling treats to go out behind the alloy graining salt-mixture of surface chlorination potassium, potassium oxide, promptly obtains the SAC mishmetal series leadless solder of low silver content.
Embodiment 5
With potassium chloride: potassium oxide=(1～1.7): the salt-mixture of (0.8～1.3) (percentage by weight) adds smelting furnace, after dissolving under 580 ℃, adds the tin of percentage by weight 96.2%; After treating that tin melts fully, the Cu of the Ag of percentage by weight 1.8% and percentage by weight 1.7% is joined in the middle of the tin liquor, stir, form alloy; La/Ce base mishmetal with percentage by weight 0.3% adds in the above-mentioned alloy liquid rapidly simultaneously, and constantly stirs, till melting fully to rare earth; 460 ℃ of insulations 1.5 hours, stir, make the alloy homogenising.Cooling treats to go out behind the alloy graining salt-mixture of surface chlorination potassium, potassium oxide, promptly obtains the SAC mishmetal series leadless solder of low silver content.
Comparative example 1
With potassium chloride: potassium oxide=(1～1.7): the salt-mixture of (0.8～1.3) (percentage by weight) adds smelting furnace, after dissolving under 580 ℃, adds the tin of percentage by weight 96.3%; After treating that tin melts fully, the Cu of the Ag of percentage by weight 3.0% and percentage by weight 0.7% is joined in the middle of the tin liquor, stir, form alloy; 460 ℃ of insulations 1.5 hours, stir, make the alloy homogenising.Cooling treats to go out behind the alloy graining salt-mixture of surface chlorination potassium, potassium oxide, i.e. De Yinxi copper lead free brazing material.
The SAC mishmetal series leadless solder of the low silver content of embodiment 1-5 preparation and the silver-colored tin copper lead free brazing material performance of comparative example 1 preparation are detected, and testing result is as shown in table 2.
Table 2: embodiment 1-5 and comparative example tin solder performance are relatively
As can be seen from Table 1: the SAC mishmetal series leadless solder Ag content of low silver content of the present invention is 0.1%～2.0%, and silver content is lower, thereby cost is lower, has very high cost performance, and economic benefit is obvious, is suitable for market-oriented demand.
As can be seen from Table 2: the SAC mishmetal series leadless solder of low silver content of the present invention not only has good tensile strength, percentage elongation, and spreading area is all bigger, is applicable to the surface-assembled of microelectronic industry.
Specific embodiment described in the present invention only is that the present invention's spirit is illustrated.The technical staff of the technical field of the invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although the present invention has been made detailed explanation and has quoted some specific embodiments as proof, to those skilled in the art, only otherwise leave that the spirit and scope of the present invention can be done various variations or correction is obvious.
Claims (7)
1. the SAC mishmetal series leadless solder of a low silver content, this lead-free brazing is made up of following components in weight percentage:
Ag:0.1%～2.0%; Cu:0.2%～2.5%; Mishmetal: 0.1%～3.0%; All the other are Sn and the impurity element that is difficult to avoid.
2. the SAC mishmetal series leadless solder of low silver content according to claim 1 and 2, it is characterized in that: this lead-free brazing is made up of following components in weight percentage:
Ag:0.5%～1.5%; Cu:0.8%～2.0%; Mishmetal: 0.5%～2.0%; All the other are Sn and the impurity element that is difficult to avoid.
3. the SAC mishmetal series leadless solder of low silver content according to claim 1 and 2, it is characterized in that: described mishmetal is a La-Ce base mishmetal, and wherein the each component weight percent content is in the mishmetal: La＞28.0%, Ce＞50%, Pr＞4%, Nd＞15%, Fe＜0.2%, P＜0.01%, Sm＜0.3%, Mg＜0.1%, S＜0.01%, Zn＜0.1%.
4. the preparation method of the SAC mishmetal series leadless solder of a low silver content, this method may further comprise the steps:
A: be cast on the metal Sn after the salt-mixture fusing with potassium chloride and potassium oxide, under temperature 600-800 ℃ condition, metal Sn melted fully then;
B: will be that 0.1%～2.0% metal A g and percentage by weight are that 0.2%～2.5% metal Cu joins fully to stir in the Sn liquid and forms alloy liquid according to percentage by weight;
C, will be that 0.1%～3.0% norium joins rapidly constantly to stir in the above-mentioned alloy liquid norium is melted fully according to percentage by weight, insulation be 0.5-3 hour under 400-600 ℃ condition, stirs; The salt-mixture for the treatment of to remove behind the alloy graining surface chlorination potassium and potassium oxide promptly obtains the SAC mishmetal series leadless solder of low silver content.
5. the preparation method of the SAC mishmetal series leadless solder of low silver content according to claim 4, it is characterized in that: the weight ratio of potassium chloride described in the steps A and potassium oxide is 1-1.7: 0.8-1.3, and the temperature when described salt-mixture melts is 450-600 ℃.
6. according to the preparation method of the SAC mishmetal series leadless solder of claim 4 or 5 described low silver contents, it is characterized in that: the temperature when metal Sn melts fully in the steps A is 650-750 ℃.
7. the preparation method of the SAC mishmetal series leadless solder of low silver content according to claim 4 is characterized in that: the temperature among the step C during insulation is 450-500 ℃, and temperature retention time is 1-2 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102461355A CN101700606B (en) | 2009-11-27 | 2009-11-27 | Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102461355A CN101700606B (en) | 2009-11-27 | 2009-11-27 | Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof |
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| CN102848099A (en) * | 2012-10-10 | 2013-01-02 | 南京航空航天大学 | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Pr, Ga and Se |
| CN102936669A (en) * | 2012-11-28 | 2013-02-20 | 一远电子科技有限公司 | Low-melting-point lead-free solder alloy |
| CN103028862A (en) * | 2011-09-29 | 2013-04-10 | 江苏天瑞仪器股份有限公司 | Flux and process used for welding six-level rod of mass spectrometer on fixing plate |
| CN104759783A (en) * | 2015-03-24 | 2015-07-08 | 广东工业大学 | Low-silver lead-free solder and preparation method thereof |
| CN105290642A (en) * | 2015-11-28 | 2016-02-03 | 一远电子科技有限公司 | Antioxidant tin-copper alloy brazing filler metal |
| CN106181110A (en) * | 2016-08-16 | 2016-12-07 | 镇江市锶达合金材料有限公司 | A kind of rare earth alloy solder and preparation method thereof |
| CN106514041A (en) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | Low-Ag Cu-based medium-temperature solder |
| CN106736017A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Low-silver copper-base middle temperature solder paste |
| CN113843546A (en) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | CuPSnAg Ni-Re ultra-silver solder, preparation method and application |
| CN114367761A (en) * | 2022-02-21 | 2022-04-19 | 中山翰华锡业有限公司 | Halogen-free lead-free soldering paste with low residues after soldering and preparation method thereof |
| CN114871628A (en) * | 2022-05-31 | 2022-08-09 | 杭州华光焊接新材料股份有限公司 | Low-silver high-strength lead-free tin-based solder and preparation method thereof |
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- 2009-11-27 CN CN2009102461355A patent/CN101700606B/en not_active Expired - Fee Related
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| CN103028862A (en) * | 2011-09-29 | 2013-04-10 | 江苏天瑞仪器股份有限公司 | Flux and process used for welding six-level rod of mass spectrometer on fixing plate |
| CN103028862B (en) * | 2011-09-29 | 2015-08-26 | 江苏天瑞仪器股份有限公司 | For mass spectrometric six grades of bars being welded on solder flux on fixed head and technique |
| CN102848099A (en) * | 2012-10-10 | 2013-01-02 | 南京航空航天大学 | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Pr, Ga and Se |
| CN102848099B (en) * | 2012-10-10 | 2015-05-20 | 南京航空航天大学 | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Pr, Ga and Se |
| CN102936669A (en) * | 2012-11-28 | 2013-02-20 | 一远电子科技有限公司 | Low-melting-point lead-free solder alloy |
| CN102936669B (en) * | 2012-11-28 | 2014-09-10 | 一远电子科技有限公司 | Low-melting-point lead-free solder alloy |
| CN104759783A (en) * | 2015-03-24 | 2015-07-08 | 广东工业大学 | Low-silver lead-free solder and preparation method thereof |
| CN105290642A (en) * | 2015-11-28 | 2016-02-03 | 一远电子科技有限公司 | Antioxidant tin-copper alloy brazing filler metal |
| CN106181110A (en) * | 2016-08-16 | 2016-12-07 | 镇江市锶达合金材料有限公司 | A kind of rare earth alloy solder and preparation method thereof |
| CN106181110B (en) * | 2016-08-16 | 2018-11-23 | 镇江市锶达合金材料有限公司 | A kind of preparation method of rare earth alloy solder |
| CN106514041A (en) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | Low-Ag Cu-based medium-temperature solder |
| CN106736017A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Low-silver copper-base middle temperature solder paste |
| CN113843546A (en) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | CuPSnAg Ni-Re ultra-silver solder, preparation method and application |
| CN114367761A (en) * | 2022-02-21 | 2022-04-19 | 中山翰华锡业有限公司 | Halogen-free lead-free soldering paste with low residues after soldering and preparation method thereof |
| CN114367761B (en) * | 2022-02-21 | 2023-08-18 | 中山翰华锡业有限公司 | Low-residue halogen-free lead-free soldering paste after welding and preparation method thereof |
| CN114871628A (en) * | 2022-05-31 | 2022-08-09 | 杭州华光焊接新材料股份有限公司 | Low-silver high-strength lead-free tin-based solder and preparation method thereof |
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