CN103737195A - Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper - Google Patents
Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper Download PDFInfo
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- CN103737195A CN103737195A CN201310746672.2A CN201310746672A CN103737195A CN 103737195 A CN103737195 A CN 103737195A CN 201310746672 A CN201310746672 A CN 201310746672A CN 103737195 A CN103737195 A CN 103737195A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
The invention discloses Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper and belongs to the technical field of new material. The solder alloy comprises, by weight, 11-35% of Zn, 16-34% of Bi, 0.01-2% of one or both of Al and Ni or 0.01-0.5% of one or both of P and RE, and rest of Sn. The solder alloy has excellent wettability on both aluminum baseboard and copper baseboard and can be well combined with an aluminum interface and a copper interface, and accordingly the soldered joint has excellent mechanical property; such dissimilar metals as aluminum and copper can be soldered directly, and the Sn-Zn-Bi-base lead-free solder alloy can also be used for the soldering between aluminum and aluminum; the Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper is simple in technique, is low in cost, and is more suitable for the aluminum-copper soldering or aluminum-aluminum soldering than the prior solder.
Description
Technical field
The present invention relates to the Sn-Zn-Bi base leadless solder alloy for aluminum bronze solder, belong to new material technology field.
Background technology
In recent years, because copper shortage of resources causes copper valency high, in order to reduce costs, in the industries such as refrigeration, electric power transfer, machine-building, electronics manufacture, adopt the more approaching aluminium substitution copper of electric conductivity and thermal conductivity and copper.In application at aluminium for copper, the problem that aluminum bronze dissimilar metal connects is particularly important.
At present, the major way of aluminum bronze soldering is solder brazing (brazing temperature is higher than 450 ℃), use aluminium silicon brazing filler metal, for example the solder of Al-12.6wt.%Si eutectic solder (577 ℃ of eutectic temperatures) and interpolation the 3rd constituent element, adopts heating in vacuum or automatic flame heating conventionally.But, solder brazing exists many deficiencies: 1) fusing point of aluminium is 660 ℃, it is improper that brazing temperature is controlled, aluminum pipe can local thawing cause tube wall attenuation, in addition, higher brazing temperature can be aggravated the ablation of soldered fitting, and particularly the ablation of aluminium side is more serious, thereby has affected the mechanical property of soldered fitting; 2) brazing temperature is generally more than 500 ℃, and Al, Cu atom diffusion ratio are very fast, easily forms the CuAl2 intermetallic compound of fragility, causes soldered fitting strength decreased; 3) generally use the brazing flux that corrosivity is strong to remove the oxide-film on aluminium surface, the residue of pricker after-welding brazing flux has strong corrosivity, and soldered fitting is caused corrosion and is difficult to cleaning; 4) vacuum brazing, gas brazing are higher to specification requirement, and the quality of soldered fitting can not guarantee.
Solder typically refers to solder liquidus temperature lower than 450 ℃ of solderings of carrying out.Because brazing temperature is lower, solder is little to the oxidation of matrix material and ablation effect; Meanwhile, can select as the case may be different solders, obtain the soldered fitting of varying strength and different operating temperature requirements, strong adaptability, flexibility are good, can meet the requirement unleaded to soldering of environmental protection under the new situation.Therefore, develop and be applicable to the solder of aluminum bronze dissimilar metal, and the lead-free brazing that meets environmental requirement is the key that realizes aluminum bronze brazing.
Plumbous (Sn-Pb) alloy of tin is the preferred material of conventional softer soldering.The seventies in last century, the people such as Gordon Francis Arbib develop at least 35wt%Pb of a kind of use Pb-Sn-Ag(, at least 10wt%Sn and X%Ag, and X=0.1+ (5 * 10
-4) (Sn%)
2+ (1 * 10
-5) (Sn%)
3) soft solder carrys out the method (Gordon Francis Arbib, Bernard Michael Allen, Aluminum soldering composition, U.S. Patent number: US4070192, Granted publication day: Jan.24,1978) of brazed aluminum.The people such as Duane J.Schmatz come brazed aluminum and copper (Duane J.Schmatz, Dearborn Heights, Aluminum soldering with the brazing filler metal alloy that composition is 95Pb-3Sn-2Ag, U.S. Patent number: US3855679, Granted publication day, Dec.24,1974).But lead can enter nature along with discontinued product as a kind of poisonous and hazardous heavy metal element, by being dissolved in acid rainwater, infiltrate soil, finally dissolve in underground water and food chain.Leaded underground water or food can damage health.For preventing the plumbous harm to the pollution of natural environment and human health, various countries in succession to lead the application in industry carried out strict restriction.Therefore, adopt lead-free to replace lead-containing materials to become inevitable choice.
The definition of at present generally acknowledged lead-free brazing is in the world: take Sn as matrix, added the solder alloy of the alloying elements such as Ag, Cu, In, Bi, Zn.Existing lead-free brazing mainly be take the Bimary and trinary alloys such as Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-In, Sn-Bi, Sn-Zn as main.Wherein, the eutectic composition of Sn-Ag solder is Sn-3.5Ag, during with its soldering aluminum bronze, at aluminium side near interface, can form Ag-Al compound, but in the middle of this compound and aluminium interface, also have the rich Sn layer of one deck, so the combination at aluminium side interface is still the weak solid solution combination of Sn-Al, eliminate the rich Sn layer between Ag-Al, must increase the content of Ag in solder, and the cost of Ag is higher, the content that increases Ag will certainly increase the cost of solder greatly.Cu in Sn-Cu solder can generate intermetallic compound with Al in theory, but its eutectic composition is Sn-0.7Cu, very little containing Cu amount, during with its soldering aluminum bronze, cannot form Al-Cu intermetallic compound, thereby cannot form effective combination at aluminium side interface.Sn-3Ag-0.5Cu solder is the solder of extensive use in microelectronics industry at present, but while using its soldering aluminum bronze, the problem that existence is identical with Sn-Cu bianry alloy with Sn-Ag, be that Al-Ag and Al-Cu intermetallic compound are not easy to form on aluminium interface, so the combination at aluminium side interface is still very weak.The eutectic temperature of Sn-In alloy is 120 ℃, Sn-Bi alloy eutectic temperature is 139 ℃, there is the fusing point lower than Sn-Pb eutectic solder, but while adopting Sn-In or Sn-Bi solder brazing aluminum bronze, because the mutual solubility of Al and Sn, In, Bi is extremely low, and without intermetallic compound, generate, so aluminium side interface cannot form effective combination.
To sum up, other lead-free solder alloy except Sn-Zn, is all difficult to and the effective combination of aluminium side interface formation, and the bond strength that increases aluminium side interface is the key that solves aluminum bronze solder problem.Zn, Al mutual solubility are larger, in very large range can generate solid solution.During with the direct soldering aluminum bronze of Sn-Zn solder, can generate in aluminium interface Al-Zn solution area, form solid solution with aluminium base and be combined; Meanwhile, Sn-Zn base solder can form Cu-Zn, Cu-Sn intermetallic compound with copper base, thereby forms reliable combination.The eutectic composition of Sn-Zn bianry alloy is Sn-9Zn, 199 ℃ of fusing points that approach Sn-Pb eutectic solder of its fusing point.But, the discovery of research Sn-9Zn aluminum bronze soldered fitting, the fracture position of joint is still in aluminium side interface, the weak link that aluminum bronze soldered fitting is described is still the combination at solder and aluminium interface.Therefore,, in order to obtain the aluminum bronze soldered fitting of high reliability, must increase the content of Zn in solder.In addition, under molten condition, Sn-Zn solder surface is oxidizable, makes solder wetting variation, has a strong impact on the soldering processes performance of solder; Meanwhile, the Zn in Sn-Zn solder is compatible perishable, makes the corrosion resistance variation of solder, and its soldered fitting easily produces integrity problem in process under arms.Therefore, also need to add soldering processes performance and the corrosion resistance that other constituent element improves solder.Nippon Telegraph and Telephone Company in 1987 to develop the Sn-Zn-Bi solder (Zn :0.1-10wt%, Bi :25-85wt%, Sb :0-10wt%, Sn as the margin) to weld ceramics (Nippon Telegraph and Telephone company, Ceramide ッ ku use は san da, Japanese Patent No.: JPS62-252693, authorized the announcement date: November 4, 1987), Japan Senju Metal corporation and Matsushita Electric has developed a Sn-Zn-Bi-Ag solder (Zn: 2 - 10wt%, Bi :10-30wt%, Ag :0.05-2wt%, Sn for the balance) for the electronic device at low temperature solder (Japanese Senju Metal Industry Co., Matsushita Electric Industrial Co., lead gift re ー は san da alloys, Japanese Patent No.: JPH9 -253 882, authorized the announcement date: September 30, 1997).In above-mentioned patent, the high Zn content of brazing filler metal alloy only has 10wt%, approaches the Zn content in Sn-9Zn solder, if carry out aluminum bronze soldering with it, and combination that equally cannot be stronger with aluminium interface formation.Kunshan Chengli Soldering Tin Manufacturin Co., Ltd has developed Sn-Zn-Bi solder (Zn:35-47wt%, Bi:10-15wt%, Sn is surplus) for the secondary soldering (Kunshan Chengli Soldering Tin Manufacturin Co., Ltd of wiring board, no-lead soft soldering, China Patent No.: ZL200610089715.4, Granted publication day: on January 21st, 2009), but its Zn too high levels, solder non-oxidizability is reduced, significantly affect the soldering processes performance of solder; Meanwhile, its Bi content is too low, less to the improvement effect of solder wetting.Dongguan Hanhong Electronic Materials Co., Ltd. is just at disclosed Sn-Zn-Bi gold alloy solder tin cream patent application (Zn:1-20wt%, Bi:35-45wt%, Sn:45-60wt%) for plumbous aluminium, low-temperature welding (Dongguan Hanhong Electronic Materials Co., Ltd. between lead bronze, a kind of novel gold alloy solder tin cream and preparation method thereof, Chinese Patent Application No.: 201310196429.8, Shen Qing Publication day: on August 28th, 2013), but its Bi too high levels, can make solder embrittlement increase, simultaneously, in process, easily there is microstructure coarsening phenomenon under arms in soldered fitting, produce integrity problem.
In sum, the subject matter that existing aluminum bronze solder exists with solder: 1) solder brazing solder fusing point is too high, causes its soldering processes temperature higher, easily aluminium base is caused to ablation, affects the performance of soldered fitting; 2) bond strength at solder and aluminium side interface a little less than, cause the mechanical property of joint poor; 3) solder is poor in the wetability of aluminium base, has had a strong impact on the soldering processes performance of solder; 4) in solder, contain poisonous and harmful substance.
Summary of the invention
The object of the invention is the problem for existing solder fusing point high (solder brazing solder), and soldered fitting poor mechanical property poor in aluminium base wetability, be provided for the Sn-Zn-Bi base leadless solder alloy of aluminum bronze solder, can the lower direct brazed aluminum copper heterogenous metal of soft soldering method of adopting process temperature, it all has good wetability on aluminium base and copper base, and all can form stronger combination with aluminium and copper interface, form the aluminum bronze soldered joint of high reliability.
The technical scheme that the present invention takes is: for the Sn-Zn-Bi base leadless solder alloy of aluminum bronze solder, described lead-free solder alloy comprises that the component of following percentage by weight: Zn is 11-35%, Bi is 16-34%, one or both in the Al of 0.01-2% or the Ni of 0.01-2%, and Sn is surplus.
Described lead-free solder alloy also comprises the P of 0.001-0.5%, one or both in the RE of 0.01-0.5%.
Take above-mentioned technical scheme, Zn element and aluminium base and copper base all have good adhesion, and Zn, Al mutual solubility are larger, easily form solid solution, and Zn and Cu can form Cu
5zn
8and CuZn
5intermetallic compound.With when the Zn solder brazing aluminum bronze, be conducive to generate in aluminium interface Al-Zn solution area, Zn also can form thorn-like solid solution whisker and inserts solder and improve bond strength on aluminium base simultaneously; Containing Zn solder, in copper interface, generate Cu-Zn intermetallic compound, thereby form effective combination.The optimum interpolation scope of Zn is 11-35wt%, if Zn content lower than 11wt%, combination that can not be stronger with aluminium interface formation, causes aluminum bronze soldered fitting mechanical property poor; If Zn content higher than 35wt%, can have a strong impact on non-oxidizability and the decay resistance of solder.
Bi element is enriched in liquid solder surface when solder melts, and effectively reduces surface tension, thereby improves the wetability of solder.And low melting point Bi element add the fusing point that can significantly reduce solder.The optimum interpolation scope of Bi is 16-34%, if Bi content, lower than 16wt%, cannot play the effect that improves solder wetting of the present invention; If Bi content higher than 34%, can make solder embrittlement increase, meanwhile, easily there is microstructure coarsening phenomenon in process in soldered fitting, produces integrity problem under arms.
Because Al is more active than Zn, the Al element of interpolation can form pellumina, changes the structure of liquid solder skin covering of the surface, has hindered contacting of oxygen and Zn, the oxidation of minimizing Zn, thus improve the wettability of solder.And because Al can be solidly soluted in Zn, the Zn that makes in solder conventionally to exist with needle-like form changes into spherical mutually, has the effect of thinning microstructure, thereby improves the mechanical property of brazing filler metal alloy.
Adding of Ni element, can improve the non-oxidizability of liquid solder, thereby improve the wetability of solder to substrate.In process of setting Ni can with solder in Zn form Ni
3zn
14compound, has reduced the content of the Zn phase being easily corroded in solder after soldering, thereby has improved the corrosion resistance of solder.
P element replaces Zn oxidation on liquid solder surface, and the oxide of P is not static, and it constantly generates and volatilizees, and makes the liquid solder surface can residual too much oxidation product, thereby has improved the wetability of brazing filler metal alloy.
Trace RE element add the generation that can significantly suppress thick β-Sn crystal grain, thinning microstructure, thus improve the mechanical property of brazing filler metal alloy.Meanwhile, RE element has certain suction-operated to oxygen, has improved non-oxidizability and the wetability of solder.
Effect of the present invention and benefit are: 1) liquidus temperature of brazing filler metal alloy of the present invention, between 160 ℃-330 ℃, can adopt the lower soldering process temperature of 180 ℃-350 ℃ to carry out soldering, little to the oxidation of aluminium, copper base and ablation effect.2) Zn and Al have larger solid solubility, make solder form solid solution with aluminium, with respect to eutectic Sn-9Zn solder, the present invention has increased the content of Zn in solder, increased the dissolution degree of Al-Zn solution area and aluminium base, improved its bond strength on aluminium interface, thereby made aluminum bronze soldered fitting there is good mechanical property.3) surface tension of liquid solder when Bi element can reduce soldering in solder, thus the wetability of solder on aluminium and copper base improved, and its wetability on aluminium base is obviously better than the wetability on copper base; Meanwhile, the interpolation of Bi can effectively reduce the fusing point of solder.4) interpolation of Al or Ni element has all improved the non-oxidizability of solder; Meanwhile, add the obviously microstructure of refinement solder of Al element, add the decay resistance that Ni element can also improve solder.5) the present invention uses Sn, Zn, Bi, Al, Ni, P, RE constituent element are nontoxic element, meet the requirement of lead-free brazing green, environmental protection.
Accompanying drawing explanation
Fig. 1 is the bridging arrangement schematic diagram of joint of aluminium and copper before soldering.
Fig. 2 is the spreading area of solder on aluminium base.
Fig. 3 is the spreading area of solder on copper base.
Fig. 4 is the shear strength of aluminum bronze soldered fitting.
The specific embodiment
Below in conjunction with technical scheme, describe the specific embodiment of the present invention in detail.
Embodiment 1
Each component is respectively by weight percentage: Zn11%, and Bi34%, Al0.01%, surplus is Sn.
The preparation method of solder is as follows:
(1) preparation of lead-free solder alloy is to use the metal Sn that purity is 99.99%, the Metal Zn that purity is 99.99%, the metal Bi that purity is 99.99%, purity is 99.99% metal A l, purity is 99.99% metal Ni, each component of components by weight percentage brazing filler metal alloy, 100g, is placed in high-temperature resistant tube altogether;
(2) use hydrogen flame by high-temperature resistant tube one end scorification sealing, other end scorification is for thin mouth and use vavuum pump to vacuumize processing, after the air in emptying pipe, thin mouthful of place's scorification is sealed;
(3) high-temperature resistant tube is put in resistance furnace, is heated to 650 ℃ of meltings, after all components all melts, insulation 2-3 hour, makes alloy homogenising, and then cooling down, to room temperature, obtains brazing filler metal alloy.
Embodiment 2
Each component is respectively by weight percentage: Zn12%, and Bi28%, Al0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 3
Each component is respectively by weight percentage: Zn15%, and Bi25%, Al0.4%, P0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 4
Each component is respectively by weight percentage: Zn20%, and Bi23%, Al1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Each component is respectively by weight percentage: Zn25%, and Bi20%, Al0.5%, RE0.5%, P0.001%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 6
Each component is respectively by weight percentage: Zn30%, and Bi18%, Al1.5%, RE0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 7
Each component is respectively by weight percentage: Zn35%, and Bi16%, Al2%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 8
Each component is respectively by weight percentage: Zn11%, and Bi34%, Ni0.01%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 9
Each component is respectively by weight percentage: Zn12%, and Bi28%, Ni0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Each component is respectively by weight percentage: Zn15%, and Bi25%, Ni0.25%, P0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 11
Each component is respectively by weight percentage: Zn20%, and Bi23%, Ni1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 12
Each component is respectively by weight percentage: Zn25%, and Bi20%, Ni0.25%, RE0.01%, P0.5%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 13
Each component is respectively by weight percentage: Zn30%, and Bi18%, Ni1.5%, RE0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 14
Each component is respectively by weight percentage: Zn35%, and Bi16%, Ni2%, surplus is Sn.Alloy preparation method is with embodiment 1.
Each component is respectively by weight percentage: Zn11%, and Bi34%, Al0.1%, Ni0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 16
Each component is respectively by weight percentage: Zn15%, and Bi28%, Al0.5%, Ni0.2%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 17
Each component is respectively by weight percentage: Zn20%, and Bi25%, Al0.1%, Ni0.5%, RE0.1%, P0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 18
Each component is respectively by weight percentage: Zn25%, and Bi23%, Al1%, Ni0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 19
Each component is respectively by weight percentage: Zn30%, and Bi20%, Al2%, Ni0.1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Embodiment 20
Each component is respectively by weight percentage: Zn35%, and Bi16%, Al0.1%, Ni1%, surplus is Sn.Alloy preparation method is with embodiment 1.
Solder in above-described embodiment and comparative example Sn-9Zn solder are carried out to wetability test and the soldered fitting shearing performance test on copper, aluminium base, and wherein soldered fitting adopts bridging type joint, and bridging arrangement as shown in Figure 1.Experiment condition is as follows: (1) makes by solder the solder ball that diameter is 1.5mm, solder ball is placed on the copper coin and aluminium sheet of the commercially available commercial brazing flux that applies 12mg, and put it in reflow ovens and heat, the spreading area of brazing filler metal alloy on aluminium base and copper base after use graphics software measurement Reflow Soldering, measurement result is listed in respectively in Fig. 2 and Fig. 3.(2) after joint is assembled, put into reflow ovens by the rework profile heating of setting, after refluxing, take out soldered fitting, then, by the shear strength of omnipotent stretching experiment machine test soldered fitting, test result is listed in Fig. 4.
Table 1 has been listed the performance of the present invention for composition, performance and the comparative example Sn-9Zn of the Sn-Zn-Bi base leadless solder alloy embodiment of aluminum bronze solder.
Table 1
。
Claims (2)
1. for the Sn-Zn-Bi base leadless solder alloy of aluminum bronze solder, it is characterized in that: described lead-free solder alloy comprises that the component of following percentage by weight: Zn is 11-35%, Bi is 16-34%, one or both in the Al of 0.01-2% or the Ni of 0.01-2%, and Sn is surplus.
2. the Sn-Zn-Bi base leadless solder alloy for aluminum bronze solder according to claim 1, is characterized in that: the component of described lead-free solder alloy also comprises the P of 0.001-0.5%, one or both in the RE of 0.01-0.5%.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104213011A (en) * | 2014-09-04 | 2014-12-17 | 楚盛 | Long-service life and low-melting point metal alloy heat conducting material and preparation method thereof |
| CN106624431A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin-zinc lead-free solder and preparation method thereof |
| CN108213764A (en) * | 2017-12-13 | 2018-06-29 | 华南理工大学 | A kind of tin base leadless soldering-flux alloy for effectively reducing base material meltage |
| CN109202328A (en) * | 2017-06-29 | 2019-01-15 | 中航光电科技股份有限公司 | It is a kind of for brazed aluminum alloy and the solder of magnesium alloy and preparation method thereof |
| CN109226992A (en) * | 2018-08-31 | 2019-01-18 | 西安理工大学 | A kind of method that low temperature diffusion prepares Cu-Al bimetal material |
| CN111112883A (en) * | 2020-03-04 | 2020-05-08 | 程斌 | Corrosion-resistant high-strength anisotropic welding material and preparation method thereof |
| CN113369745A (en) * | 2021-05-21 | 2021-09-10 | 北京理工大学 | Quaternary eutectic solder, preparation method and solder composition |
| US11450642B2 (en) * | 2017-07-31 | 2022-09-20 | Infineon Technologies Ag | Soldering a conductor to an aluminum metallization |
| WO2022199061A1 (en) * | 2021-03-23 | 2022-09-29 | 浙江永旺焊材制造有限公司 | Self-fluxing brazing alloy applied to welding of aluminum-copper dissimilar materials and welding method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104213011A (en) * | 2014-09-04 | 2014-12-17 | 楚盛 | Long-service life and low-melting point metal alloy heat conducting material and preparation method thereof |
| CN106624431A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin-zinc lead-free solder and preparation method thereof |
| CN109202328A (en) * | 2017-06-29 | 2019-01-15 | 中航光电科技股份有限公司 | It is a kind of for brazed aluminum alloy and the solder of magnesium alloy and preparation method thereof |
| US11450642B2 (en) * | 2017-07-31 | 2022-09-20 | Infineon Technologies Ag | Soldering a conductor to an aluminum metallization |
| CN108213764A (en) * | 2017-12-13 | 2018-06-29 | 华南理工大学 | A kind of tin base leadless soldering-flux alloy for effectively reducing base material meltage |
| CN109226992A (en) * | 2018-08-31 | 2019-01-18 | 西安理工大学 | A kind of method that low temperature diffusion prepares Cu-Al bimetal material |
| CN111112883A (en) * | 2020-03-04 | 2020-05-08 | 程斌 | Corrosion-resistant high-strength anisotropic welding material and preparation method thereof |
| WO2022199061A1 (en) * | 2021-03-23 | 2022-09-29 | 浙江永旺焊材制造有限公司 | Self-fluxing brazing alloy applied to welding of aluminum-copper dissimilar materials and welding method |
| CN113369745A (en) * | 2021-05-21 | 2021-09-10 | 北京理工大学 | Quaternary eutectic solder, preparation method and solder composition |
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