JP2000126890A - Soldering material - Google Patents
Soldering materialInfo
- Publication number
- JP2000126890A JP2000126890A JP11317139A JP31713999A JP2000126890A JP 2000126890 A JP2000126890 A JP 2000126890A JP 11317139 A JP11317139 A JP 11317139A JP 31713999 A JP31713999 A JP 31713999A JP 2000126890 A JP2000126890 A JP 2000126890A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- solder
- alloy
- composition
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、主として電子回路
基板のはんだ付けに用いるクリームはんだ等におけるは
んだ材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder material for cream solder used mainly for soldering electronic circuit boards.
【０００２】[0002]
【従来の技術】近年の電子回路基板における表面実装
は、電子部品の小型化、高密度実装化の一途をたどって
いる。それに伴いはんだ材料の高機能化が必要となって
きている。2. Description of the Related Art In recent years, surface mounting on electronic circuit boards has been steadily reduced in size and high-density mounting of electronic components. Accordingly, it has become necessary to enhance the functionality of the solder material.
【０００３】しかし、環境問題の立場から、従来一般の
はんだ材料（Ｓｎ−Ｐｂ系合金）中に含まれる鉛の問題
が浮上してきている。すなわち、従来のはんだ材料を用
いた製品の廃棄物が酸性雨にさらされると、有害物質で
ある鉛が大量に溶出するので、その毒性は非常に深刻な
問題となっている。そのため鉛を含むはんだに代替する
ことができる鉛を含有しないはんだ（鉛レスはんだ）材
料の開発が必要となっている。However, from the standpoint of environmental problems, the problem of lead contained in conventional general solder materials (Sn-Pb-based alloys) has emerged. That is, when the waste of a product using a conventional solder material is exposed to acid rain, a large amount of lead, which is a harmful substance, is eluted, so that its toxicity is a very serious problem. Therefore, it is necessary to develop a lead-free solder (lead-less solder) material that can be substituted for a solder containing lead.
【０００４】以下に従来のはんだ材料の一例について説
明する。代表的なはんだ合金はその金属組成が錫と鉛の
共晶合金である、６３Ｓｎ−３７Ｐｂ（組成の比率６
３：３７は重量％以下同様）であり、１８３℃に共晶点
をもつものであった。An example of a conventional solder material will be described below. A typical solder alloy is 63Sn-37Pb (composition ratio 6), whose metal composition is a eutectic alloy of tin and lead.
3: 37% by weight or less), and had a eutectic point at 183 ° C.
【０００５】また、鉛を含まないはんだ合金の一例につ
いて説明する。Ｓｎ−３．５Ａｇ合金はんだ、およびＳ
ｎ−５Ｓｂ合金はんだは、Ｓｎ−Ｐｂ共晶はんだよりも
優れた機械的強度を持っている。また、濡れ性について
はＳｎ−Ｐｂ共晶はんだには若干劣るが、それでも代替
できる可能性があると考えられている。An example of a lead-free solder alloy will be described. Sn-3.5Ag alloy solder, and S
The n-5Sb alloy solder has better mechanical strength than the Sn-Pb eutectic solder. In addition, although the wettability is slightly inferior to that of the Sn-Pb eutectic solder, it is considered that there is a possibility that the solder may be substituted.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、Ｓｎ−
３．５Ａｇ合金はんだやＳｎ−５Ｓｂ合金はんだは融点
が高いため、作業温度が２２０℃〜２５０℃であるよう
な高温となり、電子部品の組立には温度が高すぎ、電子
部品を損傷させるという問題点を有していた。However, Sn-
Since the 3.5Ag alloy solder and the Sn-5Sb alloy solder have a high melting point, the working temperature is as high as 220 ° C. to 250 ° C., and the temperature is too high for assembling electronic components, and the electronic components are damaged. Had a point.
【０００７】本発明の目的は、上記のような問題点を発
生することなく、上記はんだの融点を下げ、優れた機械
的強度を持つはんだ材料を提供することにある。An object of the present invention is to provide a solder material having a low melting point and excellent mechanical strength without causing the above-mentioned problems.
【０００８】[0008]
【課題を解決するための手段】本願の発明は、上記課題
を解決するために、Ｓｎ−Ａｇ−Ｂｉ−Ｃｕ系、Ｓｎ−
Ａｇ−Ｂｉ−Ｉｎ−Ｃｕ系あるいはＳｎ−Ｓｂ系のはん
だ材料の組成割合いや、添加材料の割合いを所定のもの
としたものである。Means for Solving the Problems In order to solve the above-mentioned problems, the invention of the present application is based on Sn-Ag-Bi-Cu,
The composition ratio of the Ag-Bi-In-Cu-based or Sn-Sb-based solder material or the ratio of the additive material is set to a predetermined value.
【０００９】[0009]
【発明の実施の形態】本願の第１発明は、上記従来のＳ
ｎ−３．５Ａｇ合金はんだの問題点（融点２２１℃）を
解消するため、Ｓｎを基本組成とし、Ａｇの含有量が
０．１〜２０重量％と、Ｂｉの含有量が０．１〜２５重
量％、Ｃｕの含有量が０．１〜３．０重量％の範囲で含
有することを特徴とするＳｎ−Ａｇ−Ｂｉ−Ｃｕ系のは
んだ材料に係るものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The first invention of the present application is a conventional S
In order to solve the problem of the n-3.5Ag alloy solder (melting point: 221 ° C.), Sn is used as a basic composition, the content of Ag is 0.1 to 20% by weight, and the content of Bi is 0.1 to 25%. The present invention relates to a Sn-Ag-Bi-Cu-based solder material, characterized in that the content of Cu is in the range of 0.1 to 3.0% by weight.
【００１０】本願の第２発明は、同様の目的を達成する
ため、Ｓｎを基本組成とし、Ａｇの含有量が０．１〜２
０重量％、Ｂｉの含有量が０．１〜２５重量％、Ｉｎの
含有量が０．１〜２０重量％、Ｃｕの含有量が０．１〜
３．０重量％の範囲で含有することを特徴とするＳｎ−
Ａｇ−Ｂｉ−Ｉｎ−Ｃｕ系のはんだ材料に係るものであ
る。In order to achieve the same object, the second invention of the present application has a basic composition of Sn and an Ag content of 0.1 to 2%.
0% by weight, Bi content of 0.1 to 25% by weight, In content of 0.1 to 20% by weight, Cu content of 0.1 to
Characterized in that it is contained in a range of 3.0% by weight.
It relates to an Ag-Bi-In-Cu-based solder material.
【００１１】第１発明及び第２発明においてＡｇの含有
量は３．５重量％を中心にして、０．５〜６重量％の範
囲にあることが好適である。また主組成であるＳｎの含
有量は７５〜９８重量％の範囲にあることが好適であ
る。In the first and second inventions, the Ag content is preferably in the range of 0.5 to 6% by weight, centering on 3.5% by weight. The content of Sn as the main composition is preferably in the range of 75 to 98% by weight.
【００１２】本願の第３発明は、上記従来のＳｎ−５Ｓ
ｂ合金はんだの問題点（融点２４０℃）を解消するた
め、ＳｎとＳｂを基本組成とし、Ｓｂの含有量が０．１
〜２０重量％とする合金であって、その中に０．１〜３
０重量％のＢｉ、０．１〜２０重量％のＩｎのいずれか
１種以上を含有し、残部がＳｎからなることを特徴とす
る。A third invention of the present application is the above-mentioned conventional Sn-5S.
In order to solve the problem of the b alloy solder (melting point: 240 ° C.), Sn and Sb are used as basic compositions and the Sb content is 0.1%.
-20% by weight, in which 0.1-3%
It is characterized in that it contains at least one of Bi at 0% by weight and In at 0.1 to 20% by weight, with the balance being Sn.
【００１３】本願の第４発明は、同様の目的を達成する
ため、ＳｎとＳｂを基本組成とし、Ｓｂの含有量が０．
１〜２０重量％とする合金であって、その中に０．１〜
３０重量％のＢｉ、０．１〜２０重量％のＩｎのいずれ
か１種以上を含有すると共に、０．１〜３．０重量％の
Ｃｕ、０．１〜１５重量％のＺｎのいずれか１種以上を
含有し、残部がＳｎからなることを特徴とする。[0013] In order to achieve the same object, the fourth invention of the present application has Sn and Sb as basic compositions and the Sb content is 0.1%.
An alloy containing 1 to 20% by weight, in which 0.1 to
30% by weight of Bi, 0.1 to 20% by weight of In, and / or 0.1 to 3.0% by weight of Cu and 0.1 to 15% by weight of Zn It is characterized in that it contains one or more kinds and the balance consists of Sn.
【００１４】第３発明及び第４発明においてＳｂの含有
量は５重量％を中心にして、１〜９重量％の範囲にある
ことが好適である。また主組成であるＳｎの含有量は８
０〜９８重量％の範囲にあることが好適である。In the third and fourth inventions, the content of Sb is preferably in the range of 1 to 9% by weight, centering on 5% by weight. The content of Sn, which is the main composition, is 8
Preferably it is in the range of 0 to 98% by weight.
【００１５】第１発明及び第２発明において、ＳｎとＡ
ｇを基本的な組成とする合金に、Ｂｉ又はこれに加えて
Ｉｎを添加するのは、融点を下げるためである。このよ
うな目的を達成するため、Ｂｉ、Ｉｎのそれぞれの組成
を０．１重量％以上としている。In the first invention and the second invention, Sn and A
The reason why Bi or In is added to the alloy having g as a basic composition is to lower the melting point. In order to achieve such an object, the composition of each of Bi and In is set to 0.1% by weight or more.
【００１６】また、Ｂｉ、Ｉｎの組成がそれぞれ２５、
２０重量％を超えると機械的強度が得られなくなるので
好ましくない。さらにＢｉ、Ｉｎの添加量を増大する
と、濡れ性を良好なものとすることができる。The composition of Bi and In is 25, respectively.
If it exceeds 20% by weight, it is not preferable because mechanical strength cannot be obtained. Further, when the addition amount of Bi and In is increased, the wettability can be improved.
【００１７】図１は、Ｓｎ−３．５Ａｇ合金にＢｉを添
加した場合の添加量の変化に伴う融点の変化を示すもの
である。図１から明らかなように、Ｂｉの添加量が増加
するとともに融点は直線的に低下し、２５重量％の添加
により融点は１７５℃まで降下する。FIG. 1 shows the change in the melting point with the change in the amount of Bi added to the Sn-3.5Ag alloy. As is clear from FIG. 1, the melting point decreases linearly with an increase in the amount of Bi added, and the melting point drops to 175 ° C. with the addition of 25% by weight.
【００１８】図２は、Ｓｎ−３．５Ａｇ合金にＢｉを添
加した場合の添加量の変化に伴う引張り強度の変化を示
すものである。図２から明らかなように、Ｂｉの添加量
が約１０重量％で引張り強度が最大値を示し、Ｂｉの添
加量が２５重量％を超えると、Ｓｎ−３．５Ａｇ合金の
引張り強度よりも低下する。FIG. 2 shows the change in tensile strength with the change in the amount of Bi added to the Sn-3.5Ag alloy. As apparent from FIG. 2, the tensile strength shows the maximum value when the amount of added Bi is about 10% by weight, and when the amount of added Bi exceeds 25% by weight, the tensile strength is lower than the tensile strength of the Sn-3.5Ag alloy. I do.
【００１９】図３はＳｎ−３．５Ａｇ合金にＢｉを３重
量％添加した場合（Ｓｎ−３．５Ａｇ−３Ｂｉ）と、２
０重量％添加した場合（Ｓｎ−３．５Ａｇ−２０Ｂｉ）
の濡れ性を示すものである。図３から明らかなように、
６０Ｓｎ−４０Ｐｂ共晶はんだと同等の濡れ性を示し、
特にＢｉを２０重量％添加したものは、６０Ｓｎ−４０
Ｐｂ共晶はんだよりも良好な濡れ性を示す。FIG. 3 shows a case where Bi was added to Sn-3.5Ag alloy by 3% by weight (Sn-3.5Ag-3Bi),
0% by weight (Sn-3.5Ag-20Bi)
It indicates the wettability of the material. As is clear from FIG.
Shows the same wettability as 60Sn-40Pb eutectic solder,
In particular, those containing 20% by weight of Bi are 60Sn-40.
Shows better wettability than Pb eutectic solder.
【００２０】上記図１〜図３に示した傾向は、Ｓｎ−
３．５Ａｇ合金にＢｉ及びＩｎの両者を添加した場合に
もみられ、又Ａｇの含有量を異ならしたときにもみられ
る。The trends shown in FIG. 1 to FIG.
This is also seen when both Bi and In are added to the 3.5 Ag alloy, and also when the Ag content is varied.
【００２１】なお、Ｉｎの添加についてはＳｎホイスカ
の発生を抑制する作用をも有している。The addition of In also has the effect of suppressing the generation of Sn whiskers.
【００２２】第１、第２発明において、Ｃｕを添加する
のは強度を向上させるためである。強度確保のためＣｕ
の組成を０．１重量％以上としている。また、２２１℃
未満の融点を確保するために３．０重量％以下とした。In the first and second aspects of the present invention, Cu is added to improve the strength. Cu to ensure strength
Is 0.1% by weight or more. 221 ° C
In order to secure a melting point of less than 3.0% by weight or less.
【００２３】第３発明及び第４発明において、ＳｎとＳ
ｂを基本組成とする合金に、Ｂｉ、Ｉｎの一方又は両方
を添加するのは、第１発明と同様、融点を下げ、濡れ性
を改善するためである。この目的を達成するため、Ｂ
ｉ、Ｉｎのそれぞれの組成を０．１重量％以上とし、ま
た機械的強度の低下を防ぐため、Ｂｉ、Ｉｎのそれぞれ
の組成を３０、２０重量％以下としている。In the third invention and the fourth invention, Sn and S
The reason why one or both of Bi and In are added to the alloy having the basic composition of b is to lower the melting point and improve the wettability similarly to the first invention. To achieve this goal, B
The composition of each of i and In is set to 0.1% by weight or more, and the composition of Bi and In is set to 30 or 20% by weight or less in order to prevent a decrease in mechanical strength.
【００２４】第４発明において、ＳｎとＳｂを基本組成
とし、Ｂｉ、Ｉｎの一方又は両方を添加したものに、更
にＣｕ、Ｚｎを添加するのは強度を向上させるためであ
る。強度確保のためＣｕ、Ｚｎのそれぞれの組成を０．
１重量％以上とし、又２４０℃未満の融点を確保するた
めにそれぞれ、３．０、１５重量％以下とした。In the fourth aspect of the invention, Cu and Zn are further added to the element having a basic composition of Sn and Sb and one or both of Bi and In added to improve the strength. In order to secure strength, the composition of each of Cu and Zn is set to 0.1.
The content is set to 1% by weight or more, and 3.0 and 15% by weight or less to secure a melting point of less than 240 ° C, respectively.
【００２５】表１に本発明のはんだ材料の各実施例、参
考例、比較例をその組成率（重量％）と共に示す。Table 1 shows Examples, Reference Examples and Comparative Examples of the solder material of the present invention, together with the composition ratio (% by weight).
【００２６】[0026]
【表１】 [Table 1]
【００２７】表１に示す実施例１および参考例１〜参考
例６は、Ｓｎ（錫）とＡｇ（銀）を基本組成とし、その
中にＢｉ（ビスマス）、Ｉｎ（インジウム）のいずれか
１種以上を含有したはんだ材料に係るものである。実施
例１は第１発明の実施例である。Example 1 and Reference Examples 1 to 6 shown in Table 1 have a basic composition of Sn (tin) and Ag (silver), in which any one of Bi (bismuth) and In (indium) is contained. It relates to a solder material containing more than one kind. Embodiment 1 is an embodiment of the first invention.
【００２８】特に実施例１、参考例６は、ＳｎとＡｇを
基本組成とし、その中にＢｉ、Ｉｎのいずれか１種以上
を含有すると共に、Ｃｕ（銅）、Ｚｎ（亜鉛）のいずれ
か１種以上を含有したはんだ材料に係るものである。In particular, Example 1 and Reference Example 6 have a basic composition of Sn and Ag, which contain at least one of Bi and In, and which contain at least one of Cu (copper) and Zn (zinc). The present invention relates to a solder material containing at least one kind.
【００２９】実施例２、実施例３は、ＳｎとＳｂ（アン
チモン）を基本組成とし、その中にＢｉ、Ｉｎのいずれ
か１種以上を含有したはんだ材料に係るものである。実
施例２、実施例３は第３発明の実施例である。Embodiments 2 and 3 relate to a solder material having a basic composition of Sn and Sb (antimony) and containing at least one of Bi and In. Embodiment 2 and Embodiment 3 are embodiments of the third invention.
【００３０】又表１には、比較例として従来のはんだ材
料をその組成率（重量％）と共に示す。比較例１はＳｎ
−３．５Ａｇ合金はんだ、比較例２はＳｎ−５Ｓｂ合金
はんだ、比較例３は６３Ｓｎ−３７Ｐｂ共晶はんだであ
る。Table 1 shows a conventional solder material together with its composition ratio (% by weight) as a comparative example. Comparative Example 1 is Sn
-3.5Ag alloy solder, Comparative Example 2 is a Sn-5Sb alloy solder, and Comparative Example 3 is a 63Sn-37Pb eutectic solder.
【００３１】実施例１〜実施例３、参考例１〜６及び比
較例１〜比較例３の各融点、引張り強度及び濡れ性は、
表１に示すとおりである。濡れ性の評価は、○が最良、
□が良、△が普通であり、表１に示す事例のすべては普
通以上であって、不良のものはなかった。The melting point, tensile strength and wettability of Examples 1 to 3, Reference Examples 1 to 6 and Comparative Examples 1 to 3 were as follows:
It is as shown in Table 1. For the evaluation of wettability, ○ is the best,
□ is good, Δ is normal, all of the cases shown in Table 1 are more than normal, and none were defective.
【００３２】表１より明らかなように、Ｓｎ−Ａｇ合金
はんだ及びＳｎ−Ｓｂ合金はんだに、Ｂｉ、Ｉｎを添加
することにより、融点を下げることができ、特に参考例
２、参考例４、参考例５では融点を２００℃以下にする
ことができた。また機械的強度も６３Ｓｎ−３７Ｐｂ共
晶はんだに比較し、同等あるいは改善されている。さら
に濡れ性も実用に差しつかえなく、特に参考例２は６３
Ｓｎ−３７Ｐｂ共晶はんだと同等の良好な濡れ性を有し
ている。As is clear from Table 1, the melting point can be lowered by adding Bi and In to the Sn—Ag alloy solder and the Sn—Sb alloy solder. In Example 5, the melting point could be reduced to 200 ° C. or less. Also, the mechanical strength is equivalent or improved as compared with the 63Sn-37Pb eutectic solder. Furthermore, the wettability may be practical, and in particular, Reference Example 2 is 63
It has good wettability equivalent to that of Sn-37Pb eutectic solder.
【００３３】次に参考例６（Ａｇ３．５重量％、Ｂｉ３
重量％、Ｚｎ１％、Ｃｕ０．７％、Ｓｎ残部）のはんだ
材料及び参考例２（Ａｇ３．５重量％、Ｂｉ２０重量
％．Ｓｎ残部）のはんだ材料をペースト化してなるクリ
ームはんだを用いて、チップ部品実装に供したときの実
験結果を、比較例３（６３Ｓｎ−３７Ｐｂ共晶はんだ）
を材料とするクリームはんだの場合と比較して示すと、
表２のようになる。Next, Reference Example 6 (3.5% by weight of Ag, Bi3
Chip using cream solder obtained by pasting the solder material of wt.%, Zn1%, Cu0.7%, Sn balance) and the solder material of Reference Example 2 (Ag3.5 wt%, Bi20 wt%. Sn balance). Comparative example 3 (63Sn-37Pb eutectic solder) shows the experimental result when subjected to component mounting.
In comparison with the case of cream solder using
Table 2 below.
【００３４】なお、ペースト化に用いたフラックスの組
成は、溶剤４０重量％、ロジン５５．３１重量％、活性
剤０．６９重量％、チキソ剤４重量％である。The composition of the flux used for forming the paste was 40% by weight of solvent, 55.31% by weight of rosin, 0.69% by weight of activator, and 4% by weight of thixotropic agent.
【００３５】[0035]
【表２】 [Table 2]
【００３６】表２から明らかなように、参考例６及び参
考例２におけるチップ立ち発生率は１．７％、１．５５
％であって、比較例３の１．５％とほぼ同等であり、チ
ップ部品の実装を従来の場合とほぼ同様に行うことがで
きる。As is clear from Table 2, the chip standing rate in Reference Example 6 and Reference Example 2 was 1.7% and 1.55.
%, Which is almost the same as 1.5% in Comparative Example 3, and the mounting of the chip component can be performed in substantially the same manner as in the conventional case.
【００３７】上記説明においては、第４発明の実施例を
具体的には挙げなかったが、参考例６と参考例１との関
係に見られるように、例えば実施例２（第３発明の実施
例）のものにＺｎ、Ｃｕを添加することによって引張り
強度を改善できる実施例（第４発明の実施例相当のも
の）を想定できることが自明であるからである。In the above description, the embodiment of the fourth invention is not specifically described. However, as can be seen from the relationship between the reference example 6 and the reference example 1, for example, the embodiment 2 (the implementation of the third invention) This is because it is obvious that an embodiment (corresponding to the embodiment of the fourth invention) in which the tensile strength can be improved by adding Zn and Cu to the example) can be assumed.
【００３８】[0038]
【発明の効果】本発明によれば、はんだの融点を電子部
品組立てが可能な程度にまで下げることができると共
に、機械的強度及び濡れ性にすぐれた、無鉛のはんだ材
料を提供することができる。According to the present invention, it is possible to provide a lead-free solder material which can lower the melting point of solder to a level at which electronic components can be assembled and has excellent mechanical strength and wettability. .
【図１】Ｓｎ−３．５Ａｇ合金にＢｉを添加した場合の
添加量と融点との関係を示す特性図。FIG. 1 is a characteristic diagram showing a relationship between an added amount and a melting point when Bi is added to a Sn-3.5Ag alloy.
【図２】Ｓｎ−３．５Ａｇ合金にＢｉを添加した場合の
添加量と引張り強度との関係を示す特性図。FIG. 2 is a characteristic diagram showing a relationship between the addition amount and the tensile strength when Bi is added to a Sn-3.5Ag alloy.
【図３】各種はんだ材料の濡れ性を比較して示す特性
図。FIG. 3 is a characteristic diagram showing a comparison of wettability of various solder materials.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 福島 哲夫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 古澤 彰男 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Tetsuo Fukushima 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd.
Claims (4)
０．１〜２０重量％、Ｂｉの含有量が０．１〜２５重量
％、Ｃｕの含有量が０．１〜３．０重量％の範囲で含有
することを特徴とするＳｎ−Ａｇ−Ｂｉ−Ｃｕ系のはん
だ材料。1. A composition comprising Sn as a basic composition, containing 0.1 to 20% by weight of Ag, 0.1 to 25% by weight of Bi, and 0.1 to 3.0% by weight of Cu. % Of Sn-Ag-Bi-Cu-based solder material.
０．１〜２０重量％、Ｂｉの含有量が０．１〜２５重量
％、Ｉｎの含有量が０．１〜２０重量％、Ｃｕの含有量
が０．１〜３．０重量％の範囲で含有することを特徴と
するＳｎ−Ａｇ−Ｂｉ−Ｉｎ−Ｃｕ系のはんだ材料。2. A composition comprising Sn as a basic composition, an Ag content of 0.1 to 20% by weight, a Bi content of 0.1 to 25% by weight, an In content of 0.1 to 20% by weight, A Sn-Ag-Bi-In-Cu-based solder material, characterized in that the Cu content is in the range of 0.1 to 3.0% by weight.
量が０．１〜２０重量％とする合金であって、その中に
０．１〜３０重量％のＢｉ、０．１〜２０重量％のＩｎ
のいずれか１種以上を含有し、残部がＳｎからなること
を特徴とするはんだ材料。3. An alloy having a basic composition of Sn and Sb and an Sb content of 0.1 to 20% by weight, wherein 0.1 to 30% by weight of Bi and 0.1 to 20% by weight are contained. Wt% In
A solder material containing at least one of the foregoing, and the balance being Sn.
量が０．１〜２０重量％とする合金であって、その中に
０．１〜３０重量％のＢｉ、０．１〜２０重量％のＩｎ
のいずれか１種以上を含有すると共に、０．１〜３．０
重量％のＣｕ、０．１〜１５重量％のＺｎのいずれか１
種以上を含有し、残部がＳｎからなることを特徴とする
はんだ材料。4. An alloy having a basic composition of Sn and Sb and a Sb content of 0.1 to 20% by weight, wherein 0.1 to 30% by weight of Bi and 0.1 to 20% by weight are contained. Wt% In
, And 0.1 to 3.0.
Any one of Cu% by weight and Zn of 0.1 to 15% by weight.
A solder material comprising at least one species and the balance consisting of Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11317139A JP2000126890A (en) | 1999-11-08 | 1999-11-08 | Soldering material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11317139A JP2000126890A (en) | 1999-11-08 | 1999-11-08 | Soldering material |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7018048A Division JP3040929B2 (en) | 1995-02-06 | 1995-02-06 | Solder material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000126890A true JP2000126890A (en) | 2000-05-09 |
Family
ID=18084890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11317139A Pending JP2000126890A (en) | 1999-11-08 | 1999-11-08 | Soldering material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000126890A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001329046A (en) * | 2000-05-24 | 2001-11-27 | Japan Epoxy Resin Kk | Semiconductor sealing epoxy resin composition, resin sealed semiconductor device, and method for packaging semiconductor device |
| JP2007105750A (en) * | 2005-10-12 | 2007-04-26 | Senju Metal Ind Co Ltd | Sn-In BASED SOLDER ALLOY |
| CN100413634C (en) * | 2005-12-12 | 2008-08-27 | 黄德欢 | Low melting point lead-free soldering tin |
| JP2011058003A (en) * | 2010-11-24 | 2011-03-24 | Mitsubishi Chemicals Corp | Epoxy resin composition for sealing semiconductor, resin-sealed semiconductor device and method for mounting semiconductor device |
| CN103737195A (en) * | 2013-12-30 | 2014-04-23 | 大连理工大学 | Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN106312360A (en) * | 2016-09-28 | 2017-01-11 | 深圳市唯特偶新材料股份有限公司 | Low-temperature welding material and preparation method thereof |
-
1999
- 1999-11-08 JP JP11317139A patent/JP2000126890A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001329046A (en) * | 2000-05-24 | 2001-11-27 | Japan Epoxy Resin Kk | Semiconductor sealing epoxy resin composition, resin sealed semiconductor device, and method for packaging semiconductor device |
| JP2007105750A (en) * | 2005-10-12 | 2007-04-26 | Senju Metal Ind Co Ltd | Sn-In BASED SOLDER ALLOY |
| JP4618089B2 (en) * | 2005-10-12 | 2011-01-26 | 千住金属工業株式会社 | Sn-In solder alloy |
| CN100413634C (en) * | 2005-12-12 | 2008-08-27 | 黄德欢 | Low melting point lead-free soldering tin |
| JP2011058003A (en) * | 2010-11-24 | 2011-03-24 | Mitsubishi Chemicals Corp | Epoxy resin composition for sealing semiconductor, resin-sealed semiconductor device and method for mounting semiconductor device |
| CN103737195A (en) * | 2013-12-30 | 2014-04-23 | 大连理工大学 | Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN104148822B (en) * | 2014-07-28 | 2016-06-01 | 北京卫星制造厂 | A kind of low temperature brazing material |
| CN106312360A (en) * | 2016-09-28 | 2017-01-11 | 深圳市唯特偶新材料股份有限公司 | Low-temperature welding material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3040929B2 (en) | Solder material | |
| JP3220635B2 (en) | Solder alloy and cream solder | |
| JP3753168B2 (en) | Solder paste for joining microchip components | |
| JP3761678B2 (en) | Tin-containing lead-free solder alloy, cream solder thereof, and manufacturing method thereof | |
| EP1317991B1 (en) | Solder paste | |
| KR19980068127A (en) | Lead-Free Alloys for Soldering | |
| JP2002018589A (en) | Lead-free solder alloy | |
| JP4389331B2 (en) | Paste solder | |
| JPH08243782A (en) | Solder alloy and soldering method using the same | |
| JPH08132277A (en) | Leadless solder | |
| JPH09295182A (en) | Cream solder | |
| JP2000126890A (en) | Soldering material | |
| JP3425332B2 (en) | Electronic component electrode material and electronic component electrode manufacturing method | |
| JPH0994688A (en) | Lead-free solder alloy | |
| JP2003112285A (en) | Solder paste | |
| JP3346848B2 (en) | Lead-free solder alloy | |
| JPH0994687A (en) | Lead-free solder alloy | |
| JP2002185130A (en) | Electronic circuit device and electronic part | |
| JP2019155465A (en) | Solder paste for chip component joining | |
| JPH08192291A (en) | Cream solder | |
| JP3107483B2 (en) | No to low lead content solder alloy | |
| JP2002178191A (en) | Low temperature system lead-free solder composition and electronic parts-packaged structure using the same | |
| JP3462025B2 (en) | Solder paste | |
| JP3876446B2 (en) | Solder paste | |
| KR100366131B1 (en) | Lead-free solder with lower melting point and lower dross |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041116 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050329 |