CN100413634C - Low melting point lead-free soldering tin - Google Patents
Low melting point lead-free soldering tin Download PDFInfo
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- CN100413634C CN100413634C CNB2005100619455A CN200510061945A CN100413634C CN 100413634 C CN100413634 C CN 100413634C CN B2005100619455 A CNB2005100619455 A CN B2005100619455A CN 200510061945 A CN200510061945 A CN 200510061945A CN 100413634 C CN100413634 C CN 100413634C
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- melting point
- quartz glass
- low melting
- pure
- temperature
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000002844 melting Methods 0.000 title claims abstract description 15
- 230000008018 melting Effects 0.000 title abstract description 7
- 238000005476 soldering Methods 0.000 title abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 15
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims abstract description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 3
- 238000003466 welding Methods 0.000 abstract description 8
- 239000006023 eutectic alloy Substances 0.000 abstract description 2
- 229910001122 Mischmetal Inorganic materials 0.000 abstract 2
- 239000000470 constituent Substances 0.000 abstract 1
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000007790 solid phase Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 29
- 239000000956 alloy Substances 0.000 description 24
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000000203 mixture Substances 0.000 description 11
- 229910052797 bismuth Inorganic materials 0.000 description 7
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000010792 warming Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 229910052761 rare earth metal Inorganic materials 0.000 description 5
- 150000002910 rare earth metals Chemical class 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
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Abstract
The present invention discloses low melting point lead-free soldering tin. The constituent and the weight percentage content of the present invention comprise 20.0 to 40.0% of Bi, 0.01 to 8.0% of Zn, 0 to 2.0% of Al, 0 to 2.0% of Mg, 0 to 2.0% of misch metal, Sn and inevitable impurities, wherein La, Ce and Nd elements are contained in the misch metal. The low melting point lead-free soldering tin is not eutectic alloy. A solid phase point of the utility model is 125 to 140 DEG C, and a liquid phase point is 150 to 170 DEG C according to the difference of the components. The utility model has low melting point, is suitable for the weld of components which are sensitive to temperature and can not resist heat, can eliminate the damage to electronic components due to high welding temperature during weld, and has no environment pollution.
Description
Technical field
The present invention relates to a kind of soldering tin material, especially low-melting point leadless scolding tin.
Background technology
Use Sn
63Pb
37Contain lead in the electronic product of scolding tin manufacturing inevitably, such electronic product go out of use or removal process in, environment is polluted, human beings'health is brought harm.In addition, Sn
63Pb
37Scolding tin or the fusing point that contains indium scolding tin are～185 ℃, and the welding processing temperature when the thermally sensitive electronic devices and components of welding, can cause damage at～240 ℃ to components and parts, need weld with the lower scolding tin of fusing point.Particularly, when having had with fusing point in the electronic devices and components,, can make original solder joint sealing-off if when still welding once more with this class scolding tin for the solder joint of～185 ℃ scolding tin welding.
Summary of the invention
The object of the present invention is to provide a kind of fusing point to be lower than Sn
63Pb
37The low-melting point leadless scolding tin of scolding tin fusing point.
Low-melting point leadless scolding tin of the present invention, its solidus temperature are at 132～139 ℃, and component and weight percent content thereof are:
Bi?25.3～34.5％
Zn?0.01～4.0％
Al?0.0～2.0％
Mg?0.0～2.0％
Mishmetal 0.0～2.0%, and Al, Mg, mishmetal three be not zero simultaneously, all the other are Sn and unavoidable impurities, contain La, Ce and Nd element in the mishmetal.
Above-mentioned mishmetal can be the commercial goods.
The preparation method of low-melting point leadless scolding tin of the present invention, its step is as follows:
1) be raw material with pure Bi, pure Zn, pure Al, pure Mg, mishmetal, pure Sn, percentage composition 25.3～38.4%Bi, 0.01～8.0%Zn, 0.0～2.0%Al, 0.0～2.0%Mg, 0.0～2.0% mishmetal and Al, Mg, mishmetal three are not zero simultaneously by weight, surplus Sn, the alloyage material;
2) alloy material is packed into diameter is in the quartz glass tube of 12～20mm, maybe when containing mishmetal, earlier prepare tin-mixed rare earth alloy with vacuum non-consumable arc furnace, the diameter of then tin-mixed rare earth alloy and other compositions being packed into together is in the quartz glass tube of 12～20mm, vacuumize, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 800～900 ℃ with 1～3 ℃/minute speed, be incubated outage after 1～3 hour, cool to 200～300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample.
In addition to the above methods, perhaps also can adopt the low melting point series lead-free soldering tin of vacuum induction melting furnace melting large volume.
Low-melting point leadless scolding tin of the present invention is non-eutectic alloy, and according to the difference of composition, its solidus is that 125～140 ℃, liquidus point are 150～170 ℃.The fusing point of this series leadless soldering alloy is lower, is applicable to the welding to responsive to temperature, thermo-labile components and parts, can eliminate when welding because the too high damage to electronic devices and components of welding temperature; Environmentally safe.
Description of drawings
Fig. 1 is that Pb-free solder is heating up and differential scanning calorimetric (DSC) curve of temperature-fall period in the embodiment of the invention 1;
Fig. 2 is that Pb-free solder is heating up and the DSC curve of temperature-fall period in the embodiment of the invention 2;
Fig. 3 is that Pb-free solder is heating up and the DSC curve of temperature-fall period in the embodiment of the invention 3;
Fig. 4 is that Pb-free solder is heating up and the DSC curve of temperature-fall period in the embodiment of the invention 4.
The specific embodiment
Further specify the present invention below in conjunction with example.
1) be raw material with pure Bi, pure Zn, pure Al, pure Mg, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 17.24g Bi, 0.005g Zn, 0.25g Al, 0.5g Mg, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 850 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 200 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 34.5%Bi, 0.01%Zn, 0.5%Al, 1.0%Mg, all the other are Sn and unavoidable impurities, and it is 151.2 ℃ with the liquidus point temperature that the solidus temperature is 139.0 ℃, and Fig. 1 is the DSC curve of this sample.
1) be raw material with pure Bi, pure Zn, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 17.15g Bi, 1.0g Zn, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 200 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition be 34.3%Bi, 2.0%Zn all the other be Sn and unavoidable impurities, it is 170.7 ℃ with the liquidus point temperature that the solidus temperature is 134.1 ℃, and Fig. 2 is the DSC curve of this sample.
Embodiment 3
1) be raw material with pure Bi, pure Zn, mishmetal, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 16.45g Bi, 2.0g Zn, 1.0g mishmetal, all the other are Sn and unavoidable impurities;
2) contain the scolding tin of rare earth for the ease of preparation, prepare tin-mixed rare earth alloy with vacuum non-consumable arc furnace earlier; With tin-mixed rare earth alloy and other composition diameter of packing into is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 850 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 200 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition be 32.9%Bi, 4.0%Zn, 2.0% mishmetal all the other be Sn and unavoidable impurities, it is 171.2 ℃ with the liquidus point temperature that the solidus temperature is 134.0 ℃, and Fig. 3 is the DSC curve of this sample.
Embodiment 4
1) be raw material with pure Bi, pure Zn, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 16.8g Bi, 2.0g Zn, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 200 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition be 33.6%Bi, 4.0%Zn all the other be Sn and unavoidable impurities, it is 165.9 ℃ with the liquidus point temperature that the solidus temperature is 133.9 ℃, and Fig. 4 is the DSC curve of this sample.
1) be raw material with pure Bi, pure Zn, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 16.1g Bi, 4.0g Zn, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 850 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 200 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition be 32.2%Bi, 8.0%Zn all the other be Sn and unavoidable impurities, the solidus temperature is that 134.2 ℃ and liquidus point temperature are 202.4 ℃.
Embodiment 6
1) be raw material with pure Bi, pure Zn, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 12.75g Bi, 3.25g Zn, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 200 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 25.5%Bi, 6.5%Zn, all the other are Sn and unavoidable impurities, and it is 207.2 ℃ with the liquidus point temperature that the solidus temperature is 135.5 ℃.
Table 1 has been listed the temperature of typical composition, solidus and the liquidus point of low-melting point leadless scolding tin of the present invention.
Table 1
Claims (1)
1. low-melting point leadless scolding tin, the solidus temperature that it is characterized in that it is at 132～139 ℃, and component and weight percent content thereof are:
Bi 25.3～34.5％
Zn 0.01～4.0％
Al 0.0～2.0％
Mg 0.0～2.0％
Mishmetal 0.0～2.0%, and Al, Mg, mishmetal three be not zero simultaneously, all the other are Sn and unavoidable impurities, contain La, Ce and Nd element in the mishmetal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100619455A CN100413634C (en) | 2005-12-12 | 2005-12-12 | Low melting point lead-free soldering tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100619455A CN100413634C (en) | 2005-12-12 | 2005-12-12 | Low melting point lead-free soldering tin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1775458A CN1775458A (en) | 2006-05-24 |
| CN100413634C true CN100413634C (en) | 2008-08-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100619455A Expired - Fee Related CN100413634C (en) | 2005-12-12 | 2005-12-12 | Low melting point lead-free soldering tin |
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| Country | Link |
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| CN (1) | CN100413634C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5724411B2 (en) | 2011-01-31 | 2015-05-27 | 富士通株式会社 | Solder, soldering method and semiconductor device |
| CN106514032A (en) * | 2016-12-29 | 2017-03-22 | 安徽华众焊业有限公司 | Low-melting-point and high-hardness lead-free solder and preparation method thereof |
| CN109202328B (en) * | 2017-06-29 | 2022-01-25 | 中航光电科技股份有限公司 | Brazing filler metal for brazing aluminum alloy and magnesium alloy and preparation method thereof |
| CN110125571A (en) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | A kind of high intensity low-temperature lead-free solder and its solder(ing) paste |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5942185A (en) * | 1994-10-11 | 1999-08-24 | Hitachi, Ltd. | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same |
| JP2000126890A (en) * | 1999-11-08 | 2000-05-09 | Matsushita Electric Ind Co Ltd | Soldering material |
| JP2001347394A (en) * | 2000-06-07 | 2001-12-18 | Kiyohito Ishida | Solder and solder ball |
| US20020015660A1 (en) * | 1995-09-29 | 2002-02-07 | Toshikazu Murata | Lead-free solder alloys |
| CN1421296A (en) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | Lead-free welding material and its prepn |
-
2005
- 2005-12-12 CN CNB2005100619455A patent/CN100413634C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5942185A (en) * | 1994-10-11 | 1999-08-24 | Hitachi, Ltd. | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same |
| US20020015660A1 (en) * | 1995-09-29 | 2002-02-07 | Toshikazu Murata | Lead-free solder alloys |
| JP2000126890A (en) * | 1999-11-08 | 2000-05-09 | Matsushita Electric Ind Co Ltd | Soldering material |
| JP2001347394A (en) * | 2000-06-07 | 2001-12-18 | Kiyohito Ishida | Solder and solder ball |
| CN1421296A (en) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | Lead-free welding material and its prepn |
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| Publication number | Publication date |
|---|---|
| CN1775458A (en) | 2006-05-24 |
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Effective date of registration: 20170626 Address after: 215299 science and Technology Pioneer Park, Wujiang Economic Development Zone, Suzhou, Jiangsu Patentee after: Wujiang Haibo Technology Venture Investment Company Limited Address before: 215200 Jiangsu city of Suzhou province Wujiang City Economic Development Zone of Wujiang science and Technology Park Pang Road West Patentee before: Suzhou Zhiqiao New Materials S&T Co., Ltd. |
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Granted publication date: 20080827 Termination date: 20191212 |
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