CN101381826A - Sn-Cu base leadless solder alloy and preparation method - Google Patents
Sn-Cu base leadless solder alloy and preparation method Download PDFInfo
- Publication number
- CN101381826A CN101381826A CNA2008101072270A CN200810107227A CN101381826A CN 101381826 A CN101381826 A CN 101381826A CN A2008101072270 A CNA2008101072270 A CN A2008101072270A CN 200810107227 A CN200810107227 A CN 200810107227A CN 101381826 A CN101381826 A CN 101381826A
- Authority
- CN
- China
- Prior art keywords
- alloy
- percent
- tin
- crucible
- weighing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to tin-copper-based lead-free solder alloy and a preparation method thereof. The compositions in mass percentage of the alloy are 0.1 to 1.5 percent of copper, 0.001 to 1 percent of phosphor, 0 to 6 percent of bismuth, 0 to 3 percent of zinc, and the balance being tin. The preparation method comprises the following steps: 3 to 8 percent of the phosphor and 92 to 97 percent of the tin are weighed at first and placed into a graphite crucible; the mixture is covered with protective molten salt and subjected to heat preservation for 30 to 60 minutes at a temperature of between 400 and 550 DEG C; after uniform stirring, casting is performed and tin-copper intermediate alloy is obtained; the tin-copper intermediate alloy is weighed according to the fact that the phosphor occupies 0.001 to 1 percent as calculated by the total mass of 100 percent, and 0.1 to 1.5 percent of the copper, 0 to 6 percent of the bismuth, 0 to 3 percent of the zinc and residual tin are weighed and placed into the graphite crucible; the mixture is covered with the protective molten salt and subjected to heat preservation for 40 to 80 minutes at a temperature of between 450 and 550 DEG C; and after uniform stirring, the mixture is cast into ingots. The preparation method has simple preparation technique and is easy to operate; and the product of the tin-copper-based lead-free solder alloy has the advantages of good wettability, low melting point, good mechanical property, good antioxidation, low cost and so on.
Description
Technical field:
The invention belongs to the non-ferrous alloy material, what relate to is a kind of unleaded brazing material, specially refers to a kind of Sn-Cu base leadless solder alloy that the electronic component soldering is used and preparation method thereof that is applicable to.
Background technology:
Sn-Pb eutectic and nearly eutectic alloy because cheap, fusing point is low, advantages such as the wettability of copper base is good are obtained widespread use in electronic industry.Enhancing along with human environmental consciousness, lead and compound thereof cause global showing great attention to the hazardness of environment and human health, international community has put into effect a series of regulation limitations in succession or has forbidden containing the use of Pb solder, and the lead-free brazing of development excellent property, environmental protection is imperative.
Countries in the world have been carried out big quantity research in recent years, have developed multiple lead-free solder alloy, are broadly divided into binary alloy systems such as Sn-Ag, Sn-Cu, Sn-Bi and Sn-zn, and add ternary, quad alloy system that the 3rd, the 4th constituent element forms on this basis.But do not find all gratifying Sn-Pb solder of various aspects of performance substitute so far as yet.The wherein wettability and the erosion resistance extreme difference of Sn-Zn system, the fusing point of Sn-Bi also may make solder produce fragility far below Sn-Pb and Bi, at present the performance of having generally acknowledged relatively better, what be applied in some occasions is Sn-Ag and Sn-Ag-Cu alloy, but the fusing point of Sn-Ag and Sn-Ag-Cu alloy (about 220 ℃) is too high with respect to existing Sn-Pb eutectic alloy solder fusing point (183 ℃), be difficult to and existing circuit sheet material, electronics soldering production technique and hardware compatibility, and raw materials cost is also higher.Sn-Cu is that the reserves of main raw material Sn, the Cu of alloy enrich, cheap, the cost of most of lead-free brazings is than the high 2-3 of Sn-Pb solder times, and the Sn-0.7Cu alloy is only high 1.3 times than Sn-Pb solder by contrast, is one of solder that cost is minimum relatively in the lead-free brazing of being studied at present; This alloy also has and has no side effect, and easily produces, easy advantage such as recovery, and Sn-Cu is one of alloy product of becoming the most potential alternative Sn-Pb solder.But the eutectic temperature of this binary alloy (227 ℃) is higher, oxidation-resistance, erosion resistance are relatively poor, comprehensive mechanical property is relatively poor, the wettability of Sn-Cu lead-free brazing on the Cu base is not ideal enough simultaneously, these shortcomings have limited the use of this alloy greatly, the Sn-Cu alloy has mainly obtained application in wave soldering technology at present, because fusing point is too high, does not almost obtain to use in reflow soldering process.
Summary of the invention
The objective of the invention is, at the problems referred to above that exist in the Sn-Cu alloy, improve the mechanical property of Sn-Cu alloy by adding an amount of alloy constituent element, oxidation-resistance and erosion resistance, and can significantly improve the wettability of this alloy on copper, the fusing point of this alloy is effectively reduced, the new formulation of the Sn-Cu base leadless solder alloy of, high comprehensive performance cheap to obtain to have, and this kind Sn-Cu is provided the preparation method of base leadless solder alloy.
Sn-Cu base leadless solder alloy of the present invention, its Cu content are the 0.1-1.5% of alloy gross weight, and P content is the 0.001-1% of alloy gross weight, and Bi content is the 0-6% of alloy gross weight, and Zn content is the 0-3% of alloy gross weight, and surplus is Sn.
More excellent technical scheme of the present invention is: its Cu content is the 0.1-1.5% of alloy gross weight, and Bi content is the 0.1-6% of alloy gross weight, and Zn content is the 0.1-3% of alloy gross weight, and P content is the 0.001-1% of alloy gross weight, and surplus is Sn.
Preparation method of the present invention is as follows:
1, take by weighing P 3～8% by mass ratio, Sn 92-97% puts into plumbago crucible with both then, the covering protection fused salt places smelting furnace with crucible in the above, is incubated 30～60 minutes under 400～550 ℃ the temperature, casting after stirring gets the Sn-P master alloy;
2, be 100% by total mass; the amount that accounts for 0.001-1% in P takes by weighing the Sn-P master alloy, takes by weighing Cu0.1-1.5% again, Bi 0-6%; Zn 0-3%; surplus is Sn, and batching is put into plumbago crucible, thereon the covering protection fused salt; crucible is placed smelting furnace; be incubated 40～80 minutes under the 450-550 ℃ of temperature, be cast into ingot after stirring, promptly get required solder alloy.
Protection fused salt of the present invention can be the mixture of KCl and LiCl, also can be the mixture of LiCl and LiF or NaCl, and the melting range of used protection fused salt is generally selected between 300～500 ℃.
When protection fused salt of the present invention was got the mixture of KCl and LiCl, can be with KCl, LiCl with (1.2～1.5): the mass ratio of (0.9～1.1) mixes, dry and get final product.
The present invention is to provide that a kind of wettability is good, fusing point is lower, good mechanical properties, the low-cost preferably lead-free solder alloy of oxidation-resistance, add antioxidant property, corrosion resistance and the wettability on the Cu base thereof that P can significantly improve alloy; Add a spot of Bi and can improve the wettability of alloy on Cu to a certain extent, and reduce the fusing point of this alloy; Interpolation Zn helps improving the mechanical property of alloy, and is also useful to the welding spot reliability that improves alloy and Cu formation.Adopt Cu surface spreading wetting experiment to weigh the wettability of alloy on Cu, find that the simple Sn-Cu alloy wettability of Sn-Cu alloy ratio of adding a small amount of P or Bi significantly improves, basically can reach the level of Sn-Pb alloy, and be higher than the Sn-Ag (Cu) wettability of alloy; Add Bi the fusing point of Sn-Cu alloy is significantly reduced, make its fusing point can reach the level that Sn-Ag is an alloy at least, this helps promoting the application of Sn-Cu alloy in reflow soldering process; Be higher than the Sn-Pb solder alloy even its intensity is approaching, thereby long work-ing life and higher reliability are arranged.With respect to other Sn-Cu welding flux alloys that adds dystectic Ni, the present invention adds P, Bi, Zn, and additive material is bought on market easily, does not adopt noble metal, makes its cost more cheap, and preparation technology is simple, and operation has good development potentiality easily.Comprehensive considering various effects, the present invention has cost performance and practicality preferably.
Description of drawings
Fig. 1 is the spreading area of Sn-0.7Cu solder alloy on Cu of different P additions.
Fig. 2 is the influence of adding P to Sn-0.7Cu solder alloy oxidation-resistance at 260 ℃.
Fig. 3 is for adding Bi and the P influence to Sn-0.7Cu solder alloy wettability on Cu.
Specific embodiment
The present invention will be further described by following examples.
The used protection fused salt of following examples is that KCl:LiCl is mixed, dries gained with the mass ratio of 1.3:1.
Embodiment 1:
1, take by weighing P 4% by mass ratio, Sn 96%, is 50 grams altogether, then both are put into plumbago crucible, and cover the above-mentioned molten fused salt for preparing in the above, crucible is placed resistance furnace, temperature is 450 ℃ and is incubated 45 minutes down that the back casting that stirs gets the Sn-P master alloy;
2, be 100% by total mass, 0.1% the amount of accounting in P takes by weighing the Sn-P master alloy, takes by weighing Cu 0.7% again, and surplus is Sn, and gross weight is 100 grams.Batching is put into plumbago crucible, cover above-mentioned protection fused salt thereon, crucible is placed resistance furnace, insulation is 60 minutes under 450 ℃ of temperature, is cast into ingot after stirring, and promptly obtains required solder alloy.
Molten as stated above Sn-Cu alloy of having joined a series of different P content is measured for wettability and oxidation-resistance; The solder alloy of different P content is seen accompanying drawing 1 to the influence of Cu wettability.P content is seen accompanying drawing 2 to the influence of solder alloy oxidation-resistance.
Wettability is weighed by the spreading area of solder alloy on the copper base.Measuring method is: with diameter is that the 0.3g solder alloy disk of 8mm places the copper sheet central authorities that covered one deck soldering flux (RMA), have been of a size of 40mm * 40mm * 0.1mm, again at the same autogamy soldering flux of surface coverage one deck of solder alloy, it is placed reflow soldering, refluxed 15 seconds down at 250 ℃, sample is taken out in the cooling back, photograph it with digital camera and on copper sheet, sprawl the plane, calculate the solder alloy spreading area by Image Pro Plus image analysis software; Measure 5 times, get the measuring result of its mean value as spreading area.Accompanying drawing 1 has provided the gained result.Wherein content is the wettability level that 0 point is represented the Sn-0.7Cu mother metal.The result shows that the alloy wettability of several interpolation trace P all is significantly increased with respect to pure Sn-0.7Cu alloy.
Weigh the oxidation-resistance of each solder alloy with the weightening finish method.Fig. 2 has provided measuring result.As can be seen from the figure, under equal conditions, add P the weightening finish of alloy on unit surface reduced, promptly the oxidation-resistance of alloy is significantly improved.
Embodiment 2:
1, take by weighing P 4% by mass ratio, Sn 96%, is 50 grams altogether, then both are put into plumbago crucible, and cover the above-mentioned molten fused salt for preparing in the above, crucible is placed induction furnace, be 500 ℃ in temperature and be incubated 30 minutes down that the back casting that stirs gets the Sn-P master alloy;
2, be 100% by total mass, 0.05% the amount of accounting in P takes by weighing the Sn-P master alloy, takes by weighing Cu 0.7% again, and P 0.05%, and Bi 1%, and surplus is Sn, and gross weight is 100 grams.Batching is put into plumbago crucible, cover above-mentioned protection fused salt thereon, crucible is placed induction furnace, insulation is 30 minutes under 500 ℃ of temperature, is cast into ingot after stirring, and promptly obtains required solder alloy.
Molten as stated above Sn-0.7Cu base alloy of having joined a series of different B i content and P content is measured for wettability and fusing point.Each alloy characterizes with its spreading area on the Cu surface the wettability of Cu.The method that is adopted among measuring method and the embodiment 1 is identical.Accompanying drawing 3 and subordinate list 1 have provided the measuring result of wettability and fusing point respectively.The result shows: adding a small amount of Bi or adding Bi, P simultaneously all has by a relatively large margin raising to the wettability of alloy; Add the fusing point that Bi or P can reduce the Sn-0.7Cu solder alloy simultaneously, make its fusing point can be reduced to Sn-Ag (level Cu) at least.
Embodiment 3:
1, take by weighing P 4% by mass ratio, Sn 96%, is 50 grams altogether, then both are put into plumbago crucible, and cover the above-mentioned molten fused salt for preparing in the above, crucible is placed induction furnace, temperature is 400 ℃ and is incubated 60 minutes down that the back casting that stirs gets the Sn-P master alloy;
2, be 100% by total mass, 0.05% the amount of accounting in P takes by weighing the Sn-P master alloy, takes by weighing Cu 0.7% again, P0.05%, and Bi1%, Zn1%, surplus is Sn, gross weight is 100 grams.Batching is put into plumbago crucible, cover above-mentioned protection fused salt thereon, crucible is placed induction furnace, insulation is 30 minutes under 500 ℃ of temperature, is cast into ingot after stirring, and promptly obtains required solder alloy.
The molten as stated above Sn-0.7Cu-1Bi-1Zn that has joined a series of P content is an alloy, measures for wettability.Each alloy characterizes with its spreading area on the Cu surface the wettability of Cu.The method that is adopted among measuring method and the embodiment 1 is identical.The result shows: adding a small amount of P all has by a relatively large margin raising to the wettability of alloy.
Embodiment 4:
1, take by weighing P 3% by mass ratio, Sn 97%, and both are put into plumbago crucible, and covers the above-mentioned fused salt for preparing that melts in the above, and crucible is placed resistance furnace, and temperature is 550 ℃ and is incubated 30 minutes down that the back casting that stirs gets the Sn-P master alloy;
2, be 100% by total mass, 1% the amount of accounting in P takes by weighing the Sn-P master alloy, takes by weighing Cu 1.5% again, and surplus is Sn.Batching is put into plumbago crucible, cover above-mentioned protection fused salt thereon, crucible is placed resistance furnace, insulation is 60 minutes under 450 ℃ of temperature, is cast into ingot after stirring, and promptly obtains required solder alloy.
Embodiment 5:
1, take by weighing P 8% by mass ratio, Sn 92%, and both are put into plumbago crucible, and covers the above-mentioned fused salt for preparing that melts in the above, and crucible is placed induction furnace, is 450 ℃ in temperature and is incubated 45 minutes down, and the back casting that stirs gets the Sn-P master alloy;
2, be 100% by total mass, 0.002% the amount of accounting in P takes by weighing the Sn-P master alloy, takes by weighing Cu 0.1% again, and Bi 0.8%, and surplus is Sn.Batching is put into plumbago crucible, cover above-mentioned protection fused salt thereon, crucible is placed induction furnace, insulation is 30 minutes under 500 ℃ of temperature, is cast into ingot after stirring, and promptly obtains required solder alloy.
Embodiment 6:
1, take by weighing P5% by mass ratio, Sn 95%, and both are put into plumbago crucible, and covers the above-mentioned fused salt for preparing that melts in the above, and crucible is placed induction furnace, is 450 ℃ in temperature and is incubated 45 minutes down, and the back casting that stirs gets the Sn-P master alloy;
2, by total mass 100%, 0.05% the amount of accounting in P takes by weighing the Sn-P master alloy, takes by weighing Cu 0.7% again, and Bi 1%, and Zn 1%, and surplus is Sn.Batching is put into plumbago crucible, cover above-mentioned protection fused salt thereon, crucible is placed induction furnace, insulation is 30 minutes under 500 ℃ of temperature, is cast into ingot after stirring, and promptly obtains required solder alloy.
Following table is that the present invention adds Bi or the P influence to Sn-0.7Cu solder alloy fusing point.
Claims (4)
1, a kind of Sn-Cu base leadless solder is characterized in that Cu content is the 0.1-1.5% of alloy gross weight, and P content is the 0.001-1% of alloy gross weight, and Bi content is the 0-6% of alloy gross weight, and Zn content is the 0-3% of alloy gross weight, and surplus is Sn.
2, Sn-Cu base leadless solder according to claim 1, it is characterized in that Cu content is the 0.1-1.5% of alloy gross weight, Bi content is the 0.1-6% of alloy gross weight, and Zn content is the 0.1-3% of alloy gross weight, P content is the 0.001-1% of alloy gross weight, and surplus is Sn.
3, the preparation method of the described Sn-Cu base leadless solder of a kind of claim 1 is characterized in that:
(1) take by weighing P3～8% by mass ratio, Sn92-97% puts into plumbago crucible with both then, the covering protection fused salt places smelting furnace with crucible in the above, is incubated 30～60 minutes under 400～550 ℃ the temperature, casting after stirring gets the Sn-P master alloy;
(2) be 100% by total mass; the amount that accounts for 0.001-1% in P takes by weighing the Sn-P master alloy, takes by weighing Cu0.1-1.5%, Bi0-6% again; Zn0-3%; surplus is Sn, and batching is put into plumbago crucible, thereon the covering protection fused salt; crucible is placed smelting furnace; be incubated 40～80 minutes under the 450-550 ℃ of temperature, be cast into ingot after stirring, promptly get required solder alloy.
4, preparation method according to claim 3 is characterized in that:
(1) take by weighing P3～8% by mass ratio, Sn92-97% puts into plumbago crucible with both then, the covering protection fused salt places smelting furnace with crucible in the above, is incubated 30～60 minutes under 400～550 ℃ the temperature, casting after stirring gets the Sn-P master alloy;
(2) be 100% by total mass; the amount that accounts for 0.001-1% in P takes by weighing the Sn-P master alloy, takes by weighing Cu0.1-1.5%, Bi0.1-6% again; Zn0.1-3%; surplus is Sn, and batching is put into plumbago crucible, thereon the covering protection fused salt; crucible is placed smelting furnace; be incubated 40～80 minutes under the 450-550 ℃ of temperature, be cast into ingot after stirring, promptly get required solder alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101072270A CN101381826B (en) | 2008-09-26 | 2008-09-26 | Sn-Cu base leadless solder alloy and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101072270A CN101381826B (en) | 2008-09-26 | 2008-09-26 | Sn-Cu base leadless solder alloy and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101381826A true CN101381826A (en) | 2009-03-11 |
| CN101381826B CN101381826B (en) | 2012-11-07 |
Family
ID=40461877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101072270A Expired - Fee Related CN101381826B (en) | 2008-09-26 | 2008-09-26 | Sn-Cu base leadless solder alloy and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101381826B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101780607A (en) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof |
| CN102862002A (en) * | 2012-05-31 | 2013-01-09 | 北京科技大学 | Al-Si-Zn-Ge low-melting-point aluminum based brazing filler metal and preparation method thereof |
| CN103317252A (en) * | 2013-06-03 | 2013-09-25 | 北京科技大学 | Tin-based solder for aluminum/copper brazing and preparing method thereof |
| CN103801852A (en) * | 2012-11-12 | 2014-05-21 | 恒硕科技股份有限公司 | High-strength silver-free and lead-free soldering tin |
| CN103894754A (en) * | 2014-04-04 | 2014-07-02 | 河南科隆集团有限公司 | Stanniferous low-temperature copper-based brazing filler metal and preparation method thereof |
| CN106031963A (en) * | 2015-03-11 | 2016-10-19 | 中山翰华锡业有限公司 | A lead-free and silver-free tin bar and a preparation method thereof |
| CN106425154A (en) * | 2016-11-29 | 2017-02-22 | 东莞市广信知识产权服务有限公司 | Unleaded brazing filler metal |
| CN106624443A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Yellow brass brazing filler metal alloy |
| CN108465971A (en) * | 2018-02-28 | 2018-08-31 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys |
| CN111636004A (en) * | 2020-07-17 | 2020-09-08 | 昆山联德电子科技有限公司 | Smelting method of binary alloy material with high and low melting points |
| CN117697224A (en) * | 2024-02-06 | 2024-03-15 | 保定朝日电子焊料有限公司 | Antioxidant tin bar and flame cutting device thereof |
| CN117697224B (en) * | 2024-02-06 | 2024-05-03 | 保定朝日电子焊料有限公司 | Antioxidant tin bar and flame cutting device thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6011709B1 (en) | 2015-11-30 | 2016-10-19 | 千住金属工業株式会社 | Solder alloy |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1128037C (en) * | 2000-10-24 | 2003-11-19 | 北京工业大学 | Rare earth contained tin base lead-less solder and its preparation method |
| CN100469511C (en) * | 2006-06-14 | 2009-03-18 | 浙江亚通焊材有限公司 | No-lead soft brazing alloy |
| CN100534700C (en) * | 2006-12-06 | 2009-09-02 | 深圳市亿铖达工业有限公司 | No-lead soft soldering alloy |
| CN101077553A (en) * | 2007-06-05 | 2007-11-28 | 西安理工大学 | Sn-Ag-Cu-Ce leadless solder alloy and preparation method thereof |
| CN101239424A (en) * | 2008-03-05 | 2008-08-13 | 东莞市普赛特电子科技有限公司 | Low silver leadless solder and preparation |
-
2008
- 2008-09-26 CN CN2008101072270A patent/CN101381826B/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101780607A (en) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof |
| CN102862002B (en) * | 2012-05-31 | 2015-06-17 | 北京科技大学 | Al-Si-Zn-Ge low-melting-point aluminum based brazing filler metal and preparation method thereof |
| CN102862002A (en) * | 2012-05-31 | 2013-01-09 | 北京科技大学 | Al-Si-Zn-Ge low-melting-point aluminum based brazing filler metal and preparation method thereof |
| CN103801852A (en) * | 2012-11-12 | 2014-05-21 | 恒硕科技股份有限公司 | High-strength silver-free and lead-free soldering tin |
| CN103317252B (en) * | 2013-06-03 | 2015-07-22 | 北京科技大学 | Tin-based solder for aluminum/copper brazing and preparing method thereof |
| CN103317252A (en) * | 2013-06-03 | 2013-09-25 | 北京科技大学 | Tin-based solder for aluminum/copper brazing and preparing method thereof |
| CN103894754A (en) * | 2014-04-04 | 2014-07-02 | 河南科隆集团有限公司 | Stanniferous low-temperature copper-based brazing filler metal and preparation method thereof |
| CN106031963A (en) * | 2015-03-11 | 2016-10-19 | 中山翰华锡业有限公司 | A lead-free and silver-free tin bar and a preparation method thereof |
| CN106425154A (en) * | 2016-11-29 | 2017-02-22 | 东莞市广信知识产权服务有限公司 | Unleaded brazing filler metal |
| CN106624443A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Yellow brass brazing filler metal alloy |
| CN108465971A (en) * | 2018-02-28 | 2018-08-31 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys |
| CN111636004A (en) * | 2020-07-17 | 2020-09-08 | 昆山联德电子科技有限公司 | Smelting method of binary alloy material with high and low melting points |
| CN111636004B (en) * | 2020-07-17 | 2022-04-26 | 联德电子科技(常熟)有限公司 | Smelting method of binary alloy material with high and low melting points |
| CN117697224A (en) * | 2024-02-06 | 2024-03-15 | 保定朝日电子焊料有限公司 | Antioxidant tin bar and flame cutting device thereof |
| CN117697224B (en) * | 2024-02-06 | 2024-05-03 | 保定朝日电子焊料有限公司 | Antioxidant tin bar and flame cutting device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101381826B (en) | 2012-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101381826B (en) | Sn-Cu base leadless solder alloy and preparation method | |
| CN105195915B (en) | Low-temperature lead-free solder alloy | |
| EP3326745B1 (en) | Solder alloy, solder paste, and electronic circuit board | |
| CN108971793B (en) | Low-temperature lead-free solder | |
| CN105215569A (en) | A kind of leadless welding alloy | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN101780607B (en) | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof | |
| CN100494436C (en) | Low melting point leadless welding flux alloy | |
| CN102699563A (en) | Low-silver lead-free soft solder | |
| CN103249519B (en) | Pb-free solder alloy having Zn as main component | |
| CN101927410B (en) | Sn-Ag-Zn-Bi-Cr lead-free solder | |
| CN110238557B (en) | ZnSn-based high-temperature lead-free solder and preparation method thereof | |
| CN102476249A (en) | Sn-Ag-Cu welding flux capable of resisting atmospheric corrosion | |
| US7335269B2 (en) | Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P) | |
| CN102152022A (en) | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance | |
| CN104018026A (en) | Sn-Zn-S lead-free brazing filler metal alloy and preparation method thereof | |
| CA2502747A1 (en) | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus | |
| CN101486133A (en) | Lead-free solder for aluminum soft soldering | |
| JP4076182B2 (en) | Lead-free solder alloy | |
| CN102672367A (en) | ZnSn-base high-temperature lead-free soft solder and preparation method thereof | |
| CN1313631C (en) | Tin silver copper nickel aluminium series leadless welding flux alloy | |
| CN101264557A (en) | Tin-copper base lead-free solder and preparation thereof | |
| CA2540486A1 (en) | Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), nickel (ni), phosphorus (p) and/or rare earth: cerium (ce) or lanthanum (la) | |
| CN101318269A (en) | Tin-Silver-Zinc system lead-free solder with low silver content | |
| CN102886624A (en) | Novel low-melting-point copper-manganese-zinc brazing filler |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20140926 |
|
| EXPY | Termination of patent right or utility model |