CN102476249A - Sn-Ag-Cu welding flux capable of resisting atmospheric corrosion - Google Patents
Sn-Ag-Cu welding flux capable of resisting atmospheric corrosion Download PDFInfo
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- CN102476249A CN102476249A CN2010105591438A CN201010559143A CN102476249A CN 102476249 A CN102476249 A CN 102476249A CN 2010105591438 A CN2010105591438 A CN 2010105591438A CN 201010559143 A CN201010559143 A CN 201010559143A CN 102476249 A CN102476249 A CN 102476249A
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Abstract
The invention aims to provide a corrosion-resisting Sn-Ag-Cu eutectic alloy. A main technical means is that trace alloy elements are added to a common Sn-Ag-Cu eutectic alloy, so as to achieve the purpose of improving the atmospheric corrosion resistance of an alloy surface under the condition that the basic physical and mechanical properties of the Sn-Ag-Cu eutectic alloy are not changed. In order to achieve the purpose, the invention provides a technical scheme of adding one or more trace alloy elements to the common Sn-Ag-Cu eutectic alloy, wherein the alloy comprises the following elements by weight percent: 2.5-4.0% of Ag, 0.5-1.5% of Cu, 0.001-0.1% of trace alloy elements, and the balance Sn and inevitable impurities; the trace alloy elements are selected from one or more of Ti, Al, P, Ge, Si, Ni and Ga; and the added volume of the trace alloy elements is preferably within a scope of 0.005-0.03%.
Description
Technical field
The present invention relates to a kind of Su-Ag-Cu ternary eutectic solder of atmospheric corrosion resistance, specifically a kind of Su-Ag-Cu ternary eutectic solder that adds trace element.
Background technology
Solder is important interconnection technique in the microelectronics industry, and (Sn 63%-Pb 37% all is weight percentage mainly to adopt Sn-Pb eutectic composition traditionally; Be the alloy system on basis down together); The terne metal eutectic temperature is 183 ℃, has good mechanical performance and processing performance, and cost of material is cheap simultaneously; Resource is extensive, so in industry, obtained to use widely.Because lead is a kind of toxic metals; After a large amount of waste and old electric devices go out of use and bury processing; Toxic substance lead is gradually by the aqueous corrosion in the natural environment, dissolving, diffusion and enrichment in the alloy; Finally to natural environment, soil, natural water body and animals and plants biological chain thereof cause expendable environmental pollution.World major industrialized country all recognizes the harmfulness of this problem at present; Forbid solder containing pb producing and selling and use home gradually; Under this background, people have spent a large amount of effort, and research and development can be used for substituting the lead-free solder of new generation of tin-lead solder.Through domestic and international a large amount of screening operations, some present instead of alloy comprise some off-patent binary eutectic alloys, like Sn-3.5Ag, and Sn-52Bi, Sn-0.7Cu etc.; Ternary eutectic scolder Sn-3.8Ag-0.7Cu (and similar Sn-4Ag-0.5Cu and the Sn-3.2Ag-0.5Cu of composition) and some polynary patent alloys.From existing lead-free solder, the fusing point of Sn-3.5Ag alloy higher (221 ℃), matrix copper is dissolved in the solder easily in a large number during soldering, influences the reliability of linkage interface; The Sn-52Bi eutectic alloy is a kind of low-melting point leadless scolder, and eutectic temperature is merely 138 ℃, only is applicable to that low temperature brazing and some are to the less demanding special occasion of serviceability temperature; Sn-0.7Cu eutectic solder major defect is that fusing point is higher, and 227 ℃ of its eutectic temperatures, welding temperature are near the limit of circuit board material; Therefore present this alloy only is used for the crest welding; Sn-3.8Ag-0.7Cu (and similar alloy) ternary eutectic alloy makes the eutectic temperature of alloy drop to 217 ℃ owing on the basis of Sn-3.5Ag binary eutectic alloy, added a part of copper, simultaneously because the existence of copper; Reduced the dissolving in scolder effectively by weldering mother metal Cu; Improve connection reliability, therefore become a kind of lead-free solder of the most promising alternative Sn-Pb eutectic alloy at present, in various existing candidate's alloys, had stronger technological competitiveness.
Although the Sn-Ag-Cu eutectic alloy has been widely used in electronic solder at present; But under some have corrosive atmosphere, for example, be exposed in the atmospheric environment in naval air environment or industrial pollution area; Under the condition that has surperficial moisture film to exist, tangible atmospheric corrosion can take place in alloy surface.This surface corrosion phenomenon has influence in various degree to relevant various industrial products.For example, for the electronic product peculiar to vessel that is operated under the naval air environment, the surface corrosion of Sn-Ag-Cu eutectic alloy possibly cause the local corrosion of electronic component solder joint, causes coming off and short circuit of solder joint sometimes, causes the trouble or failure of electronic product.These surface corrosion behaviors are not generally hoped to take place; Therefore; Related industries department hopes to research and develop a kind of Sn-Ag-Cu eutectic alloy of atmospheric corrosion resistance; It can use down at some special corrosive environments (for example naval air environment), because its surface corrosion resistance effect makes the related industries product have long service life.
Summary of the invention
In order to overcome the problem of existing Sn-Ag-Cu eutectic alloy corrosion resistance of surface difference in the corrosive atmosphere environment; The present invention provides a kind of corrosion proof Sn-Ag-Cu eutectic alloy; Its major technique means are through in common Sn-Ag-Cu eutectic alloy, adding some micro-alloying elements; Reach not changing under these Sn-Ag-Cu eutectic alloy basic physical, the mechanical property prerequisite, improve the weather-resistant purpose of alloy surface.In order to realize above-mentioned target, technical scheme provided by the invention is: in common Sn-Ag-Cu eutectic alloy, add one or more trace alloying elements, the percentage by weight of its alloy is:
Ag 2.5-4.0%
Cu 0.5-1.5%
Microalloy element 0.001-0.1%
Sn and inevitable impurity surplus
Wherein microalloy element is Ti, Al, P, Ge, Si, Ni, the one or more combination among the Ga; The addition preferable range of microalloy element is 0.005-0.03%.Sn-Ag-Cu ternary eutectic solder provided by the invention can be the block foundry alloy, also can be welding wire, soldered ball, welding powder or soldering paste.
The present invention can adopt existing common melting technique, and above-mentioned alloy is carried out melting, and the various alloy compositions of preparing are added among the Sn of molten conditions, through stirring and making it homogenising, can obtain foundry alloy after the cast.Because the microalloy element that adds among the present invention is trace very; Their main effect is the corrosion resistance that improves alloy surface; And little to other physical property (for example fusing point, density, conductance, thermal coefficient of expansion etc.) influence of alloy, so the present invention can well be merged with the industrial technology of existing product mutually.
The selection principle of micro-addition is in the technical scheme provided by the invention: if micronutrient levels is very few; Then they mainly are dissolved in LIQUID Sn-Ag-Cu eutectic alloy; Enough amount segregations can not be arranged in the metal surface, cause being not enough to bring into play weather-resistant effect thus; And if micronutrient levels is too much,, be easy to form dystectic second be mingled with mutually because itself solubility is very little; Thereby influence some basic physical properties of Sn-Ag-Cu eutectic alloy; Like viscosity, liquid physical property such as flowability, and microscopic structure after solidifying and mechanical property etc.Suitable addition should remain between the two, and promptly content is enough to form continuous surface protection film, and the while does not produce undesirable high-melting-point second phase again or is mingled with.Thereby be complementary with existing material or technological specification, guarantee other serviceability of alloy.
The invention has the beneficial effects as follows:
1, the present invention is through being raw material at common Sn-Ag-Cu eutectic alloy; Through adding some micro-alloying elements; Make Sn-Ag-Cu eutectic alloy microalloying; Reach and do not changing under Sn-Ag-Cu eutectic alloy basic physical, the mechanical property prerequisite, improve the weather-resistant ability of alloy surface, and good compatibility is arranged with existing manufacturing technique.
2, compare with common Sn-Ag-Cu eutectic alloy, advantage of the present invention is that Sn-Ag-Cu eutectic alloy resistance to corrosion is good, can be applicable to be formulated in the electronic solder of using under the corrosive atmosphere, comprises the block foundry alloy, welding wire, soldered ball, welding powder or soldering paste etc.
The specific embodiment
Embodiment 1:
Use the Sn-3.8Ag-0.7Cu alloy to be raw material, add 0.01%Ga (percentage by weight, down together) and 0.01%Ni and prepare weather-resistant Sn-3.8Ag-0.7Cu eutectic alloy.With alloy in a graphite crucible with the Muffle furnace heat fused after, add the microalloy element of proportioning, the dissolving back is stirred and is made it homogenising; Water then and be cast in the graphite shallow bid that diameter is Φ 20mm the about 5mm height of ingot casting, the ingot casting of cooling back acquisition surface-brightening; This sample is corroded (every 30min spraying once) with salt fog; After 3 days, the surface still can keep metal polish, explains that the alloy surface corrosion resistance is good.
Embodiment 2:
Use the Sn-4.0Ag-0.5Cu eutectic alloy to be raw material, add 0.02%P, adopt embodiment 1 described method preparation and test; The gained sample is corroded (every 30min spraying once) with salt fog; After 3 days, the surface still can keep metal polish, and promptly gained sample corrosion resistance is good.
Embodiment 3:
Adopting the Sn-2.5Ag-1.0Cu eutectic alloy is raw material; Add 0.03%Ge and 0.01%Ti; Adopt embodiment 1 described method preparation and test, the gained sample is corroded (every 30min spraying once) with salt fog, after 3 days; The surface still can keep metal polish, and promptly gained sample corrosion resistance is good.
Embodiment 4:
Adopting the Sn-3.0Ag-1.5Cu eutectic alloy is raw material, adds 0.005%Ga, adopts embodiment 1 described method preparation and test; The gained sample is corroded (every 30min spraying once) with salt fog; After 3 days, the surface still can keep metal polish, and promptly gained sample corrosion resistance is good.
Embodiment 5:
Adopting the Sn-3.5Ag-0.6Cu alloy is raw material; Add 0.01P%, 0.01%Si and 0.001%Al adopt embodiment 1 described method preparation and test; The gained sample is corroded (every 30min spraying once) with salt fog; After 3 days, the surface still can keep metal polish, and promptly gained sample corrosion resistance is good.
Comparative Examples:
In the test of embodiment 1 ~ 5, do not add the comparative sample of trace element and under similarity condition, observe, each alloy surface has all begun variable color after 1 day, explains that the sample resistance to corrosion under the salt air corrosion condition that does not add trace element is not enough.
Claims (3)
1. the Sn-Ag-Cu scolder of an atmospheric corrosion resistance, it is characterized in that: its chemical formulation is following, and percentage by weight is:
Ag 2.5-4.0%
Cu 0.5-1.5%
Microalloy element 0.001-0.1%
Sn and inevitable impurity surplus;
Wherein microalloy element is Ti, Al, P, Ge, Si, Ni, one or more among the Ga.
2. according to the Su-Ag-Cu scolder of the said atmospheric corrosion resistance of claim 1, it is characterized in that: by weight percentage, the microalloy element addition is 0.005 ~ 0.03%.
3. by the Su-Ag-Cu scolder of the said atmospheric corrosion resistance of claim 1, it is characterized in that: said scolder is block foundry alloy, welding wire, soldered ball, welding powder or soldering paste.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105591438A CN102476249A (en) | 2010-11-25 | 2010-11-25 | Sn-Ag-Cu welding flux capable of resisting atmospheric corrosion |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105591438A CN102476249A (en) | 2010-11-25 | 2010-11-25 | Sn-Ag-Cu welding flux capable of resisting atmospheric corrosion |
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| CN102476249A true CN102476249A (en) | 2012-05-30 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103273217A (en) * | 2013-05-29 | 2013-09-04 | 哈尔滨工业大学深圳研究生院 | Partially-reinforced high-reliability brazing filler metal and preparing method thereof |
| CN103659042A (en) * | 2013-12-27 | 2014-03-26 | 中山翰华锡业有限公司 | Durable intermediate-temperature lead-free soldering tin bar and preparing method thereof |
| CN104259685A (en) * | 2014-08-06 | 2015-01-07 | 上海新华锦焊接材料科技有限公司 | Lead-free solder and preparation method thereof |
| EP3098020A1 (en) * | 2015-05-29 | 2016-11-30 | ELSOLD GmbH & Co. KG | Flux cored solder wire, in particular for soldering of aluminium |
| CN106181107A (en) * | 2016-08-05 | 2016-12-07 | 京信通信技术(广州)有限公司 | Sn-coupled SSBR material and Sn-coupled SSBR connect method |
| CN111085799A (en) * | 2020-01-19 | 2020-05-01 | 上海锡喜材料科技有限公司 | Formula of soft soldering wire product without flux core for TC power device |
| CN114769936A (en) * | 2022-04-25 | 2022-07-22 | 深圳市兴鸿泰锡业有限公司 | Wave soldering tin bar and manufacturing method thereof |
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| KR100904651B1 (en) * | 2006-02-14 | 2009-06-25 | 주식회사 에코조인 | Pb free solder Composition for wave and deeping, electronic equipment and PCB with the same |
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Patent Citations (5)
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| CN1077151A (en) * | 1992-04-11 | 1993-10-13 | 中国科学院金属研究所 | The Sn base active medium solder of weldable ceramic |
| CN1583352A (en) * | 2003-08-20 | 2005-02-23 | 中国科学院金属研究所 | Sn-Ag-Cu-X eutectic alloy leadless welding materials for electronic elements |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103273217A (en) * | 2013-05-29 | 2013-09-04 | 哈尔滨工业大学深圳研究生院 | Partially-reinforced high-reliability brazing filler metal and preparing method thereof |
| CN103273217B (en) * | 2013-05-29 | 2016-01-13 | 哈尔滨工业大学深圳研究生院 | High reliability solder of a kind of local strengthening and preparation method thereof |
| CN103659042A (en) * | 2013-12-27 | 2014-03-26 | 中山翰华锡业有限公司 | Durable intermediate-temperature lead-free soldering tin bar and preparing method thereof |
| CN103659042B (en) * | 2013-12-27 | 2017-04-12 | 中山翰华锡业有限公司 | Durable intermediate-temperature lead-free soldering tin bar and preparing method thereof |
| CN104259685A (en) * | 2014-08-06 | 2015-01-07 | 上海新华锦焊接材料科技有限公司 | Lead-free solder and preparation method thereof |
| EP3098020A1 (en) * | 2015-05-29 | 2016-11-30 | ELSOLD GmbH & Co. KG | Flux cored solder wire, in particular for soldering of aluminium |
| CN106181107A (en) * | 2016-08-05 | 2016-12-07 | 京信通信技术(广州)有限公司 | Sn-coupled SSBR material and Sn-coupled SSBR connect method |
| CN111085799A (en) * | 2020-01-19 | 2020-05-01 | 上海锡喜材料科技有限公司 | Formula of soft soldering wire product without flux core for TC power device |
| CN114769936A (en) * | 2022-04-25 | 2022-07-22 | 深圳市兴鸿泰锡业有限公司 | Wave soldering tin bar and manufacturing method thereof |
| CN114769936B (en) * | 2022-04-25 | 2023-09-26 | 深圳市兴鸿泰锡业有限公司 | Wave soldering tin bar and manufacturing method thereof |
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Application publication date: 20120530 |