CN102476251A - Sn-Cu lead-free welding flux capable of resisting atmospheric corrosion - Google Patents
Sn-Cu lead-free welding flux capable of resisting atmospheric corrosion Download PDFInfo
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- CN102476251A CN102476251A CN2010105591457A CN201010559145A CN102476251A CN 102476251 A CN102476251 A CN 102476251A CN 2010105591457 A CN2010105591457 A CN 2010105591457A CN 201010559145 A CN201010559145 A CN 201010559145A CN 102476251 A CN102476251 A CN 102476251A
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Abstract
The invention aims to provide a corrosion-resisting Sn-Cu welding flux. A main technical means is that trace alloy elements are added to a common Sn-based alloy, so as to achieve the purpose of improving the atmospheric corrosion resistance of an alloy surface under the condition that the basic physical and mechanical properties of the Sn-Cu welding flux are not changed. In order to achieve the purpose, the invention provides a technical scheme that one or more of the trace alloy elements Ti, P, Ge, Si, Ni and Ga is/are added to the common Sn-Cu based alloy; the added volume by weight percent is 0.001-0.10%; and the common Sn-Cu based alloy is a Sn-Cu binary alloy which contains 0.10-1.5wt% of copper.
Description
Technical field
The present invention relates to a kind of Sn base alloy of atmospheric corrosion resistance, specifically a kind of Sn-Cu base lead-free solder that adds trace element.
Background technology
Solder is an important interconnection technique, and the main leypewter that adopts is the basis in the soft soldering alloys that the annual approximately consumption in the whole world is 60,000 tons.Because this alloy has better welding performance on copper and copper alloy, (account for more than 70% of world's scolder consumption figure) and be widely used in the electronics industry.Yet lead is a kind of toxic metals, and the lead of absorption of human body low dosage will cause lead poisoning.Because the waste and old electric device rolls up; Existingly bury in the processing that toxic substance is plumbous in the tin-lead solder can finally can cause expendable environmental pollution to natural water body and animals and plants biological chain thereof gradually by the aqueous corrosion in the natural environment, dissolving, diffusion and enrichment.
World major industrialized country all recognizes the harmfulness of the problems referred to above gradually at present; And legislation respectively; Progressively forbid the producing and selling and the use of solder containing pb and electronic product thereof; Under this industrial background, through domestic and international a large amount of screening operations, people have explored the replacement scheme of some lead-free solders.Wherein the Sn-Cu lead-free solder is owing to there is relatively low price, and composition is simple, is eutectic composition, and fusing point is single, has preferable mechanical property again, is a kind of competitive lead-free solder, has been widely used in Electronic Packaging industry at present.Yet, under some have corrosive atmosphere, for example, be exposed in the atmospheric environment in naval air environment or industrial pollution area, under the condition that has surperficial moisture film to exist, atmospheric corrosion can take place in the Sn-Cu alloy surface.This surface corrosion phenomenon has influence in various degree to relevant various industrial products.For example, for the electronic product peculiar to vessel that is operated under the naval air environment, the surface corrosion of solder joint possibly cause the local corrosion of electronic component solder joint and come off, and causes the trouble or failure of electronic product, and this does not hope to take place.Therefore; Related industries department hopes to research and develop a kind of Sn-Cu alloy of atmospheric corrosion resistance; It can use down at some special corrosive environments (for example naval air environment), because its surface corrosion resistance effect makes the related industries product have long service life.
Summary of the invention
In order to overcome the problem of existing Sn-Cu scolder corrosion resistance of surface difference in the corrosive atmosphere environment; The present invention provides a kind of corrosion proof Sn-Cu scolder; Its major technique means are through in common Sn base alloy, adding some micro-alloying elements; Reach not changing under these Sn-Cu scolder basic physical, the mechanical property prerequisite, improve the weather-resistant purpose of alloy surface.
In order to realize above-mentioned target, technical scheme provided by the invention is: in common Sn-Cu base alloy, add microalloy element Ti, P, Ge, Si, Ni, the one or more combination among the Ga; Addition is weight percentage: 0.001 ~ 0.10%.Said common Sn-Cu base alloy is that copper content is the Sn-Cu bianry alloy of 0.10-1.5wt%.
The Sn-Cu lead-free solder of atmospheric corrosion resistance provided by the invention is characterized in that: the percentage by weight of its alloy is:
Trace alloying element 0.001 ~ 0.10%
Cu 0.1-2.0%
Sn and unavoidable impurities surplus
Wherein trace alloying element refers to Ti, P, Ge, Si, Ni, one or more among the Ga.
The Sn-Cu lead-free solder of anti-surface corrosion according to the invention can be the block foundry alloy, also can be welding wire, soldered ball, welding powder or soldering paste.
The present invention can adopt existing common melting technique, and above-mentioned Sn-Cu alloy is carried out melting, and the various alloy compositions of preparing are added among the Sn of molten conditions, through stirring and making it homogenising, can obtain foundry alloy after the cast.
Because alloying element adds very trace among the present invention; Their main effect is the corrosion resistance that improves alloy surface; And little to other physical property (for example fusing point, density, conductance, thermal coefficient of expansion etc.) influence of alloy, so the present invention can well be merged with the industrial technology of existing product mutually.
The selection principle of micro-addition is in the technical scheme provided by the invention: if micronutrient levels is very few; Then they mainly are dissolved among LIQUID Sn-Cu; Can not obtain the effect of segregation, be not enough to bring into play weather-resistant effect in the liquid alloy surface; And if trace element adds too much, then they are easy to influence other physics or the mechanical property of Sn-Cu alloy, thereby do not match with existing material or technological specification, influence other serviceability of alloy.
The present invention has following beneficial effect:
1, the present invention on the basis of traditional Sn-Cu base solder, added micro-alloying element, so that the basic physical property of alloy changes is very little, good with existing welding procedure compatibility, use is easy to put it over.
2, the chemical composition denier that adds in the alloy of the present invention not only can guarantee the simplification of alloying component, also is easy to the recovery of scolder, reduces production costs.
3, applied widely.The present invention can process various solder products with varying degrees with routine techniques, like the scolder foundry alloy, and welding wire, soldered ball, welding powder or weld tabs.
The specific embodiment
Embodiment 1:
Use No. 1 tin of industry to be raw material, add 0.7%Cu (percentage by weight, down together) and 0.02%Ga and prepare weather-resistant lead-free solder.With industrial pure tin and copper in a graphite crucible with the Muffle furnace heat fused after, add the 3rd constituent element microalloy element Ga of proportioning, stirring after the dissolving; Water then and be cast in the graphite shallow bid that diameter is Φ 20mm the about 5mm height of ingot casting, the ingot casting of cooling back acquisition surface-brightening; This sample is corroded (every 30min spraying once) with salt fog; After 4 days, the surface still can keep metal polish, explains that the alloy surface corrosion resistance is good.
Embodiment 2:
Use the Sn-0.1%Cu alloy to be raw material, add 0.01%P, 0.01%Ni; Adopt embodiment 1 described method preparation and test, the gained sample corrodes (every 30min spraying once) with salt fog, after 4 days; The surface still can keep metal polish, and the alloy corrosion resistance is good.
Embodiment 3:
Adopting the Sn-1%Cu alloy is raw material, adds 0.02%Ge and 0.01%Si, adopts embodiment 1 described method preparation and test; The gained sample corrodes (every 30min spraying once) with salt fog; After 4 days, the surface still can keep metal polish, and the alloy corrosion resistance is good.
Embodiment 4:
Adopting the Sn-0.5%Cu alloy is raw material, adds 0.005%Ga, adopts embodiment 1 described method preparation and test; The gained sample corrodes (every 30min spraying once) with salt fog; After 4 days, the surface still can keep metal polish, and the alloy corrosion resistance is good.
Embodiment 5:
Adopting the Sn-1.5%Cu alloy is raw material, adds 0.03Ge%, 0.01%Si and 0.001%Ti; Adopt embodiment 1 described method preparation and test, the gained sample corrodes (every 30min spraying once) with salt fog, after 4 days; The surface still can keep metal polish, and the alloy corrosion resistance is good.
Comparative Examples:
In the test of embodiment 1 ~ 5, do not add the comparative sample of trace element and under similarity condition, observe, each alloy surface has all begun variable color after 2 days, explains that the sample resistance to corrosion under the salt air corrosion condition that does not add trace element is not enough.
Claims (3)
1. the Sn-Cu lead-free solder of an atmospheric corrosion resistance is characterized in that: in common Sn-Cu base alloy, add microalloy element Ti, P, Ge, Si, Ni, the one or more combination among the Ga; Addition is weight percentage: 0.001 ~ 0.10%.
2. according to the Sn-Cu lead-free solder of the said atmospheric corrosion resistance of claim 1, it is characterized in that: said common Sn-Cu base alloy is that copper content is the Sn-Cu bianry alloy of 0.10-1.5wt%.
3. according to the Sn-Cu lead-free solder of the said atmospheric corrosion resistance of claim 1, it is characterized in that: said lead-free solder is block foundry alloy, welding wire, soldered ball, welding powder or soldering paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105591457A CN102476251A (en) | 2010-11-25 | 2010-11-25 | Sn-Cu lead-free welding flux capable of resisting atmospheric corrosion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105591457A CN102476251A (en) | 2010-11-25 | 2010-11-25 | Sn-Cu lead-free welding flux capable of resisting atmospheric corrosion |
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| CN102476251A true CN102476251A (en) | 2012-05-30 |
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| CN2010105591457A Pending CN102476251A (en) | 2010-11-25 | 2010-11-25 | Sn-Cu lead-free welding flux capable of resisting atmospheric corrosion |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3098020A1 (en) * | 2015-05-29 | 2016-11-30 | ELSOLD GmbH & Co. KG | Flux cored solder wire, in particular for soldering of aluminium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400081A (en) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN1442272A (en) * | 2003-04-11 | 2003-09-17 | 深圳市亿铖达工业有限公司 | Leadless soft brazing alloy for wave crest soldering |
| CN1586792A (en) * | 2004-08-24 | 2005-03-02 | 陈明汉 | Improved Sn-0.7 wt% Cu lead-free welding flux |
| CN1803380A (en) * | 2006-01-11 | 2006-07-19 | 黄守友 | Leadless soldering material and its preparation method |
| CN101224525A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Lead-free pasty solder and preparing method thereof |
| KR100904653B1 (en) * | 2006-02-14 | 2009-06-25 | 주식회사 에코조인 | Pb free solder composition for wave and deeping, electronic equipment and PCB with the same |
-
2010
- 2010-11-25 CN CN2010105591457A patent/CN102476251A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1400081A (en) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN1442272A (en) * | 2003-04-11 | 2003-09-17 | 深圳市亿铖达工业有限公司 | Leadless soft brazing alloy for wave crest soldering |
| CN1586792A (en) * | 2004-08-24 | 2005-03-02 | 陈明汉 | Improved Sn-0.7 wt% Cu lead-free welding flux |
| CN1803380A (en) * | 2006-01-11 | 2006-07-19 | 黄守友 | Leadless soldering material and its preparation method |
| KR100904653B1 (en) * | 2006-02-14 | 2009-06-25 | 주식회사 에코조인 | Pb free solder composition for wave and deeping, electronic equipment and PCB with the same |
| CN101224525A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Lead-free pasty solder and preparing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3098020A1 (en) * | 2015-05-29 | 2016-11-30 | ELSOLD GmbH & Co. KG | Flux cored solder wire, in particular for soldering of aluminium |
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Application publication date: 20120530 |