CN103909363A - Cadmium-free low-silver solder containing tin, manganese and indium - Google Patents
Cadmium-free low-silver solder containing tin, manganese and indium Download PDFInfo
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- CN103909363A CN103909363A CN201410132957.1A CN201410132957A CN103909363A CN 103909363 A CN103909363 A CN 103909363A CN 201410132957 A CN201410132957 A CN 201410132957A CN 103909363 A CN103909363 A CN 103909363A
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- solder
- silver
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- indium
- manganese
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to welding materials, and particularly relates to cadmium-free low-silver solder containing tin, manganese and indium. The solder is characterized by comprising, by mass, 24-26% of silver, 32-34% of zinc, 0.9-1.5% of tin, 0.8-1.8% of manganese, 1.0-1.6% of indium and the balance copper. Through the optimized elementary compositions, mechanical property of the silver solder can be improved, liquidus and solidus temperature is lowered, wettability and flowability of the solder are improved, overall performance of the solder shows that the solder is enough to replace conventional silver solder B-Ag35CuZn, content of the precious metal Ag is lowered, production cost of the solder is effectively lowered to the benefit of popularization and application, and good economic benefit is produced.
Description
Technical field
The invention belongs to welding material class, be specifically related to a kind of cadmium-free low-silver solder of stanniferous manganese indium.
Background technology
Traditional middle temperature ag material is Ag-Cu-Zn-Cd brazing filler metal alloy, and along with the promulgation of the 39th command of seven ministries and commissions such as RoHS instruction and the Ministry of Information Industry of China, cadmium element is limited in using in solder.Solders Research person attempts to realize without cadmium by finding the replacer of cadmium, but these solder systems or all still have a certain distance with traditional containing cadmium brazing silver alloy in price or in soldering processes performance or in processing characteristics.Obtain with tradition and contain the performance that cadmium solder is identical, conventionally need to be undertaken by the content that improves silver and other noble metal.
Silver solder is mainly taking Ag-Cu-Zn alloy as matrix, be aided with elements such as adding Cd, Sn, Mn, Ni, Ga, In, Si, fall low-alloyed fusing point, dwindle molten temperature region, thereby improve brazing manufacturability, mainly contain Ag-Cu-Zn, Ag-Cu-Zn-Cd, Ag-Cu-Zn-Sn, Ag-Cu-Zn-Ni, Ag-Cu-Zn-In, six series such as Ag-Cu-Zn-Ga.For example: the Ag-Cu-Zn solder that model is B-Ag35CuZn is that one is widely used, the good silver solder of combination property, and major parameter index is: composition is silver-colored 34.0%-36.0%, copper 29.0%-31.0%, surplus is zinc; Approximately 665 DEG C of its solidus, approximately 745 DEG C of liquidus curves; Approximately 745 DEG C-845 DEG C of brazing temperatures; Solder tensile strength is about 386MPa.Be that fusing point is lower by the feature of known this solder of These parameters, wetability and seam-filling ability are good, and strength of joint is high and can bear oscillating load, are applicable to soldered seam requirement bright and clean and have high-intensity copper and copper alloy, steel and a stainless steel parts in the time impacting; But this alloy causes cost also higher because silver content is higher, this has improved electronic product cost to a certain extent, has reduced its competitiveness, is unfavorable for applying.
Summary of the invention
The object of the invention is to for noble silver too high levels in conventional silver solder and the problem that contains poisonous element cadmium, provide a kind of combination property better, without cadmium and the low silver solder of silver content.
For achieving the above object, the technical solution adopted in the present invention is: a kind of cadmium-free low-silver solder of stanniferous manganese indium, formed by following each component proportion: silver content 24%-26%, zinc content 32%-34%, tin content 0.9%-1.5%, manganese content 0.8%-1.8%, indium content 1.0%-1.6%, surplus is copper.
Preferably, described silver content 25%, zinc content 34%, tin content 1.3%, manganese content 1.4%, indium content 1.6%, surplus is copper.The silver solder combination property of now making approaches and traditional silver solder B-Ag35CuZn, in the situation that silver content reduces approximately 10%, can play good substitution effect.
The advantage of the technical program is to adopt Sn to replace poisonous Cd, to reduce the fusing point of solder, Sn solubility in Ag, Cu is larger, can greatly reduce the fusion temperature of solder, 0.9%-1.5% content Sn has played the good action of refining eutectic tissue, is conducive to carry heavy alloyed wettability.Because Sn also has certain limit to reducing brazing temperature, therefore need to add phosphide element to regulate the brazing temperature of solder, the fusing point of phosphide element is only 156 DEG C, interpolation indium can more significantly reduce the solid, liquid phase line of solder, indium similar to tin also can make solder melting region reduce, and improves solder mobility, and In and Ag, Cu, Mn etc. all form solid solution, in silver solder, add In, also can make the intensity of joint obtain raising to a certain extent.Manganese element can improve the wetability of silver to copper, is dissolved in silver and forms solid solution, plays solution strengthening effect, improves intensity, especially elevated temperature strength, and containing the solder of manganese nickel, butt joint gap is insensitive, and processing performance is good.
Prove by lot of experiments, by the each elemental constituent after above-mentioned optimization, can make mechanical property raising, liquidus curve and the solidus temperature of silver solder decrease, solder wettability and mobility improve, combination property of the present invention has enough substituted traditional silver solder B-Ag35CuZn, the technical program has reduced the content of precious metal element Ag, effectively reduce the production cost of solder and apply, producing good economic benefit.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is made to further elaboration.
The nickeliferous manganese indium of one of the present invention cadmium-free low-silver solder, is made up of following each component proportion: silver content 24%-26%, and zinc content 32%-34%, tin content 0.9%-1.5%, manganese content 0.8%-1.8%, indium content 1.0%-1.6%, surplus is copper.Within the scope of silver solder component proportion described above, choose the component of concrete amount and carry out a kind of making of nickeliferous manganese indium cadmium-free low-silver solder, manufacture method is: choose each component raw material according to above-mentioned formulation ratio, put into the melting of conventional intermediate frequency smelting furnace even, carry out ingot casting after melted, then by extruding, drawing, obtain needed solder, then solder is processed as the silk material that diameter is 2.0mm, coordinates FB102 brazing flux, weld identical stainless steel mother metal by conventional method, test.
Proportioning numerical value and the test data of a kind of nickeliferous manganese indium cadmium-free low-silver solder that employing said ratio and manufacture method are produced are as follows:
Embodiment 1
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Embodiment 14
Can be drawn by above-described embodiment: the silver content of solder of the present invention warm B-Ag35CuZn brazing material in than tradition reduces more than 10%, coordinate FB102 (QJ102) brazing flux, the mechanical property of soldered fitting can reach respectively B-Ag35CuZn in-scope, can replace B-Ag35CuZn completely, the scolder in above-described embodiment also shows good wetability and mobility simultaneously.
Claims (2)
1. a cadmium-free low-silver solder for stanniferous manganese indium, is characterized in that being made up of following each constituent mass proportioning: silver content 24%-26%, zinc content 32%-34%, tin content 0.9%-1.5%, manganese content 0.8%-1.8%, indium content 1.0%-1.6%, surplus is copper.
2. the cadmium-free low-silver solder of a kind of stanniferous manganese indium as claimed in claim 1, is characterized in that described silver content 25%, zinc content 34%, and tin content 1.3%, manganese content 1.4%, indium content 1.6%, surplus is copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410132957.1A CN103909363A (en) | 2014-04-01 | 2014-04-01 | Cadmium-free low-silver solder containing tin, manganese and indium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410132957.1A CN103909363A (en) | 2014-04-01 | 2014-04-01 | Cadmium-free low-silver solder containing tin, manganese and indium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103909363A true CN103909363A (en) | 2014-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410132957.1A Pending CN103909363A (en) | 2014-04-01 | 2014-04-01 | Cadmium-free low-silver solder containing tin, manganese and indium |
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| CN (1) | CN103909363A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105014259A (en) * | 2015-07-13 | 2015-11-04 | 江西金世纪特种焊接材料有限公司 | Seamless flux-cored wire and processing method thereof |
| CN106736015A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Without silver yellow copper brazing filler metal alloy |
| CN106825987A (en) * | 2016-12-29 | 2017-06-13 | 安徽华众焊业有限公司 | A kind of silver-based brazing alloy and preparation method thereof |
| CN107511469A (en) * | 2017-10-13 | 2017-12-26 | 安阳恒安电机有限公司 | A kind of squirrel cage motor rotor low pressure cast copper equipment, cast copper and its cast copper method |
| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
| CN110280924A (en) * | 2019-04-03 | 2019-09-27 | 金华市双环钎焊材料有限公司 | A kind of low silver-colored cadmium-free silver brazing alloy of low melting point |
| CN114131239A (en) * | 2021-12-27 | 2022-03-04 | 浙江亚通焊材有限公司 | Lead-free solder for welding automobile glass |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS5141657A (en) * | 1974-10-07 | 1976-04-08 | Tanaka Precious Metal Ind | GINRO |
| CN1120480A (en) * | 1995-04-26 | 1996-04-17 | 东南大学 | Copper-base solder-silver substituted solder for electrical vacuum with low melting point, low vapour pressure and ductility |
| KR20020073777A (en) * | 2001-03-16 | 2002-09-28 | 주식회사삼화합금사 | an alloy composition for a filler metal |
| CN1836823A (en) * | 2006-04-19 | 2006-09-27 | 南京航空航天大学 | Cadmium-free silver solder containing indium and cerium |
| CN102240870A (en) * | 2011-05-20 | 2011-11-16 | 杭州华光焊接新材料股份有限公司 | Multielement rare-earth silver solder |
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2014
- 2014-04-01 CN CN201410132957.1A patent/CN103909363A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141657A (en) * | 1974-10-07 | 1976-04-08 | Tanaka Precious Metal Ind | GINRO |
| CN1120480A (en) * | 1995-04-26 | 1996-04-17 | 东南大学 | Copper-base solder-silver substituted solder for electrical vacuum with low melting point, low vapour pressure and ductility |
| KR20020073777A (en) * | 2001-03-16 | 2002-09-28 | 주식회사삼화합금사 | an alloy composition for a filler metal |
| CN1836823A (en) * | 2006-04-19 | 2006-09-27 | 南京航空航天大学 | Cadmium-free silver solder containing indium and cerium |
| CN102240870A (en) * | 2011-05-20 | 2011-11-16 | 杭州华光焊接新材料股份有限公司 | Multielement rare-earth silver solder |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105014259A (en) * | 2015-07-13 | 2015-11-04 | 江西金世纪特种焊接材料有限公司 | Seamless flux-cored wire and processing method thereof |
| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
| CN106736015A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Without silver yellow copper brazing filler metal alloy |
| CN106825987A (en) * | 2016-12-29 | 2017-06-13 | 安徽华众焊业有限公司 | A kind of silver-based brazing alloy and preparation method thereof |
| CN107511469A (en) * | 2017-10-13 | 2017-12-26 | 安阳恒安电机有限公司 | A kind of squirrel cage motor rotor low pressure cast copper equipment, cast copper and its cast copper method |
| CN110280924A (en) * | 2019-04-03 | 2019-09-27 | 金华市双环钎焊材料有限公司 | A kind of low silver-colored cadmium-free silver brazing alloy of low melting point |
| CN110280924B (en) * | 2019-04-03 | 2020-12-22 | 金华市双环钎焊材料有限公司 | Low-melting-point low-silver cadmium-free silver solder |
| CN114131239A (en) * | 2021-12-27 | 2022-03-04 | 浙江亚通焊材有限公司 | Lead-free solder for welding automobile glass |
| CN114131239B (en) * | 2021-12-27 | 2023-02-28 | 浙江亚通新材料股份有限公司 | Lead-free solder for welding automobile glass |
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Application publication date: 20140709 |
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| RJ01 | Rejection of invention patent application after publication |