CN100463763C - Cu-P-Ag solder containing Ga, In and Ce - Google Patents
Cu-P-Ag solder containing Ga, In and Ce Download PDFInfo
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- CN100463763C CN100463763C CNB2006101614398A CN200610161439A CN100463763C CN 100463763 C CN100463763 C CN 100463763C CN B2006101614398 A CNB2006101614398 A CN B2006101614398A CN 200610161439 A CN200610161439 A CN 200610161439A CN 100463763 C CN100463763 C CN 100463763C
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Abstract
The invention relates to a copper phosphor silver solder which contains gallium, indium and cerium, wherein it comprises that: 13. 0%-18. 0% silver, 4. 0%-8. 0% phosphor, 0.001%-0.1% gallium, 0.001%-0.1% indium, 0.002%-0.10% cerium, and copper. The invention has the advantages that: it has better anti-drawing strength and anti-shearing strength, etc. It can be used to prepare wires and band; it can reduce the fusion point of alloy (Ag-Cu-Zn alloy), improve its welding property; and it adds rare-earth cerium to particle the crystals, and improve the plasticity to 18. 7-34. 7%.
Description
Technical field
The present invention relates to a kind of silver solder, particularly a kind of Cu-P-Ag solder that contains gallium, indium and cerium that is applicable to metal material solderings such as red copper, brass and nickel-base alloy belongs to the brazing material of class of metal materials and field of metallurgy.
Background technology
Present Cu-P-Ag solder such as the BCu80AgP that uses, silver content is about 15% in its chemical composition, though its performance is comparatively good, but since the solidus temperature of this kind solder at 645 ℃, liquidus temperature at 800 ℃, brazed seam tensile strength in 188MPa (red copper), brazed seam shearing strength at 163MPa (red copper), solder percentage elongation (processing attitude) 15.0%, so still do not satisfy the needs that for example super wide strip solder of many special braze-welded structures, special shape and special size prepares.Therefore, research and development performance, silver content better than BCu80AgP and BCu80AgP are quite or similar and use and satisfy the direction that Cu-P-Ag solder that aforesaid super wide strip solder preparation requires becomes the industry pursuit.
Summary of the invention
Task of the present invention is to provide a kind of more better and satisfied the Cu-P-Ag solder that contains gallium, indium and cerium that the super wide strip solder preparation of special braze-welded structure, special shape and special size requires than BCu80AgP solder performance.
Task of the present invention is finished like this, a kind of Cu-P-Ag solder that contains gallium, indium and cerium, its chemical composition by the mass percent proportioning is: 13.0%～18.0% silver (Ag), 4.0%～8.0% phosphorus (P), 0.001%～0.1% gallium (Ga), 0.001%～0.1% indium (In), 0.002%～0.10% cerium (Ce), all the other are copper (Cu).
The advantage of institute of the present invention tool: 1) to be better than traditional silver content be 15% BCu80AgP copper-phosphorus brazing alloy for solid, liquid phase line temperature, brazed seam tension and combination properties such as shearing strength, solder percentage elongation; 2) by optimize gallium, indium and cerium chemical composition, improved effectively mother metal wetability, spreadability, brazed seam mechanical property (σ
b, τ); 3) except that can being prepared into a material, also can be prepared into thickness is 0.05mm～0.5mm, and width is the strip of 20mm～200mm; 4) gallium of Jia Ruing (Ga) and indium (In) amount of getting are suitable, can reduce the fusing point of principal component alloy (Ag-Cu-P alloy), improve the wetability of Cu-P-Ag solder on red copper, brass and nickel-base alloy simultaneously; 5) by adding rare-earth element cerium (Ce), the crystal grain of fined Cu-P-Ag solder makes Cu-P-Ag solder plasticity raising rate of the present invention reach 18.7%～34.7% (referring to table 1), is convenient to be processed into the solder of special shape and the super wide strip of special size.
The specific embodiment
1), use commercially available silver, cathode copper, phosphor copper, gallium, indium metal, metallic cerium, proportioning on demand adopts that conventional intermediate frequency smelting furnace is smelted, casting, by extruding, drawing, promptly obtains needed solder wire material then; 2), according to producing needs, gallium, indium metal, metallic cerium can be smelted into alloy respectively in advance, add then in copper-phosphorus-silver alloy smelt, casting, by extruding, drawing, promptly obtain needed solder wire material again; Or, be prepared into the strip of desired thickness, width by the multiple tracks rolling process.Solidus temperature at 635 ℃～645 ℃ scopes, liquidus temperature 780 ℃～795 ℃ scopes; Except that can being prepared as a material, also can be prepared into thickness is 0.05mm～0.5mm, and width is the strip of 20mm～200mm; Brazing material is following combination: when red copper-brass, brass-nickel-base alloy, red copper-nickel-base alloy, the brazed seam mechanical property is respectively: σ
b=185～350MPa, τ=180～300MPa.
Embodiment one:
15.0% silver medal (Ag), 5.0% phosphorus (P), 0.1% gallium (Ga), 0.1% indium (In), 0.10% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment two:
13.0% silver medal (Ag), 8.0% phosphorus (P), 0.1% gallium (Ga), 0.1% indium (In), 0.10% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment three:
18.0% silver medal (Ag), 4.0% phosphorus (P), 0.001% gallium (Ga), 0.001% indium (In), 0.002% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment four:
14.0% silver medal (Ag), 7.0% phosphorus (P), 0.01% gallium (Ga), 0.01% indium (In), 0.02% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment five:
14.0% silver medal (Ag), 7.0% phosphorus (P), 0.01% gallium (Ga), 0.01% indium (In), 0.02% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment six:
16.0% silver medal (Ag), 5.50% phosphorus (P), 0.05% gallium (Ga), 0.05% indium (In), 0.05% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment seven:
14.8% silver medal (Ag), 5.2% phosphorus (P), 0.005% gallium (Ga), 0.1% indium (In), 0.08% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment eight:
15.6% silver medal (Ag), 4.8% phosphorus (P), 0.08% gallium (Ga), 0.06% indium (In), 0.03% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment nine:
15.0% silver medal (Ag), 5.0% phosphorus (P), 0.001% gallium (Ga), 0.08% indium (In), 0.03% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment ten:
16.8% silver medal (Ag), 4.4% phosphorus (P), 0.02% gallium (Ga), 0.02% indium (In), 0.03% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment 11:
16.2% silver medal (Ag), 5.6% phosphorus (P), 0.02% gallium (Ga), 0.02% indium (In), 0.08% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment 12:
15.2% silver medal (Ag), 6.0% phosphorus (P), 0.001% gallium (Ga), 0.02% indium (In), 0.06% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
Embodiment 13:
14.5% silver medal (Ag), 4.9% phosphorus (P), 0.02% gallium (Ga), 0.003% indium (In), 0.005% cerium (Ce), all the other are copper (Cu).The percentage elongation of the solder that the mentioned component proportioning obtains, solidus temperature, liquidus temperature, soldering mother metal are red copper-brass, the brazed seam intensity when red copper-nickel-base alloy is combined is all by shown in the table 1, and brazed seam tensile strength and brazed seam shearing strength when brass-nickel-base alloy is combined are respectively σ
b=325 ± 25MPa and τ=270 ± 30MPa).
The Cu-P-Ag solder that contains gallium, indium and cerium of the present invention all has good wettability respectively to soldering mother metal red copper, brass, nickel-base alloy, so any Cu-P-Ag solder that contains gallium, indium and cerium in the foregoing description one to embodiment 13, when different combined material (mother metal) such as soldering red copper-red copper, red copper-brass, red copper-nickel-base alloy, brass-nickel-base alloy, combined material (mother metal) to institute's soldering all has good wetability, and soldered fitting has good comprehensive mechanical properties.
Claims (1)
1. a Cu-P-Ag solder that contains gallium, indium and cerium is characterized in that its chemical composition by the mass percent proportioning is: 13.0%～18.0% silver, 4.0%～8.0% phosphorus, 0.001%～0.1% gallium, 0.001%～0.1% indium, 0.002%～0.10% cerium, all the other are copper.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006101614398A CN100463763C (en) | 2006-12-12 | 2006-12-12 | Cu-P-Ag solder containing Ga, In and Ce |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006101614398A CN100463763C (en) | 2006-12-12 | 2006-12-12 | Cu-P-Ag solder containing Ga, In and Ce |
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| CN1994658A CN1994658A (en) | 2007-07-11 |
| CN100463763C true CN100463763C (en) | 2009-02-25 |
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| CNB2006101614398A Active CN100463763C (en) | 2006-12-12 | 2006-12-12 | Cu-P-Ag solder containing Ga, In and Ce |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181123A (en) * | 2016-08-19 | 2016-12-07 | 佛山晓世科技服务有限公司 | A kind of low silver middle temperature brazing material |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581514B (en) * | 2012-03-16 | 2015-06-03 | 金华市金钟焊接材料有限公司 | Silver solder containing phosphorus, stannum and rare earth |
| CN103480977B (en) * | 2013-09-05 | 2015-12-02 | 常熟市华银焊料有限公司 | Containing the copper-phosphorus brazing alloy of hafnium zirconium |
| CN105149813A (en) * | 2015-09-30 | 2015-12-16 | 杭州华光焊接新材料股份有限公司 | Low-silver-copper-phosphorus brazing material containing trace indium |
| CN115533366A (en) * | 2022-09-21 | 2022-12-30 | 南京航空航天大学 | High-tin rare earth copper phosphorus brazing filler metal and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107455A (en) * | 1978-02-10 | 1979-08-23 | Hitachi Ltd | Self-melting brazing material |
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| JPH0615477A (en) * | 1992-07-02 | 1994-01-25 | Tanaka Kikinzoku Kogyo Kk | Ag brazer |
| DE19629375A1 (en) * | 1996-07-20 | 1998-01-22 | Degussa | Copper-phosphorus alloy for fluxless brazing of copper |
| CN1775459A (en) * | 2005-11-25 | 2006-05-24 | 常熟市华银焊料有限公司 | Cadmium-free silver solder comprising Ga, Im and Ce |
| CN1799761A (en) * | 2006-01-24 | 2006-07-12 | 徐振五 | Lead-free solder |
-
2006
- 2006-12-12 CN CNB2006101614398A patent/CN100463763C/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107455A (en) * | 1978-02-10 | 1979-08-23 | Hitachi Ltd | Self-melting brazing material |
| EP0465861A1 (en) * | 1990-07-04 | 1992-01-15 | Degussa Aktiengesellschaft | Brazing alloy |
| JPH0615477A (en) * | 1992-07-02 | 1994-01-25 | Tanaka Kikinzoku Kogyo Kk | Ag brazer |
| DE19629375A1 (en) * | 1996-07-20 | 1998-01-22 | Degussa | Copper-phosphorus alloy for fluxless brazing of copper |
| CN1775459A (en) * | 2005-11-25 | 2006-05-24 | 常熟市华银焊料有限公司 | Cadmium-free silver solder comprising Ga, Im and Ce |
| CN1799761A (en) * | 2006-01-24 | 2006-07-12 | 徐振五 | Lead-free solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181123A (en) * | 2016-08-19 | 2016-12-07 | 佛山晓世科技服务有限公司 | A kind of low silver middle temperature brazing material |
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| CN1994658A (en) | 2007-07-11 |
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