CN103846569B - Containing the low silver-colored cadmium-free silver brazing alloy of cobalt - Google Patents
Containing the low silver-colored cadmium-free silver brazing alloy of cobalt Download PDFInfo
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- CN103846569B CN103846569B CN201410074925.0A CN201410074925A CN103846569B CN 103846569 B CN103846569 B CN 103846569B CN 201410074925 A CN201410074925 A CN 201410074925A CN 103846569 B CN103846569 B CN 103846569B
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- 238000005219 brazing Methods 0.000 title claims abstract description 58
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 39
- 239000004332 silver Substances 0.000 title claims abstract description 39
- 229910000531 Co alloy Inorganic materials 0.000 title description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 59
- 239000000956 alloy Substances 0.000 claims abstract description 59
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 34
- 239000010941 cobalt Substances 0.000 claims abstract description 34
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052738 indium Inorganic materials 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 52
- 238000005476 soldering Methods 0.000 abstract description 27
- 230000004927 fusion Effects 0.000 abstract description 9
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000006731 degradation reaction Methods 0.000 abstract description 2
- 239000007769 metal material Substances 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 229910052790 beryllium Inorganic materials 0.000 abstract 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001369 Brass Inorganic materials 0.000 description 18
- 239000010951 brass Substances 0.000 description 18
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 230000004907 flux Effects 0.000 description 13
- 229910052733 gallium Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000003723 Smelting Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000011160 research Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- HSSJULAPNNGXFW-UHFFFAOYSA-N [Co].[Zn] Chemical compound [Co].[Zn] HSSJULAPNNGXFW-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000538562 Banjos Species 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- RYTYSMSQNNBZDP-UHFFFAOYSA-N cobalt copper Chemical compound [Co].[Cu] RYTYSMSQNNBZDP-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000013332 literature search Methods 0.000 description 1
- 201000004792 malaria Diseases 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- -1 nickel-base alloy Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 235000020681 well water Nutrition 0.000 description 1
- 239000002349 well water Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to class of metal materials, specifically a kind of low silver-colored cadmium-free silver brazing alloy containing cobalt, it is characterized in that, be: Ag12% ~ 16%, Cu39% ~ 41%, In1% ~ 8%, Ga0.5% ~ 4%, Co0.01% ~ 1.2% by mass percent proportioning, surplus is Zn.And In ︰ Ga=2 ︰ 1.Mentioned component proportioning of the present invention obtain containing beryllium low silver-colored cadmium-free silver brazing alloy has good fluidity, wetability is good, Joint Strength high, but also have and BAg20CuZnCd solder " close fusion temperature scope ", be specially adapted to the soldering of household electric appliances, some product of hardware industry, avoid cause because brazing temperature is too high workpiece oxidation, degradation problem under soldering joint strength.
Description
Technical field
The invention belongs to the technical field of soldering materials of class of metal materials, be specifically related to a kind of low silver-colored cadmium-free silver brazing alloy containing cobalt.
Background technology
In brazing material, the BAg20CuZnCd solder more generally used at present, owing to containing Cd element in its chemical composition, although brazing property is excellent when coordinating scaling powder (as FB102 brazing flux), can not meet RoHS Directive requirement.Other silver solder has multiple not containing the formula of cadmium, but due to its silver content higher, the needs of household electric appliances, the competition of hardware industry market cannot be met, be badly in need of developing silver content about 15% silver solder, to reduce production cost.
The applicant has carried out literature search, although be seen in the technical information of low silver-colored cadmium-free silver brazing alloy in published Chinese patent literature, " multi-component alloy cadmium-free low-silver solder ", Chinese patent CN101347871 disclosed " application of a kind of low-silver solder in the end ring and sliver soldering processes of rotor " and Chinese patent CN102416530A disclosed " cadmium-free low-silver solder and preparation method thereof " disclosed in Chinese patent CN101716702A, etc.But, disclosed in these documents, low its silver content of silver-colored cadmium-free silver brazing alloy is all in 16.0% ~ 40% scope, more particularly all do not belong to the low silver-colored cadmium-free silver brazing alloy of " silver content about 15%, solder fusing point close to BAg20CuZnCd ", therefore, BAg20CuZnCd solder cannot be substituted " under not changing the condition of existing production technology ".For this reason, the applicant has carried out a large amount of explorations and useful test, and technical scheme described below produces under this background.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, provide a kind of and there is the low silver-colored cadmium-free silver brazing alloy containing cobalt that good mobility and wetability, Joint Strength are moderate, have the fusion temperature scope close with BAg20CuZnCd solder.
Task of the present invention has been come like this:
Containing a low silver-colored cadmium-free silver brazing alloy for cobalt, it is characterized in that: composition by mass percent proportioning is: the Ag of 12% ~ 16%, the Cu of 39% ~ 41%, the In of 1% ~ 8%, the Ga of 0.5% ~ 4%, the Co of 0.01% ~ 1.2%, surplus is Zn.
In technique scheme, when In 1% ~ 8%, Ga in the scope of 0.5% ~ 4% and the proportion of In ︰ Ga=2 ︰ 1 time, there is best mobility and wetability and there is the fusion temperature scope close with BAg20CuZnCd solder.
" the low silver-colored cadmium-free silver brazing alloy containing cobalt " its solidus temperature that mentioned component proportioning obtains is 655 DEG C ± 10 DEG C, and liquidus temperature is 745 DEG C ± 10 DEG C (all considering evaluated error).Use gas brazing mode, coordinate FB102 brazing flux, Joint intensity when soldering mother metal is following combination is shown in data in bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), red copper-nickel-base alloy (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-nickel-base alloy (σ
b=330 ± 25MPa, τ=325 ± 30MPa), coordinate soldered fitting mechanical property when scaling powder (as FB102 brazing flux) soldering red copper-brass, red copper-nickel-base alloy, brass-nickel-base alloy suitable with BAg20CuZnCd solder.
The present invention program mainly solves following two key technical problems: the novel low silver-colored cadmium-free silver brazing alloy containing cobalt 1) developed, good fluidity during soldering, wetability are good, Joint Strength is high, but also has and BAg20CuZnCd solder " close fusion temperature scope ".By optimizing the chemical composition of " the novel low silver-colored cadmium-free silver brazing alloy containing cobalt ", making neoteric silver solder except can being prepared as common band, silk material, also can be prepared into the filament that diameter is 1.2 ~ 1.5; 2) by adding indium and the gallium element of appropriate ratio in silver solder, add the cobalt of trace simultaneously, make silver solder having well " wettability " on red copper, brass and nickel-base alloy, lower and close to the fusion temperature scope of BAg20CuZnCd solder.
Use commercially available silver, cathode copper, zinc ingot metal, indium metal, gallium, zinc-cobalt alloy, on demand proportioning, adopt conventional intermediate frequency smelting furnace to smelt, cast, then by extruding, drawing, namely obtain required solder wire material; According to need of production, indium metal, gallium can be smelted into alloy respectively in advance, then add smelting in smelting furnace, casting, then by extruding, drawing, namely obtain required solder wire material; Or by multiple tracks rolling process, be prepared into the strip of desired thickness, width.
Compared with studying, the achievement part of technical scheme provided by the invention was in the past:
1, research has found under " synergy " of trace cobalt element, in silver solder, the alloying element indium of appropriate ratio and gallium are to the affecting laws of " low silver-colored cadmium-free silver brazing alloy "---i.e. indium and gallium element content (mass percent in silver solder, lower with) control respectively In be 1% ~ 8%, Ga be 0.5% ~ 4% scope in and In ︰ Ga=2 ︰ 1 time, when can make Ag content≤16% in low silver-colored cadmium-free silver brazing alloy, neoteric low silver-colored cadmium-free silver brazing alloy still has good " wettability ".
Test finds, when the addition of In higher than 8%, the addition of Ga higher than 4% after, the fusing point of solder is not that " dullness " declines, and solder poor processability, soaks, trend that spreading property also has variation.But the addition of In lower than 1%, the addition of Ga lower than 0.5% time, as In ︰ Ga=2 ︰ 1, solder still has good wetting, spreading property, but solder fusing point significantly rises, and liquidus temperature reaches more than 780 DEG C.
Further research also finds, when the addition of control In 1% ~ 8%, the addition of Ga is in the scope of 0.5% ~ 4%, as In ︰ Ga > 2 ︰ 1, as In ︰ Ga=2.1 ︰ 1 time (as the addition of In in the addition of 1.05%, Ga 0.5% time; The addition of In 8%, the addition of Ga 3.81% time, brazed seam mechanical property reduces.The soldering object red copper-brass commonly used the most using silver solder in research carries out contrast test as mother metal, finds red copper-brass soldering joint strength (σ
bfor banjo fixing butt jointing pull-off force, τ is lap joint pull-off force) σ
b=190 ± 25MPa, τ=180 ± 30MPa(subnormal red copper-brass soldered fitting pull-off force σ
b=210 ± 25MPa, the scope of τ=200 ± 30MPa), solder fusing point significantly rises, and solidus temperature is 685 DEG C, liquidus temperature reaches 780 DEG C, obtains 655 DEG C (solidus temperatures) to 745 DEG C of (liquidus temperature) scopes apparently higher than employing composition proportion of the present invention.
As In ︰ Ga < 2 ︰ 1, during as In ︰ Ga=1.9 ︰ 1, (as the addition of In in the addition of 0.95%, Ga 0.5% time; The addition of In 7.6%, the addition of Ga 4% time, brazed seam mechanical property reduces, and only has σ
b=195 ± 25MPa, τ=185 ± 30MPa(subnormal red copper-brass soldered fitting pull-off force σ
b=210 ± 25MPa, the scope of τ=200 ± 30MPa), solder fusing point significantly rises, and solidus temperature is 705 DEG C, liquidus temperature reaches 800 DEG C, apparently higher than 655 DEG C (solidus temperatures) adopting composition proportion of the present invention to obtain to 745 DEG C of (liquidus temperature) scopes.
Therefore, to control in low silver-colored cadmium-free silver brazing alloy indium and gallium element content and In 1% ~ 8%, Ga is in the scope of 0.5% ~ 4% and in the proportion of In ︰ Ga=2 ︰ 1, be one of key point of the present invention program.
2, research has found that trace cobalt element is to the low wettability of silver-colored cadmium-free silver brazing alloy, the affecting laws of processing characteristics.Many experimental results shows, cobalt element content scope that should control 0.01% ~ 1.2% in low silver-colored cadmium-free silver brazing alloy is advisable.In above-mentioned scope, when the addition meeting In ︰ Ga=2 ︰ 1(In should 1% ~ 8% simultaneously, the addition of Ga should in 0.5% ~ 4% scope) condition time, neoteric its fusion temperature scope of low silver-colored cadmium-free silver brazing alloy can control 655 DEG C ~ 745 DEG C scopes, close to the fusion temperature scope of BAg20CuZnCd solder, (BAg20CuZnCd solidus temperature is 605 DEG C, liquidus temperature is 765 DEG C, continue see GB/T10046-2008 " silver solder " the 4th page table 2()), now, the neoteric novel low silver-colored cadmium-free silver brazing alloy soldering red copper containing cobalt, H62 brass, during the metals such as nickel-base alloy, there is the brazing property suitable with BAg20CuZnCd and close fusion temperature, and the content of precious metals ag reduces about 5 percentage points, although In, Ga also belongs to rare precious metal, but its price is lower slightly compared with silver-colored valency, COMPREHENSIVE CALCULATING, the cost of raw material still can reduce about 10% ~ 20%, technological progress is remarkable.
Metallic cobalt fusing point about 1495 DEG C, is obviously difficult to be dissolved in silver solder.But cobalt is first smelted into zinc-cobalt alloy with zinc, and the fusing point of its zinc-cobalt alloy can drop to about 900 DEG C, just can join in silver solder easily, equably like this in the smelting process of silver solder.There are some researches show, " equilirbium solid solubility " of metallic cobalt in copper only has 0.2%(mass percent, lower same), but, its " expansion solid solubility " under rapid solidification condition can reach 15%, thus forms the copper-cobalt alloy with " high strength ", " high conductivity ".Of the present invention containing in the low silver-colored cadmium-free silver brazing alloy of cobalt, the content of cobalt is higher than after 1.2%, the intensity of solder, electric conductivity increase although can continue " dullness ", but bring difficulty to the processing of solder, preparation, and, too high intensity and electric conductivity are tantamount to waste for soldered fitting (brazed seam), and therefore, the addition of cobalt is best to control within 1.2%.When cobalt addition lower than 0.01% time, still there is certain effect, but for the preparation deleterious of filament solder, be particularly drawn to fracture of wire phenomenon when diameter is less than 1.3mm at solder wire material and start to increase, therefore, the minimum addition of determination cobalt of the present invention is 0.01%.
3, also find in experimental study process, because cobalt is got along well water effect at normal temperatures, also very stable in malaria, adding of trace cobalt has " purification " significantly effect to the smelting of silver solder, namely after adding cobalt element, pore in ingot casting, field trash obviously reduce, and when preparing filament solder (if diameter is the filament of 1.2mm ~ 1.5mm), " fracture of wire phenomenon " significantly reduces, make neoteric solder aborning lumber recovery greatly improve.
Technical scheme provided by the invention is for the BAg20CuZnCd solder in prior art, not only there is good fluidity, wetability is good, Joint Strength high, but also have and BAg20CuZnCd solder " close fusion temperature scope ", be specially adapted to the soldering of household electric appliances, some product of hardware industry, avoid cause because brazing temperature is too high workpiece oxidation, degradation problem under soldering joint strength.
Detailed description of the invention
The specific embodiment embodying the novel low silver-colored cadmium-free silver brazing alloy containing cobalt of the present invention of above-mentioned technique effect is as follows.
Embodiment 1:
Containing a low silver-colored cadmium-free silver brazing alloy for cobalt, be: the Ag of 16%, the Cu of 41%, the In of 1%, the Ga of 0.5%, the Co of 0.01% that surplus is Zn by mass percent proportioning." the novel low silver-colored cadmium-free silver brazing alloy containing cobalt " its solidus temperature that mentioned component proportioning obtains is 655 DEG C ± 10 DEG C, and liquidus temperature is 745 DEG C ± 10 DEG C (all considering evaluated error).During soldering, solder fluidity is good, good to the wettability of mother metal.
Use gas brazing mode, coordinate FB102 brazing flux, Joint intensity when soldering mother metal is following combination is shown in data in bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), red copper-nickel-base alloy (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-nickel-base alloy (σ
b=330 ± 25MPa, τ=325 ± 30MPa), coordinate soldered fitting mechanical property when scaling powder (as FB102 brazing flux) soldering red copper-brass, red copper-nickel-base alloy, brass-nickel-base alloy suitable with BAg20CuZnCd solder.
Embodiment 2:
Containing a low silver-colored cadmium-free silver brazing alloy for cobalt, be: the Ag of 12%, the Cu of 39%, the In of 8%, the Ga of 4%, the Co of 1.2% that surplus is Zn by mass percent proportioning." the novel low silver-colored cadmium-free silver brazing alloy containing cobalt " its solidus temperature that mentioned component proportioning obtains is 655 DEG C ± 10 DEG C, and liquidus temperature is 745 DEG C ± 10 DEG C (all considering evaluated error).During soldering, solder fluidity is good, good to the wettability of mother metal.
Use gas brazing mode, coordinate FB102 brazing flux, Joint intensity when soldering mother metal is following combination is shown in data in bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), red copper-nickel-base alloy (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-nickel-base alloy (σ
b=330 ± 25MPa, τ=325 ± 30MPa), coordinate soldered fitting mechanical property when scaling powder (as FB102 brazing flux) soldering red copper-brass, red copper-nickel-base alloy, brass-nickel-base alloy suitable with BAg20CuZnCd solder.
Embodiment 3:
Containing a low silver-colored cadmium-free silver brazing alloy for cobalt, be: the Ag of 13%, the Cu of 40%, the In of 2%, the Ga of 1%, the Co of 0.2% that surplus is Zn by mass percent proportioning." the novel low silver-colored cadmium-free silver brazing alloy containing cobalt " its solidus temperature that mentioned component proportioning obtains is 655 DEG C ± 10 DEG C, and liquidus temperature is 745 DEG C ± 10 DEG C (all considering evaluated error).During soldering, solder fluidity is good, good to the wettability of mother metal.
Use gas brazing mode, coordinate FB102 brazing flux, Joint intensity when soldering mother metal is following combination is shown in data in bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), red copper-nickel-base alloy (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-nickel-base alloy (σ
b=330 ± 25MPa, τ=325 ± 30MPa), coordinate soldered fitting mechanical property when scaling powder (as FB102 brazing flux) soldering red copper-brass, red copper-nickel-base alloy, brass-nickel-base alloy suitable with BAg20CuZnCd solder.
Embodiment 4:
Containing a low silver-colored cadmium-free silver brazing alloy for cobalt, be: the Ag of 12.5%, the Cu of 39.5%, the In of 5%, the Ga of 2.5%, the Co of 0.8% that surplus is Zn by mass percent proportioning." the novel low silver-colored cadmium-free silver brazing alloy containing cobalt " its solidus temperature that mentioned component proportioning obtains is 655 DEG C ± 10 DEG C, and liquidus temperature is 745 DEG C ± 10 DEG C (all considering evaluated error).During soldering, solder fluidity is good, good to the wettability of mother metal.
Use gas brazing mode, coordinate FB102 brazing flux, Joint intensity when soldering mother metal is following combination is shown in data in bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), red copper-nickel-base alloy (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-nickel-base alloy (σ
b=330 ± 25MPa, τ=325 ± 30MPa), coordinate soldered fitting mechanical property when scaling powder (as FB102 brazing flux) soldering red copper-brass, red copper-nickel-base alloy, brass-nickel-base alloy suitable with BAg20CuZnCd solder.
Embodiment 5:
Containing a low silver-colored cadmium-free silver brazing alloy for cobalt, be: the Ag of 14%, the Cu of 39.8%, the In of 1.8%, the Ga of 0.9%, the Co of 0.5% that surplus is Zn by mass percent proportioning." the novel low silver-colored cadmium-free silver brazing alloy containing cobalt " its solidus temperature that mentioned component proportioning obtains is 655 DEG C ± 10 DEG C, and liquidus temperature is 745 DEG C ± 10 DEG C (all considering evaluated error).During soldering, solder fluidity is good, good to the wettability of mother metal.
Use gas brazing mode, coordinate FB102 brazing flux, Joint intensity when soldering mother metal is following combination is shown in data in bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), red copper-nickel-base alloy (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-nickel-base alloy (σ
b=330 ± 25MPa, τ=325 ± 30MPa), coordinate soldered fitting mechanical property when scaling powder (as FB102 brazing flux) soldering red copper-brass, red copper-nickel-base alloy, brass-nickel-base alloy suitable with BAg20CuZnCd solder.
Claims (1)
1., containing a low silver-colored cadmium-free silver brazing alloy for cobalt, it is characterized in that, be: Ag12% ~ 16%, Cu39% ~ 41%, In1% ~ 8%, Ga0.5% ~ 4%, Co0.01% ~ 1.2% by mass percent proportioning, surplus is Zn, and In ︰ Ga=2 ︰ 1.
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| CN104384743B (en) * | 2014-09-27 | 2017-05-03 | 宁波银马焊材科技有限公司 | Low-silver cadmium-free solder and preparation method thereof |
| CN106862798A (en) * | 2016-12-29 | 2017-06-20 | 安徽华众焊业有限公司 | A kind of nothing is every silver-based solder and preparation method thereof |
| CN109894771B (en) * | 2019-04-03 | 2020-10-30 | 南京理工大学 | Low-silver cadmium-free silver solder |
| CN113843548B (en) * | 2021-09-16 | 2023-03-31 | 南京理工大学 | High-strength cadmium-free low-silver brazing filler metal |
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| CN1962159A (en) * | 2006-11-26 | 2007-05-16 | 常熟市华银焊料有限公司 | Cadmium-free silver based solder containing gallium, indium and cerium |
| WO2008061406A1 (en) * | 2006-11-26 | 2008-05-29 | Changshu Huayin Filler Metals Co., Ltd. | A cadmium less silver brazing filter metal |
| CN101049655A (en) * | 2007-05-14 | 2007-10-10 | 骆华明 | Silver solder of containing gallium, indium, and rare earth neodymium and cerium without cadmium |
| RU2367553C1 (en) * | 2008-04-30 | 2009-09-20 | Федеральное государственное образовательное учреждение высшего профессионального образования "Сибирский федеральный университет" | Solder alloys on basis of silver |
| CN101279407A (en) * | 2008-05-09 | 2008-10-08 | 金李梅 | Cadmium-free silver solder containing indium and silicon |
| CN103111770A (en) * | 2012-12-19 | 2013-05-22 | 杭州华光焊接新材料股份有限公司 | Polybasic silver solder |
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| CN103846569A (en) | 2014-06-11 |
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