CN101279407A - Cadmium-free silver solder containing indium and silicon - Google Patents
Cadmium-free silver solder containing indium and silicon Download PDFInfo
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- CN101279407A CN101279407A CNA2008100623384A CN200810062338A CN101279407A CN 101279407 A CN101279407 A CN 101279407A CN A2008100623384 A CNA2008100623384 A CN A2008100623384A CN 200810062338 A CN200810062338 A CN 200810062338A CN 101279407 A CN101279407 A CN 101279407A
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Abstract
The invention relates to an indium and silicon-contained cadmium-free silver filler metal, which belongs to the field of medium-temperature brazing materials. The cadmium-free silver filler metal consists of chemical components accounting by weight percentage: 36 percent to 40 percent of copper, 25 percent to 35 percent of zinc, 0.5 percent to 4.5 percent of indium, 0.01 percent to 0.5 percent of silicon and 0.001 percent to 0.1 percent of microalloy elements and the allowance is silver; wherein, the microalloy elements are one or more of the alloying elements such as Ni, Mn, Sb, Zr, B, Ce, La, etc. The components are smelted and cast by adopting a conventional medium-frequency induction furnace, and then the required filler metal can be obtained by extruding, drawing, forming and washing the processed components. The temperature at which the indium and silicon-contained cadmium-free silver filler metal of the invention is melted ranges from 640 to 760 DEG C. By removing the hazardous element-cadmium, the alloy filler metal completely meets the requirement of the RoHS directive by European Union, removes the hazard caused to the health of the bodies of the operation employees and contaminations caused to the environment. By matching the FB102 flux and the silver filler metal of the invention for use, the invention can be applied to the brazing between the copper and workpieces such as copper alloy, hard alloy, stainless steel fitting, etc., and has the advantages of favorable wettability and fluidity, high mechanical strength of the brazed joint, good brazing process performance, etc. The mechanical property of the weld is equal to that of the silver filler metals such as BAg40CuZnCd, BAG45CuZnCd, BAG45CuZn, etc. The silver filler metal of the invention can be widely applied to the brazing in the industries such as refrigeration, machinery, electric machinery, electric apparatuses, instruments and meters, valves and pipe fittings, etc.
Description
Technical field:
The present invention relates to a kind of cadmium-free silver brazing alloy that contains indium and silicon, be applicable to the soldering of workpiece such as copper and copper alloy, carbide alloy, stainless steel pipe, belong to middle temperature brazing material field.
Background technology:
At the restriction of the RoHS of European Union instruction, be used to freeze, to contain cadmium brazing silver alloy will be disabled or alternative gradually for BAg40CuZnCd, the BAg45CuZnCd of industry solderings such as machinery, electromechanics, electrical equipment, instrument and meter, valve pipe fitting, BAg50CuZnCd etc.These contain the harmful element cadmium (Cd) in the cadmium brazing silver alloy, harm operator's healthy and contaminated environment.All contain higher noble metal silver in these solders simultaneously, because noble metal silver resource-constrained, price is more and more expensive.Therefore research and develop out a kind of RoHS of European Union command request that both met; has suitable brazing property again; fusion temperature is suitable; the cadmium-free silver brazing alloy that contains indium and silicon that silver content is lower substitutes BAg40CuZnCd, BAg45CuZnCd, BAg50CuZnCd etc. and contains cadmium brazing silver alloy; both can save the limited noble metal silver resource of country; reduce cost, can protect the healthy of operative employee and elimination pollution again ecological environment.Thereby have great economic benefit and social benefit.
Summary of the invention:
The objective of the invention is to overcome existing above-mentioned deficiency in the prior art, provide a kind of can be in brazing process and soldering after do not have fully at the soldering position poisonous element cadmium, brazing property is good, and suitable with silver solder combination properties such as BAg40CuZnCd, BAg45CuZnCd, BAg45CuZn, the brazing material that silver content is lower again.
The present invention mainly solves following two key technical problems: 1) develop no cadmium, silver solder such as combination property and BAg40CuZnCd, BAg45CuZnCd, BAg45CuZn is suitable, silver solders such as alternative BAg40CuZnCd, BAg45CuZnCd, BAg45CuZn, by optimization, obtained mother metal wetability, good, the weld properties (σ of spreadability to " cadmium-free silver brazing alloy that contains indium and silicon " chemical composition
b, τ) good silver solder; 2) in cadmium-free silver brazing alloy, add an amount of indium (In), be mainly used to reduce the fusing point of brazing filler metal alloy (Ag-Cu-Zn), improve wetability, the spreadability of solder on copper, copper alloy, carbide alloy and stainless steel simultaneously, add silicon (Si) and trace alloying element simultaneously, be mainly used to the crystal grain and the tissue of refinement cadmium-free silver brazing alloy, increase the plasticity of solder, postwelding improves the mechanical strength and the corrosion resistance of soldered fitting.
The invention of this reality solves the problems of the technologies described above the technical scheme that is adopted and is: a kind of cadmium-free silver brazing alloy that contains indium and silicon, it is characterized in that: the composition of this solder and content are by weight percentage: copper: 36%～40%, zinc: 25%～35%, indium: 0.5%～4.5%, silicon: 0.01%～0.5%, trace alloying element: 0.001～0.1%, surplus is a silver, wherein, trace alloying element is one or more in the alloying elements such as Ni, Mn, Sb, Zr, B, Ce, La.The fusion temperature of this cadmium-free silver brazing alloy is 640 ℃～760 ℃ (reference value), cooperates the FB102 brazing flux to use, and can be used for the soldering of workpiece such as copper and copper alloy, carbide alloy, stainless steel pipe, and the mechanical strength of soldered fitting can reach σ
b=190～390MPa, τ=180～290MPa.
The present invention can make intermediate alloy with silicon and trace alloying element melting in advance according to producing needs, add silver-copper-zinc alloy then and carry out melting, again by cast,, extruding, drawing, moulding, cleaning obtain brazing material.
The present invention has following technical characterstic: 1) neoteric " cadmium-free silver brazing alloy that contains indium and silicon " compares the obvious consumption that reduces noble metal silver with silver solders such as BAg40CuZnCd, BAg45CuZnCd, BAg45CuZn, save limited noble metal silver resource, greatly reduced client's use cost simultaneously; 2) removed the harmful element cadmium, and welding line joint mechanical strength height behind the workpiece such as brazed copper and copper alloy, carbide alloy, stainless steel pipe, weld seam densification, any surface finish can replace silver solders such as BAg40CuZnCd, BAg45CuZnCd, BAg45CuZn fully.
The specific embodiment:
Formulation by weight according to " cadmium-free silver brazing alloy that contains indium and silicon " of the present invention is recently specifically narrated the specific embodiment of the present invention.
Embodiment 1:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 36%, and zinc: 27%, indium: 1.0%, silicon: 0.05%, trace alloying element: 0.01%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 750 ℃ (reference value) about 645 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 1 °～5 °; Strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=215～240MPa, τ=180～200MPa), red copper or copper alloy-stainless steel (σ
b=320～340MPa, τ=220～240MPa), stainless steel-stainless steel (σ
b=350～370MPa, τ=260～290MPa).
Embodiment 2:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 38%, and zinc: 28%, indium: 1.5%, silicon: 0.1%, trace alloying element: 0.03%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 745 ℃ (reference value) about 650 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 1 °～5 °; Strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=220～245MPa, τ=185～210MPa), red copper or copper alloy-stainless steel (σ
b=315～330MPa, τ=210～230MPa), stainless steel-stainless steel (σ
b=340～360MPa, τ=250～270MPa).
Embodiment 3:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 37%, and zinc: 30%, indium: 2.0%, silicon: 0.15%, trace alloying element: 0.03%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 740 ℃ (reference value) about 650 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 1 °～5 °; Soldering is identical with embodiment 2 with mother metal and weld strength data.
Embodiment 4:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 40%, and zinc: 29%, indium: 2.5%, silicon: 0.2%, trace alloying element: 0.02%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 745 ℃ (reference value) about 655 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 2 °～5 °; Strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=250～270MPa, τ=190～220MPa), red copper or copper alloy-stainless steel (σ
b=320～350MPa, τ=215～230MPa), stainless steel-stainless steel (σ
b=360～390MPa, τ=245～260MPa).
Embodiment 5:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 40%, and zinc: 32%, indium: 4.0%, silicon: 0.15%, trace alloying element: 0.02%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 760 ℃ (reference value) about 650 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 2 °～5 °; Strength of joint when the soldering mother metal is following the combination is seen data in the bracket: red copper-copper alloy (σ
b=235～250MPa, τ=180～210MPa), red copper or copper alloy-stainless steel (σ
b=315～340MPa, τ=210～230MPa), stainless steel-stainless steel (σ
b=350～370MPa, τ=240～260MPa).
Embodiment 6:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 39%, and zinc: 33%, indium: 3.5%, silicon: 0.3%, trace alloying element: 0.02%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 755 ℃ (reference value) about 660 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 1 °～5 °; Soldering is identical with embodiment 5 with mother metal and weld strength data.
Embodiment 7:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 36%, and zinc: 27%, indium: 4.5%, silicon: 0.15%, trace alloying element: 0.05%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 735 ℃ (reference value) about 640 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 1 °～5 °; Soldering is identical with embodiment 1 with mother metal and weld strength data.
Embodiment 8:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 36%, and zinc: 30%, indium: 3.5%, silicon: 0.3%, trace alloying element: 0.1%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 750 ℃ (reference value) about 650 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 1 °～5 °; Soldering is identical with embodiment 1 with mother metal and weld strength data.
Embodiment 9:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 37%, and zinc: 31%, indium: 3.0%, silicon: 0.5%, trace alloying element: 0.005%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 760 ℃ (reference value) about 665 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 1 °～5 °; Soldering is identical with embodiment 2 with mother metal and weld strength data.
Embodiment 10:
Press the percetage by weight proportioning of alloy, its composition consists of: copper: 38%, and zinc: 35%, indium: 0.5%, silicon: 0.2%, trace alloying element: 0.01%, all the other are silver.
The cadmium-free silver brazing alloy solidus temperature that the mentioned component proportioning obtains is at (reference value), liquidus temperature about 760 ℃ (reference value) about 665 ℃, cooperate the FB102 brazing flux, the wetability of solder on copper and copper alloy, carbide alloy, stainless steel is good, spreadability is good, good fluidity, and angle of wetting is at 2 °～5 °; Soldering is identical with embodiment 1 with mother metal and weld strength data.
Claims (2)
1, a kind of cadmium-free silver brazing alloy that contains indium and silicon, it is characterized in that: the chemical composition of this cadmium-free silver brazing alloy and content are by weight percentage: copper: 36%～40%, zinc: 25%～35%, indium: 0.5%～4.5%, silicon: 0.01%～0.5%, trace alloying element: 0.001～0.1%, surplus is a silver.
2, the cadmium-free silver brazing alloy that contains indium and silicon according to claim 1 is characterized in that: described trace alloying element is one or more among Ni, Mn, Sb, Zr, B, Ce, the La.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100623384A CN101279407A (en) | 2008-05-09 | 2008-05-09 | Cadmium-free silver solder containing indium and silicon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100623384A CN101279407A (en) | 2008-05-09 | 2008-05-09 | Cadmium-free silver solder containing indium and silicon |
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| CN101279407A true CN101279407A (en) | 2008-10-08 |
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| CNA2008100623384A Pending CN101279407A (en) | 2008-05-09 | 2008-05-09 | Cadmium-free silver solder containing indium and silicon |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101554686B (en) * | 2009-05-15 | 2011-11-16 | 西安理工大学 | High-entropy alloy solder used for welding hard alloy and steel and preparation method thereof |
| CN103056551A (en) * | 2013-01-04 | 2013-04-24 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
| CN103111770A (en) * | 2012-12-19 | 2013-05-22 | 杭州华光焊接新材料股份有限公司 | Polybasic silver solder |
| CN103846569A (en) * | 2014-03-03 | 2014-06-11 | 浙江高博焊接材料有限公司 | Cobalt-containing low-silver cadmium-free silver solder |
| CN103909360A (en) * | 2014-04-01 | 2014-07-09 | 金华市三环焊接材料有限公司 | Cadmium-free low-silver solder containing nickel, manganese and indium |
| CN106001991A (en) * | 2016-06-30 | 2016-10-12 | 杭州华光焊接新材料股份有限公司 | Indium containing low-silver multi-element brazing filler metal and preparation method thereof |
| CN106077995A (en) * | 2016-06-30 | 2016-11-09 | 杭州华光焊接新材料股份有限公司 | A kind of containing manganese, the cadmium-free low-silver solder and preparation method thereof of stannum |
| CN110076475A (en) * | 2013-07-31 | 2019-08-02 | 尤米科尔股份公司及两合公司 | Hard solder, purposes and the combination with scaling powder, the method that metal parts is connected by solder brazing |
| CN110369909A (en) * | 2019-08-27 | 2019-10-25 | 常熟市华银焊料有限公司 | A kind of low silver-colored cadmium-free silver brazing alloy containing Ga and In |
| CN114161026A (en) * | 2021-12-29 | 2022-03-11 | 杭州华光焊接新材料股份有限公司 | Silver-saving brazing filler metal special for hard alloy brazing and preparation method thereof |
-
2008
- 2008-05-09 CN CNA2008100623384A patent/CN101279407A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101554686B (en) * | 2009-05-15 | 2011-11-16 | 西安理工大学 | High-entropy alloy solder used for welding hard alloy and steel and preparation method thereof |
| CN103111770B (en) * | 2012-12-19 | 2015-11-04 | 杭州华光焊接新材料股份有限公司 | A kind of Polybasic silver solder |
| CN103111770A (en) * | 2012-12-19 | 2013-05-22 | 杭州华光焊接新材料股份有限公司 | Polybasic silver solder |
| CN103056551A (en) * | 2013-01-04 | 2013-04-24 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
| CN103056551B (en) * | 2013-01-04 | 2015-04-29 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
| CN110076475A (en) * | 2013-07-31 | 2019-08-02 | 尤米科尔股份公司及两合公司 | Hard solder, purposes and the combination with scaling powder, the method that metal parts is connected by solder brazing |
| CN103846569A (en) * | 2014-03-03 | 2014-06-11 | 浙江高博焊接材料有限公司 | Cobalt-containing low-silver cadmium-free silver solder |
| CN103846569B (en) * | 2014-03-03 | 2016-03-02 | 浙江高博焊接材料有限公司 | Containing the low silver-colored cadmium-free silver brazing alloy of cobalt |
| CN103909360A (en) * | 2014-04-01 | 2014-07-09 | 金华市三环焊接材料有限公司 | Cadmium-free low-silver solder containing nickel, manganese and indium |
| CN106001991A (en) * | 2016-06-30 | 2016-10-12 | 杭州华光焊接新材料股份有限公司 | Indium containing low-silver multi-element brazing filler metal and preparation method thereof |
| CN106077995A (en) * | 2016-06-30 | 2016-11-09 | 杭州华光焊接新材料股份有限公司 | A kind of containing manganese, the cadmium-free low-silver solder and preparation method thereof of stannum |
| CN110369909A (en) * | 2019-08-27 | 2019-10-25 | 常熟市华银焊料有限公司 | A kind of low silver-colored cadmium-free silver brazing alloy containing Ga and In |
| CN114161026A (en) * | 2021-12-29 | 2022-03-11 | 杭州华光焊接新材料股份有限公司 | Silver-saving brazing filler metal special for hard alloy brazing and preparation method thereof |
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Open date: 20081008 |