CN105834613A - Solder special for high-frequency soldering of four-way valve - Google Patents
Solder special for high-frequency soldering of four-way valve Download PDFInfo
- Publication number
- CN105834613A CN105834613A CN201610340256.6A CN201610340256A CN105834613A CN 105834613 A CN105834613 A CN 105834613A CN 201610340256 A CN201610340256 A CN 201610340256A CN 105834613 A CN105834613 A CN 105834613A
- Authority
- CN
- China
- Prior art keywords
- solder
- temperature
- soldering
- way valve
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Abstract
The invention discloses solder special for high-frequency soldering of a four-way valve. The solder special for high-frequency soldering of the four-way valve comprises, by mass, 1.0%-2.0% of Ag, 4.5%-8.0% of P, 0.01%-2.5% of Ni, 4.0%-9.0% of Sn, 0.01%-0.1% of Zr, 0.0001%-0.0005% of Ti and the balance Cu. According to the solder special for high-frequency soldering of the four-way valve, a proper amount of Zr and Ti are added into low-silver solder, and thus the wet spreadability of the low-silver solder is improved; and in addition, Zr and Ti are used as a deoxidizing agent and a grain refiner, so that the soldering seam strength during high-frequency inductive soldering of the low-silver solder is improved while the good wet spreadability, the excellent plasticity and strength of the solder are achieved, the soldering seam strength is improved to 230 MPa or over from 190+/-10 MPa and is improved by about 15%, and the service life of the four-way valve can be prolonged easily. The solidus temperature of the solder is 610+/-5 DEG C, the liquidus temperature of the solder is 660+/-5 DEG C, the tensile strength of the solder is equal to or higher than 320 MPa, the soldering seam tensile strength is equal to or higher than 230 MPa, the solder is completely molten when the temperature of the solder in a furnace reaches 640 DEG C and well spread on a soldered portion, and the solder is particularly suitable for high-frequency soldering of the four-way valve.
Description
Technical field
The invention belongs to the technical field of welding materials of class of metal materials, be specifically related to one and be exclusively used in cross valve high frequency brazing
Solder.
Background technology
Since RoHS instruction is formally effective, research and the use of lead-free and cadmium-free brazing material are more and more.RoHS refers to
Order allows lead tolerance in " ledrite " less than 4%, can reduce the consideration of cost, making of ledrite for manufacturing industry
With more and more, various copper alloy products are substantially employing ledrite, therefore, propose the wettability of solder more
High requirement.In the manufacture process of cross valve, relate to the repeatedly soldering of multiple parts.At cross valve " end cap "
During high frequency brazing, owing to inside has been mounted with plastic components, if brazing temperature is too high, easily damage plastic components,
Accordingly, it would be desirable to the fusion temperature of end cap high frequency brazing low-silver solder is reduced further, to ensure cross valve Inner plastic
The safety of parts.
Summary of the invention
It is an object of the invention to provide a kind of ledrite is had good wetting and spreading performance, solid-liquid liquidus temperature low,
Silver content is relatively low, and brazed seam has the solder being exclusively used in cross valve high frequency brazing of excellent plasticity, intensity.
The technical scheme realizing the object of the invention is as follows:
A kind of solder being exclusively used in cross valve high frequency brazing, the most composed of the following components: 1.0%～2.0%
Ag, the P of 4.5%～8.0%, the Ni of 0.01%～2.5%, the Sn of 4.0%～9.0%, the Zr of 0.01%～0.1%,
The Ti of 0.0001%～0.0005%, surplus is Cu.
The solder of the present invention uses preparation method conventional in the art to make, and as by above-mentioned each composition proportion, uses
Intermediate frequency smelting furnace is smelted, and by Zr-Cu alloy commercially available to nickel block, tin slab, commercially available copper foil-clad and Ti-Cu alloy, adds
Enter in liquid Cu-Ag-P ternary alloy three-partalloy, casting or horizontal casting, extruding, drawing, i.e. obtain required solder wire material；
Ingot casting also first can be squeezed into band, then through roughing, finish rolling, be prepared as band (strip).
Inventor finds, adding appropriate Zr, Ti element in low-silver solder can affect the wetting and spreading of low-silver solder
Can, when low-silver solder being the Ti of Zr and 0.0001%～0.0005% of 0.01%～0.1% containing mass fraction, low silver
Solder has optimal wetting and spreading performance.
Inventor also finds, adds the Sn of the Ni and 4.0%～9.0% that mass fraction is 0.01%～2.5% in low-silver solder
Time, employing Zr and Ti element is as deoxidizer and grain refiner, except improving the wetting and spreading in low-silver solder
Outside performance, also having synergism, improve plasticity and the intensity of solder simultaneously, solder has good wetting and spreading
While performance, excellent plasticity and intensity, its solidus temperature relatively GB/T6418-2008 " copper base solder " standard model
BCu91PAg solder solidus temperature reduce about 35 DEG C (solidus temperature of BCu91PAg solder is 643 DEG C,
See GB/T6418-2008 " copper base solder " table 4), liquidus temperature reduction about 125 DEG C be (BCu91PAg solder
Liquidus temperature is 788 DEG C, sees GB/T6418-2008 " copper base solder " table 4).
Another further aspect, inventor finds, when adding the Ti of 0.0001%～0.0005%, Ti Yu Zr produces excellent association
Same-action is also embodied in the Joint intensity that improve low-silver solder when high-frequency induction brazing so that it is Joint intensity from 190 ±
10MPa improves to more than 230MPa, improves about 15%, is conducive to extending the service life of cross valve.
Compared with prior art, the present invention has following remarkable result: the solder of the present invention has good wetting and spreading
Can, solidus temperature is 610 ± 5 DEG C, and liquidus temperature is 660 ± 5 DEG C, solder tensile strength >=320MPa, brazed seam
Tensile strength >=230MPa, furnace brazing temperature reaches be completely melt when 640 DEG C and sprawled at brazed portions good
Good, it is particularly well-suited to cross valve high frequency brazing.
Accompanying drawing explanation
Fig. 1 is the BCu91PAg solder (GB/T6418-2008 of embodiment 1 (a), embodiment 3 (b) and commercially available argentiferous 2%
" copper base solder " standard model) (c) fusing on imitation specimen and sprawl result figure at a temperature of 640 DEG C.
Fig. 2 is the BCu91PAg solder (GB/T6418-2008 of embodiment 1 (a), embodiment 3 (b) and commercially available argentiferous 2%
" copper base solder " standard model) (c) fusing on imitation specimen and sprawl result figure at a temperature of 650 DEG C.
Fig. 3 is the BCu91PAg solder (GB/T6418-2008 of embodiment 1 (a), embodiment 3 (b) and commercially available argentiferous 2%
" copper base solder " standard model) (c) fusing on imitation specimen and sprawl result figure at a temperature of 660 DEG C.
Fig. 4 is the BCu91PAg solder (GB/T6418-2008 of embodiment 1 (a), embodiment 3 (b) and commercially available argentiferous 2%
" copper base solder " standard model) (c) fusing on imitation specimen and sprawl result figure at a temperature of 670 DEG C.
Detailed description of the invention
A kind of solder being exclusively used in cross valve high frequency brazing of the present invention, is made up of following component by mass percentage:
The Ag of 1.0%～2.0%, the P of 4.5%～8.0%, the Ni of 0.01%～2.5%, the Sn of 4.0%～9.0%, 0.01%～
The Zr of 0.1%, the Ti of 0.0001%～0.0005%, surplus is Cu.
In a particular embodiment of the present invention, owing in high-frequency induction brazing, the temperature of brazed portions cannot accurately be measured, and
During furnace brazing, furnace temperature can accurately be measured and control, therefore, select accuracy of temperature control reach ± Muffle furnace of 1 DEG C carries out
Contrast test, the solder of the discovery present invention is under the brazing temperature of 640 DEG C～670 DEG C, than GB model BCu91PAg
Solder has more excellent wetting and spreading performance, and result sees Fig. 1～Fig. 4.Wherein, Fig. 1 be embodiment 1 (a),
Embodiment 3 (b) and the BCu91PAg solder (GB/T6418-2008 " copper base solder " standard model) (c) of argentiferous 2%
At a temperature of 640 DEG C, total time is 6min, and temperature rising-time is 93s, and maximum temperature is under 641.3 DEG C of brazing conditions,
Fusing on imitation specimen and sprawl result figure；Fig. 2 is embodiment 1 (a), embodiment 3 (b) and argentiferous 2%
BCu91PAg solder (GB/T6418-2008 " copper base solder " standard model) (c) at a temperature of 650 DEG C, total time
For 6min, temperature rising-time is 95s, and maximum temperature is under 651 DEG C of brazing conditions, fusing on imitation specimen and sprawling
Result figure；Fig. 3 is the BCu91PAg solder (GB/T6418-2008 of embodiment 1 (a), embodiment 3 (b) and argentiferous 2%
" copper base solder " standard model) (c), at a temperature of 660 DEG C, total time is 6min, temperature rising-time is 93s, the highest
Temperature is under 661 DEG C of brazing conditions, fusing on imitation specimen and sprawl result figure；Fig. 4 be embodiment 1 (a),
Embodiment 3 (b) and the BCu91PAg solder (GB/T6418-2008 " copper base solder " standard model) (c) of argentiferous 2%
At a temperature of 670 DEG C, total time is 6min, and temperature rising-time is 80s, and maximum temperature is under 671 DEG C of brazing conditions,
Fusing on imitation specimen and sprawl result figure.
Below in conjunction with embodiment and accompanying drawing, the invention will be further described.
Embodiment 1
A kind of solder being exclusively used in cross valve high frequency brazing, is made up of following component by mass percentage: the Ag of 1.0%, and 8.0%
P, the Ni of 0.01%, the Sn of 9.0%, the Zr of 0.01%, the Ti of 0.0005%, surplus is Cu.
It is 610 ± 5 DEG C by the low-silver solder solidus temperature for cross valve high frequency brazing obtained by the present embodiment (to consider
Test error), liquidus temperature is 660 ± 5 DEG C (considering test error), solder tensile strength reaches 321MPa,
Brazed seam tensile strength reaches 235MPa.Under the brazing temperature of 640 DEG C～670 DEG C, no matter use in stove mode of heating also
It is high-frequency induction brazing mode, all can be completely melt, reach the effect that moistening well, is uniformly sprawled, see Fig. 1～Fig. 4
In a figure.
Embodiment 2
A kind of solder being exclusively used in cross valve high frequency brazing, is made up of following component by mass percentage: the Ag of 2.0%,
The P of 4.5%, the Ni of 2.5%, the Sn of 4.0%, the Zr of 0.1%, the Ti of 0.0001%, surplus is Cu.
It is 610 ± 5 DEG C by the low-silver solder solidus temperature for cross valve high frequency brazing obtained by the present embodiment (to consider
Test error), liquidus temperature is 660 ± 5 DEG C (considering test error), solder tensile strength reaches 325MPa,
Brazed seam tensile strength reaches 232MPa.Under the brazing temperature of 640 DEG C～670 DEG C, no matter use in stove mode of heating also
It is high-frequency induction brazing mode, all can be completely melt, reach the effect that moistening well, is uniformly sprawled.
Embodiment 3
A kind of solder being exclusively used in cross valve high frequency brazing, is made up of following component by mass percentage: the Ag of 1.5%,
The P of 6.0, the Ni of 1.0%, the Sn of 7.0%, the Zr of 0.05%, the Ti of 0.0002%, surplus is Cu.
It is 610 ± 5 DEG C by the low-silver solder solidus temperature for cross valve high frequency brazing obtained by the present embodiment (to consider
Test error), liquidus temperature is 660 ± 5 DEG C (considering test error), solder tensile strength reaches 325MPa,
Brazed seam tensile strength reaches 241MPa.Under the brazing temperature of 640 DEG C～670 DEG C, no matter use in stove mode of heating also
It is high-frequency induction brazing mode, all can be completely melt, reach the effect that moistening well, is uniformly sprawled, see Fig. 1～Fig. 4
In b figure.
Embodiment 4
A kind of solder being exclusively used in cross valve high frequency brazing, is made up of following component by mass percentage: the Ag of 1.8%,
The P of 5.5%, the Ni of 0.05%, the Sn of 6.5%, the Zr of 0.02%, 0.0003%～Ti, surplus is Cu.
It is 610 ± 5 DEG C by the low-silver solder solidus temperature for cross valve high frequency brazing obtained by the present embodiment (to consider
Test error), liquidus temperature is 660 ± 5 DEG C (considering test error), solder tensile strength reaches 322MPa,
Brazed seam tensile strength reaches 238MPa.Under the brazing temperature of 640 DEG C～670 DEG C, no matter use in stove mode of heating also
It is high-frequency induction brazing mode, all can be completely melt, reach the effect that moistening well, is uniformly sprawled.
Embodiment 5
A kind of solder being exclusively used in cross valve high frequency brazing, is made up of following component by mass percentage: the Ag of 1.6%,
The P of 7.5%, the Ni of 1.2%, the Sn of 8.5%, the Zr of 0.06%, the Ti of 0.0004%, surplus is Cu.
It is 610 ± 5 DEG C by the low-silver solder solidus temperature for cross valve high frequency brazing obtained by the present embodiment (to consider
Test error), liquidus temperature is 660 ± 5 DEG C (considering test error), solder tensile strength reaches 323MPa,
Brazed seam tensile strength reaches 235MPa.Under the brazing temperature of 640 DEG C～670 DEG C, no matter use in stove mode of heating also
It is high-frequency induction brazing mode, all can be completely melt, reach the effect that moistening well, is uniformly sprawled.
Comparative example 1
Select the BCu91PAg solder (GB/T6418-2008 " copper base solder " standard model) of commercially available argentiferous 2%, its
P is 6.8～7.2, and Ag is 1.8～2.2, and surplus is Cu, the solidus be given according to GB/T6418-2008 standard scale 4
Temperature is 643 DEG C, and liquidus temperature is 788 DEG C.It is 310MPa that test records its solder tensile strength, and brazed seam tension is strong
Degree is 198MPa, is below the embodiment of the present invention 1～the intensity level of embodiment 5.It is 640 DEG C～the soldering of 670 DEG C
At a temperature of, no matter use mode of heating or high-frequency induction brazing mode in stove, be not all completely melt, it is impossible to reach moistening
The effect well, uniformly sprawled, sees the c figure in Fig. 1～Fig. 4.
Comparative example 2
Select identical with embodiment 1 main component, but be free from Ti solder (i.e. solder composition is, the Ag of 1.0%,
The P of 8.0%, the Ni of 0.01%, the Sn of 9.0%, the Zr of 0.01%, surplus is Cu), recording its solidus temperature is 610
± 5 DEG C (considering test error), liquidus temperature is 660 ± 5 DEG C (considering test error), solder tensile strength
Reaching 326MPa, brazed seam tensile strength only has 196MPa.Although under the brazing temperature of 640 DEG C～670 DEG C, using
Mode of heating or high-frequency induction brazing mode in stove, solder can reach the effect that moistening well, is uniformly sprawled, but pricker
Seam intensity is still suitable, less than embodiment 1～the intensity level of embodiment 5 with comparative example 1.
Comparative example 3
Select identical with embodiment 1 main component, but be free from Zr solder (i.e. solder composition is, the Ag of 1.0%,
The P of 8.0%, the Ni of 0.01%, the Sn of 9.0%, the Ti of 0.0005%, surplus is Cu.), recording its solidus temperature is
610 ± 5 DEG C (considering test error), liquidus temperature is 660 ± 5 DEG C (considering test error), and solder tension is strong
Degree reaches 326MPa, and brazed seam tensile strength only has 192MPa.Although under the brazing temperature of 640 DEG C～670 DEG C, adopting
By mode of heating in stove or high-frequency induction brazing mode, solder can reach the effect that moistening well, is uniformly sprawled, but
Joint intensity is still suitable, less than embodiment 1～the intensity level of embodiment 5 with comparative example 1.
Relatively above-described embodiment 1～5 and comparative example 1～the intensity level of comparative example 3, can absolutely prove, in the present invention,
Ti can produce excellent synergism with Zr, thus improves low-silver solder Joint intensity when high-frequency induction brazing, makes pricker
Seam intensity improves to >=230MPa (improving about 15%) from 190 ± 10MPa, is conducive to extending the use longevity of cross valve
Life.
Claims (1)
1. the solder being exclusively used in cross valve high frequency brazing, it is characterised in that the most composed of the following components:
The Ag of 1.0%～2.0%, the P of 4.5%～8.0%, the Ni of 0.01%～2.5%, the Sn of 4.0%～9.0%, 0.01%～
The Zr of 0.1%, the Ti of 0.0001%～0.0005%, surplus is Cu.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610340256.6A CN105834613B (en) | 2016-05-20 | 2016-05-20 | A kind of solder being exclusively used in four-way valve high frequency brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610340256.6A CN105834613B (en) | 2016-05-20 | 2016-05-20 | A kind of solder being exclusively used in four-way valve high frequency brazing |
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| CN105834613A true CN105834613A (en) | 2016-08-10 |
| CN105834613B CN105834613B (en) | 2018-10-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108381058A (en) * | 2018-02-27 | 2018-08-10 | 江苏远方动力科技有限公司 | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof |
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| CN105290646A (en) * | 2015-12-08 | 2016-02-03 | 哈尔滨工业大学 | Multi-element high-temperature brazing filler metal |
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| CN101003109A (en) * | 2006-12-29 | 2007-07-25 | 哈尔滨工业大学 | Active mesothermal copper base solder, and preparation method |
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| CN108381058A (en) * | 2018-02-27 | 2018-08-10 | 江苏远方动力科技有限公司 | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof |
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| CN105834613B (en) | 2018-10-02 |
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Effective date of registration: 20210826 Address after: 312452 industrial cluster zone, Sanjie Town, Shengzhou City, Shaoxing City, Zhejiang Province Patentee after: ZHEJIANG XINRUI WELDING SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 210094 No. 200, Xiaolingwei, Jiangsu, Nanjing Patentee before: NANJING University OF SCIENCE AND TECHNOLOGY |
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