CN102886624A - Novel low-melting-point copper-manganese-zinc brazing filler - Google Patents
Novel low-melting-point copper-manganese-zinc brazing filler Download PDFInfo
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Abstract
The invention discloses a novel low-melting-point copper-manganese-zinc brazing filler which belongs to the technical field of brazing. The low-melting-point copper-manganese-zinc brazing filler comprises following components in mass percent: 83% of Mn, 8-10% of nickel, 4-6% of tin, 0.9-1.5% of zinc, 0.2-0.5% of silicon, 0.2-0.4% of lanthanum, and the balance of copper. The brazing filler has the advantages of low melting point, high adapter intensity, heat resistance, corrosion resistance and favorable flowability.
Description
Technical field
The invention belongs to the soldering tech field, specifically, relate to a kind of solder, more particularly, relate to a kind of novel low melting-point coper manganese tin solder.
Background technology
Soldering mainly divides solder and solder brazing, and the solder mainly solder of usefulness is tin-lead solder, and tin-lead solder increases and increases the wettability of the steel content along with tin, and brazing temperature do not produce adverse effect to mother metal, but intensity is generally not high.The solder of solder brazing is a lot, mainly take copper base solder and nickel-based solder as main, but according to domestic and international present Research, the nickel-based solder fusing point is generally all very high, and be difficult to reduce, so now mainly take copper base solder as research direction, mainly contain at present copper zinc brazing filler metal, copper silver brazing filler metal, copper phosphorus brazing filler metal and copper manganese brazing filler metal both at home and abroad.The Cu-Mn-Si ternary alloy three-partalloy solder of Tianjin institute of welding development is arranged in the copper manganese solder, excellent to the soldering effect of mild steel, but owing to fusing point too high (950 ℃), affected the range of application of solder.
China Patent No.: 200510061823.6, open day on 05 24th, 2006, the patent document that a name is called a kind of multi-element alloy copper-base brazing filler material is disclosed, this invention relates to a kind of multi-element alloy copper-base brazing filler material, comprises copper, silver and phosphorus in the prescription, also includes antimony, the content of each component is: silver: 1.5%-4.0%, phosphorus: 5.8%-7.8%, antimony: 0.1%-1.0%, surplus is copper and inevitable impurity.This invention has that spreadability is good, the fluid welding rate is low, processing performance is good, any surface finish, steady quality, high conformity, the advantage that can replace noble silver solder BAg40CuZnSn, can fully fill up the joint gap.But this solder need to use silver element, and production cost is high, and there is the low problem of intensity in the weld seam of this solder welding.
China Patent No.: 201110116100.7, open day on 09 14th, 2011, the patent document that a name is called copper base solder and preparation method thereof is disclosed, this disclosure of the Invention a kind of copper base solder and preparation method thereof, weight percentages of components is: Sn3.95-5.6%, P5.8-6.5%, Sb0.08-0.5%, Si0.05-0.13%, Ce0.07-0.25%, La0.04-0.1%, surplus is Cu.Its preparation method comprises: a. melts Cu; B. add CuP; C. add successively La, Ce, Si and Sb; D. add charcoal powder; E. add Sn; F. cast; G. make short ingot, be cut into the short ingot of 70-80mm; H. push wire vent; I. the drawing of heating.But this patent exists Joint intensity low, the problem that the solder fusing point is high.
Summary of the invention
The problem that solves
Exist expensively for the prior art copper base solder, Joint intensity is low, and the problem that the solder fusing point is high the invention provides a kind of novel low melting-point coper manganese tin solder.
Technical scheme
For addressing the above problem, the technical solution used in the present invention is as follows.
A kind of novel low melting-point coper manganese tin solder, it forms and mass percent is: the content of Mn is 33%, and the content of nickel is 8-10%, and the content of tin is 4-6%, and the content of zinc is 0.9-1.5%, and the content of silicon is 0.2-0.5%, and the content of lanthanum is 0.2-0.4%, and surplus is copper.
Further, described lanthanum is replaced with yittrium oxide, the percentage by weight of described yittrium oxide is 0.5-0.6%.
Preferably, described composition and mass percent are: the content of Mn is 33%, and the content of nickel is 8%, and the content of tin is 4%, and the content of zinc is 1%, and the content of silicon is 0.2%, and the content of lanthanum is 0.2%, and surplus is copper.
A nearlyer step, described lanthanum is replaced with yittrium oxide, the mass percent of described yittrium oxide is 0.5%.
Beneficial effect
Than prior art, the present invention has following beneficial effect:
When the content of Mn reached 33%, fusing point was minimum, was 33% so get the content of Mn; The adding of Sn and Zn element has reduced again the fusing point of solder, but too much Sn content can produce the fragility phase, so consider, the content of determining Sn is 4-6%; The adding of Zn has also been played and has been fallen low-melting effect, and the adding of Zn can improve the plasticity of solder; The adding of Si element is in order to reduce the volatilization of Zn element, and this is because Si oxidation during soldering forms low-melting silicate with the borate in the brazing flux, floats over the liquid solder surface, prevents the evaporation of Zn; Because Si can significantly reduce the solubility of Zn in copper, impel to generate the fragility phase, solder is become fragile, si content is too high in addition can form excessive silica, is difficult for removing, so Si content is 0.2-0.5%; Add a certain amount of Ni element, the content of nickel is 8-10%, improves the intensity of solder, has also improved heat resistance, corrosion resistance and the flowability of solder; And add micro-Rare Earth Lanthanum or yittrium oxide, and make the grain refinement of solder, improve strength of joint, and reduce the defective incidence.
The specific embodiment
Describe the present invention below in conjunction with specific embodiment.
Embodiment 1
A kind of novel low melting-point coper manganese tin solder, it forms and mass percent is: the content of Mn is 33%, and the content of nickel is 10%, and the content of tin is 5%, and the content of zinc is 1.5%, and the content of silicon is 0.5%, and the content of lanthanum is 0.4%, and surplus is copper.During this solder brazing, it is low to have a fusing point, and strength of joint is high, the characteristics of heat resistance, corrosion resistance and good fluidity, and the solder fusing point is 859.3 ℃.
Embodiment 2
With embodiment 1, difference is that described lanthanum is replaced with yittrium oxide, and the percentage by weight of described yittrium oxide is 0.6%.The solder fusing point is 858.7 ℃.
Embodiment 3
A kind of novel low melting-point coper manganese tin solder, it forms and mass percent is: the content of Mn is 33%, and the content of nickel is 8%, and the content of tin is 4%, and the content of zinc is 1%, and the content of silicon is 0.2%, and the content of lanthanum is 0.2%, and surplus is copper.This solder fusing point is 853.5 ℃, and it is low to have a fusing point, the processing performance that intensity is high, and soldered fitting intensity is 347MPa, is suitable for welding in the air, need not vacuum seal and processes, and technique is simple, and cost is low.
Embodiment 4
With embodiment 3, difference is that described lanthanum is replaced with yittrium oxide, and the mass percent of described yittrium oxide is 0.5%.Solder has the advantage that fusing point is low, Joint intensity is high, and the solder fusing point is 854.7 ℃.
Embodiment 5
With embodiment 1, difference is that it forms and mass percent is: the content of nickel is 9%, and the content of tin is 6%, and the content of zinc is 0.9%, and the content of silicon is 0.4%, and the content of lanthanum is 0.3%, and surplus is copper.The good fluidity of solder, fusing point is low, and strength of joint is high, and the solder fusing point is 860.2 ℃.
Claims (4)
1. a novel low melting-point coper manganese tin solder is characterized in that, it forms and mass percent is: the content of Mn is 33%, the content of nickel is 8-10%, and the content of tin is 4-6%, and the content of zinc is 0.9-1.5%, the content of silicon is 0.2-0.5%, and the content of lanthanum is 0.2-0.4%, and surplus is copper.
2. a kind of novel low melting-point coper manganese tin solder according to claim 1 is characterized in that described lanthanum is replaced with yittrium oxide, and the percentage by weight of described yittrium oxide is 0.5-0.6%.
3. a kind of novel low melting-point coper manganese tin solder according to claim 1, it is characterized in that described composition and mass percent are: the content of Mn is 33%, the content of nickel is 8%, and the content of tin is 4%, and the content of zinc is 1%, the content of silicon is 0.2%, and the content of lanthanum is 0.2%, and surplus is copper.
4. a kind of novel low melting-point coper manganese tin solder according to claim 3 is characterized in that described lanthanum is replaced with yittrium oxide, and the mass percent of described yittrium oxide is 0.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210445747.9A CN102886624B (en) | 2012-11-09 | 2012-11-09 | Novel low-melting-point copper-manganese-zinc brazing filler |
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| CN201210445747.9A CN102886624B (en) | 2012-11-09 | 2012-11-09 | Novel low-melting-point copper-manganese-zinc brazing filler |
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| CN102886624A true CN102886624A (en) | 2013-01-23 |
| CN102886624B CN102886624B (en) | 2015-07-15 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358051A (en) * | 2013-07-23 | 2013-10-23 | 华南理工大学 | Copper-based solder and preparation method thereof |
| CN107498210A (en) * | 2017-08-16 | 2017-12-22 | 江苏阳明船舶装备制造技术有限公司 | A kind of Cu sills being modified for red copper surface and preparation and welding method |
| CN108018452A (en) * | 2017-11-30 | 2018-05-11 | 沈阳工业大学 | Leadless soft soldering material and preparation method thereof |
| CN109128577A (en) * | 2018-10-30 | 2019-01-04 | 西南交通大学 | A kind of solder and preparation method thereof of Mn-Cu alloy and the soldering of Fe-Cr based alloy |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327899A (en) * | 2000-12-25 | 2001-12-26 | 吉林大学 | Multi-element Cu-base solder for soldering low-alloy chilled cast iron |
| CN1799760A (en) * | 2005-01-05 | 2006-07-12 | 罗成林 | Copper based brazing alloy |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
-
2012
- 2012-11-09 CN CN201210445747.9A patent/CN102886624B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327899A (en) * | 2000-12-25 | 2001-12-26 | 吉林大学 | Multi-element Cu-base solder for soldering low-alloy chilled cast iron |
| CN1799760A (en) * | 2005-01-05 | 2006-07-12 | 罗成林 | Copper based brazing alloy |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 王鼎钟: "一种新型Cu-Mn-Ni-Zn钎料的研制", 《材料开发与应用》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358051A (en) * | 2013-07-23 | 2013-10-23 | 华南理工大学 | Copper-based solder and preparation method thereof |
| CN103358051B (en) * | 2013-07-23 | 2015-08-26 | 华南理工大学 | A kind of copper base solder and preparation method thereof |
| CN107498210A (en) * | 2017-08-16 | 2017-12-22 | 江苏阳明船舶装备制造技术有限公司 | A kind of Cu sills being modified for red copper surface and preparation and welding method |
| CN108018452A (en) * | 2017-11-30 | 2018-05-11 | 沈阳工业大学 | Leadless soft soldering material and preparation method thereof |
| CN109128577A (en) * | 2018-10-30 | 2019-01-04 | 西南交通大学 | A kind of solder and preparation method thereof of Mn-Cu alloy and the soldering of Fe-Cr based alloy |
| CN109128577B (en) * | 2018-10-30 | 2020-03-24 | 西南交通大学 | Brazing filler metal for brazing Mn-Cu alloy and Fe-Cr-based alloy and preparation method thereof |
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| Publication number | Publication date |
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| CN102886624B (en) | 2015-07-15 |
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