CN103418933A - Silver solder for connecting brass and stainless steel - Google Patents
Silver solder for connecting brass and stainless steel Download PDFInfo
- Publication number
- CN103418933A CN103418933A CN2013103080836A CN201310308083A CN103418933A CN 103418933 A CN103418933 A CN 103418933A CN 2013103080836 A CN2013103080836 A CN 2013103080836A CN 201310308083 A CN201310308083 A CN 201310308083A CN 103418933 A CN103418933 A CN 103418933A
- Authority
- CN
- China
- Prior art keywords
- solder
- brass
- silver
- silver solder
- stainless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of welding materials, in particular to silver solder for connecting brass and stainless steel. The invention aims at overcoming the defects that existing solder for connecting the brass and the stainless steel is high in silver content and in welding cost, and providing the silver solder for connecting the brass and the stainless steel, wherein the silver solder is low in silver content and in welding cost, and non-cadmium silver solder containing more than 25wt.% of silver can be replaced by the silver solder for connecting the brass and the stainless steel. According to the technical scheme, the silver solder for connecting the brass and the stainless steel comprises components, by weight, 18-22 wt.% of Ag, 30-35wt.% of Zn, 0.3-4.5wt.% of In, 0.3-3.0wt.% of Sn, 0.1-2.5wt.% of Ni, 0.001-0.1wt.% of rare earth, and the balance Cu.
Description
Technical field
The present invention relates to technical field of welding materials, particularly a kind of connection brass and stainless silver solder.
Background technology
Brass and stainless Welding Structure are widely used in refrigeration industry, due to approximately 900 ℃ of brass self fusing points, there is the danger of burning during soldering when adopted little solder (as the cadmium-free silver brazing alloy of silver content lower than the 25wt.%) brazing brass of fusing point and brass difference, and the welding steel should not adopt phosphorous copper base solder usually, therefore generally, more than 25wt.%, the cost of welding is higher for the silver content of current welding brass and stainless solder.
Summary of the invention
The objective of the invention is for the silver content of existing welding brass and stainless solder higher, the high weak point of cost of welding, provide a kind of silver content lower, the connection brass that welding cost is lower and stainless silver solder, this solder can substitute the above cadmium-free silver brazing alloy of argentiferous 25wt.% for brass and stainless connection.
The present invention is achieved through the following technical solutions: a kind of connection brass and stainless silver solder, the mass percent of each component of this silver solder is: the Ag of 18～22wt.%, the Zn of 30～35wt.%, 0.3 the In of～4.5wt.%, 0.3 the Sn of～3.0wt.%, 0.1 the Ni of～2.5wt.%, the rare earth of 0.001～0.1wt.%, surplus is Cu.
In described a kind of connection brass and stainless silver solder, the component Ag of described solder is one or more in IC-Ag99.99, IC-Ag99.95 and IC-Ag99.90.
In described a kind of connection brass and stainless silver solder, the component Zn of described solder is one or more in Zn99.995, Zn99.99 and Zn99.95.
In described a kind of connection brass and stainless silver solder, the component I n of described solder is a kind of in In99995 and In9999 or two kinds.
In described a kind of connection brass and stainless silver solder, the component S n of described solder is one or more in Sn99.99A, Sn99.95A, Sn99.95AA, Sn99.90A and Sn99.90AA.
In described a kind of connection brass and stainless silver solder, the component Ni of described solder is one or more in Ni9999, Ni9996, Ni9990, Ni9950 and Ni9920.
In described a kind of connection brass and stainless silver solder, the component Cu of described solder is one or more in Cu-CATH-1, Cu-CATH-2 and Cu-CATH-3.
In described a kind of connection brass and stainless silver solder, the component rare earth of described solder is mixed rare earth of lanthanum and cerium.
Above-mentioned a kind of connection brass and stainless silver solder can be smelted into intermediate alloy in advance by rare earth, then carry out as required proportioning, obtain silk material or the band of solder by melting, casting, extruding, drawing or rolling.
A kind of advantage that connects brass and stainless silver solder of the present invention is:
1, solder does not contain poisonous element cadmium, safety and environmental protection.
2, the fusing point of solder is moderate, 640～690 ℃ of its solidus, 770～800 ℃ of liquidus curves.
3, the processing characteristics of solder is good, can be processed into by processing methods such as proportioning, melting, casting, extruding, wire drawing or rollings silk material and the band of different size.
4, solder has good wetability to brass and stainless steel, can substitute the above cadmium-free silver brazing alloy of argentiferous 25wt.% for brass and stainless connection.
A kind of advantage that connects brass and stainless silver solder of the present invention is to realize by following principle:
Ag, Cu, Zn are the host elements of silver solder, and its processing characteristics on solder and welding performance have larger impact.For controlling the cost of solder, Ag content is controlled at 18～22wt.%; For the alloy structure that guarantees solder is copper based solid solution and silver-colored solid solution two-phase, the content of Zn is controlled at 31～35wt.%; Copper is surplus.
The solid solubility of In in Ag is greater than the solid solubility in Cu, add a certain amount of In and can when reducing the solder fusing point, substantially not affect the plasticity of solder, because In is that rare and scatter element and price are higher, the content that considers the cost In of processing characteristics and solder is 0.3～4.5wt.%.
Sn can reduce the fusing point of solder, improves the wetability of solder, but Sn is easy and Cu forms intermetallic compound, reduce the plasticity of solder, so its addition is preferably 0.3～3.0wt.%.
Ni can improve solder to stainless wettability, and simultaneously Ni can improve the processing characteristics of silver solder, but because Ni can improve the fusing point of solder, so its content is preferably 0.1～2.5wt.%.
Rare earth: highly active rare earth element adds in solder can reduce the harmful effect of impurity element to welding in solder, improves the seam-filling ability of solder, and the content of mixed rare earth of lanthanum and cerium is at 0.001～0.1wt.%.
The present invention compares with stainless solder with existing welding brass, has a silver content lower, the characteristics that welding cost is low.
The specific embodiment
The manufacture of solder: according to adopting melting, casting, extruding, drawing or rolling mill practice to manufacture silk material and the band of solder after composition proportion.Its middle rare earth carries out proportioning after being smelted in advance copper-rare earth intermediate alloy, and the raw material of other component adopt simple metal.
The embodiment of solder of the present invention reaches with the Performance Ratio that has the BAg20CuZn solder now in Table 1.The fusion temperature of solder adopts differential thermal analyzer to measure, and heating rate is 15 ℃/min, and protective gas is N
2, adopt the high purity aluminium oxide crucible.
Table 1: the embodiment of solder of the present invention and with the Performance Ratio that has silver solder now
Claims (8)
1. one kind connects brass and stainless silver solder, the mass percent that it is characterized in that each component of this silver solder is: the Ag of 18～22wt.%, the Zn of 30～35wt.%, 0.3 the In of～4.5wt.%, 0.3 the Sn of～3.0wt.%, 0.1 the Ni of～2.5wt.%, the rare earth of 0.001～0.1wt.%, surplus is Cu.
2. a kind of connection brass according to claim 1 and stainless silver solder, the component Ag that it is characterized in that described solder is one or more in IC-Ag99.99, IC-Ag99.95 and IC-Ag99.90.
3. a kind of connection brass according to claim 1 and 2 and stainless silver solder, the component Zn that it is characterized in that described solder is one or more in Zn99.995, Zn99.99 and Zn99.95.
4. a kind of connection brass according to claim 1 and 2 and stainless silver solder, the component I n that it is characterized in that described solder is a kind of in In99995 and In9999 or two kinds.
5. a kind of connection brass according to claim 1 and 2 and stainless silver solder, the component S n that it is characterized in that described solder is one or more in Sn99.99A, Sn99.95A, Sn99.95AA, Sn99.90A and Sn99.90AA.
6. a kind of connection brass according to claim 1 and 2 and stainless silver solder, the component Ni that it is characterized in that described solder is one or more in Ni9999, Ni9996, Ni9990, Ni9950 and Ni9920.
7. a kind of connection brass according to claim 1 and 2 and stainless silver solder, the component Cu that it is characterized in that described solder is one or more in Cu-CATH-1, Cu-CATH-2 and Cu-CATH-3.
8. a kind of connection brass according to claim 1 and 2 and stainless silver solder, the component rare earth that it is characterized in that described solder is mixed rare earth of lanthanum and cerium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103080836A CN103418933A (en) | 2013-07-18 | 2013-07-18 | Silver solder for connecting brass and stainless steel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103080836A CN103418933A (en) | 2013-07-18 | 2013-07-18 | Silver solder for connecting brass and stainless steel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103418933A true CN103418933A (en) | 2013-12-04 |
Family
ID=49644578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103080836A Pending CN103418933A (en) | 2013-07-18 | 2013-07-18 | Silver solder for connecting brass and stainless steel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103418933A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817456A (en) * | 2014-03-03 | 2014-05-28 | 金华市双环钎焊材料有限公司 | Beryllium-containing low-silver cadmium-free silver solder |
| CN103909362A (en) * | 2014-03-17 | 2014-07-09 | 金华市三环焊接材料有限公司 | Low-silver brazing filler metal containing nickel and indium |
| CN104785951A (en) * | 2015-03-16 | 2015-07-22 | 杭州华光焊接新材料股份有限公司 | Low-silver brazing material for dissimilar metal connecting |
| CN105033500A (en) * | 2015-05-28 | 2015-11-11 | 浙江信和科技股份有限公司 | Silver-free brazing filler metal without overflow phenomenon during welding of copper and copper alloy and preparing method |
| CN106825987A (en) * | 2016-12-29 | 2017-06-13 | 安徽华众焊业有限公司 | A kind of silver-based brazing alloy and preparation method thereof |
| CN106862798A (en) * | 2016-12-29 | 2017-06-20 | 安徽华众焊业有限公司 | A kind of nothing is every silver-based solder and preparation method thereof |
| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
| CN109894771A (en) * | 2019-04-03 | 2019-06-18 | 南京理工大学 | A kind of low silver-colored cadmium-free silver brazing alloy |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001087889A (en) * | 1999-08-24 | 2001-04-03 | Degussa Huels Ag | Cadmium-free hard birazing filler alloy |
| CN1775459A (en) * | 2005-11-25 | 2006-05-24 | 常熟市华银焊料有限公司 | Cadmium-free silver solder comprising Ga, Im and Ce |
| CN1836823A (en) * | 2006-04-19 | 2006-09-27 | 南京航空航天大学 | Cadmium-free silver solder containing indium and cerium |
| CN1962160A (en) * | 2006-11-26 | 2007-05-16 | 常熟市华银焊料有限公司 | Cadmium-free silver solder containing gallium, indium and cerium |
| CN101716702A (en) * | 2009-11-26 | 2010-06-02 | 金华市三环焊接材料有限公司 | Multi-component alloy cadmium-free low-silver solder |
-
2013
- 2013-07-18 CN CN2013103080836A patent/CN103418933A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001087889A (en) * | 1999-08-24 | 2001-04-03 | Degussa Huels Ag | Cadmium-free hard birazing filler alloy |
| CN1775459A (en) * | 2005-11-25 | 2006-05-24 | 常熟市华银焊料有限公司 | Cadmium-free silver solder comprising Ga, Im and Ce |
| CN1836823A (en) * | 2006-04-19 | 2006-09-27 | 南京航空航天大学 | Cadmium-free silver solder containing indium and cerium |
| CN1962160A (en) * | 2006-11-26 | 2007-05-16 | 常熟市华银焊料有限公司 | Cadmium-free silver solder containing gallium, indium and cerium |
| CN101716702A (en) * | 2009-11-26 | 2010-06-02 | 金华市三环焊接材料有限公司 | Multi-component alloy cadmium-free low-silver solder |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103817456A (en) * | 2014-03-03 | 2014-05-28 | 金华市双环钎焊材料有限公司 | Beryllium-containing low-silver cadmium-free silver solder |
| CN103817456B (en) * | 2014-03-03 | 2015-12-02 | 金华市双环钎焊材料有限公司 | Containing the low silver-colored cadmium-free silver brazing alloy of beryllium |
| CN103909362A (en) * | 2014-03-17 | 2014-07-09 | 金华市三环焊接材料有限公司 | Low-silver brazing filler metal containing nickel and indium |
| CN104785951A (en) * | 2015-03-16 | 2015-07-22 | 杭州华光焊接新材料股份有限公司 | Low-silver brazing material for dissimilar metal connecting |
| CN105033500A (en) * | 2015-05-28 | 2015-11-11 | 浙江信和科技股份有限公司 | Silver-free brazing filler metal without overflow phenomenon during welding of copper and copper alloy and preparing method |
| CN105033500B (en) * | 2015-05-28 | 2018-01-05 | 浙江信和科技股份有限公司 | Silver-less solder and preparation method without excessive phenomenon when a kind of welding copper and copper alloy |
| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
| CN106825987A (en) * | 2016-12-29 | 2017-06-13 | 安徽华众焊业有限公司 | A kind of silver-based brazing alloy and preparation method thereof |
| CN106862798A (en) * | 2016-12-29 | 2017-06-20 | 安徽华众焊业有限公司 | A kind of nothing is every silver-based solder and preparation method thereof |
| CN109894771A (en) * | 2019-04-03 | 2019-06-18 | 南京理工大学 | A kind of low silver-colored cadmium-free silver brazing alloy |
| CN109894771B (en) * | 2019-04-03 | 2020-10-30 | 南京理工大学 | Low-silver cadmium-free silver solder |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103418933A (en) | Silver solder for connecting brass and stainless steel | |
| CN100408256C (en) | Cadmium-free silver solder containing gallium, indium and cerium | |
| CN102601542B (en) | A kind of brazing solder alloy | |
| CN101716702B (en) | Multi-component alloy cadmium-free low-silver solder | |
| CN100420538C (en) | Cadmium-free silver based solder containing gallium, indium and cerium | |
| CN100496864C (en) | Cadmium-free silver solder containing gallium, indium, and rare earth neodymium and cerium | |
| CN103008915B (en) | Low-silver copper-based solder free of spillover phenomenon during weld period | |
| CN102699563A (en) | Low-silver lead-free soft solder | |
| CN103028863B (en) | A kind of High-anti-oxidation lead-free solder | |
| CN112518169A (en) | Low-melting-point high-strength low-silver cadmium-free manganese-free multi-element silver solder and preparation method thereof | |
| CN101716705B (en) | Multi-alloy cadmium-free phosphor-free copper-based solder | |
| CN106736015A (en) | Without silver yellow copper brazing filler metal alloy | |
| CN104625471A (en) | Cadmium-free silver filler metal for vacuum electron brazing and preparation method thereof | |
| CN100408255C (en) | Cadmium-free silver solder containing indium and cerium | |
| CN106001991A (en) | Indium containing low-silver multi-element brazing filler metal and preparation method thereof | |
| CN100398251C (en) | Cadmium-free silver solder containing gallium and cerium | |
| CN102642097A (en) | Low-silver lead-free solder alloy | |
| CN106624443A (en) | Yellow brass brazing filler metal alloy | |
| CN100377832C (en) | Cd-free silver solder containing Ga and Ce | |
| CN101885119A (en) | Sn-Cu-Ni lead-free solder containing V, Nd and Ge | |
| CN102886624A (en) | Novel low-melting-point copper-manganese-zinc brazing filler | |
| CN105195922A (en) | High-adhesion wear-resisting copper base alloy brazing material | |
| CN105033500A (en) | Silver-free brazing filler metal without overflow phenomenon during welding of copper and copper alloy and preparing method | |
| CN102500948A (en) | Lead-free high-temperature soft solder and preparation method thereof | |
| CN104526180A (en) | Lead-free solder containing cerium, rubidium and zinc and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |