CN106624443A - Yellow brass brazing filler metal alloy - Google Patents
Yellow brass brazing filler metal alloy Download PDFInfo
- Publication number
- CN106624443A CN106624443A CN201611084368.6A CN201611084368A CN106624443A CN 106624443 A CN106624443 A CN 106624443A CN 201611084368 A CN201611084368 A CN 201611084368A CN 106624443 A CN106624443 A CN 106624443A
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- CN
- China
- Prior art keywords
- solder
- brazing
- filler metal
- brazing filler
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Abstract
The invention provides a yellow brass brazing filler metal alloy. The alloy is prepared from, by weight, 50-55% of copper, 0.2-0.4% of tin, 2-5% of bismuth, 0.1-1% of titanium and 0.02-0.06% of germanium, and the balance being zinc. The yellow brass brazing filler metal alloy does not contain silver and cadmium, but is capable of lowering the melting point of traditional yellow brass brazing filler metal, and has the advantages of high reactivity and low cost.
Description
Technical field
The invention belongs to technical field of welding materials, and in particular to a kind of brazing solder alloy.
Background technology
Material used in hardware ＆ tools industry mainly has hard alloy and diamond and irony body, these materials
Workpiece welding when more adopt brass class solder.Because the fusing point of brass is higher, therefore it is unfavorable for the welding of workpiece.Due to silver
Addition can effectively reduce the fusing point of strong solder and effectively improve the soldering mobility of strong solder, it is therefore existing
It is most containing silver in the solder of most of brass bases in technology.The addition of silver can reduce the fusing point of brazing solder, wherein
The most frequently used silver content is 2%, 5%, 10%, 15%, 20%, 30%, 35%, 40%, 45%, 50% in silver-colored brazing solder
Deng, but because silver is a kind of noble metal, its price is higher, therefore add silver to improve the cost of solder in brazing solder.
For a long time, traditional brazing solder be all based on Cu, first by add alloy element Zn come formed α-
Cu solid solution, the addition scope of its Zn is generally 38%～42%；Secondly, by adding trace alloying element Sn, Mn, Ni, Si
To improve the soldering processes performance and mechanical property of solder.Adding Sn in Cu-Zn alloys can reduce the fusing temperature of brazing filler metal alloy
Degree, improves wetability；Addition Mn, Fe and Ni can improve wetability of the solder on hard alloy；Add Si to prevent in soldering
During Zn evaporation.In addition, according to the regulation of American Welding Society (AWS), also having and adding trace P (such as in above brazing filler metal alloy：
RBCuZn-D) improving the wetability of solder.
Although existing brazing solder is applied in some industrial circles, in some important occasions brass is used
Solder carrys out soldering steel, and it also has many deficiencies.Research shows, in Cu-Zn alloys plus micro Si and P, in brazing process
In can form Fe-Si and Fe-P intermetallic compounds in steel/solder interface, or even form micro-crack in interface, and use silver-based
There is larger difference (interface is α-Cu solid solution) in joint during solder brazing.Due to Fe-Si and Fe-P intermetallic compounds
The generation of intrinsic fragility and micro-crack, it will reduce the reliability of soldered fitting military service process (such as：Air-tightness, electric conductivity and power
Learn performance).Secondly, existing brazing solder is higher due to fusing point, soldering class it is steely/copper sleeve when, copper annealing is serious, causes
Excessive grain is grown up, and causes intensity index to reduce.
The content of the invention
The present invention proposes a kind of brazing solder alloy, not argentiferous and cadmium in the brazing solder alloy, but can reduce passing
System brazing solder fusing point, the active high advantage with low cost.
The technical scheme is that what is be achieved in that：
A kind of brazing solder alloy, calculates according to percetage by weight, including following raw material is made：
Copper 50～55%, tin 0.2～0.4%, bismuth 2～5%, titanium 0.1～1% and germanium 0.02～0.06%, balance of zinc.
Preferably, calculate according to percetage by weight, including following raw material is made：
Copper 52～54%, tin 0.2～0.4%, bismuth 2～4%, titanium 0.3～0.8% and germanium 0.03～0.06%, it is balance of
Zinc.
Further, calculate according to percetage by weight, including following raw material is made：Copper 53%, tin 0.3%, bismuth 3%, titanium
0.5% with germanium 0.05%, balance of zinc.
Further, calculate according to percetage by weight, including following raw material is made：
Copper 50%, tin 0.4%, bismuth 5%, titanium 1% and germanium 0.06%, balance of zinc.
Further, calculate according to percetage by weight, including following raw material is made：
Copper 55%, tin 0.2%, bismuth 2%, titanium 0.1% and germanium 0.02%, balance of zinc.
Above-mentioned brazing filler metal alloy can pass through conventional brazing filler metal alloy method of smelting and obtain, and can be routinely solder processing method
It is processed into silk material, the band of different size.
Beneficial effects of the present invention：
1 and existing brazing solder compare, due to fusion temperature it is relatively low, can use silver-substituted solder be used for steel/copper sleeve pricker
Weldering.
2nd, the present invention does not adopt noble silver, but is substituted by bismuth metal, germanium and titanium, reduces cost.
Cu and Zn：To ensure that brazing filler metal alloy is organized as α-Cu solid solution；Solder has good processing characteristics, according to Cu-Zn
The ratio of binary phase diagraml, Cu and Zn should be limited to Cu: Zn in the range of 50-55%: 50%-45%.
Add Sn in Cu-Zn alloys, it is possible to decrease the fusion temperature of brazing filler metal alloy, increase wetability.But Sn is in Cu and Zn
In solid solubility it is very little, therefore add Sn can and Cu formed intermetallic compound, make solder become fragile, preferably 0.2～
0.4%.
Bi can reduce the fusion temperature of brazing filler metal alloy, improve wetability, while improving the mechanical property of solder.
Ti and Ge is active element (activity is less than Si), can prevent the evaporation of Zn, and Fe from will not form intermetallic compound,
Consider that the brazing solder brazing temperature of the present invention decreases simultaneously, thus preferably Ti0.1～1%, Ge 0.02～
0.06%.
Specific embodiment
Embodiment 1
A kind of brazing solder alloy, calculates according to percetage by weight, including following raw material is made：
Copper 53%, tin 0.3%, bismuth 3%, titanium 0.5% and germanium 0.05%, balance of zinc.
Preparation method：
1) each material of formula preparation amounts to 5000 grams by more than；
2) Cu is put into induction furnace and is heated to more than 1100 DEG C and melts it；
3) add Zn and be sufficiently stirred for, while reducing fusing metal temperature to 920 DEG C rapidly；
4) metal to be melted uniformly adds afterwards Bi and is sufficiently stirred for；
5) Sn, Ti and Ge are added and is stirred, then cast；
6) solder processing method extruding routinely, wire drawing are obtained the brazing filler metal alloy.
Embodiment 2
A kind of brazing solder alloy, calculates according to percetage by weight, including following raw material is made：
Copper 50%, tin 0.4%, bismuth 5%, titanium 1% and germanium 0.06%, balance of zinc.
The preparation method of the brazing solder alloy in the present embodiment is consistent with the method described in embodiment 1, and difference only exists
Ratio is weighed in the percetage by weight of brazing solder alloys components is according to the present embodiment.
Embodiment 3
A kind of brazing solder alloy, calculates according to percetage by weight, including following raw material is made：
Copper 55%, tin 0.2%, bismuth 2%, titanium 0.1% and germanium 0.02%, balance of zinc.
The preparation method of the brazing solder alloy in the present embodiment is consistent with the method described in embodiment 1, and difference only exists
Ratio is weighed in the percetage by weight of brazing solder alloys components is according to the present embodiment.
Embodiment 4
A kind of brazing solder alloy, calculates according to percetage by weight, including following raw material is made：
Copper 54%, tin 0.26%, bismuth 3.2%, titanium 0.7% and germanium 0.05%, balance of zinc.
The preparation method of the brazing solder alloy in the present embodiment is consistent with the method described in embodiment 1, and difference only exists
Ratio is weighed in the percetage by weight of brazing solder alloys components is according to the present embodiment.
The brazing solder alloy obtained in above-described embodiment is randomly selected, to its liquidus temperature, solidus temperature, interface
The performance of tissue and interface state is tested, and concrete test result is shown in table 1 below.
The embodiment 1-4 brazing solder alloy property testing result of table 1
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (5)
1. a kind of brazing solder alloy, it is characterised in that calculate according to percetage by weight, including following raw material is made：
Copper 50～55%, tin 0.2～0.4%, bismuth 2～5%, titanium 0.1～1% and germanium 0.02～0.06%, balance of zinc.
2. brazing solder alloy according to claim 1, it is characterised in that calculate according to percetage by weight, including it is following
Raw material is made：
Copper 52～54%, tin 0.2～0.4%, bismuth 2～4%, titanium 0.3～0.8% and germanium 0.03～0.06%, balance of zinc.
3. brazing solder alloy according to claim 2, it is characterised in that calculate according to percetage by weight, including it is following
Raw material is made：Copper 53%, tin 0.3%, bismuth 3%, titanium 0.5% and germanium 0.05%, balance of zinc.
4. brazing solder alloy according to claim 1, it is characterised in that calculate according to percetage by weight, including it is following
Raw material is made：
Copper 50%, tin 0.4%, bismuth 5%, titanium 1% and germanium 0.06%, balance of zinc.
5. brazing solder alloy according to claim 1, it is characterised in that calculate according to percetage by weight, including it is following
Raw material is made：
Copper 55%, tin 0.2%, bismuth 2%, titanium 0.1% and germanium 0.02%, balance of zinc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611084368.6A CN106624443A (en) | 2016-11-30 | 2016-11-30 | Yellow brass brazing filler metal alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611084368.6A CN106624443A (en) | 2016-11-30 | 2016-11-30 | Yellow brass brazing filler metal alloy |
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| Publication Number | Publication Date |
|---|---|
| CN106624443A true CN106624443A (en) | 2017-05-10 |
Family
ID=58813734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611084368.6A Pending CN106624443A (en) | 2016-11-30 | 2016-11-30 | Yellow brass brazing filler metal alloy |
Country Status (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107199416A (en) * | 2017-07-29 | 2017-09-26 | 安徽华众焊业有限公司 | A kind of brass silver-less solder alloy |
| CN111299901A (en) * | 2019-12-12 | 2020-06-19 | 郑州机械研究所有限公司 | Brazing alloy, brazing filler metal, preparation method and application of brazing filler metal and prepared brazing product |
| CN112475667A (en) * | 2020-11-13 | 2021-03-12 | 娄底市安地亚斯电子陶瓷有限公司 | Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof |
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| JPS52126659A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Brazing alloy |
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| JPS52126659A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Brazing alloy |
| CN101381826A (en) * | 2008-09-26 | 2009-03-11 | 南昌大学 | Sn-Cu base leadless solder alloy and preparation method |
| CN101913036A (en) * | 2010-09-08 | 2010-12-15 | 郑州机械研究所 | CuZnTi solder for soldering diamond tool |
| CN102554491A (en) * | 2011-12-14 | 2012-07-11 | 河南科技大学 | Zn (zinc) based high-temperature lead-free soft solder and preparation method for same |
| CN102601542A (en) * | 2012-03-28 | 2012-07-25 | 华南理工大学 | Brass brazing alloy |
| CN105324209A (en) * | 2013-06-20 | 2016-02-10 | 三菱电机株式会社 | Zn-based lead-free solder and semiconductor power module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107199416A (en) * | 2017-07-29 | 2017-09-26 | 安徽华众焊业有限公司 | A kind of brass silver-less solder alloy |
| CN111299901A (en) * | 2019-12-12 | 2020-06-19 | 郑州机械研究所有限公司 | Brazing alloy, brazing filler metal, preparation method and application of brazing filler metal and prepared brazing product |
| CN112475667A (en) * | 2020-11-13 | 2021-03-12 | 娄底市安地亚斯电子陶瓷有限公司 | Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof |
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Application publication date: 20170510 |