CN107052614A - Without silver yellow spelter solder - Google Patents
Without silver yellow spelter solder Download PDFInfo
- Publication number
- CN107052614A CN107052614A CN201611083183.3A CN201611083183A CN107052614A CN 107052614 A CN107052614 A CN 107052614A CN 201611083183 A CN201611083183 A CN 201611083183A CN 107052614 A CN107052614 A CN 107052614A
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- CN
- China
- Prior art keywords
- solder
- silver
- silver yellow
- percetage
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
Abstract
The present invention proposes one kind without silver yellow spelter solder, is calculated according to percetage by weight, including following raw material is made：Copper 52~58%, tin 0.8~1.2%, bismuth 0.6~1.8%, silicon 0.16~0.36%, indium 0.02~0.2% and germanium 0.02~0.06%, surplus is zinc.This is not only able to reduce traditional brazing solder fusing point without silver yellow spelter solder, and solves the problems, such as due to the micro-crack that addition Si is brought.
Description
Technical field
The invention belongs to technical field of welding materials, and in particular to one kind is without silver yellow spelter solder.
Background technology
The material used in hardware ＆ tools industry mainly has hard alloy and diamond and irony body, these materials
Workpiece welding when more use brass class solder.Because the fusing point of brass is higher, therefore it is unfavorable for the welding of workpiece.Due to silver
Addition can effectively reduce no silver yellow spelter solder fusing point and effectively improve strong solder soldering mobility, therefore
In the prior art, it is most containing silver in the solder of most of brass bases.The addition of silver can reduce the fusing point of brazing solder,
In wherein silver-colored brazing solder the most frequently used silver content be 2%, 5%, 10%, 15%, 20%, 30%, 35%, 40%, 45%,
50% etc., but because silver is a kind of noble metal, its price is higher, thus add in brazing solder silver improve solder into
This.
For a long time, traditional brazing solder be all using Cu as matrix, formed first by adding alloy element Zn α-
Cu solid solution, its Zn addition scope is generally 38%~42%；Secondly, by adding trace alloying element Sn, Mn, Ni, Si
To improve the soldering processes performance and mechanical property of solder.Sn is added in Cu-Zn alloys can reduce the fusing temperature of brazing filler metal alloy
Degree, improves wetability；Addition Mn, Fe and Ni can improve wetability of the solder on hard alloy；Si is added to prevent in soldering
During Zn evaporation.In addition, according to the regulation of American Welding Society (AWS), also having and adding trace P (such as in above brazing filler metal alloy：
RBCuZn-D) wetability of solder is improved.
Although existing brazing solder is applied in some industrial circles, brass is used in some important occasions
Solder carrys out soldering steel, and it also has many deficiencies.Research shows, micro Si and P is added in Cu-Zn alloys, in brazing process
In Fe-Si and Fe-P intermetallic compounds can be formed in steel/solder interface, or even form micro-crack in interface, and use silver-based
There is larger difference (interface is α-Cu solid solution) in joint during solder brazing.Due to Fe-Si and Fe-P intermetallic compounds
The generation of intrinsic fragility and micro-crack, it will the reliability of reduction soldered fitting military service process is (such as：Air-tightness, electric conductivity and power
Learn performance).Secondly, existing brazing solder is higher due to fusing point, soldering class it is steely/copper sleeve when, copper annealing is serious, causes
Excessive grain is grown up, and causes intensity index to reduce.
The content of the invention
The present invention proposes a kind of without silver yellow spelter solder, and this is not only able to reduce traditional brazing solder without silver yellow spelter solder melts
Point, and solve the problems, such as due to the micro-crack that addition Si is brought.
The technical proposal of the invention is realized in this way：
One kind is calculated without silver yellow spelter solder according to percetage by weight, including following raw material is made：
Copper 52~58%, tin 0.8~1.2%, bismuth 0.6~1.8%, silicon 0.16~0.36%, indium 0.02~0.2%, with
Germanium 0.02~0.06%, surplus is zinc.
Preferably, calculated according to percetage by weight, including following raw material is made：
Copper 53~56%, tin 0.7~1%, bismuth 0.4~1%, silicon 0.06~0.10%, manganese 0.04~0.08% and germanium
0.03~0.05%, surplus is zinc.
Further, calculated according to percetage by weight, including following raw material is made：
Copper 53~57%, tin 0.9~1.1%, bismuth 1.0~1.6%, silicon 0.2~0.32%, indium 0.08~0.16%, with
Germanium 0.02~0.05%, surplus is zinc.
Further, calculated according to percetage by weight, including following raw material is made：
Copper 55%, tin 1%, bismuth 1.2%, silicon 0.28%, indium 0.12% and germanium 0.04%, surplus is zinc.
Further, calculated according to percetage by weight, including following raw material is made：
Copper 52%, tin 1.2%, bismuth 1.6%, silicon 0.34%, indium 0.2% and germanium 0.06%, surplus is zinc.
Further, calculated according to percetage by weight, including following raw material is made：
Copper 58%, tin 0.8%, bismuth 0.6%, silicon 0.16%, indium 0.02% and germanium 0.02%, surplus is zinc.
Above-mentioned brazing filler metal alloy can be obtained by conventional brazing filler metal alloy method of smelting, and can be routinely solder processing method
It is processed into silk material, the band of different size.
Beneficial effects of the present invention：
1 and existing brazing solder compare, because fusion temperature is relatively low, can use silver-substituted solder be used for steel/copper sleeve pricker
Weldering, can use in gas brazing, stove and weld, induction welding.
2nd, in addition Si in the present invention, element silicon is a kind of nonmetallic substance for being easier to form alloy, can be effective
Raising solder soldering mobility.But, Fe-Si intermetallic compounds can be formed at steel/solder interface in brazing process,
Micro-crack even is formed in interface, and there is larger difference with joint during silver-base solder soldering.By adding indium and germanium, remove
Fusing point can be reduced, is also found surprisingly that it being capable of crystal grain thinning so that the interface in brazing process is without any crackle.
Cu and Zn：To ensure that brazing filler metal alloy is organized as α-Cu solid solution；Solder has good processing characteristics, according to Cu-Zn
Binary phase diagraml, Cu and Zn ratio should be limited to Cu: Zn in the range of 52~58%: 48%-42%.
Sn is added in Cu-Zn alloys, it is possible to decrease the fusion temperature of brazing filler metal alloy, increase wetability.But Sn is in Cu and Zn
In solid solubility it is very small, therefore add Sn can and Cu formation intermetallic compound, solder is become fragile, preferably 0.8~
1.2%.
Bi can reduce the fusion temperature of brazing filler metal alloy, improve wetability, while improving the mechanical property of solder.
Ge is active element (activity is less than Si), can prevent Zn evaporation, and Fe from will not form intermetallic compound, simultaneously
Consider that the brazing solder brazing temperature of the present invention decreases, therefore preferably Ge0.02~0.06%.
Embodiment
Embodiment 1
One kind is calculated without silver yellow spelter solder according to percetage by weight, including following raw material is made：
Copper 55%, tin 1%, bismuth 1.2%, silicon 0.28%, indium 0.12% and germanium 0.04%, surplus is zinc.
Preparation method：
1) each material of formula preparation amounts to 5000 grams more than；
2) Si is put into induction furnace and is heated to more than 1500 DEG C and melts it；
3) then be cooled to 1100 DEG C addition Cu；
4) add Zn and be sufficiently stirred for, while reduction fusing metal temperature is to 960 DEG C rapidly；
5) metal to be melted uniformly adds In and Ge and is sufficiently stirred for afterwards；
6) add Sn and stir, then cast；
7) brazing filler metal alloy is made in the extruding of solder processing method, wire drawing routinely.
Embodiment 2
One kind is calculated without silver yellow spelter solder according to percetage by weight, including following raw material is made：
Copper 58%, tin 0.8%, bismuth 0.6%, silicon 0.16%, indium 0.02% and germanium 0.02%, surplus is zinc.
The method described in the preparation method be the same as Example 1 without silver yellow spelter solder in the present embodiment is consistent, and difference only exists
Ratio is weighed in the percetage by weight without each composition of silver yellow spelter solder is according to the present embodiment.
Embodiment 3
One kind is calculated without silver yellow spelter solder according to percetage by weight, including following raw material is made：
Copper 52%, tin 1%, bismuth 1.2%, silicon 0.15%, manganese 0.08% and germanium 0.06%, surplus is zinc.
The method described in the preparation method be the same as Example 1 without silver yellow spelter solder in the present embodiment is consistent, and difference only exists
Ratio is weighed in the percetage by weight without each composition of silver yellow spelter solder is according to the present embodiment.
Embodiment 4
One kind is calculated without silver yellow spelter solder according to percetage by weight, including following raw material is made：
Copper 54%, tin 1.0%, bismuth 1.8%, silicon 0.36%, indium 0.12% and germanium 0.06%, surplus is zinc.
The method described in the preparation method be the same as Example 1 without silver yellow spelter solder in the present embodiment is consistent, and difference only exists
Ratio is weighed in the percetage by weight without each composition of silver yellow spelter solder is according to the present embodiment.
Randomly select obtained in above-described embodiment without silver yellow spelter solder, to its liquidus temperature, solidus temperature, interface
The performance of tissue and interface state is tested, and specific test result is shown in table 1 below.
The embodiment 1-4 of table 1 is without silver yellow spelter solder performance test results
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God is with principle, and any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (5)
1. one kind is without silver yellow spelter solder, it is characterised in that calculated according to percetage by weight, including following raw material is made：
Copper 52~58%, tin 0.8~1.2%, bismuth 0.6~1.8%, silicon 0.16~0.36%, indium 0.02~0.2% and germanium
0.02~0.06%, surplus is zinc.
2. it is according to claim 1 without silver yellow spelter solder, it is characterised in that to be calculated according to percetage by weight including following
Raw material is made：
Copper 53~57%, tin 0.9~1.1%, bismuth 1.0~1.6%, silicon 0.2~0.32%, indium 0.08~0.16% and germanium
0.02~0.05%, surplus is zinc.
3. it is according to claim 2 without silver yellow spelter solder, it is characterised in that to be calculated according to percetage by weight including following
Raw material is made：
Copper 55%, tin 1%, bismuth 1.2%, silicon 0.28%, indium 0.12% and germanium 0.04%, surplus is zinc.
4. it is according to claim 1 without silver yellow spelter solder, it is characterised in that to be calculated according to percetage by weight including following
Raw material is made：
Copper 52%, tin 1.2%, bismuth 1.6%, silicon 0.34%, indium 0.2% and germanium 0.06%, surplus is zinc.
5. it is according to claim 1 without silver yellow spelter solder, it is characterised in that to be calculated according to percetage by weight including following
Raw material is made：
Copper 58%, tin 0.8%, bismuth 0.6%, silicon 0.16%, indium 0.02% and germanium 0.02%, surplus is zinc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611083183.3A CN107052614A (en) | 2016-11-30 | 2016-11-30 | Without silver yellow spelter solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611083183.3A CN107052614A (en) | 2016-11-30 | 2016-11-30 | Without silver yellow spelter solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107052614A true CN107052614A (en) | 2017-08-18 |
Family
ID=59618491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611083183.3A Pending CN107052614A (en) | 2016-11-30 | 2016-11-30 | Without silver yellow spelter solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107052614A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108714749A (en) * | 2018-05-30 | 2018-10-30 | 江苏恒加机械工程有限公司 | A kind of preparation method of high brittle alloy weld tabs |
| CN114273816A (en) * | 2022-01-13 | 2022-04-05 | 郑州机械研究所有限公司 | Brazing filler metal and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126659A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Brazing alloy |
| CN101716702A (en) * | 2009-11-26 | 2010-06-02 | 金华市三环焊接材料有限公司 | Multi-component alloy cadmium-free low-silver solder |
| CN102601542A (en) * | 2012-03-28 | 2012-07-25 | 华南理工大学 | Brass brazing alloy |
| CN102770232A (en) * | 2009-12-08 | 2012-11-07 | 荒川化学工业株式会社 | Flux for solder paste, and solder paste |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| CN105324209A (en) * | 2013-06-20 | 2016-02-10 | 三菱电机株式会社 | Zn-based lead-free solder and semiconductor power module |
-
2016
- 2016-11-30 CN CN201611083183.3A patent/CN107052614A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126659A (en) * | 1976-04-19 | 1977-10-24 | Ishifuku Metal Ind | Brazing alloy |
| CN101716702A (en) * | 2009-11-26 | 2010-06-02 | 金华市三环焊接材料有限公司 | Multi-component alloy cadmium-free low-silver solder |
| CN102770232A (en) * | 2009-12-08 | 2012-11-07 | 荒川化学工业株式会社 | Flux for solder paste, and solder paste |
| CN102601542A (en) * | 2012-03-28 | 2012-07-25 | 华南理工大学 | Brass brazing alloy |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| CN105324209A (en) * | 2013-06-20 | 2016-02-10 | 三菱电机株式会社 | Zn-based lead-free solder and semiconductor power module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108714749A (en) * | 2018-05-30 | 2018-10-30 | 江苏恒加机械工程有限公司 | A kind of preparation method of high brittle alloy weld tabs |
| CN114273816A (en) * | 2022-01-13 | 2022-04-05 | 郑州机械研究所有限公司 | Brazing filler metal and preparation method thereof |
| CN114273816B (en) * | 2022-01-13 | 2023-12-01 | 郑州机械研究所有限公司 | Solder and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170818 |
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| RJ01 | Rejection of invention patent application after publication |