CN106514050A - Brass solder and preparation method thereof - Google Patents
Brass solder and preparation method thereof Download PDFInfo
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- CN106514050A CN106514050A CN201611249344.1A CN201611249344A CN106514050A CN 106514050 A CN106514050 A CN 106514050A CN 201611249344 A CN201611249344 A CN 201611249344A CN 106514050 A CN106514050 A CN 106514050A
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- Prior art keywords
- solder
- brazing
- brazing solder
- intermediate alloy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention provides a brass solder and a preparation method thereof and belongs to the technical field of solders. The brass solder is prepared from the following raw materials by mass percent: 56-59% of Cu, 0.7-1.0% of Sn, 0.05-0.15% of Si, 0.03-0.09% of Mn, 0.35-1.20% of Fe, 0.1-0.6% of Ni, 1.0-3.0% of Ag, 0.05-0.3% of Ge, 0.02-0.08% of P and the balance of Zn and inevitable impurities. Compared with the existing brass solder, the brass solder provided by the invention can replace a silver solder to be used for brazing of steel/copper connectors due to low melting temperature and is low in cost due to low content of Ag.
Description
Technical field
The present invention relates to a kind of solder technology field, more particularly to a kind of brazing solder and preparation method thereof.
Background technology
Currently in each industrial circle, the brazing filler metal alloy that the solder brazing of steel is adopted mainly has silver solder (Ag-Cu-Zn systems), Huang
Copper solder (Cu-Zn systems) etc..Silver solder is due to relatively low fusion temperature, excellent wettability and good comprehensive mechanics
Performance is extensively applied.But as the excessive use of non-renewable resources, the price of noble silver rise steadily, cause production
The manufacturing cost of producer is continuously increased.To make the reasonable disposition of non-renewable resources, manufacturing cost is reduced, people begin to focus on again
In the feasibility of each industrial circle application brazing solder.
As the fusing point of brass is higher, therefore it is unfavorable for the welding of workpiece.As the addition of silver can effectively reduce Huang
The fusing point of spelter solder and effectively the soldering mobility of raising strong solder, therefore in prior art, most of brass bases
Solder in it is most containing silver.The addition of silver can reduce the fusing point of brazing solder, wherein the most frequently used in silver-colored brazing solder
Silver content is 2%, 5%, 10%, 15%, 20%, 30%, 35%, 40%, 45%, 50% etc., but as silver is a kind of your gold
Category, its price are higher, therefore in brazing solder, add silver to improve the cost of solder.
Another kind of mode being modified for the strong solder that tradition is used is to add cadmium metal, and cadmium metal can be effectively reduced
The fusing point of strong solder, and the soldering mobility of very considerable raising strong solder.Yet with dirt of the cadmium metal to environment
Dye is very big, and the healthy impact on operator is very big, and present countries in the world have all prohibitted the use of.
The content of the invention
The present invention provides a kind of brazing solder and preparation method thereof, the brazing solder contain micro silver, without cadmium, can drop
Low traditional brazing solder fusing point improves activity, and cost is relatively low.
The technical scheme is that what is be achieved in that：
A kind of brazing solder, is made up of following raw material by mass percentage：Cu56～59%, Sn0.7～1.0%,
Si0.05～0.15%, Mn0.03～0.09%, Fe0.35～1.20%, Ni0.1～0.6%, Ag1.0～3.0%, Ge0.05
～0.3%, P0.02～0.08%, balance of Zn and inevitable impurity.
Wherein it is preferred to, a kind of brazing solder is made up of following raw material by mass percentage：Cu57～58%,
Sn0.8～0.9%, Si0.08～0.12%, Mn0.04～0.06%, Fe0.5～0.8%, Ni0.2～0.5%, Ag1.5～
2.5%th, Ge0.1～0.2%, P0.04～0.06%, balance of Zn and inevitable impurity.
Wherein it is preferred to, a kind of brazing solder is made up of following raw material by mass percentage：Cu57%, Sn0.8%,
Si1.0%, Mn0.05%, Fe0.6%, Ni0.4%, Ag2.0%, Ge0.15%, P0.05%, balance of Zn and inevitable
Impurity.
The present invention simultaneously provides a kind of preparation method of brazing solder, comprises the following steps：
(1) P is carried out into pre-selection melting with the Cu of half quality, makes intermediate alloy Cu-P；
(2) Ni is carried out into pre-selection melting with remaining Cu again, makes intermediate alloy Cu-Ni；
(3) obtained intermediate alloy Cu-P and Cu-Ni is put in induction furnace and is heated to more than 1100 DEG C and melts which；
(4) add Zn and be sufficiently stirred for, while reducing rapidly fusing metal temperature to 900 DEG C；
(5) metal to be melted uniformly adds Ag afterwards and is sufficiently stirred for；
(6) Sn, Si, Mn, Fe, Ge are added and then is cast；
(7) solder processing method extruding routinely, wire drawing are obtained the brazing solder.
The principle that the effect of each component and content are limited in the present invention is following (content is by percentage to the quality)：
Cu and Zn：To ensure that brazing filler metal alloy is organized as α-Cu solid solution；Solder has good processing characteristics, according to Cu-Zn
The ratio of binary phase diagraml, Cu and Zn should be limited to Cu：Zn is in 56-59%：In the range of 35%-42%.
Sn：Add Sn in Cu-Zn alloys, it is possible to decrease the fusion temperature of brazing filler metal alloy, increase wetability.But Sn in Cu and
Solid solubility in Zn is very little, therefore the Sn for adding can form intermetallic compound with Cu, make solder become fragile, preferably 0.7-
1.0%.
Ag：The fusion temperature of brazing filler metal alloy can be reduced；Improve wetability, while improving the mechanical property of solder.From material
Cost and the consideration of soldered fitting combination property, preferably Ag：1.0-3.0%.
Ge：There is larger solid solubility in Cu, but Ge is active element (activity is less than Si), can prevent the evaporation of Zn, and
Fe will not form intermetallic compound, while considering that the brazing solder brazing temperature of the present invention decreases, therefore be preferably
0.05-0.30%.
In addition, improving the soldering processes performance and mechanical property of solder by adding trace alloying element Mn, Ni, Si.
Addition Mn, Fe and Ni can improve wetability of the solder on hard alloy；Add Si to prevent the evaporation of the Zn in brazing process.
Trace P is added in above brazing filler metal alloy to improve the wetability of solder.
Ni, P are first carried out advance melting with Cu by the present invention respectively, are made intermediate alloy Cu-Ni, Cu-P and are subsequently melted again
Refining.Prepared by Cu-Ni, Cu-P alloy, reduce smelting temperature, it is to avoid the too high excessive damage for causing other raw materials of smelting temperature
Consumption.In addition, can guarantee that the phosphorous percentage by weight of intermediate alloy accurately, it is that the preparation provides convenient of follow-up final lead-free solder is fast
Prompt accurately metrological operation.
The brazing solder of the present invention is mainly used in brazed copper and copper alloy, steel, cast iron etc..Gas brazing can be adopted, in stove
Weldering or induction welding.
Beneficial effects of the present invention：
(1) in soldering, interface will not form intermetallic compound, and interface is obtained and silver solder identical α-Cu solid solutions
Body interface is organized, so as to improve the reliability of soldered fitting.
(2) compare with existing brazing solder, as fusion temperature is relatively low, can use silver-substituted solder is used for steel/copper sleeve
Soldering.
(3) brazing solder of the present invention is relatively low due to measuring containing Ag, therefore cost is relatively low.
Specific embodiment
Below the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment
Only a part of embodiment of the invention, rather than the embodiment of whole.Based on the embodiment in the present invention, the common skill in this area
All other embodiment that art personnel are obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
Embodiment 1
The present embodiment provides a kind of brazing solder, is made up of following raw material by mass percentage：By mass percentage
It is made up of following raw material：Cu57%, Sn0.8%, Si1.0%, Mn0.05%, Fe0.6%, Ni0.4%, Ag2.0%,
Ge0.15%, P0.05%, balance of Zn and inevitable impurity.
The preparation method of the present embodiment brazing solder, comprises the following steps：
(1) P is carried out into pre-selection melting with the Cu of half quality, makes intermediate alloy Cu-P；
(2) Ni is carried out into pre-selection melting with remaining Cu again, makes intermediate alloy Cu-Ni；
(3) obtained intermediate alloy Cu-P and Cu-Ni is put in induction furnace and is heated to more than 1100 DEG C and melts which；
(4) add Zn and be sufficiently stirred for, while reducing rapidly fusing metal temperature to 900 DEG C；
(5) metal to be melted uniformly adds Ag afterwards and is sufficiently stirred for；
(6) Sn, Si, Mn, Fe, Ge are added and then is cast；
(7) solder processing method extruding routinely, wire drawing are obtained the brazing solder.
The brazing solder fusion temperature of the present embodiment：865 DEG C of solidus, 890 DEG C of liquidus curve.Solder tensile strength
372Mpa。
Embodiment 2
The present embodiment provides a kind of brazing solder, is made up of following raw material by mass percentage：Cu56%, Sn1.0%,
Si0.05%, Mn0.09%, Fe0.35%, Ni0.6%, Ag1.0%, Ge0.3%, P0.02%, balance of Zn and inevitable
Impurity.
The preparation method of the present embodiment brazing solder, comprises the following steps：
(1) P is carried out into pre-selection melting with the Cu of half quality, makes intermediate alloy Cu-P；
(2) Ni is carried out into pre-selection melting with remaining Cu again, makes intermediate alloy Cu-Ni；
(3) obtained intermediate alloy Cu-P and Cu-Ni is put in induction furnace and is heated to more than 1100 DEG C and melts which；
(4) add Zn and be sufficiently stirred for, while reducing rapidly fusing metal temperature to 900 DEG C；
(5) metal to be melted uniformly adds Ag afterwards and is sufficiently stirred for；
(6) Sn, Si, Mn, Fe, Ge are added and then is cast；
(7) solder processing method extruding routinely, wire drawing are obtained the brazing solder.
The brazing solder fusion temperature of the present embodiment：870 DEG C of solidus, 892 DEG C of liquidus curve.Solder tensile strength
380Mpa。
Embodiment 3
The present embodiment provides a kind of brazing solder, is made up of following raw material by mass percentage：Cu59%, Sn0.7%,
Si0.15%, Mn0.03%, Fe1.20%, Ni0.1%, Ag3.0%, Ge0.05%, P0.08%, balance of Zn and can not keep away
The impurity exempted from.
The preparation method of the present embodiment brazing solder, comprises the following steps：
(1) P is carried out into pre-selection melting with the Cu of half quality, makes intermediate alloy Cu-P；
(2) Ni is carried out into pre-selection melting with remaining Cu again, makes intermediate alloy Cu-Ni；
(3) obtained intermediate alloy Cu-P and Cu-Ni is put in induction furnace and is heated to more than 1100 DEG C and melts which；
(4) add Zn and be sufficiently stirred for, while reducing rapidly fusing metal temperature to 900 DEG C；
(5) metal to be melted uniformly adds Ag afterwards and is sufficiently stirred for；
(6) Sn, Si, Mn, Fe, Ge are added and then is cast；
(7) solder processing method extruding routinely, wire drawing are obtained the brazing solder.
The brazing solder fusion temperature of the present embodiment：859 DEG C of solidus, 884 DEG C of liquidus curve.Solder tensile strength
368Mpa。
Embodiment 4
The present embodiment provides a kind of brazing solder, is made up of following raw material by mass percentage：
It is made up of following raw material by mass percentage：Cu57%, Sn0.9%, Si0.08%, Mn0.04～0.06%,
Fe0.8%, Ni0.2%, Ag2.5%, Ge0.1%, P0.06%, balance of Zn and inevitable impurity.
The preparation method of the present embodiment brazing solder, comprises the following steps：
(1) P is carried out into pre-selection melting with the Cu of half quality, makes intermediate alloy Cu-P；
(2) Ni is carried out into pre-selection melting with remaining Cu again, makes intermediate alloy Cu-Ni；
(3) obtained intermediate alloy Cu-P and Cu-Ni is put in induction furnace and is heated to more than 1100 DEG C and melts which；
(4) add Zn and be sufficiently stirred for, while reducing rapidly fusing metal temperature to 900 DEG C；
(5) metal to be melted uniformly adds Ag afterwards and is sufficiently stirred for；
(6) Sn, Si, Mn, Fe, Ge are added and then is cast；
(7) solder processing method extruding routinely, wire drawing are obtained the brazing solder.
The brazing solder fusion temperature of the present embodiment：866 DEG C of solidus, 889 DEG C of liquidus curve.Solder tensile strength
370Mpa。
Embodiment 5
The present embodiment provides a kind of brazing solder, is made up of following raw material by mass percentage：Cu58%, Sn0.8%,
Si0.12%, Mn0.04%, Fe0.8%, Ni0.2%, Ag2.5%, Ge0.1%, P0.06%, balance of Zn and inevitable
Impurity.
The preparation method of the present embodiment brazing solder, comprises the following steps：
(1) P is carried out into pre-selection melting with the Cu of half quality, makes intermediate alloy Cu-P；
(2) Ni is carried out into pre-selection melting with remaining Cu again, makes intermediate alloy Cu-Ni；
(3) obtained intermediate alloy Cu-P and Cu-Ni is put in induction furnace and is heated to more than 1100 DEG C and melts which；
(4) add Zn and be sufficiently stirred for, while reducing rapidly fusing metal temperature to 900 DEG C；
(5) metal to be melted uniformly adds Ag afterwards and is sufficiently stirred for；
(6) Sn, Si, Mn, Fe, Ge are added and then is cast；
(7) solder processing method extruding routinely, wire drawing are obtained the brazing solder.
The brazing solder fusion temperature of the present embodiment：861 DEG C of solidus, 892 DEG C of liquidus curve.Solder tensile strength
367Mpa。
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (4)
1. a kind of brazing solder, it is characterised in that be made up of following raw material by mass percentage：Cu56～59%, Sn0.7～
1.0%th, Si0.05～0.15%, Mn0.03～0.09%, Fe0.35～1.20%, Ni0.1～0.6%, Ag1.0～3.0%,
Ge0.05～0.3%, P0.02～0.08%, balance of Zn and inevitable impurity.
2. a kind of brazing solder according to claim 1, it is characterised in that by mass percentage by following raw material system
Into：Cu57～58%, Sn0.8～0.9%, Si0.08～0.12%, Mn0.04～0.06%, Fe0.5～0.8%, Ni0.2～
0.5%th, Ag1.5～2.5%, Ge0.1～0.2%, P0.04～0.06%, balance of Zn and inevitable impurity.
3. a kind of brazing solder according to claim 1, it is characterised in that by mass percentage by following raw material system
Into：Cu57%, Sn0.8%, Si1.0%, Mn0.05%, Fe0.6%, Ni0.4%, Ag2.0%, Ge0.15%, P0.05%,
Balance of Zn and inevitable impurity.
4. the preparation method of the brazing solder described in a kind of any one of claims 1 to 3, it is characterised in that comprise the following steps：
(1) P is carried out into pre-selection melting with the Cu of half quality, makes intermediate alloy Cu-P；
(2) Ni is carried out into pre-selection melting with remaining Cu again, makes intermediate alloy Cu-Ni；
(3) obtained intermediate alloy Cu-P and Cu-Ni is put in induction furnace and is heated to more than 1100 DEG C and melts which；
(4) add Zn and be sufficiently stirred for, while reducing rapidly fusing metal temperature to 900 DEG C；
(5) metal to be melted uniformly adds Ag afterwards and is sufficiently stirred for；
(6) Sn, Si, Mn, Fe, Ge are added and then is cast；
(7) solder processing method extruding routinely, wire drawing are obtained the brazing solder.
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| CN201611249344.1A CN106514050A (en) | 2016-12-29 | 2016-12-29 | Brass solder and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611249344.1A CN106514050A (en) | 2016-12-29 | 2016-12-29 | Brass solder and preparation method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109706342A (en) * | 2018-12-29 | 2019-05-03 | 郑州机械研究所有限公司 | A kind of copper zinc silicon substrate powdery brazing filler metal material and preparation method thereof containing alterant |
| CN109865961A (en) * | 2019-03-05 | 2019-06-11 | 苏州昆腾威新材料科技有限公司 | A kind of copper-based spherical powder material and the preparation method and application thereof |
| CN113828961A (en) * | 2021-10-20 | 2021-12-24 | 宁波兴业盛泰集团有限公司 | Lead-free copper alloy solder and preparation method thereof |
| CN114161025A (en) * | 2021-11-15 | 2022-03-11 | 华南理工大学 | Brass brazing material prepared from high-nickel copper alloy waste and method thereof |
| CN114571134A (en) * | 2022-03-08 | 2022-06-03 | 江苏省徐州技师学院 | Brazing material for brazing hard alloy cutter and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109706342A (en) * | 2018-12-29 | 2019-05-03 | 郑州机械研究所有限公司 | A kind of copper zinc silicon substrate powdery brazing filler metal material and preparation method thereof containing alterant |
| CN109865961A (en) * | 2019-03-05 | 2019-06-11 | 苏州昆腾威新材料科技有限公司 | A kind of copper-based spherical powder material and the preparation method and application thereof |
| CN109865961B (en) * | 2019-03-05 | 2021-07-20 | 苏州昆腾威新材料科技有限公司 | Copper-based spherical powder material and preparation method and application thereof |
| CN113828961A (en) * | 2021-10-20 | 2021-12-24 | 宁波兴业盛泰集团有限公司 | Lead-free copper alloy solder and preparation method thereof |
| CN113828961B (en) * | 2021-10-20 | 2022-09-23 | 宁波兴业盛泰集团有限公司 | Lead-free copper alloy solder and preparation method thereof |
| CN114161025A (en) * | 2021-11-15 | 2022-03-11 | 华南理工大学 | Brass brazing material prepared from high-nickel copper alloy waste and method thereof |
| CN114571134A (en) * | 2022-03-08 | 2022-06-03 | 江苏省徐州技师学院 | Brazing material for brazing hard alloy cutter and preparation method thereof |
| CN114571134B (en) * | 2022-03-08 | 2023-04-25 | 江苏省徐州技师学院 | Brazing material for brazing hard alloy cutter and preparation method thereof |
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Application publication date: 20170322 |