CN102601542B

CN102601542B - A kind of brazing solder alloy

Info

Publication number: CN102601542B
Application number: CN201210087424.7A
Authority: CN
Inventors: 卫国强
Original assignee: South China University of Technology SCUT
Current assignee: South China University of Technology SCUT
Priority date: 2012-03-28
Filing date: 2012-03-28
Publication date: 2015-08-26
Anticipated expiration: 2032-03-28
Also published as: CN102601542A

Abstract

The invention discloses a kind of brazing solder alloy, be made up of Cu, Zn, Sn, Ge and Ag and/or In; Described each component is by mass percentage: Cu:58-60%, Sn:0.5-3.0%, Ag:1.0-6.0% and/or In:1.0-5.0%, Ge:0.05-0.3%, surplus is Zn.Brazing solder alloy of the present invention and existing brazing solder compare, and fusion temperature is lower, and desirable silver-substituted solder is used for the soldering of steel/copper sleeve, and due to lower containing Ag amount, therefore cost is lower.

Description

A kind of brazing solder alloy

Technical field

The present invention relates to soldering tech field, specifically refer to a kind of high reliability brazing solder alloy for brazing steel.

Background technology

Current at each industrial circle, the brazing filler metal alloy that the solder brazing of steel adopts mainly contains silver solder (Ag-Cu-Zn system), brazing solder (Cu-Zn system) etc.Silver solder is able to extensive use owing to having lower fusion temperature, excellent wettability and good comprehensive mechanical property.But along with the excessive use of non-renewable resources, the price of noble silver rises steadily, the manufacturing cost of manufacturer is caused constantly to increase.For making the reasonable disposition of non-renewable resources, reduce manufacturing cost, people start again the feasibility focusing on each industrial circle application brazing solder.

For a long time, traditional brazing solder is all take Cu as matrix, and first form α-Cu solid solution by adding alloy element Zn, the interpolation scope of its Zn is generally 38%-42%; Secondly, soldering processes performance and the mechanical property of solder is improved by adding trace alloying element Sn, Mn, Ni, Si.In Cu-Zn alloy, add the fusion temperature that Sn can reduce brazing filler metal alloy, improve wetability; Add Mn, Fe and Ni and can improve the wetability of solder on carbide alloy; Add the evaporation that Si prevents Zn in brazing process.In addition, according to the regulation of American Welding Society (AWS), also have and add the wetability that trace P (as: RBCuZn-D) improves solder in above brazing filler metal alloy.

Although existing brazing solder is applied at some industrial circle, brazing solder will be used to carry out soldering steel in some important occasions, also there is many deficiencies in it.Research shows, Si and P of trace is added in Cu-Zn alloy, Fe-Si and Fe-P intermetallic compound can be formed at steel/solder interface in brazing process, even form micro-crack in interface, and there is larger difference (interface is α-Cu solid solution) with joint during silver-base solder soldering.Due to the intrinsic fragility of Fe-Si and Fe-P intermetallic compound and the generation of micro-crack, the reliability (as: air-tightness, electric conductivity and mechanical property) of soldered fitting military service process will be reduced.Secondly, existing brazing solder due to fusing point higher, soldering class steely/copper sleeve time, copper annealing is serious, causes excessive grain to grow up, causes intensity index to reduce.

Summary of the invention

The object of this invention is to provide a kind of high reliability brazing solder alloy, the desirable silver-substituted solder of this solder is used for the steel/steel, steel/copper brazing joint etc. of brazing requirements high reliability, and solder is with low cost.

The object of the invention is achieved through the following technical solutions:

A kind of brazing solder alloy, is made up of Cu, Zn, Sn, Ge and Ag and/or In.

Described each component is by mass percentage: Cu:58-60%, Sn:0.5-3.0%, Ag:1.0-6.0% and/or In:1.0-5.0%, Ge:0.05-0.3%, surplus is Zn.

Preferably, described Cu:58-60%, Sn:1.0-2.0%, Ag:2.0-5.0% and/or In:1.0-3.0%, Ge:0.05-0.1%, surplus is Zn.

Preferably, described Cu:60%, Sn:1.5%, Ag:5%, In:1%, Ge:0.05%, Zn: surplus.

Preferably, described Cu:58%, Sn:1.0%, Ag:2%, Ge:0.1%, Zn: surplus.

Preferably, described Cu:58%, Sn:2.0%, Ag:4%, In:3%, Ge:0.1%, Zn: surplus.

Preferably, described Cu:60%, Sn:1.5%, Ag:5%, Ge:0.08%, Zn: surplus.

Preferably, described Cu:59%, Sn:2.0%, Ag:3.0%, Ge:0.06%, Zn: surplus.

Preferably, described Cu:59%, Sn:1.5%, In:3.0%, Ge:0.15%, Zn: surplus.

Above-mentioned brazing filler metal alloy obtains by the brazing filler metal alloy method of smelting of routine, and solder processing method routinely can be processed into silk material, the band of different size.

Brazing filler metal alloy of the present invention compared with prior art tool has the following advantages:

1) when soldering steel, steel/solder interface can not form intermetallic compound, and interface can obtain the α-Cu solid solution Interface Microstructure identical with silver solder, thus improves the reliability of soldered fitting.

2) and existing brazing solder compare, because fusion temperature is lower, desirable silver-substituted solder is used for the soldering of steel/copper sleeve.

3) brazing solder of the present invention is due to lower containing Ag amount, and therefore cost is lower.

The effect of each component and the principle following (content is all by percentage to the quality) of content restriction in the present invention:

Cu and Zn: for ensureing that brazing filler metal alloy is organized as α-Cu solid solution; Solder has good processing characteristics, and according to Cu-Zn binary phase diagraml, the ratio of Cu and Zn should be limited to Cu: Zn within the scope of 58-60%: 42%-40%.

Sn: add Sn in Cu-Zn alloy, can reduce the fusion temperature of brazing filler metal alloy, increases wetability.But the solid solubility of Sn in Cu and Zn is very little, the Sn meeting therefore added and Cu form intermetallic compound, and solder is become fragile, and are preferably 1.0-2.0%.

Ag and In: the fusion temperature that can reduce brazing filler metal alloy; Improve wetability, improve the mechanical property of solder simultaneously.Consider from material cost and soldered fitting combination property, be preferably Ag:2.0-5.0% and/or In:1.0-3.0%.

Ge: have larger solid solubility in Cu, but Ge is active element (active in Si), can prevent the evaporation of Zn, and Fe can not form intermetallic compound, consider that brazing solder brazing temperature of the present invention decreases simultaneously, be therefore preferably 0.05-0.1%.

Detailed description of the invention

Embodiment 1

A kind of brazing solder alloy, its alloy formula is Cu:60%, Sn:1.5%, Ag:5%, In:1.0%, Ge:0.05%, Zn: surplus.

The preparation process of above-mentioned brazing solder alloy is as follows:

1) 5000 grams are amounted to by each material of above formulated;

2) Cu is put into induction furnace be heated to more than 1100 DEG C and make it melt;

3) add Zn and fully stir, reducing rapidly deposite metal temperature to 920 DEG C simultaneously;

4) metal to be melted evenly after add Ag and fully stir;

5) add Sn, In and Ge and stir, then casting;

6) solder processing method extruding routinely, wire drawing obtains this brazing filler metal alloy.

Embodiment 2

The present embodiment difference from Example 1 is to adopt following formula:

Cu:58%, Sn:1.0%, Ag:2%, Ge:0.1%, Zn: surplus.

Embodiment 3

The present embodiment difference from Example 1 is to adopt following formula:

Cu:58%, Sn:2.0%, Ag:4%, In:3%, Ge:0.1%, Zn: surplus.

Embodiment 4

The present embodiment difference from Example 1 is to adopt following formula:

Cu:60%, Sn:1.5%, Ag:5%, Ge:0.08%, Zn: surplus.

Embodiment 5

The present embodiment difference from Example 1 is to adopt following formula:

Cu:59%, Sn:2.0%, Ag:3.0%, Ge:0.06%, Zn: surplus.

Embodiment 6

The present embodiment difference from Example 1 is to adopt following formula:

Cu:59%, Sn:1.5%, In:3.0%, Ge:0.15%, Zn: surplus.

The preparation of brazed coupon adopts conventional gas brazing, and the mother metal trade mark is Q195, and brazing flux is trimethylborate type gas flux.Solder fusing point adopts dsc measurement, and programming rate is 10 DEG C/min; The loaded load of microhardness is 100gf, and the load time is 15s; Brazed coupon interface topography adopts sem observation.Testing result is in table 1.

Table 1 embodiment and comparative example testing result compare

Claims

1. a brazing solder alloy, is characterized in that, is made up of Cu, Zn, Sn, Ge and Ag and/or In, described each component is by mass percentage: Cu:58-60%, Sn:0.5-3.0%, Ag:1.0-6.0% and/or In:1.0-5.0%, Ge:0.05-0.3%, surplus is Zn.

2. alloy according to claim 1, is characterized in that, described Cu:58-60%, Sn:1.0-2.0%, Ag:2.0-5.0% and/or In:1.0-3.0%, Ge:0.05-0.1%, and surplus is Zn.

3. alloy according to claim 2, is characterized in that, described Cu:60%, Sn:1.5%, Ag:5%, In:1%, Ge:0.05%, Zn: surplus.

4. alloy according to claim 2, is characterized in that, described Cu:58%, Sn:1.0%, Ag:2%, Ge:0.1%, Zn: surplus.

5. alloy according to claim 2, is characterized in that, described Cu:58%, Sn:2.0%, Ag:4%, In:3%, Ge:0.1%, Zn: surplus.

6. alloy according to claim 2, is characterized in that, described Cu:60%, Sn:1.5%, Ag:5%, Ge:0.08%, Zn: surplus.

7. alloy according to claim 2, is characterized in that, described Cu:59%, Sn:2.0%, Ag:3.0%, Ge:0.06%, Zn: surplus.

8. alloy according to claim 1, is characterized in that, described Cu:59%, Sn:1.5%, In:3.0%, Ge:0.15%, Zn: surplus.