CN101569967B - Copper-silver alloy low vapor pressure brazing filler metal containing Si and Ga and its uses - Google Patents
Copper-silver alloy low vapor pressure brazing filler metal containing Si and Ga and its uses Download PDFInfo
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- CN101569967B CN101569967B CN2009100945912A CN200910094591A CN101569967B CN 101569967 B CN101569967 B CN 101569967B CN 2009100945912 A CN2009100945912 A CN 2009100945912A CN 200910094591 A CN200910094591 A CN 200910094591A CN 101569967 B CN101569967 B CN 101569967B
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- filler metal
- brazing filler
- copper
- solder
- vapor pressure
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Abstract
The invention relates to a copper-silver alloy low vapor pressure brazing filler metal containing Si and Ga, comprising the chemical composition with the mass fraction: 39-41% of silver, 1.5-2.5% of silicon, 0.3-2.5% of gallium and the rest of copper. The solidus temperature range of the brazing filler metal is within 781.6-804.3 DEG C, and the liquidus temperature range thereof is within 823-848.3 DEG C. By adopting vacuum melting, the brazing filler metal has excellent processing property, and can be made into the required thin belt material and silk material by using the conventional rolling and drawing technique. At the temperature of 850-870 DEG C, the brazing filler metal has good wettability for oxygen-free copper, nickel and stainless steel, is comparatively narrow in solidus-liquidus interval compared with the existing 50%Ag-50%Cu brazing filler metal, and reduces about 10% of the cost; under the 850-870 DEG C vacuum or protective atmosphere, when electrovacuum components such as oxygen-free copper, nickel, nickelage stainless steel and the like are in braze welding, the leakage rate of joints of the components is lower than 1*10<-5>Pa.
Description
Technical field
The present invention relates to a kind of copper-silver alloy solder that contains silicon and gallium, particularly relate to a kind of low-steam pressure solder alloy that is applicable to electron tube parts middle temperature brazing.
Background technology
Electron tube in electronics industry is made the field, in the constructional element of electrical apparatus step brazing technology, extensively adopting the silver-based alloy solder of low-steam pressure, existing three grades of general soldering processes of silver alloy are by the soldering successively in descending order of solder fusing point, for example: BAg50Cu (779-850 ℃) one-level soldering, BAg72Cu (779 ℃) secondary soldering and three grades of solderings of BAg60CuSn (or In).
In above-mentioned one-level brazing temperature section, have only BAg50Cu can select for use for one kind, the main deficiency of this trade mark solder is: solid-liquid phase line big at interval (about 70 ℃), silver content higher (containing 50%Ag).
In this application, the report that warm low vapor pressure brazing filler metal in Ag-Cu-In-Sn system and the Cu-Ag-Si system was once arranged, these solder fusion temperatures are much lower than BAg50Cu, belong to third level brazing solder, can select the less problem of the trade mark in order to solve extensive deficiency and the suitable solder that is adopting BAg50Cu (one-level soldering) electrovacuum solder to exist, the exploitation brazing characteristics is good, economic and practical, fusing point is positioned at 800 ℃～850 ℃ temperature section low vapor pressure brazing filler metal kinds, is fit to current electronics industry development actual demand.
Summary of the invention
The composition of electrovacuum solder and the vapour pressure of impurity require to be lower than 1 * 10 at 500 ℃
-5Therefore Pa, can not contain high-vapor-pressure elements such as Zn, Cd commonly used in the general solder and Pb in the solder composition; Because the common use form of solder is book band and microfilament material, solder should have certain plasticity and good processing properties again.
Existing technology shows that the vapour pressure of Si in the time of 500 ℃ is 1.72 * 10
-16Pa, the vapour pressure of Ga in the time of 500 ℃ is 3.71 * 10
-8Pa, this two element and Cu, Ag commonly used all belong to the low-steam pressure element; Test shows, adds a spot of Si and Ga to the not significantly influence of its processing characteristics in the Cu-Ag alloy, and promptly brazing filler metal alloy is easy to be processed into book band and fine silk material;
Aspect metallurgy, in Cu-(39%～41%) Ag alloy, add liquidus temperature that a spot of Si and Ga can reduce alloy, dwindle Cu-Ag alloy solid-liquid phase line at interval, can improve wetability, spreadability and the gap fillibility of solder to mother metal.
Add a spot of Si and Ga element, solidus influence to the Cu-Ag alloy is less, but its liquidus curve reduces along with the increase of Si and Ga addition, alloy in composition range of the present invention, compare with 50%Ag-50%Cu brazing filler metal alloy of the prior art, its liquidus temperature can be dropped to 823 ℃ by 850 ℃ of 50%Ag-50%Cu solder, its solid-liquid phase line narrows down to 41.4 ℃ by original 70 ℃ at interval.Usually, the solid-liquid of brazing filler metal alloy is narrow more at interval, and it is good more in spreadability on the mother metal and the gap fillibility between mother metal, and therefore, solder composition of the present invention can improve 50%Ag-50%Cu alloy brazed characteristic in the prior art effectively.
The composition range of solder of the present invention is expressed as follows by mass percent:
39～41% silver medals (Ag), 1.5～2.5% silicon (Si), 0.5～2.5% gallium (Ga), all the other are Cu (copper).
Practice shows, in 39～41% silver medals-copper alloy, add Si＜1.5% and Ga＜0.5%, very little to the brazing characteristics influence that improves Cu-(39～41%) Ag solder, and addition Si＞2.5% and Ga＞2.5%, owing in alloy, can form a spot of CuSi and CuGa compound, can make plasticity and significantly decline of processing characteristics, yield rate and the technique for applying reduction of alloy.
Solder is easy to manufacture the book band and the silk material of commercial Application specification with vacuum melting and general processing technology.
Brazing filler metal alloy of the present invention is lower than 3.51 * 10 500 ℃ vapour pressure
-8Pa.
Solder is under 850 ℃～870 ℃ conditions; wetability on oxygen-free copper, nickel, stainless steel mother metal is good; being adapted at vacuum is connected multiple mother metal solderings such as oxygen-free copper, Ni and nickel plating stainless steels with the protective atmosphere condition; compare with existing 50%Ag-50%Cu solder; can save 10% silver medal, have tangible economic benefit.This solder solidus temperature scope: 781.6～804.3 ℃, liquidus temperature scope: 823～848.3 ℃.Solder adopts vacuum melting, has good processing characteristics, and available pair rolling and drawing process are made required book band and silk material.Solder has excellent wetting capacity at 850～870 ℃ to oxygen-free copper, nickel, stainless steel.
The specific embodiment
Brazing filler metal alloy is made: adopt electrovacuum solder vacuum melting and general rolling and drawing process manufacturing, the solder specification: thickness is the silk material of 0.05～0.50mm book band and Φ 0.30～0.5mm.
The embodiment of solder of the present invention and similar application solder with prior art relatively see Table 1.
Table 1: solder embodiment of the present invention and with prior art in the comparison of similar solder performance
Claims (2)
1. copper-Yin low-steam pressure the solder alloy that contains silicon and gallium is characterized in that, by the chemical composition of mass percent is: 39～41% silver medals, and 1.5～2.5% silicon, 0.3～2.5% gallium, all the other are copper.
2. an application that contains the copper-Yin low-steam pressure solder alloy of silicon and gallium as claimed in claim 1 is characterized in that preparing the application in the electron tube parts middle temperature brazing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100945912A CN101569967B (en) | 2009-06-16 | 2009-06-16 | Copper-silver alloy low vapor pressure brazing filler metal containing Si and Ga and its uses |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100945912A CN101569967B (en) | 2009-06-16 | 2009-06-16 | Copper-silver alloy low vapor pressure brazing filler metal containing Si and Ga and its uses |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101569967A CN101569967A (en) | 2009-11-04 |
| CN101569967B true CN101569967B (en) | 2011-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100945912A Expired - Fee Related CN101569967B (en) | 2009-06-16 | 2009-06-16 | Copper-silver alloy low vapor pressure brazing filler metal containing Si and Ga and its uses |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103358048B (en) * | 2013-07-25 | 2016-08-17 | 杭州华光焊接新材料股份有限公司 | A kind of silver-bearing copper phosphorus system vacuum brazing material |
| CN103464935B (en) * | 2013-09-26 | 2015-08-19 | 郑州机械研究所 | A kind of preparation method of aluminium copper silicon solder |
| CN109079363B (en) * | 2018-09-26 | 2021-03-19 | 北京航空航天大学 | Low-vapor-pressure low-melting-point sealing solder |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4411864A (en) * | 1980-12-08 | 1983-10-25 | Mitsubishi Kinzoku Kabushiki Kaisha | Cu-Ag-Si Base alloy brazing filler material |
| CN1046194A (en) * | 1989-11-09 | 1990-10-17 | 中国有色金属工业总公司昆明贵金属研究所 | Low-steam pressure, low melting point silver based soldering alloy |
| CN1120480A (en) * | 1995-04-26 | 1996-04-17 | 东南大学 | Copper-base solder-silver substituted solder for electrical vacuum with low melting point, low vapour pressure and ductility |
| WO2002076669A1 (en) * | 2001-03-23 | 2002-10-03 | Citizen Watch Co., Ltd. | Brazing filler metal |
| CN1446664A (en) * | 2003-04-10 | 2003-10-08 | 贵研铂业股份有限公司 | Silver alloy solder with low palladium content |
-
2009
- 2009-06-16 CN CN2009100945912A patent/CN101569967B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4411864A (en) * | 1980-12-08 | 1983-10-25 | Mitsubishi Kinzoku Kabushiki Kaisha | Cu-Ag-Si Base alloy brazing filler material |
| CN1046194A (en) * | 1989-11-09 | 1990-10-17 | 中国有色金属工业总公司昆明贵金属研究所 | Low-steam pressure, low melting point silver based soldering alloy |
| CN1120480A (en) * | 1995-04-26 | 1996-04-17 | 东南大学 | Copper-base solder-silver substituted solder for electrical vacuum with low melting point, low vapour pressure and ductility |
| WO2002076669A1 (en) * | 2001-03-23 | 2002-10-03 | Citizen Watch Co., Ltd. | Brazing filler metal |
| CN1446664A (en) * | 2003-04-10 | 2003-10-08 | 贵研铂业股份有限公司 | Silver alloy solder with low palladium content |
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| CN101569967A (en) | 2009-11-04 |
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