CN102699567A - Zirconium-containing copper silver titanium solder alloy - Google Patents

Zirconium-containing copper silver titanium solder alloy Download PDF

Info

Publication number
CN102699567A
CN102699567A CN2012101958502A CN201210195850A CN102699567A CN 102699567 A CN102699567 A CN 102699567A CN 2012101958502 A CN2012101958502 A CN 2012101958502A CN 201210195850 A CN201210195850 A CN 201210195850A CN 102699567 A CN102699567 A CN 102699567A
Authority
CN
China
Prior art keywords
alloy
zirconium
solder alloy
copper silver
silver titanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101958502A
Other languages
Chinese (zh)
Inventor
肖代红
李秀秀
申婷婷
张福勤
袁铁锤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central South University
Original Assignee
Central South University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central South University filed Critical Central South University
Priority to CN2012101958502A priority Critical patent/CN102699567A/en
Publication of CN102699567A publication Critical patent/CN102699567A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Ceramic Products (AREA)

Abstract

The invention discloses a zirconium-containing copper silver titanium solder alloy. The zirconium-containing copper silver titanium solder alloy comprises the following components by mass percent: 10-45% of Ag, 1-4% of Ti, 0.5-5% of Zr and Cu for the rest. A vacuum melting and argon shield casting mode is adopted, silver and copper are molten at first and then titanium and zirconium are added. The zirconium-containing copper silver titanium solder alloy can be used for directly soldering copper alloys, iron steel, ceramics and diamonds. The zirconium-containing copper silver titanium solder alloy has the advantages as follows: the cost is low; a connector is high in mechanical strength, has smooth surface, is stable in quality and is good in uniformity after the copper alloys are soldered by the zirconium-containing copper silver titanium solder alloy; and the joint clearances can be fully filled up. The zirconium-containing copper silver titanium solder alloy can replace the conventional copper silver titanium solder and is suitable for large-scale industrial application.

Description

A kind of copper silver titanium solder alloy that contains zirconium
Technical field
The present invention relates to a kind of copper silver is alloy, is meant a kind of copper silver titanium solder alloy that contains zirconium especially, belongs to intermediate temperature solder material technology field.
Background technology
Characteristics such as ceramic material has wear-resisting, and is corrosion-resistant, high temperature resistant, good insulating and being widely used in modern industry and the sciemtifec and technical sphere have shown wide application prospect.But higher because of ceramic material hardness, bad plasticity is difficult to distortion and cut.Therefore, quite a lot on practical applications is to adopt pottery and metal or pottery and the ceramic composite component of forming, and for this reason, must solve pottery and metal and the ceramic problem that is connected with ceramic phase.Former studies shows, the welding of pottery and metal or pottery and pottery, and what tool potentiality, employing were more is active brazing filler metal.At present, in directly soldering connected, the Ag-Cu-Ti solder was that ceramic soldering is generally acknowledged best active solder.Ag-Cu-Ti alloy activated solder has less infiltration angle, and is best to the wellability of pottery.It broken away between the pottery and pottery and metal between must carry out the complex techniques process of metalized during welding earlier at ceramic surface, can realize that pottery and pottery, pottery are successful with a soldering of metal assembly.
Silver content surpasses 60% in the existing copper silver titanium solder alloy, like Ag71Cu27.5Ti1.5, Ag70Cu28Ti2, AgCuTi34.5-1.5, and AgCuTi26.5-3 and Ag-CuTil0-4 alloy etc., the alloy of these high silver contents has improved the production cost of material.In addition, research shows, is to add Ti in the alloy at Ag-Cu, has formed Cu 3Compound phase between the Ti reguline metal, this compound is enriched in brazing process on the interface of matrix and solder, has reduced the intensity of soldering head.Therefore how on the basis of the intermediate temperature solder performance that guarantees alloy, reduce the content of silver in the alloy, the intensity that improves the soldering head becomes one of important research contents.Existing document shows, both at home and abroad also not through in the silver-bearing copper titanium alloy, adding zirconium, with the content of reduction Ag and the side effect of Ti, improves the report of the combination property of alloy at present.
Summary of the invention
The object of the invention provides a kind of copper silver titanium solder alloy that contains zirconium to prior art deficiency and defective; Brazing filler metal alloy provided by the invention through the alloying of zirconium, reduces the side effect of silver content and titanium, improves the brazing property of brazing filler metal alloy, reduces copper silver titanium solder alloy manufacturing cost, satisfies industrial needs.
A kind of copper silver titanium solder alloy that contains zirconium of the present invention comprises following component, forms by mass percentage:
Ag:10~45%,
Ti:1~4%,
Zr:0.5 ~ 5%, surplus are Cu.
A kind of copper silver titanium solder alloy that contains zirconium of the present invention comprises following component, forms by mass percentage:
Ag:15~40%,
Ti:1.5~3.5%,
Zr:0.8 ~ 4.5%, surplus are Cu.
A kind of copper silver titanium solder alloy that contains zirconium of the present invention comprises following component, forms by mass percentage:
Ag:20~30%,
Ti:2~3%,
Zr:1.5 ~ 3%, surplus are Cu.
A kind of preparation method who contains the copper silver titanium solder alloy of zirconium of the present invention is: the alloy compositions proportioning by design is got each component Ag, Ti, Zr, Cu; Vacuum melting argon shield casting down obtains ingot casting; Wherein, Ti adds with the titanium sponge form, and Ag adds with the form of cathode copper with fine silver, Cu, and Zr adds with the form of Cu-Zr intermediate alloy.
Alloy component of the present invention and percentage by weight are: 45%Ag, and 4%Ti, 1%Zr, when all the other are Cu, 763 ℃ of the fusing points of the brazing filler metal alloy that casting obtains.Through with the brass alloys soldering after, the shear strength of solder joint is 96MPa, the wettability of solder and matrix alloy is good, does not find Cu 3Ti is enriched on the interface mutually.
Alloy component of the present invention and percentage by weight are: 27.5%Ag, and 2%Ti, 2%Zr, when all the other are Cu, 774 ℃ of the fusing points of the brazing filler metal alloy that casting obtains.Through with the brass alloys soldering after, the shear strength of solder joint is 113MPa, the wettability of solder and matrix alloy is good, does not find Cu 3Ti is enriched on the interface mutually.
Alloy component of the present invention and percentage by weight are: 15%Ag, and 1.5%Ti, 4%Zr, when all the other are Cu, 786 ℃ of the fusing points of the brazing filler metal alloy that casting obtains.Through with the brass alloys soldering after, the shear strength of solder joint is 98MPa, the wettability of solder and matrix alloy is good, does not find Cu 3Ti is enriched on the interface mutually.
Compared with prior art, the invention has the advantages that:
The present invention adds zirconium, through the alloying of zirconium owing to adopt the said components proportioning on the basis of existing copper silver titanium alloy; Can effectively reduce the side effect of silver content and titanium; Significantly improve the brazing property of brazing filler metal alloy, and reduce copper silver titanium solder alloy manufacturing cost, the alloying mechanism of zirconium is sketched in following among the present invention: because Ti and Zr are subordinate to same subgroup in the periodic table of elements; Has similar character; The adding of Zr destroyed the rock-steady structure of Cu3Ti, the contention electronics, upset Ti, Ag, Cu between the balance of Cheng Jian; Because the bond energy of Cu-Zr is bigger than the bond energy of Cu-Ti and Zr-Ti, then the Cu atom around the Ti will trend towards around the Zr, thereby the Cu atomicity around the Ti is reduced; The adding of Zr will make Ti activity increase, and block Cu3Ti phase amount reduces, and size is little; Ag, Cu, Ti, four kinds of atoms of Zr form (Cu, Ag) 5 (Ti that new small and dispersed distributes through being reassembled into key; Zr) phase; New looks exists as the dispersion-strengtherning phase with a kind of form of heterogeneous particles at first, has increased nucleation rate, and then has reduced the size of crystal grain; The cenotype that small and dispersed distributes helps forming the Ke Chuier air mass and produces pinning effect, strengthens dispersion-strengthened action, effectively stops dislocation motion and crystal boundary slippage, and dislocation mobile drag is under external force increased, thereby has improved the mechanical property of brazing filler metal alloy; The interpolation of Zr simultaneously; The activity of raising solder that can be direct and indirect, the homogenising degree of the elemental diffusion degree of depth and tissue is high, helps quickening the diffusion and the interfacial reaction of atom in the high temperature brazing process; This just makes, and conversion zone is interactional to double; React more thorough, help forming the conversion zone of continuous densification, thereby reduce the residual stress in the joint and improve strength of joint.For these reasons, on the basis of copper silver titanium alloy, add zirconium, reduce the content of silver, utilize the active function of zirconium, reduce block precipitated phase Cu in the alloy 3The content of Ti, form that new small and dispersed distributes (Cu, Ag) 5(intensity of raising brazing filler metal alloy improves brazing property for Zr, Ti) phase, and existing industrial equipment capable of using carries out large-scale production.
Description of drawings
Accompanying drawing 1: for the alloy casting state of Comparative Examples preparation of the present invention is organized photo;
Accompanying drawing 2: for the alloy casting state of the embodiment of the invention 2 preparations is organized photo;
Accompanying drawing 3: for the alloy casting state of the embodiment of the invention 3 preparations is organized photo;
Accompanying drawing 4: for the alloy casting state of the embodiment of the invention 4 preparations is organized photo;
Can find out in the accompanying drawing 1, contain block Cu in the as-cast structure of the alloy of Comparative Examples preparation 3The Ti phase;
In the accompanying drawing 2,3,4, can find out that the alloy casting state of embodiment 2,3,4 preparations is organized and do not contained block Cu 3The Ti phase;
In Fig. 4, can see contain in the alloy casting state tissue of embodiment 4 preparation the small and dispersed distribution (Cu, Ag) 5(Zr, Ti) phase.
The specific embodiment
In conjunction with method of the present invention following instance is provided:
Embodiments of the invention are at copper silver titanium alloy (Ag:10 ~ 45%; Ti:1 ~ 4%; Surplus is Cu) add the zirconium of different content in the batching, its composition is different from casting copper silver titanium alloys such as existing Ag71Cu27.5Ti1.5, embodiment 1,2,3,4,5 and Comparative Examples alloying ingredient such as table 1.Embodiment and the preparation of Comparative Examples alloy are all adopted and are cast into round base under the vacuum melting argon shield.The vacuum melting temperature is 1200 ~ 1500 ℃, and vacuum is 0.001 ~ 0.1 handkerchief; Specify as follows:
Comparative Examples
Alloying ingredient (raw material is: fine silver, cathode copper, titanium sponge) melting in vacuum induction melting furnace, argon shield is cast into ingot casting.789 ℃ of the fusing points of brazing filler metal alloy, Vickers hardness are 161HV.Brazing filler metal alloy applies to the connection of brass alloy material, and shear strength test shows, the shear strength of solder joint are 70MPa, solder and welding material wetting good, but a large amount of block Cu are arranged on solder and the welding material interface 3The enrichment of Ti phase.
Embodiment 1
The batching of alloy (raw material is: fine silver, cathode copper, titanium sponge, Cu-50Zr intermediate alloy) melting in vacuum induction melting furnace, argon shield is cast into ingot casting.781 ℃ of the fusing points of brazing filler metal alloy, Vickers hardness are 178HV.Brazing filler metal alloy applies to the connection of brass alloy material, and shear strength test shows, the shear strength of solder joint are 81MPa, solder and welding material wetting good, and do not have Cu on solder and the welding material interface 3The enrichment of Ti phase.
Embodiment 2
The batching of alloy (raw material is: fine silver, cathode copper, titanium sponge Cu-50Zr intermediate alloy) melting in vacuum induction melting furnace, argon shield is cast into ingot casting, alloy casting state knot of tissue member accompanying drawing 2.786 ℃ of the fusing points of brazing filler metal alloy, Vickers hardness are 198HV.Brazing filler metal alloy applies to the connection of brass alloy material, and shear strength test shows, the shear strength of solder joint are 96MPa, solder and welding material wetting good, and do not have Cu on solder and the welding material interface 3The enrichment of Ti phase.
Embodiment 3
The batching of alloy (raw material is: fine silver, cathode copper, titanium sponge Cu-50Zr intermediate alloy) melting in vacuum induction melting furnace, argon shield is cast into ingot casting, alloy casting state knot of tissue member accompanying drawing 3.774 ℃ of the fusing points of brazing filler metal alloy, Vickers hardness are 211HV.Brazing filler metal alloy applies to the connection of brass alloy material, and shear strength test shows, the shear strength of solder joint are 113MPa, solder and welding material wetting good, and do not have Cu on solder and the welding material interface 3The enrichment of Ti phase.
Embodiment 4
The batching of alloy (raw material is: fine silver, cathode copper, titanium sponge Cu-50Zr intermediate alloy) melting in vacuum induction melting furnace, argon shield is cast into ingot casting, alloy casting state knot of tissue member accompanying drawing 4.763 ℃ of the fusing points of brazing filler metal alloy, Vickers hardness are 197HV.Brazing filler metal alloy applies to the connection of brass alloy material, and shear strength test shows, the shear strength of solder joint are 98MPa, solder and welding material wetting good, and do not have Cu on solder and the welding material interface 3The enrichment of Ti phase.
Embodiment 5
The batching of alloy (raw material is: fine silver, cathode copper, titanium sponge Cu-50Zr intermediate alloy) melting in vacuum induction melting furnace, argon shield is cast into ingot casting.758 ℃ of the fusing points of brazing filler metal alloy, Vickers hardness are 199HV.Brazing filler metal alloy applies to the connection of brass alloy material, and shear strength test shows, the shear strength of solder joint are 94MPa, solder and welding material wetting good, and do not have Cu on solder and the welding material interface 3The enrichment of Ti phase.
Table 1 (mass percent)
Alloy Ag Ti Zr Cu
The comparative example 70 4 0 Surplus
Embodiment 1 45 4 0.5 Surplus
Embodiment 2 45 4 1 Surplus
Embodiment 3 27.5 2 2 Surplus
Embodiment 4 15 1.5 4 Surplus
Embodiment 5 10 1 5 Surplus

Claims (6)

1. a copper silver titanium solder alloy that contains zirconium comprises following component, forms by mass percentage:
Ag:10~45%,
Ti:1~4%,
Zr:0.5 ~ 5%, surplus are Cu.
2. a kind of copper silver titanium solder alloy that contains zirconium according to claim 1 comprises following component, forms by mass percentage:
Ag:15~40%,
Ti:1.5~3.5%,
Zr:0.8 ~ 4.5%, surplus are Cu.
3. a kind of copper silver titanium solder alloy that contains zirconium according to claim 1 comprises following component, forms by mass percentage:
Ag:20~30%,
Ti:2~3%,
Zr:1.5 ~ 3%, surplus are Cu.
4. a kind of copper silver titanium solder alloy that contains zirconium according to claim 1 comprises following component, forms by mass percentage:
45%Ag, 4%Ti, 1%Zr, all the other are Cu; The fusing point of alloy is 763 ℃; After the brass alloys soldering, the shear strength of solder joint is 96MPa.
5. a kind of copper silver titanium solder alloy that contains zirconium according to claim 1 comprises following component, forms by mass percentage:
27.5%Ag, 2%Ti, 2%Zr, all the other are Cu; The fusing point of alloy is 774 ℃; After the brass alloys soldering, the shear strength of solder joint is 113MPa.
6. a kind of copper silver titanium solder alloy that contains zirconium according to claim 1 comprises following component, forms by mass percentage: 15%Ag, and 1.5%Ti, 4%Zr, all the other are Cu; The fusing point of alloy is 786 ℃; After the brass alloys soldering, the shear strength of solder joint is 98MPa.
CN2012101958502A 2012-06-14 2012-06-14 Zirconium-containing copper silver titanium solder alloy Pending CN102699567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101958502A CN102699567A (en) 2012-06-14 2012-06-14 Zirconium-containing copper silver titanium solder alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101958502A CN102699567A (en) 2012-06-14 2012-06-14 Zirconium-containing copper silver titanium solder alloy

Publications (1)

Publication Number Publication Date
CN102699567A true CN102699567A (en) 2012-10-03

Family

ID=46892776

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101958502A Pending CN102699567A (en) 2012-06-14 2012-06-14 Zirconium-containing copper silver titanium solder alloy

Country Status (1)

Country Link
CN (1) CN102699567A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104084591A (en) * 2014-07-03 2014-10-08 哈尔滨工业大学 Method for preparing Ag-Cu-Ti nano-alloy solder
CN105834613A (en) * 2016-05-20 2016-08-10 南京理工大学 Solder special for high-frequency soldering of four-way valve
CN106041238A (en) * 2016-06-13 2016-10-26 西安理工大学 Probe shell structure for measuring specific retention of petroleum well and seal welding material of probe shell structure
US11702723B2 (en) 2019-01-24 2023-07-18 Subodh Subas Pethe Silver alloy with improved mechanical properties

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09132473A (en) * 1995-11-07 1997-05-20 Shichizun Iwate:Kk Brazing filler metal for ceramics
JPH10193211A (en) * 1997-01-09 1998-07-28 Mitsubishi Materials Corp Cemented carbide-made cutting tool having excellent brazing connection strength in cutting edge piece
CN1094810C (en) * 1999-12-27 2002-11-27 华南理工大学 Active solder and its preparation
CN1396037A (en) * 2002-08-09 2003-02-12 中国科学院上海硅酸盐研究所 High-temp soldering method for aluminium nitride and copper
CN102319964A (en) * 2011-08-06 2012-01-18 郑州机械研究所 Active core silver solder for soldering ceramics and preparation method thereof
CN102448663A (en) * 2009-05-27 2012-05-09 京瓷株式会社 Solder material, heat dissipation base using same, and electronic device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09132473A (en) * 1995-11-07 1997-05-20 Shichizun Iwate:Kk Brazing filler metal for ceramics
JPH10193211A (en) * 1997-01-09 1998-07-28 Mitsubishi Materials Corp Cemented carbide-made cutting tool having excellent brazing connection strength in cutting edge piece
CN1094810C (en) * 1999-12-27 2002-11-27 华南理工大学 Active solder and its preparation
CN1396037A (en) * 2002-08-09 2003-02-12 中国科学院上海硅酸盐研究所 High-temp soldering method for aluminium nitride and copper
CN102448663A (en) * 2009-05-27 2012-05-09 京瓷株式会社 Solder material, heat dissipation base using same, and electronic device
CN102319964A (en) * 2011-08-06 2012-01-18 郑州机械研究所 Active core silver solder for soldering ceramics and preparation method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104084591A (en) * 2014-07-03 2014-10-08 哈尔滨工业大学 Method for preparing Ag-Cu-Ti nano-alloy solder
CN104084591B (en) * 2014-07-03 2016-08-17 哈尔滨工业大学 A kind of method preparing Ag-Cu-Ti Nanoalloy solder
CN105834613A (en) * 2016-05-20 2016-08-10 南京理工大学 Solder special for high-frequency soldering of four-way valve
CN105834613B (en) * 2016-05-20 2018-10-02 南京理工大学 A kind of solder being exclusively used in four-way valve high frequency brazing
CN106041238A (en) * 2016-06-13 2016-10-26 西安理工大学 Probe shell structure for measuring specific retention of petroleum well and seal welding material of probe shell structure
CN106041238B (en) * 2016-06-13 2018-09-25 西安理工大学 A kind of oil well surveys specific retention probing shell structure and its sealing materials
US11702723B2 (en) 2019-01-24 2023-07-18 Subodh Subas Pethe Silver alloy with improved mechanical properties

Similar Documents

Publication Publication Date Title
CN102689109B (en) Preparation method of high-entropy brazing filler metal for brazing non-oxide ceramics and non-oxide ceramic composite material
CN101913036B (en) CuZnTi solder for soldering diamond tool
CN100469928C (en) Prepn of high strength heat resistant aluminium alloy and its pipe
CN100427437C (en) High temperature solder in use for braze welding ceramics of silicon nitride and composite materials based on ceramics of silicon nitride
CN101818291B (en) Al-Cu-Mg-Ag powdered metallurgical heat-resisting aluminum alloy and preparation method thereof
CN101780613A (en) Special rare earth alloy silver-brazing filler metal
CN106238962A (en) A kind of active solder alloy
CN102699567A (en) Zirconium-containing copper silver titanium solder alloy
CN109531457B (en) Powdered active brazing filler metal for diamond grinding tool
CN101332545A (en) Active solder and preparation method thereof
CN107309574A (en) A kind of high intensity silver-base solder and its method of smelting containing graphene
CN101745753A (en) Silver-free copper-based brazing material and production technology thereof
CN102044347B (en) Preparation method and products of silver-copper-nickel-ceramic alloy contact material with high welding resistance
CN103433488B (en) Preparation method of titanium nitride-ferrous metal ceramics
CN108913932B (en) MAX phase reinforced copper-based composite material and preparation method thereof
CN110666397A (en) Brazing material for titanium-containing material, preparation method and brazing method
CN100463763C (en) Cu-P-Ag solder containing Ga, In and Ce
CN102108474B (en) Zirconium-based amorphous alloy and preparation method thereof
JP3495770B2 (en) Brazing filler metal for ceramics
Du et al. Impact of Ni-coated carbon fiber on the interfacial (Cu, Ni) 6Sn5 growth of Sn-3.5 Ag composite solder on Cu substrate during reflow and isothermal aging
JP7340875B2 (en) Copper titanium alloy containing eutectic structure and its preparation method
CN112941398B (en) Graphite reinforced self-lubricating copper alloy and preparation method thereof
CN113528884B (en) Copper-based interlayer alloy and preparation method thereof, ceramic and oxygen-free copper composite connecting piece and welding method thereof
CN115558833A (en) High-strength and high-toughness FeNiCrAlTi high-entropy alloy with graded precipitated phase strengthening and preparation method thereof
CN100471613C (en) Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121003