CN101332545A - Active solder and preparation method thereof - Google Patents
Active solder and preparation method thereof Download PDFInfo
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- CN101332545A CN101332545A CNA2008100647961A CN200810064796A CN101332545A CN 101332545 A CN101332545 A CN 101332545A CN A2008100647961 A CNA2008100647961 A CN A2008100647961A CN 200810064796 A CN200810064796 A CN 200810064796A CN 101332545 A CN101332545 A CN 101332545A
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Abstract
The invention provides an active solder and a preparation method thereof and relates to a solder and a preparation method thereof. The method of the invention solves the problems that the preparation of the existing active solder needs to be smelted, thus influencing the weldability of the solder and the mechanical properties of joints. The solder of the invention consists of Ag, Cu, Sn and one of Ti or TiH2. In the solder of the invention, the Ag and the Cu are mixed with RE, the Sn and one of the Ti or the TiH2. The preparation method for the solder in the invention comprises the steps as follows: raw material of the active solder is added to a planetary ball mill for ball milling. After being brazed by adopting the method of the invention, the interface joint of the solder has good combination with the interface without air vent and crack, and forms a thinner responding layer with the side of mother metal, wherein, the responding layer can improve the mechanical properties of joints; and the shear strength of the soldering joint of the solder prepared by using the method of the invention can reach 11.56MPa.
Description
Technical field
The present invention relates to a kind of solder and preparation method thereof.
Background technology
The preparation of present most of active solders all is to need through smelting process, has dissolving and solidifying of solder, can produce phenomenons such as active element high-temperature oxydation, influences the solderability and the joint mechanical property of solder.Can bring simultaneously that production cost increases, the control procedure complexity, eliminate problems such as effect is undesirable.
Summary of the invention
The objective of the invention is to pass through smelting process for the preparation that solves existing active solder, there be dissolving and solidifying of solder, produce the phenomenon of active element high-temperature oxydation, thereby influence the solderability of solder and the problem of joint mechanical property, a kind of active solder and preparation method thereof is provided.
First kind of active solder of the present invention is made up of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti, 0.1%～0.42% mixing RE and the Sn of surplus by mass percentage.
. the preparation method of active solder of the present invention is as follows: one, by mass percentage 15%～60%Ag, 15%～60%Cu, 2%～15%Ti, 0.1%～0.42% mixing RE and the Sn of surplus are joined in the planetary ball mill, making the gross mass of Ag, Cu, Ti, mixing RE and Sn and the mass ratio of corundum abrading-ball is 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, the quality that makes acetone and Ag, Cu, Ti, the mass ratio that mixes RE and Sn gross mass are 1: 1～5, and acetone is volatilized naturally.
Add absolute ethyl alcohol in the inventive method step 2, making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5; In the step 2 under atmospheric atmosphere ball milling; In the step 2 under with the condition of nitrogen or argon shield ball milling.
Second kind of active solder of the present invention is by mass percentage by 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2, 0.1%～0.42% mixing RE and surplus Sn form.
The preparation method of active solder of the present invention is as follows: one, by mass percentage with 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2, 0.1%～0.42% mixing RE and the Sn of surplus join in the planetary ball mill, makes Ag, Cu, TiH
2, to mix RE and the gross mass of Sn and the mass ratio of corundum abrading-ball be 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, make the quality of acetone and Ag, Cu, TiH
2, the mass ratio that mixes RE and Sn gross mass is 1: 1～5, and acetone is volatilized naturally.
Add absolute ethyl alcohol in the inventive method step 2, making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5; In the step 2 under atmospheric atmosphere ball milling; In the step 2 under with the condition of nitrogen or argon shield ball milling.
The third active solder of the present invention is made up of the Sn of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti and surplus by mass percentage.
The preparation method of active solder of the present invention is as follows: one, by mass percentage the Sn of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti and surplus is joined in the planetary ball mill, making the gross mass of Ag, Cu, Ti and Sn and the mass ratio of corundum abrading-ball is 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, making the quality of acetone and the mass ratio of Ag, Cu, Ti and Sn gross mass is 1: 1～5, and acetone is volatilized naturally.
Add absolute ethyl alcohol in the inventive method step 2, making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5; In the step 2 under atmospheric atmosphere ball milling; In the step 2 under with the condition of nitrogen or argon shield ball milling.
The 4th kind of active solder of the present invention is by mass percentage by 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2Form with the Sn of surplus.
The preparation method of active solder of the present invention is as follows: one, by mass percentage with 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2Join in the planetary ball mill with the Sn of surplus, make Ag, Cu, TiH
2With the gross mass of Sn and the mass ratio of corundum abrading-ball be 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, make the quality of acetone and Ag, Cu, TiH
2With the mass ratio of Sn gross mass be 1: 1～5, acetone is volatilized naturally.
Add absolute ethyl alcohol in the inventive method step 2, making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5; In the step 2 under atmospheric atmosphere ball milling; In the step 2 under with the condition of nitrogen or argon shield ball milling.
The inventive method technology is simple, equipment is simple, efficient is high, lower and flexible to the requirement of starting powder, the solder that adopts the present invention to produce is applicable to being connected of being connected of being connected of being connected of carbon-based material and carbon-based material, carbon-based material and other material, ceramic material and ceramic material and ceramic material and other material.The inventive method is not subjected to the restriction of solid phase equilbrium phase diagram, can force to increase solid solubility by mechanism and prepare suitable solder system.
Interface tab interface behind the solder brazing of employing the inventive method preparation is in conjunction with good, there are not pore and crackle, formed one deck conversion zone, thinner, this layer conversion zone can improve the mechanical property of joint, because this layer is an intermetallic compound, the mechanical property of opposite blocked up joint can obviously reduce; Interface tab after the soldering and the transition of mother metal layer are even, are mainly the product of solid solution, and this product can improve the mechanical property of joint, can hinder the expansion of crackle.The shearing strength of joint can reach 11.56MPa behind the solder brazing of employing the inventive method preparation.
Description of drawings
Fig. 1 is wetting back graphite surface figure in the specific embodiment 21.Fig. 2 is the interface tab organization chart after graphite and the copper alloy soldering in the specific embodiment 21.Fig. 3 is the X-ray analysis figure of solder of preparation in the specific embodiment 22, and wherein ★ represents Ti, ◆ represent Cu, ▲ represent Ag,
Represent Sn.
The specific embodiment
The specific embodiment one: active solder is made up of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti, 0.1%～0.42% mixing RE and the Sn of surplus by mass percentage in the present embodiment.
The specific embodiment two: active solder is by mass percentage by 15%～60%Ag, 15%～60%Cu, 2%～15%TiH in the present embodiment
2, 0.1%～0.42% mixing RE and surplus Sn form.
The specific embodiment three: active solder is made up of the Sn of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti and surplus by mass percentage in the present embodiment.
The specific embodiment four: active solder is by mass percentage by 15%～60%Ag, 15%～60%Cu, 2%～15%TiH in the present embodiment
2Form with the Sn of surplus.
The specific embodiment five: the preparation method of active solder is as follows in the present embodiment: one, by mass percentage 15%～60% Ag, 15%～60%Cu, 2%～15%Ti, 0.1%～0.42% mixing RE and the Sn of surplus are joined in the planetary ball mill, making the gross mass of Ag, Cu, Ti, mixing RE and Sn and the mass ratio of corundum abrading-ball is 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, the quality that makes acetone and Ag, Cu, Ti, the mass ratio that mixes RE and Sn gross mass are 1: 1～5, and acetone is volatilized naturally.
The specific embodiment six: what present embodiment and the specific embodiment five were different is to add absolute ethyl alcohol in the step 2, and making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5.Other is identical with the specific embodiment five.
The specific embodiment seven: present embodiment and the specific embodiment five are different be in the step 2 under atmospheric atmosphere ball milling.Other is identical with the specific embodiment five.
The specific embodiment eight: present embodiment and the specific embodiment five are different be in the step 2 under with the condition of nitrogen or argon shield ball milling.Other is identical with the specific embodiment five.
The specific embodiment nine: the preparation method of active solder is as follows in the present embodiment: one, by mass percentage with 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2, 0.1%～0.42% mixing RE and the Sn of surplus join in the planetary ball mill, makes Ag, Cu, TiH
2, to mix RE and the gross mass of Sn and the mass ratio of corundum abrading-ball be 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, make the quality of acetone and Ag, Cu, TiH
2, the mass ratio that mixes RE and Sn gross mass is 1: 1～5, and acetone is volatilized naturally.
The specific embodiment ten: what present embodiment and the specific embodiment nine were different is to add absolute ethyl alcohol in the step 2, and making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5.Other is identical with the specific embodiment nine.
The specific embodiment 11: present embodiment and the specific embodiment nine are different be in the step 2 under atmospheric atmosphere ball milling.Other is identical with the specific embodiment nine.
The specific embodiment 12: present embodiment and the specific embodiment nine are different be in the step 2 under with the condition of nitrogen or argon shield ball milling.Other is identical with the specific embodiment nine.
The specific embodiment 13: the preparation method of active solder is as follows in the present embodiment: one, by mass percentage the Sn of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti and surplus is joined in the planetary ball mill, making the gross mass of Ag, Cu, Ti and Sn and the mass ratio of corundum abrading-ball is 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, making the quality of acetone and the mass ratio of Ag, Cu, Ti and Sn gross mass is 1: 1～5, and acetone is volatilized naturally.
The specific embodiment 14: what present embodiment and the specific embodiment 13 were different is to add absolute ethyl alcohol in the step 2, and making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5.Other is identical with the specific embodiment 13.
The specific embodiment 15: present embodiment and the specific embodiment 13 are different be in the step 2 under atmospheric atmosphere ball milling.Other is identical with the specific embodiment 13.
The specific embodiment 16: present embodiment and the specific embodiment 13 are different be in the step 2 under with the condition of nitrogen or argon shield ball milling.Other is identical with the specific embodiment 13.
The specific embodiment 17: the preparation method of active solder is as follows in the present embodiment: one, by mass percentage with 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2Join in the planetary ball mill with the Sn of surplus, make Ag, Cu, TiH
2With the gross mass of Sn and the mass ratio of corundum abrading-ball be 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, make the quality of acetone and Ag, Cu, TiH
2With the mass ratio of Sn gross mass be 1: 1～5, acetone is volatilized naturally.
The specific embodiment 18: what present embodiment and the specific embodiment 17 were different is to add absolute ethyl alcohol in the step 2, and making the quality of absolute ethyl alcohol and the mass ratio of raw-material gross mass is 1: 1～5.Other is identical with the specific embodiment nine.
The specific embodiment 19: present embodiment and the specific embodiment 17 are different be in the step 2 under atmospheric atmosphere ball milling.Other is identical with the specific embodiment nine.
The specific embodiment 20: present embodiment and the specific embodiment 17 are different be in the step 2 under with the condition of nitrogen or argon shield ball milling.Other is identical with the specific embodiment 17.
The specific embodiment 21: the preparation method of active solder is as follows in the present embodiment: one, 53%Ag by mass percentage, 32%Cu, 2.5%Ti, all the other join Ag, Cu, Ti and Sn in the planetary ball mill for the ratio of Sn, and making the gross mass of Ag, Cu, Ti and Sn and the mass ratio of corundum abrading-ball is 1: 5; Two, be that ball milling 2.5h makes element realize alloying under the condition of 250r/min～280r/min at atmospheric atmosphere, planetary ball mill rotating speed, wherein the fineness of Cu powder is that 300 orders, purity are 99%, and the fineness of Sn powder is that 200 orders, purity are 99.5%, and Ti is with TiH
2The form of powder adds, TiH
2The fineness of powder is that 300 orders, purity are 99%.
Solder after ball milling finished is to carry out wetting test at graphite surface under 700 ℃ the condition in temperature, and Fig. 1 is wetting back graphite surface figure, finds out that by Fig. 1 solder and graphite react, and solder is wetting at graphite surface, and the interface is in conjunction with well.
Solder after ball milling finished is that 820 ℃, temperature retention time are vacuum brazing graphite and copper alloy under the condition of 20min in brazing temperature, interface tab Interface Microstructure after the soldering as shown in Figure 2, as seen from Figure 2, interface tab interface after the soldering does not have pore and crackle in conjunction with good, has formed one deck conversion zone with graphite mother metal side, thinner, this layer conversion zone can improve the mechanical property of joint, because this layer is an intermetallic compound, the mechanical property of opposite blocked up joint can obviously reduce; Interface tab after the soldering and the transition of copper base metal layer are even, are mainly the product of solid solution, and this product can improve the mechanical property of joint, can hinder the expansion of crackle.
The specific embodiment 22: the preparation method of active solder is as follows in the present embodiment: one, 40%Ag by mass percentage, 45%Cu, 5%Ti, all the other join Ag, Cu, Ti and Sn in the planetary ball mill for the ratio of Sn, and making the gross mass of Ag, Cu, Ti and Sn and the mass ratio of corundum abrading-ball is 1: 10; Two, ball milling 15h makes element realize alloying under the condition that at atmospheric atmosphere, planetary ball mill rotating speed is 250r/min～280r/min, and wherein the fineness of Cu powder is that 300 orders, purity are 99%, and the fineness of Sn powder is that 200 orders, purity are 99.5%, and Ti is with TiH
2The form of powder adds, TiH
2The fineness of powder is that 300 orders, purity are 99%.
Fig. 3 is the X-ray analysis figure of the solder of present embodiment preparation, and the material for preparing solder does not as shown in Figure 3 generate through there being cenotype behind the ball milling of 15h, but the solid solubility between powder obviously increases, even has surpassed the limit solid solubility under equilibrium condition between powder.
Solder after ball milling finished is that 860 ℃, temperature retention time are vacuum brazing graphite and copper alloy under the condition of 10min in temperature, and the shearing strength of joint can reach 11.56MPa.
Claims (8)
1, active solder is characterized in that active solder is made up of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti, 0.1%～0.42% mixing RE and the Sn of surplus by mass percentage.
2, active solder is characterized in that active solder is by mass percentage by 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2, 0.1%～0.42% mixing RE and surplus Sn form.
3, active solder is characterized in that active solder is made up of the Sn of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti and surplus by mass percentage.
4, active solder is characterized in that active solder is by mass percentage by 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2Form with the Sn of surplus.
5, the method for preparing the described active solder of claim 1, the preparation method who it is characterized in that active solder is as follows: one, by mass percentage the mixing RE of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti0.1%～0.42% and the Sn of surplus are joined in the planetary ball mill, making the gross mass of Ag, Cu, Ti, mixing RE and Sn and the mass ratio of corundum abrading-ball is 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, the quality that makes acetone and Ag, Cu, Ti, the mass ratio that mixes RE and Sn gross mass are 1: 1～5, and acetone is volatilized naturally.
6, the method for preparing the described active solder of claim 2 is characterized in that the preparation method of active solder is as follows: one, by mass percentage with 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2, 0.1%～0.42% mixing RE and the Sn of surplus join in the planetary ball mill, makes Ag, Cu, TiH
2, to mix RE and the gross mass of Sn and the mass ratio of corundum abrading-ball be 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, make the quality of acetone and Ag, Cu, TiH
2, the mass ratio that mixes RE and Sn gross mass is 1: 1～5, and acetone is volatilized naturally.
7, the method for preparing the described active solder of claim 3, the preparation method who it is characterized in that active solder is as follows: one, by mass percentage the Sn of 15%～60%Ag, 15%～60%Cu, 2%～15%Ti and surplus is joined in the planetary ball mill, making the gross mass of Ag, Cu, Ti and Sn and the mass ratio of corundum abrading-ball is 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, making the quality of acetone and the mass ratio of Ag, Cu, Ti and Sn gross mass is 1: 1～5, and acetone is volatilized naturally.
8, the method for preparing the described active solder of claim 4 is characterized in that the preparation method of active solder is as follows: one, by mass percentage with 15%～60%Ag, 15%～60%Cu, 2%～15%TiH
2Join in the planetary ball mill with the Sn of surplus, make Ag, Cu, TiH
2With the gross mass of Sn and the mass ratio of corundum abrading-ball be 5～50: 1; Two, be that 1～100Pa, planetary ball mill rotating speed are ball milling 0.5h～100h under the condition of 250r/min～280r/min in vacuum, obtain active solder; Wherein add acetone in the step 2, make the quality of acetone and Ag, Cu, TiH
2With the mass ratio of Sn gross mass be 1: 1～5, acetone is volatilized naturally.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100647961A CN101332545A (en) | 2008-06-23 | 2008-06-23 | Active solder and preparation method thereof |
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|---|---|---|---|
| CNA2008100647961A CN101332545A (en) | 2008-06-23 | 2008-06-23 | Active solder and preparation method thereof |
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| CNA2008100647961A Pending CN101332545A (en) | 2008-06-23 | 2008-06-23 | Active solder and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102448663A (en) * | 2009-05-27 | 2012-05-09 | 京瓷株式会社 | Solder material, heat dissipation base using same, and electronic device |
| CN102699572A (en) * | 2012-06-21 | 2012-10-03 | 哈尔滨工业大学 | Nano particle reinforced Ag-base composite brazing filler metal and preparation method thereof |
| CN102699571A (en) * | 2012-06-21 | 2012-10-03 | 哈尔滨工业大学 | Moderate-temperature brazing filler metal for graphite-base composite material connection and preparation method thereof |
| CN103619779A (en) * | 2011-06-30 | 2014-03-05 | 日立金属株式会社 | Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module |
| CN104646850A (en) * | 2015-01-09 | 2015-05-27 | 西安交通大学 | Al-Cu-Mg-Ti quaternary active solder for high-volume-fraction cast aluminum-based composite material, and preparation method for Al-Cu-Mg-Ti quaternary active solder |
| CN108907385A (en) * | 2018-07-20 | 2018-11-30 | 华侨大学 | A kind of sapphire method of low temperature brazing |
| CN114029651A (en) * | 2021-11-18 | 2022-02-11 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
| EP4108377A4 (en) * | 2020-02-17 | 2024-02-07 | Kabushiki Kaisha Toshiba | Brazing filler material, bonded body, ceramic circuit board, and method for producing bonded body |
| CN117532198A (en) * | 2024-01-09 | 2024-02-09 | 河北省科学院能源研究所 | Ag-Cu-based active solder and production method and application thereof |
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2008
- 2008-06-23 CN CNA2008100647961A patent/CN101332545A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9012783B2 (en) | 2009-05-27 | 2015-04-21 | Kyocera Corporation | Heat dissipation base and electronic device |
| CN102448663B (en) * | 2009-05-27 | 2015-12-16 | 京瓷株式会社 | Solder and use heat dissipation base and the electronic installation of this solder |
| CN102448663A (en) * | 2009-05-27 | 2012-05-09 | 京瓷株式会社 | Solder material, heat dissipation base using same, and electronic device |
| CN103619779B (en) * | 2011-06-30 | 2015-07-01 | 日立金属株式会社 | Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module |
| CN103619779A (en) * | 2011-06-30 | 2014-03-05 | 日立金属株式会社 | Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module |
| CN102699571A (en) * | 2012-06-21 | 2012-10-03 | 哈尔滨工业大学 | Moderate-temperature brazing filler metal for graphite-base composite material connection and preparation method thereof |
| CN102699572A (en) * | 2012-06-21 | 2012-10-03 | 哈尔滨工业大学 | Nano particle reinforced Ag-base composite brazing filler metal and preparation method thereof |
| CN104646850A (en) * | 2015-01-09 | 2015-05-27 | 西安交通大学 | Al-Cu-Mg-Ti quaternary active solder for high-volume-fraction cast aluminum-based composite material, and preparation method for Al-Cu-Mg-Ti quaternary active solder |
| CN108907385A (en) * | 2018-07-20 | 2018-11-30 | 华侨大学 | A kind of sapphire method of low temperature brazing |
| CN108907385B (en) * | 2018-07-20 | 2021-02-02 | 华侨大学 | Method for brazing sapphire at low temperature |
| EP4108377A4 (en) * | 2020-02-17 | 2024-02-07 | Kabushiki Kaisha Toshiba | Brazing filler material, bonded body, ceramic circuit board, and method for producing bonded body |
| CN114029651A (en) * | 2021-11-18 | 2022-02-11 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
| CN114029651B (en) * | 2021-11-18 | 2022-07-01 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
| CN117532198A (en) * | 2024-01-09 | 2024-02-09 | 河北省科学院能源研究所 | Ag-Cu-based active solder and production method and application thereof |
| CN117532198B (en) * | 2024-01-09 | 2024-03-22 | 河北省科学院能源研究所 | Ag-Cu-based active solder and production method and application thereof |
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