CN113528884B - Copper-based interlayer alloy and preparation method thereof, ceramic and oxygen-free copper composite connecting piece and welding method thereof - Google Patents

Copper-based interlayer alloy and preparation method thereof, ceramic and oxygen-free copper composite connecting piece and welding method thereof Download PDF

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CN113528884B
CN113528884B CN202110823168.2A CN202110823168A CN113528884B CN 113528884 B CN113528884 B CN 113528884B CN 202110823168 A CN202110823168 A CN 202110823168A CN 113528884 B CN113528884 B CN 113528884B
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copper
based interlayer
alloy
oxygen
welding
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CN113528884A (en
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李琪
刘凤美
熊敏
高海涛
易耀勇
李丽坤
张雪莹
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China Uzbekistan Welding Research Institute of Guangdong Academy of Sciences
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China Uzbekistan Welding Research Institute of Guangdong Academy of Sciences
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting

Abstract

The invention belongs to the technical field of design materials, and discloses a copper-based interlayer alloy and a preparation method thereof, a ceramic and oxygen-free copper composite connecting piece and a welding method thereof. The copper-based interlayer alloy comprises the following chemical components in percentage by weight: 22.5 to 23.5% of Ti, 9.5 to 10.5% of Sn, 3.5 to 4.5% of Ni, 0.5 to 1.0% of Ag, 0.1 to 0.5% of B, 0.1 to 0.5% of Al, 0.01 to 0.2% of La and the balance of copper. The preparation method of the copper-based interlayer alloy comprises the step of mixing and smelting the elements into an alloy material. The welding method of the ceramic and the oxygen-free copper adopts the copper-based interlayer alloy to weld the alumina ceramic base material and the oxygen-free copper base material. The ceramic and oxygen-free copper composite connecting piece is obtained by welding by adopting the welding method. The copper-based interlayer material can be suitable for a direct brazing process, and the performance of a welded joint is good.

Description

Copper-based interlayer alloy and preparation method thereof, ceramic and oxygen-free copper composite connecting piece and welding method thereof
Technical Field
The invention relates to the technical field of materials, in particular to a copper-based interlayer alloy and a preparation method thereof, a ceramic and oxygen-free copper composite connecting piece and a welding method thereof.
Background
Al2O3The ceramic has excellent wear resistance, high temperature resistance, high strength, corrosion resistance and insulating property, and the ceramic is prepared by the following stepsThe method has good application prospect in the fields of aerospace, automotive electronics and the like. However, due to the inherent disadvantages of brittleness and poor cold workability of ceramic materials, the processing and preparation of large ceramic complex parts are difficult, and the application of the ceramic complex parts in various fields is greatly limited. A large number of researches show that the defects of ceramic materials can be made up by combining the advantages of high strength, high toughness and excellent cold processing performance of metal materials with the ceramics. Among many metals and alloys, oxygen-free copper has excellent thermal conductivity, ductility and weldability, as well as higher electrical conductivity and cold workability than copper oxide. Both of these materials are widely used in the field of vacuum electronics, and if they are combined, the complementation in performance can be realized, and excellent performance can be obtained.
However, the large difference in the properties of ceramics and metals makes the connection of ceramics to metals exceptionally difficult. The existing connection method mainly comprises technologies such as brazing (indirect brazing and active brazing), fusion welding, solid-phase pressure diffusion welding, transient liquid phase connection of ceramic parts, self-propagating high-temperature alloy welding and the like, wherein the active brazing technology becomes one of the main methods for connecting ceramics and metals by a series of advantages such as simple process, high indirect strength, good result repeatability, wide adaptability of joint size and shape, low relative cost, suitability for industrial scale production and the like. Among the influencing factors of direct brazing of ceramics and metals, the development and modification of brazing materials become key factors for solving the problem of direct brazing of ceramics and metals. In the brazing process of copper and ceramic, the most widely used active brazing filler metal which is researched relatively mature at present is Ag-based brazing filler metal, however, silver belongs to rare and precious metals and national control materials, and the use of the prepared silver brazing filler metal can cause the brazing cost to be too high, so that the development of some non-silver-based brazing filler metals for welding ceramic and metal is very necessary, the economic benefit can be improved, and the social benefit can also be improved.
In view of this, the invention is particularly proposed.
Disclosure of Invention
The invention aims to provide a copper-based interlayer alloy and a preparation method thereof, a ceramic and oxygen-free copper composite connecting piece and a welding method thereof.
The invention is realized by the following steps:
in a first aspect, the invention provides a copper-based interlayer alloy, which comprises the following chemical components in percentage by weight: 22.5 to 23.5% of Ti, 9.5 to 10.5% of Sn, 3.5 to 4.5% of Ni, 0.5 to 1.0% of Ag, 0.1 to 0.5% of B, 0.1 to 0.5% of Al, 0.01 to 0.2% of La and the balance of copper.
In alternative embodiments, the form is a powder or a ribbon.
In an alternative embodiment, the copper-based interlayer alloy is in a powder form, and the particle size of the copper-based interlayer alloy is 200-800 meshes.
In an alternative embodiment, the copper-based interlayer alloy is in the form of a strip having a thickness of 60 μm to 150 μm;
preferably, the width of the material is 10-110 mm.
In a second aspect, the present invention provides a method for preparing a copper-based interlayer alloy according to the foregoing embodiments, comprising mixing and melting Ti, Sn, Ni, Ag, B, Al, La and Cu to form an alloy material according to the target chemical component content.
In an alternative embodiment, the alloy material prepared by mixed smelting of Ti, Sn, Ni, Ag, B, Al, La and Cu is:
mixing Ti, Sn, Ni, Ag, B, Al, La and Cu, and then sequentially carrying out vacuum melting, gas atomization and ultrasonic screening to prepare a powdery material;
in an alternative embodiment, the resulting powdered material has a particle size of 200-800 mesh.
In an alternative embodiment, the present invention provides the method for preparing a copper-based interlayer alloy according to the preceding embodiment, wherein the alloy material prepared by mixed melting of Ti, Sn, Ni, Ag, B, Al, La and Cu is:
mixing Ti, Sn, Ni, Ag, B, Al, La and Cu, and then carrying out vacuum melting to prepare an alloy ingot;
preparing the alloy ingot into a belt-shaped material through a rapid quenching process;
in an alternative embodiment, the thickness of the tape material is 60 μm to 150 μm; more preferably, the width of the strip-shaped material is 10-110 mm.
In a third aspect, the present invention provides a method for welding ceramics and oxygen-free copper, wherein the copper-based interlayer alloy according to any one of the foregoing embodiments or the interlayer alloy obtained by the manufacturing method according to any one of the foregoing embodiments is used to weld an alumina ceramic base material and an oxygen-free copper base material.
In an optional embodiment, the welding temperature is set to 860-960 ℃, the welding pressure is set to 0.05-0.5 MPa, and the heat preservation time is set to 10-60 min.
In a fourth aspect, the present invention provides a composite connecting element of ceramic and oxygen-free copper, welded using the welding method according to the previous embodiment.
The invention has the following beneficial effects:
by improving the chemical composition of the intermediate layer alloy, the B element is added on the basis of the Cu-Sn-Ti-Ni brazing filler metal which is a product in the existing market, the B element has the effect of refining crystal grains, and the proper amount of B is added, so that the crystal grains of the brazing filler metal are fine, the plasticity and the toughness of the brazing filler metal are improved, and the strength can be improved; the addition of the rare earth element La with proper amount has higher surface activity, can reduce the surface tension of the liquid solder, refines the microstructure of the solder, has good wettability and spreadability in the brazing process, and has a fine grain structure which is helpful for uniform and rapid melting of the solder along with the continuous increase of the welding temperature in the brazing process; the addition of the alloy strengthening element Al, and the proper amount of Al element is beneficial to the wettability of the brazing filler metal to the ceramic. Because the concentration of Al is increased, the activity coefficient of Ti is increased, the mechanism is that Al has low surface energy compared with Cu and has low saturation concentration on Ti, and Al element not only can improve the activity of Ti, but also can obviously improve the oxidation resistance of the brazing filler metal; the addition of Ag element in proper amount can ensure Al2O3Has good wetting and scattering effects with oxygen-free copper in the welding process, thereby obtaining airtight and firm sealing.
The copper-based interlayer material can be suitable for a direct brazing process, when the copper-based interlayer material is welded under the direct brazing condition, the mechanical joint performance of a joint is comparable to or superior to that of aluminum oxide ceramic and oxygen-free copper under the indirect brazing condition, the welding performance is superior to the bonding strength of Ag-Cu-Ti brazing filler metal which is widely applied in the market, and the industrial application requirement of the Ag-Cu-Ti brazing filler metal is met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a microscopic morphology of the powdery material obtained in example 1;
FIG. 2 is an external view of the tape produced in example 2;
fig. 3 is a photograph of the microstructure of a welded part joint after welding the welded part using the powdered brazing filler metal provided in example 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The following is a detailed description of the copper-based interlayer alloy and the method for preparing the same, and the method for welding ceramic and oxygen-free copper.
The copper-based interlayer alloy provided by the embodiment of the invention comprises the following chemical components: 22.5 to 23.5% of Ti, 9.5 to 10.5% of Sn, 3.5 to 4.5% of Ni, 0.5 to 1.0% of Ag, 0.1 to 0.5% of B, 0.1 to 0.5% of Al, 0.01 to 0.2% of La and the balance of copper.
By improving the chemical composition of the intermediate layer alloy, the B element is added on the basis of the Cu-Sn-Ti-Ni brazing filler metal which is a product in the existing market, the B element has the effect of refining crystal grains, and the proper amount of B is added, so that the crystal grains of the brazing filler metal are fine, the plasticity and the toughness of the brazing filler metal are improved, and the strength can be improved; is added withThe rare earth element La has high surface activity, can reduce the surface tension of liquid solder, refines the microstructure of the solder, has good wettability and spreadability in the brazing process, and has a fine grain structure which is helpful for uniform and rapid melting of the solder along with continuous increase of the welding temperature in the brazing process; the addition of the alloy strengthening element Al, and the proper amount of Al element is beneficial to the wettability of the brazing filler metal to the ceramic. Because the concentration of Al is increased, the activity coefficient of Ti is increased, the mechanism is that Al has low surface energy compared with Cu and has low saturation concentration on Ti, and Al element not only can improve the activity of Ti, but also can obviously improve the oxidation resistance of the brazing filler metal; the addition of Ag element in proper amount can ensure Al2O3Has good wetting and scattering effects with oxygen-free copper in the welding process, thereby obtaining airtight and firm sealing.
The copper-based interlayer material provided by the implementation of the invention can be suitable for a direct brazing process, when the copper-based interlayer material is welded under the direct brazing condition, the mechanical joint performance of the joint is comparable to or better than that of aluminum oxide ceramic and oxygen-free copper under the indirect brazing condition, the welding performance is superior to the bonding strength of Ag-Cu-Ti brazing filler metal which is widely applied in the market, and the industrial application requirements of the Ag-Cu-Ti brazing filler metal are met.
Specifically, the copper-based interlayer alloy is in the form of powder or ribbon, which is more commonly used.
Preferably, when the copper-based interlayer alloy is in a powder form, the particle size is 200-800 meshes, and the powder with a proper particle size is used for ensuring a better welding effect.
Preferably, when the copper-based interlayer alloy is in a strip shape, the thickness of the copper-based interlayer alloy is 60-150 μm, and the width of the copper-based interlayer alloy is 10-110 mm, so that the copper-based interlayer alloy can meet the welding requirements and welding assembly of materials with different sizes.
The preparation method of the copper-based interlayer alloy provided by the embodiment of the invention comprises the following steps:
mixing and smelting Ti, Sn, Ni, Ag, B, Al, La and Cu according to the content of the target chemical components to prepare the alloy material.
Specifically, the method comprises the following steps:
1. if the material is prepared into powder, the preparation method comprises the following steps:
mixing Ti, Sn, Ni, Ag, B, Al, La and Cu, and then sequentially carrying out vacuum melting, gas atomization and ultrasonic screening to prepare the powder material with the granularity of 200-800 meshes.
2. If the material is prepared into a strip material, the preparation method comprises the following steps:
mixing Ti, Sn, Ni, Ag, B, Al, La and Cu, and then carrying out vacuum melting to prepare an alloy ingot;
and (3) preparing the alloy ingot into a strip material through a rapid quenching process.
Preferably, the thickness of the strip-shaped material is 60 μm to 150 μm; the width is 10-110 mm.
The embodiment of the invention provides a welding method of ceramic and oxygen-free copper, and an aluminum oxide ceramic base material and an oxygen-free copper base material are welded by adopting the copper-based interlayer alloy provided by the embodiment of the invention or the interlayer alloy prepared by the preparation method provided by the embodiment of the invention.
Specifically, the welding temperature is set to 860-960 ℃ (such as 860 ℃, 880 ℃, 910 ℃, 930 ℃ or 960 ℃) during welding, the welding pressure is set to 0.08-0.12 MPa (such as 0.08MPa, 0.1MPa or 0.12MPa), and the holding time is set to 15-25 min (such as 15min, 20min or 25 min).
The embodiment of the invention also provides a composite connecting piece of ceramic and oxygen-free copper, which is obtained by welding by the welding method provided by the embodiment of the invention. The joint of the composite connecting piece has good mechanical property.
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
A copper-based interlayer material comprises the following components in percentage by weight: 23% Ti, 10% Sn, 3.5% Ni, 0.8% Ag, 0.2% B, 0.3% Al, 0.1% La and the balance copper.
The preparation method of the flaky copper-based interlayer material comprises the following steps: mixing Ti, Sn, Ni, Ag, B, Al, La and Cu in proportion, firstly adopting vacuum smelting, gas atomization and ultrasonic screening to prepare the intermediate layer material into 400-mesh spherical powder. The micro-topography is shown in figure 1.
The prepared copper-based interlayer powder material is applied to direct brazing of alumina ceramic and 1A95 oxygen-free copper, and welding process parameters are as follows: the welding temperature parameter is set to 900 ℃, the pressure parameter is set to 0.1MPa, and the heat preservation time parameter is 10 min.
The microstructure of the weldment obtained by welding is shown in figure 3.
Example 2
A copper-based interlayer material comprises the following components in percentage by weight: 22.5% Ti, 10.5% Sn, 4.0% Ni, 1.0% Ag, 0.3% B, 0.2% Al, 0.15% La and the balance copper.
The preparation method of the flaky copper-based interlayer material comprises the following steps: mixing Ti, Sn, Ni, Ag, B, Al, La and Cu in proportion, firstly adopting vacuum melting, and melting into an alloy ingot. The preparation method of the flaky copper-based interlayer material comprises the following steps: cutting the smelted alloy cast ingot into alloy strips by adopting a linear cutting and mechanical cutting process, carrying out sand blasting surface treatment on the cut alloy strips to remove surface oil stains, carrying out ultrasonic cleaning on the alloy strips subjected to the sand blasting treatment by using alcohol and acetone to remove the surface oil stains, carrying out quick quenching process on the cleaned alloy strips, and preparing a middle layer material into a strip material with the thickness of 60 mu m and the width of 70 mm. The specific appearance structure is shown in fig. 2.
The prepared copper-based intermediate layer material is applied to brazing aluminum oxide ceramic and oxygen-free copper, and the welding process parameters are as follows: the welding temperature parameter is set to 910 ℃, the pressure parameter is set to 0.1MPa, and the heat preservation time parameter is 20 min.
Example 3
This embodiment is substantially the same as embodiment 1 except that:
the components by weight percentage are as follows: 23.5% Ti, 9.5% Sn, 3.5% Ni, 0.5% Ag, 0.1% B, 0.5% Al, 0.01% La and the balance copper.
The preparation method of the flaky copper-based interlayer material comprises the following steps: mixing Ti, Sn, Ni, Ag, B, Al, La and Cu in proportion, firstly adopting vacuum melting, gas atomization and ultrasonic screening to prepare the intermediate layer material into 400-mesh spherical powder.
The prepared copper-based interlayer powder material is applied to direct brazing of alumina ceramic and 1A95 oxygen-free copper, and welding process parameters are as follows: the welding temperature parameter is set to 900 ℃, the pressure parameter is set to 0.1MPa, and the heat preservation time parameter is 10 min.
Example 4
This embodiment is substantially the same as embodiment 1 except that:
the components by weight percentage are as follows: 23% Ti, 10% Sn, 4.5% Ni, 0.8% Ag, 0.5% B, 0.1% Al, 0.2% La and the balance copper.
The preparation method of the flaky copper-based interlayer material comprises the following steps: mixing Ti, Sn, Ni, Ag, Al, La and Cu in proportion, firstly adopting vacuum melting, gas atomization and ultrasonic screening to prepare the intermediate layer material into 400-mesh spherical powder.
The prepared copper-based interlayer powder material is applied to direct brazing of alumina ceramic and 1A95 oxygen-free copper, and welding process parameters are as follows: the welding temperature parameter is set to 900 ℃, the pressure parameter is set to 0.1MPa, and the heat preservation time parameter is 10 min.
Comparative example 1
This comparative example is essentially the same as example 1 except that:
the components by weight percentage are as follows: 25.0% Ti, 8.0% Sn, 2.5% Ni, 0.3% Ag, 2.0% B, 1.0% Al, 0.5% La and the balance copper.
Comparative example 2
This comparative example is essentially the same as example 1 except that:
the components by weight percentage are as follows: 25.0% Ti, 10.0% Sn, 5.0% Ni, 0.9% Ag, 0.2% B, 1.0% Al, 0.3% La and the balance copper.
Comparative example 3
This comparative example is essentially the same as example 1 except that:
the components by weight percentage are as follows: 23% Ti, 10% Sn, 3.5% Ni, 0.8% Ag, 0.3% Al, 0.1% La and the balance copper.
Comparative example 4
This comparative example is essentially the same as example 1 except that:
the components by weight percentage are as follows: 23% Ti, 10% Sn, 3.5% Ni, 0.8% Ag, 0.2% B, 0.3% Al and the balance copper.
Comparative example 5
This comparative example is essentially the same as example 1, except that an Ag-Cu-Ti powder solder having a chemical composition of: Ag71Cu27.5Ti1.5.
Comparative example 6
This comparative example is substantially the same as example 2, except that an Ag-Cu-Ti ribbon solder having a chemical composition of: Ag71Cu27.5Ti1.5.
Examples of the experiments
The joints of the welded parts of examples 1 to 4 and comparative examples 1 to 6 were subjected to performance tests. The experimental data are recorded in the table below.
TABLE 1 comparison of data in the Experimental groups
Figure BDA0003172595480000091
Figure BDA0003172595480000101
As can be seen from Table 1, when the copper-based interlayer alloy provided by the embodiment of the application is welded with alumina ceramic and oxygen-free copper, the shear strength of the welded joint is high and is far better than that of the existing Ag-Cu-Ti solder provided by the comparative examples 5 and 6; comparing the examples with comparative examples 1-4, it was found that if the chemical composition does not include certain chemical elements as claimed herein, and the composition ratio is outside the range as claimed herein, the resulting solder alumina ceramic has a joint strength lower than that of commercial Ag-Cu-Ti solder after bonding with oxygen-free copper.
In conclusion, the copper-based interlayer alloy provided by the invention is produced in the existing marketProper amounts of B, La, Al and Ag are added on the basis of the Cu-Sn-Ti-Ni brazing filler metal, so that the obtained alloy brazing filler metal is applied to Al2O3When the ceramic and the oxygen-free copper are welded, the welding effect is good, and the joint shearing strength of the obtained weldment is high.
The preparation method of the copper-based interlayer alloy provided by the invention has a simple process, and can prepare the copper-based interlayer alloy provided by the invention.
According to the welding method of the ceramic and the oxygen-free copper, the copper-based interlayer alloy provided by the invention is adopted to weld the alumina ceramic base material and the oxygen-free copper base material, so that the obtained weldment has good performance and high joint strength.
The ceramic and oxygen-free copper composite connecting piece is obtained by welding by the welding method provided by the embodiment of the invention. The joint of the composite connecting piece has good mechanical property.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (14)

1. The copper-based interlayer alloy is characterized by being used for welding alumina ceramic and oxygen-free copper and comprising the following chemical components in percentage by weight: 22.5 to 23.5% of Ti, 9.5 to 10.5% of Sn, 3.5 to 4.5% of Ni, 0.5 to 1.0% of Ag, 0.1 to 0.5% of B, 0.1 to 0.5% of Al, 0.01 to 0.2% of La and the balance of copper.
2. Copper-based interlayer alloy according to claim 1, characterized in that its morphology is powder or ribbon.
3. The copper-based interlayer alloy according to claim 1, wherein the copper-based interlayer alloy is in the form of powder with a particle size of 200-800 mesh.
4. The copper-based interlayer alloy according to claim 1, wherein the copper-based interlayer alloy is in the form of a strip having a thickness of 60 μm to 150 μm.
5. The copper-based interlayer alloy according to claim 4, wherein the width thereof is 10 to 110 mm.
6. The method for preparing the copper-based interlayer alloy according to claim 1, comprising mixing and melting Ti, Sn, Ni, Ag, B, Al, La and Cu according to the content of the target chemical components to prepare the alloy material.
7. The method for preparing the copper-based interlayer alloy according to claim 6, wherein the alloy material prepared by mixing and melting Ti, Sn, Ni, Ag, B, Al, La and Cu is:
mixing Ti, Sn, Ni, Ag, B, Al, La and Cu, and then sequentially carrying out vacuum melting, gas atomization and ultrasonic screening to prepare the powdery material.
8. The method for preparing the copper-based interlayer alloy as claimed in claim 7, wherein the particle size of the prepared powdery material is 200-800 meshes.
9. The method for preparing the copper-based interlayer alloy according to claim 6, wherein the alloy material prepared by mixing and melting Ti, Sn, Ni, Ag, B, Al, La and Cu is:
mixing Ti, Sn, Ni, Ag, B, Al, La and Cu, and then carrying out vacuum melting to prepare an alloy ingot;
and (3) preparing the alloy ingot into a strip material through a rapid quenching process.
10. The method for preparing the copper-based interlayer alloy according to claim 9, wherein the strip-shaped material has a thickness of 60 μm to 150 μm.
11. The method for preparing the copper-based interlayer alloy according to claim 9, wherein the width of the strip-shaped material is 10-110 mm.
12. A method for welding ceramics and oxygen-free copper, characterized in that the copper-based interlayer alloy according to any one of claims 1 to 5 or the interlayer alloy obtained by the production method according to any one of claims 6 to 11 is used to weld an alumina ceramic base material and an oxygen-free copper base material.
13. The method for welding ceramics and oxygen-free copper according to claim 12, wherein the welding temperature is set to 860 to 960 ℃, the welding pressure is set to 0.05 to 0.5MPa, and the holding time is set to 10 to 60 min.
14. A composite joint of ceramic and oxygen-free copper, welded by the welding method of claim 12 or 13.
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