CN1076648A - Anti-oxidation active metallic soldering material for welding ceramics - Google Patents
Anti-oxidation active metallic soldering material for welding ceramics Download PDFInfo
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- CN1076648A CN1076648A CN 92106103 CN92106103A CN1076648A CN 1076648 A CN1076648 A CN 1076648A CN 92106103 CN92106103 CN 92106103 CN 92106103 A CN92106103 A CN 92106103A CN 1076648 A CN1076648 A CN 1076648A
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- solder
- compound
- active
- oxidation
- pottery
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Abstract
The invention belongs to welding technology field, a kind of anti-oxidation active metallic soldering material for welding ceramics promptly is provided, its characteristics are the prescription of solder following (atomic percent):
Active element 1-10 nonactive elements 5-60
Antioxidant 2-10 rare earth additions 0-0.8
The Cu surplus
The present invention has enough oxidation-resistance properties, is particularly suitable for pottery and ceramic soldering or pottery and solder bonding metal that the common metal solder can't be finished, is applicable to common metal material soldering too.
Description
The invention belongs to welding technology field, specifically just provided a kind of enough oxidation-resistance properties that has, be suitable for the pottery that the common metal solder can't finish and the solder of ceramic soldering or pottery and solder bonding metal.
Since the nearly period, because the joint efforts of countries in the world scientific circles and industrial quarters make traditional ceramic material property that revolutionary variation take place, fine ceramics develops just rapidly as an emerging branch of industry, and its product progresses into the practicability stage.Yet because some intrinsic shortcomings of ceramic material itself, as intrinsic fragility, intensity dispersion and unworkability or the like still were difficult to overcome in a short time, make this new material with great potential before the application that enlarges it, must at first solve it and other material, it at first is the connectivity problem of metal material, in the product that many ceramic materials that entered practicability are at present made, as microwave electronic device, the electrode of ceramic capacitor and wave filter, large quantities of electrovacuum elements such as vacuum insulation seal, vacuum electrode lead-in wire etc., the pottery cutting tool, comprise diamond cut instrument or the like, metal is one of technological core during these technology-intensive products are made with ceramic the connection reliably.In known metal and the ceramic interconnection technique, organic bonding and inorganic adhesive, because its production cost is low, simple to operate and wide adaptability and being widely used, but the former major defect is that temperature raises, bonded joint will lose efficacy rapidly, and that the latter's shortcoming is a bonding strength is very low, and joint is very unreliable.Diffusion welding (DW), high temperature insostatic pressing (HIP) weldering, extraordinary solder technology such as electron beam or laser fusion welding and friction welding (FW) can be produced in conjunction with firm metal/ceramic joint, but it is very high that their common shortcomings are production costs, and to each technology, the scope of application is rather narrow.Soldering is the higher method of a kind of relative productivity indirectly, but because its requirement is carried out metalized in advance to ceramic surface, so increased production process and production cost.At present in many metals and the ceramic method that is connected, with the direct soldering tech of reactive metal, because productivity ratio height, wide adaptability connects reliable and multiple advantage such as production cost is low and have competitiveness most, the core of this technology be can be on pottery the development of the wetting and active metallic soldering material of adhering.Document 1 provides a kind of auri or palladium based active solder, these active fine material can keep a lower oxidation rate owing to contain noble metal, but because the cost of raw material is too high-leveled and difficult to obtain general application, document 2 provides a kind of money base active solder, document 3 provides a kind of copper-based active solder, the solder that the production cost of this two classes solder all provides well below document 1, but their common drawback is at high temperature to heat, active solder is with rapid oxidation, so, if with the metal/ceramic joint of the fine prickers of these solders at oxidizing atmosphere (as atmosphere) be higher than under the uniform temperature of room temperature and work, joint will lose efficacy rapidly owing to the oxidation of solder, on this meaning, present urgent need will develop cheaply a kind of, but the practical active solder of sludge proof.
The object of the present invention is to provide a kind of active metallic soldering material of resistance to oxidation type, under certain condition can be directly wetting at multiple ceramic surface, sprawl and solidify the back and pottery fuse securely.
The present invention is a kind of active solder of cupric, its concrete prescription following (atomic percent):
The nonactive element antioxidant of active element rare earth addition Cu
1-10 5-60 2-10 0～0.8 surplus
Active element refers to down column element: Ti, Zr, V, Hf or theirs is compound.
Nonactive element refers to down column element Iu, Sn, and Ag, Au, P or its are compound.
Antioxidant refers to following element Cr, Al, and Sl, Nl or its are compound.
Rare earth addition means: Ce or based on its compound rare-earth compound.
In the present invention, the effect of active element is to make solder can be on pottery wetting and adhere to.The effect of nonactive element be improve and the control solder on pottery wetability and with the bonding strength of pottery, antioxidant is used to improve solder oxidation resistance at high temperature, the effect of rare earth addition is the interface binding power that strengthens alloy oxide film and parent metal, also can not add.
Solder prescription provided by the invention can carry out alloying with pyrometallurgy or Physical Metallurgy, can select one or more machinings after the alloying, and solder is made suitable shape, as solder wire, solder powder or solder sheet etc.
Compare with original technology, solder provided by the invention, the ability of resistance to high temperature oxidation strengthens greatly, contains the metal solder of Cn for this class, and general oxidation behavior is all obeyed the second-degree parabola law
△W
2＝Kt
△ W is the oxidation weight gain of unit are in the formula, K is the second-degree parabola constant, t is an oxidization time, test as a comparison, compare Cu-5Tl-57Ag and Cu-5Tl-54Ag-4.5Ag-0.5Ce provided by the invention by EP0135603 provided, oxidation in 600 ℃ of following air, its parabola constant K is respectively 6.29 * 10
-5Mg
2/ cm
2δ and 3.18 * 10
-5Mg
2/ cm
2About δ, active solder promptly provided by the invention are doubled the oxidation drag.Solder provided by the invention can be at multiple pottery, comprise oxide ceramics (aluminium oxide, quartz, mullite, zirconia etc.), non-oxide ceramics (diamond, graphite, silicon nitride, Slalon, carborundum etc.) well wetting and adhesion effect directly takes place on the surface, and be equally applicable to the soldering of metal and alloy, embodiment is described in detail in detail below:
Embodiment 1
The alloy of preparation Cu-5Ti-54Ag-5Cr under the Ar gas shiled, carries out melting with tungsten arc.It is even to adopt electromagnetic field to stir to guarantee alloy composition in the fusion process, and the alloy after the melting can cold rolling one by one one-tenth solder sheet through middle vacuum annealing.
Silicon nitride ceramics, the surface is carefully cleaned with ultrasonic wave in acetone after careful the grinding, then, places in the vacuum brazing furnace, gets suitable solder sheet surface grinding and clean to be placed on the ceramic surface.The sealing furnace chamber also vacuumizes, when vacuum reaches 1 * 10
-5Behind the Torr, gently be warming up to 880 ℃, insulation 5mln, slowly pit furnace is as cold as room temperature then.Solder is wetting good at ceramic surface, and is connected firmly.
Embodiment 2
Preparation Cu-5Tl-54Ag-4.5Al-0.5Ce alloy is tested with method same among the embodiment 1, and pottery is selected Slalon for use, found that, fine material is wetting good at ceramic surface, and is connected firmly with pottery.
List of references
1、EP 0104623（1983）
2、EP 0135603（1983）
3、GB 2066291A（1981）
Claims (7)
1, a kind of active solder of cupric is specially adapted to the direct soldering of ceramic material, its specifically fill a prescription following (atomic percent):
The nonactive element antioxidant of active element rare earth addition Cu
1-10 5-60 2-10 0～0.8 surplus
2, by the described solder of claim 1, it is characterized by used active element and refer to column element down, Tl, Zr, V, Hf or its are compound.
3, by the described solder of claim 1, it is characterized by used nonactive element and refer to column element: In down, Sn, Ag, Au, P or its are compound.
4, by the described solder of claim 1, it is characterized by used antioxidant and refer to following element Cr, Nl, Al, Sl or its are compound.
5, by solder described in the claim 1, it is characterized by used rare earth addition is C
8Or based on its compound rare-earth compound.
6, by the described solder of claim 1～5, it is characterized in that: fill a prescription available pyrometallurgy or Physical Metallurgy of solder carried out alloying.
7, by the described solder of claim 6, it is characterized in that to select machining after the alloying, solder is made suitable shape, as solder wire, solder powder or solder sheet etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 92106103 CN1027797C (en) | 1992-03-25 | 1992-03-25 | Anti-oxidation active metallic soldering material for welding ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 92106103 CN1027797C (en) | 1992-03-25 | 1992-03-25 | Anti-oxidation active metallic soldering material for welding ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1076648A true CN1076648A (en) | 1993-09-29 |
| CN1027797C CN1027797C (en) | 1995-03-08 |
Family
ID=4941797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 92106103 Expired - Fee Related CN1027797C (en) | 1992-03-25 | 1992-03-25 | Anti-oxidation active metallic soldering material for welding ceramics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1027797C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103329235A (en) * | 2010-12-22 | 2013-09-25 | Abb技术股份公司 | Interrupter insert for a circuit breaker arrangement |
| CN105899326A (en) * | 2013-11-29 | 2016-08-24 | 迪阿蒙德公司 | Cutting insert, cutting tool comprising such an insert and methods for producing and repairing such a tool |
| CN105948779A (en) * | 2016-04-25 | 2016-09-21 | 东莞市联洲知识产权运营管理有限公司 | Preparation method of silicon nitride ceramic/metal composite plate |
| CN110202294A (en) * | 2019-05-09 | 2019-09-06 | 华侨大学 | A kind of Sn-Cu-V solder for low temperature brazing diamond |
| CN110891733A (en) * | 2017-07-04 | 2020-03-17 | 罗杰斯德国有限公司 | Welding material for active welding and method for active welding |
| CN112059470A (en) * | 2020-09-08 | 2020-12-11 | 中物院成都科学技术发展中心 | Active brazing filler metal for brazing titanate microwave dielectric ceramic and metal and preparation method thereof |
| CN113528884A (en) * | 2021-07-21 | 2021-10-22 | 广东省科学院中乌焊接研究所 | Copper-based interlayer alloy and preparation method thereof, ceramic and oxygen-free copper composite connecting piece and welding method thereof |
| CN117532198A (en) * | 2024-01-09 | 2024-02-09 | 河北省科学院能源研究所 | Ag-Cu-based active solder and production method and application thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1052674C (en) * | 1995-09-27 | 2000-05-24 | 中国科学院金属研究所 | Tin-base active flux for soldering ceramic under coarse vacuum condition |
-
1992
- 1992-03-25 CN CN 92106103 patent/CN1027797C/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103329235A (en) * | 2010-12-22 | 2013-09-25 | Abb技术股份公司 | Interrupter insert for a circuit breaker arrangement |
| CN103329235B (en) * | 2010-12-22 | 2016-03-30 | Abb技术股份公司 | For the contact maker plug-in unit of electric circuit breaker apparatus |
| CN105899326A (en) * | 2013-11-29 | 2016-08-24 | 迪阿蒙德公司 | Cutting insert, cutting tool comprising such an insert and methods for producing and repairing such a tool |
| CN105899326B (en) * | 2013-11-29 | 2019-08-27 | 迪阿蒙德公司 | Cutting blade, the cutting tool with this blade and manufacture and the method for repairing this tool |
| CN105948779A (en) * | 2016-04-25 | 2016-09-21 | 东莞市联洲知识产权运营管理有限公司 | Preparation method of silicon nitride ceramic/metal composite plate |
| CN110891733A (en) * | 2017-07-04 | 2020-03-17 | 罗杰斯德国有限公司 | Welding material for active welding and method for active welding |
| US11338397B2 (en) | 2017-07-04 | 2022-05-24 | Rogers Germany Gmbh | Soldering material for active soldering and method for active soldering |
| CN110891733B (en) * | 2017-07-04 | 2022-05-27 | 罗杰斯德国有限公司 | Welding material for active welding and method for active welding |
| CN110202294A (en) * | 2019-05-09 | 2019-09-06 | 华侨大学 | A kind of Sn-Cu-V solder for low temperature brazing diamond |
| CN112059470A (en) * | 2020-09-08 | 2020-12-11 | 中物院成都科学技术发展中心 | Active brazing filler metal for brazing titanate microwave dielectric ceramic and metal and preparation method thereof |
| CN113528884A (en) * | 2021-07-21 | 2021-10-22 | 广东省科学院中乌焊接研究所 | Copper-based interlayer alloy and preparation method thereof, ceramic and oxygen-free copper composite connecting piece and welding method thereof |
| CN113528884B (en) * | 2021-07-21 | 2021-12-28 | 广东省科学院中乌焊接研究所 | Copper-based interlayer alloy and preparation method thereof, ceramic and oxygen-free copper composite connecting piece and welding method thereof |
| CN117532198A (en) * | 2024-01-09 | 2024-02-09 | 河北省科学院能源研究所 | Ag-Cu-based active solder and production method and application thereof |
| CN117532198B (en) * | 2024-01-09 | 2024-03-22 | 河北省科学院能源研究所 | Ag-Cu-based active solder and production method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1027797C (en) | 1995-03-08 |
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