CN100471613C - Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium - Google Patents
Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium Download PDFInfo
- Publication number
- CN100471613C CN100471613C CNB2007100685653A CN200710068565A CN100471613C CN 100471613 C CN100471613 C CN 100471613C CN B2007100685653 A CNB2007100685653 A CN B2007100685653A CN 200710068565 A CN200710068565 A CN 200710068565A CN 100471613 C CN100471613 C CN 100471613C
- Authority
- CN
- China
- Prior art keywords
- indium
- cadmium
- silicon
- neodymium
- gallium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052733 gallium Inorganic materials 0.000 title claims abstract description 48
- 229910052738 indium Inorganic materials 0.000 title claims abstract description 48
- 229910052779 Neodymium Inorganic materials 0.000 title claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 45
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 title claims description 46
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title claims description 46
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 title claims description 45
- 239000010703 silicon Substances 0.000 title claims description 43
- 229910052761 rare earth metal Inorganic materials 0.000 title claims description 27
- 150000002910 rare earth metals Chemical class 0.000 title claims description 27
- 229910000679 solder Inorganic materials 0.000 title abstract description 10
- 229910052793 cadmium Inorganic materials 0.000 title description 8
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 title description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 49
- 229910052718 tin Inorganic materials 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract 2
- 238000005219 brazing Methods 0.000 claims description 51
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 48
- 239000004332 silver Substances 0.000 claims description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 42
- 229910045601 alloy Inorganic materials 0.000 claims description 42
- 239000000956 alloy Substances 0.000 claims description 42
- 239000010949 copper Substances 0.000 claims description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims 1
- 238000005266 casting Methods 0.000 abstract description 10
- 238000003723 Smelting Methods 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 238000005476 soldering Methods 0.000 description 19
- 230000004907 flux Effects 0.000 description 16
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 15
- 229910000906 Bronze Inorganic materials 0.000 description 14
- 239000010974 bronze Substances 0.000 description 14
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 229910001369 Brass Inorganic materials 0.000 description 7
- 229910000975 Carbon steel Inorganic materials 0.000 description 7
- 239000010951 brass Substances 0.000 description 7
- 239000010962 carbon steel Substances 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 241001062472 Stokellia anisodon Species 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000007096 poisonous effect Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 241001417490 Sillaginidae Species 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- NZWXMOTXTNDNLK-UHFFFAOYSA-N [Cu].[Zn].[Ag] Chemical compound [Cu].[Zn].[Ag] NZWXMOTXTNDNLK-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100685653A CN100471613C (en) | 2007-05-14 | 2007-05-14 | Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100685653A CN100471613C (en) | 2007-05-14 | 2007-05-14 | Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101049656A CN101049656A (en) | 2007-10-10 |
CN100471613C true CN100471613C (en) | 2009-03-25 |
Family
ID=38781366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100685653A Active CN100471613C (en) | 2007-05-14 | 2007-05-14 | Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100471613C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102848100B (en) * | 2012-10-10 | 2015-03-25 | 南京航空航天大学 | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Nd and Ga |
CN106736003B (en) * | 2016-12-15 | 2019-01-22 | 常熟市华银焊料有限公司 | The low cadmium brazing silver alloy of low melting point |
-
2007
- 2007-05-14 CN CNB2007100685653A patent/CN100471613C/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101049656A (en) | 2007-10-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100496864C (en) | Cadmium-free silver solder containing gallium, indium, and rare earth neodymium and cerium | |
CN100408256C (en) | Cadmium-free silver solder containing gallium, indium and cerium | |
CN100352597C (en) | Cadmium-free silver solder comprising Ga, Im and Ce | |
CN100420538C (en) | Cadmium-free silver based solder containing gallium, indium and cerium | |
CN101716702B (en) | Multi-component alloy cadmium-free low-silver solder | |
CN100558499C (en) | A kind of manufacture method of cadmium-free silver brazing alloy | |
CN109894771B (en) | Low-silver cadmium-free silver solder | |
CN101716705B (en) | Multi-alloy cadmium-free phosphor-free copper-based solder | |
CN101537546B (en) | Sn-Ag-Cu lead-free solder containing Pr, Ni and Ga | |
CN100408255C (en) | Cadmium-free silver solder containing indium and cerium | |
CN100467192C (en) | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus | |
CN102626838B (en) | Silver-based cadmium-free medium temperature brazing filler metal and preparation method thereof | |
CN100377832C (en) | Cd-free silver solder containing Ga and Ce | |
CN100398251C (en) | Cadmium-free silver solder containing gallium and cerium | |
CN100471613C (en) | Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium | |
CN100463763C (en) | Cu-P-Ag solder containing Ga, In and Ce | |
CN101362265B (en) | Tin wire production method of welding material | |
CN102886624B (en) | Novel low-melting-point copper-manganese-zinc brazing filler | |
CN103909361A (en) | Low-silver-content cadmium-free solder | |
CN102513727B (en) | Self-fluxing silver solder containing neodymium, zirconium and gallium | |
CN101579789B (en) | Sn-Ag-Cu lead-free solder containing Pr, Zr and Co | |
CN101524793B (en) | Cadmium-free silver filler containing lithium and niobium | |
CN103056551A (en) | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal | |
CN100457368C (en) | No-cadmium brazing silver alloy containing Ga and Ce | |
CN103084749A (en) | Lead-free solder with high service life |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jinzhong Welding Material Co., Ltd., Jinhua Zhejiang Assignor: Luo Huaming Contract fulfillment period: 2009.1.18 to 2027.5.13 Contract record no.: 2009330000471 Denomination of invention: Silver solder of containing gallium, indium, and rare earth silicon and neodymium without cadmium Granted publication date: 20090325 License type: Exclusive license Record date: 20090318 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.1.18 TO 2027.5.13; CHANGE OF CONTRACT Name of requester: JINHUA CITY JINZHONG WELDING MATERIALS CO., LTD. Effective date: 20090318 |
|
EM01 | Change of recordation of patent licensing contract |
Change date: 20110331 Contract record no.: 2009330000471 Assignor after: Luo Huaming Assignor before: Luo Huaming |
|
TR01 | Transfer of patent right |
Effective date of registration: 20180730 Address after: 321016 No. 306 Longtan Road, Wucheng District, Jinhua, Zhejiang Patentee after: Jinzhong Welding Material Co., Ltd., Jinhua Zhejiang Address before: 321016 Zhejiang 777 Jinhua (Jinhua Jinzhong Welding Material Co., Ltd.) Patentee before: Luo Huaming |
|
TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Cadmium free silver solder containing gallium, indium, silicon and rare earth neodymium Effective date of registration: 20220615 Granted publication date: 20090325 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jinhua Economic Development Zone Branch Pledgor: JINHUA JINZHONG WELDING MATERIALS CO.,LTD. Registration number: Y2022330000951 |